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Qualcomm and Neura Join Forces, Making a Major Bet on the AI Robotics Field

When "WALL-E" Meets "Ultra-Fast Networks": The Communication Cornerstone in the Edge Intelligence Era   Recently, chip giant Qualcomm and German robotics innovator Neura Robotics have entered into a key strategic partnership. The latter will adopt Qualcomm's latest IQ10 processor, unveiled at CES 2026, to serve as the "brain" for its next-generation humanoid robots. This is far from an ordinary supplier agreement; it signifies Qualcomm's ambitious move to heavily invest in the AI robotics market, directly challenging NVIDIA's dominance in the AI hardware arena.   The Strategic Shift: From Mobile Chips to the Robotic "Heart"   Qualcomm is no longer content with its success in the smartphone market. This collaboration with Neura Robotics represents a significant upgrade in its business diversification strategy. Neura Robotics, known for its cognitive automation technology, chose Qualcomm's IQ10 processor precisely for its core capability designed for edge AI​ workloads—the ability to run large language models and computer vision algorithms locally on the device for real-time decision-making. This is crucial for humanoid robots that need to navigate dynamic environments, recognize objects, and collaborate with humans, avoiding the latency of cloud connections and marking a key step towards true autonomy.     An Industry Inflection Point: The New "Connectivity" Bottleneck Amidst the Computing Power Race   The robotics industry is currently at a turning point, transitioning from experimentation to industrialization. However, while the industry focuses on the AI computing power (processor) race, a parallel critical bottleneck is becoming increasingly prominent: the real-time wireless transmission capability for massive data.​ Whether it's the continuous data stream generated by multiple sensors on a robot (such as high-def vision, LiDAR), coordination commands between robot swarms, or instant communication with central control systems, they all place extreme demands on the bandwidth, latency, and reliability​ of wireless connections. Powerful local computing power (like the IQ10) requires an equally powerful data pipeline to be "fed" and to "interact" in order to unleash its full potential.     The Complementary Foundation: How Wi-Fi 7 Empowers Robots   This highlights the core value of the next-generation wireless connection technology—Wi-Fi 7. It perfectly complements high-performance AI processors, aiming to solve the aforementioned "connectivity" bottleneck. Technologies supported by Wi-Fi 7, such as 320MHz ultra-wide bandwidth, Multi-Link Operation (MLO), and 4K QAM modulation, can deliver wired-network-like ultra-low latency and multi-gigabit bandwidth. This means robots can deploy more high-definition sensors without concern, achieve smoother real-time environmental modeling and video backhaul, and ensure that control command transmission remains stable and instantaneous even in dense multi-device scenarios, paving the way for complex autonomous decision-making and precise collaborative operations.   QOGRISYS's O2072PM: Infusing Connectivity Power into High-End Robots   Addressing this cutting-edge demand, QOGRISYS​ provides a mature wireless connectivity solution. Its flagship product, the O2072PM Wi-Fi 7 Tri-Band Module, is specifically designed for high-end devices like robots and autonomous driving systems.     The module fully supports Wi-Fi 7 and Bluetooth 6.0. In the 6GHz band, leveraging 2x2 MIMO and 320MHz channel width, it achieves a theoretical peak rate of up to 5.8Gbps, sufficient to handle multi-sensor data torrents. Its Bluetooth component supports LE Audio​ and High Accuracy Distance Measurement (HADM), facilitating device interconnection and positioning. Choosing the O2072PM means acquiring a comprehensive hardware solution​ that is fully validated and can accelerate time-to-market.   Related Video: Qualcomm is Ready to Power YOUR Robot! #Qualcomm #AI #EdgeComputing #WiFi7 #Robotics #WirelessCommsModule #AutonomousDriving #QOGRISYS #O2072PM  

2026

04/02

Realtek Showcases High-Speed Connectivity and Intelligent Networking at Convergence India Expo 2026

Realtek Showcases High-Speed Connectivity and Intelligent Networking at Convergence India Expo 2026     From March 23 to 25, 2026, the 33rd Convergence India Expo will be held at Pragati Maidan in New Delhi. As a leading global network and multimedia chip provider, Realtek will showcase its full-stack solutions covering communication infrastructure and smart terminals at Booth C5-275, Hall 5, highlighting its latest achievements in high-speed connectivity, intelligent computing, and network convergence.     Full-Stack Ethernet Capabilities: From Core Networks to Edge Computing   In the field of communication infrastructure, Realtek continues to strengthen its Ethernet product portfolio, building comprehensive solutions from core to edge: · 100GbE Optical PHY (RTL9164 series): Designed for telecom and edge AI servers, leveraging advanced CMOS processes and optimized packaging to enhance signal stability · 10GbE Product Line (RTL8127 / RTL8159 / RTL8261D): Based on low-power SoC architecture, supporting PCIe and USB interfaces to enable smooth upgrades to 10G networks · PCIe Multi-Interface Bridge (RTL9151 series): Expands Ethernet, USB, and SATA through a single PCIe channel, enabling highly integrated system designs Overall, Realtek continues to advance in both bandwidth upgrades and high integration, addressing the growing demand for high-performance networking in data centers and edge computing.     Dual AI-Driven Evolution: Convergence of Multimedia and Edge Computing   On the smart terminal side, Realtek leverages a collaborative “edge AI + cloud AI” architecture to enhance multimedia experiences: · RTD1635 Dual-AI Set-Top Box Solution: Supports offline voice recognition and intelligent debugging, while optimizing audio and video processing through AI for clearer voice and smarter image recognition · RTD1325 4K OTT Solution: Provides a stable and smooth 4K/IPTV streaming experience · RTD1920S Low-Power Laptop Solution: Balances performance and battery life, meeting the needs of mobile work and learning scenarios These solutions reflect a shift in AI from “feature enhancement” to “experience reconstruction.”     Smart Cockpit: Multi-Screen Integration with Secure Computing In the automotive field, Realtek introduces highly integrated AI-powered smart cockpit solutions: · A single chip drives the instrument cluster, IVI system, and entertainment displays, enabling multi-screen collaboration · CPU/GPU hardware isolation architecture ensures stable operation of critical systems · Integrated NPU supports driver monitoring (DMS) and environmental perception (pedestrian/vehicle recognition) With AI integration, cockpit systems are evolving from “information display” to “proactive safety + intelligent interaction.”     Wi-Fi 7 and High-Speed Connectivity: Toward Next-Generation Wireless Experience In wireless connectivity, Realtek highlights its Wi-Fi 7 router solutions: · Supports dual 2.5GbE and 10G interfaces, preparing for future Wi-Fi 8 evolution · BE7200 solution: 4T5R architecture for stronger coverage and stability · BE6400 solution: Supports 4K-QAM and high-speed video transmission · BE3600 solution: Focuses on low power consumption and high integration, suitable for compact devices Wi-Fi is transitioning from “speed competition” to a new stage of “stable connectivity and multi-scenario adaptability.”     Bluetooth and IoT: Building a Diverse Intelligent Ecosystem Realtek’s Bluetooth product lineup spans from consumer electronics to industrial applications: · Smart dashboards and helmets: Support LE Audio and AI-based noise reduction · Peripheral solutions: Support 8K polling rate and seamless pairing · ESL (Electronic Shelf Labels): Low power consumption and secure communication · Smart wearables: Support Wi-Fi video transmission and efficient computing This ecosystem further strengthens its competitiveness in the IoT sector.     PON and Switching: Enabling Carrier-Grade Network Upgrades · Full-mode PON solutions (GPON/XGS-PON + Wi-Fi 6/7/8): Designed for home gateways and operator networks · 25G PON SoC: Meets high-bandwidth requirements for enterprise and backhaul · Switching product line: Covers L2/L3 and cloud-managed solutions, balancing performance and flexibility     From Chips to Modules: A Critical Step for Connectivity Deployment It is clear that from Ethernet and Wi-Fi to PON, Realtek is building a comprehensive communication technology foundation. However, in real-world product deployment, translating chip capabilities into end-device performance still relies on highly integrated and reliable communication modules.   At this stage, QOGRISYS leverages its mature end-to-end solution capabilities to introduce the O8852PM Wi-Fi 6 module, helping customers accelerate the entire process from solution validation to large-scale deployment. It is widely applicable in routers, gateways, industrial equipment, and smart terminal scenarios       As AI, Wi-Fi 7, and 10G networks continue to evolve, the communications industry is rapidly moving toward a new era of high bandwidth, low latency, and high reliability. With chips as the foundation, modules as the bridge, and solutions as the enabler, industry collaboration will become the key driving force behind the next generation of connectivity.     Related Video: Taiwan AI Team Showcases at India’s Largest Tech Expo #WiFi6 #WiFi7 #CommunicationModule #IoT #Ethernet #EdgeComputing #QOGRISYS #Realtek  

2026

03/25

Realtek Showcases at AWE 2026: From Wi-Fi 7 to AIoT, Upgrading Full-Scenario Connectivity Capabilities

Realtek Showcases at AWE 2026: From Wi-Fi 7 to AIoT, Upgrading Full-Scenario Connectivity Capabilities   Hsinchu, Taiwan – March 10, 2026 — At the Appliance & Electronics World Expo (AWE 2026), held from March 12 to 15, Realtek Semiconductor will present its latest technological achievements in wireless connectivity and AIoT (Booth No.: W3-3F61). At this exhibition, centered on the core theme of “Connectivity + Intelligence,” Realtek introduces a comprehensive product portfolio covering Wi-Fi 7 router platforms, ultra-low-power AI SoCs, IoT Mesh networking, and multi-scenario intelligent terminal solutions. This further strengthens its technological positioning in the smart home and IoT ecosystem.     Wi-Fi 7 Router Platform: Balancing Performance and Evolution At the wireless infrastructure level, Realtek showcases its next-generation Wi-Fi 7 AP router solutions. The platform features dual 2.5G PHY and 10G network interfaces, while also reserving upgrade capability for future Wi-Fi 8 evolution. Among them, the BE7200 solution, based on a 4T5R RF architecture, delivers more stable connectivity and wider coverage in complex environments. Meanwhile, the BE3600 solution adopts a highly integrated, low-power design, making it ideal for cost- and space-sensitive applications. Through a unified platform architecture, Realtek enables full product coverage from entry-level to high-performance segments, helping customers achieve efficient development and faster time-to-market across diverse market demands.     AIoT SoCs: Deep Integration of Low Power and Intelligence In the AIoT chip segment, Realtek highlights its Ameba Pro series multimodal AI SoCs. The Ameba Pro 3 integrates a multi-core CPU, dual AI NPUs, and Wi-Fi 6/BLE 5.3, delivering high-performance AI processing under an ultra-low-power architecture. Its innovative AI ISP enables high-quality full-color imaging even in extremely low-light conditions, making it ideal for security and vision-based applications. Meanwhile, the Ameba Pro 2, designed for battery-powered camera scenarios, further optimizes energy efficiency. It balances stable connectivity with edge AI computing and high-definition video processing, making it suitable for smart doorbells, smart home appliances, and wearable devices.     R-Mesh: Building a More Stable Whole-Home Network To address the increasing dispersion of smart home devices and the growing demand for broader network coverage, Realtek introduces its new R-Mesh IoT solution. This solution adopts a tree topology and automatically constructs optimal transmission paths through cooperative relay mechanisms between devices, maintaining stable connections even in long-distance or weak-signal environments. At the same time, its design forwards data without decryption, ensuring both network performance and user data privacy. This effectively solves the limitations of traditional Wi-Fi coverage and instability, providing a more reliable networking foundation for whole-home intelligence and large-scale IoT deployments.     Multi-Scenario Intelligent Terminal Solutions On the application side, Realtek presents a wide range of solutions across multiple scenarios: HMI Smart Display Solutions: Supporting interfaces such as MIPI, DSI, RGB, and SPI, covering diverse needs from high-end home appliances to wearable devices Bluetooth Smart Mobility Solutions: Integrating communication, audio, MCU, and display for an all-in-one design UWB Directional Remote Control Solutions: Combining UWB, IMU, and Bluetooth technologies to enable high-precision, low-latency spatial positioning and interaction These solutions are widely applied in home appliances, industrial control, and medical equipment, further expanding the application boundaries of AIoT technologies.     From Chip to Module: Accelerating Wireless Connectivity Deployment As Wi-Fi 7 and AIoT technologies continue to evolve, terminal devices are placing higher demands on wireless connectivity solutions. Beyond chip performance, stability, power efficiency, and rapid integration capabilities are becoming key factors for product deployment. In this context, QOGRISYS leveraging its extensive experience in wireless communication, has developed mature end-to-end product solutions to help device manufacturers quickly build connectivity capabilities from chip to end products.   Among them, the O8852PM Wi-Fi 6 module stands out as a key product designed for high-performance wireless connectivity needs, achieving an excellent balance between performance, stability, and integration. It is suitable for applications such as smart homes, industrial IoT, and smart gateways, providing stable and efficient wireless connectivity support for terminal devices.   As wireless communication evolves from “performance-first” to “experience-first,” connectivity is becoming the infrastructure of intelligent devices. Through the collaborative evolution of chip platforms and module solutions, the deployment of the AIoT ecosystem will further accelerate.   https://www.bilibili.com/video/BV1J1wgzJEii/?spm_id_from=333.337.search-card.all.click&vd_source=6ee4c8f8e96d252c5e52264db64e87bd #WiFi7 #WiFi6 #AIoT #Realtek #WiFi module #QOGRISYS #O8852PM  

2026

03/19

Wi-Fi 8: Entering a New Era of “Reliable Connectivity” Beyond Speed Competition

Wi-Fi 8: Entering a New Era of “Reliable Connectivity” Beyond Speed Competition     At this year’s MWC (Mobile World Congress) in Barcelona, the exhibition area dedicated to Wi-Fi 8 was not the largest. However, from an industry perspective, it may represent one of the technologies with the most far-reaching impact on the future of connectivity showcased at the event.   Unlike previous generations of wireless technology that focused primarily on peak data rates, the core objective of Wi-Fi 8 is shifting toward reliability. This change means that future wireless networks must not only be faster but also maintain stable, low-latency connections in complex environments, high-density device scenarios, and multi-service concurrent applications.     Wi-Fi 8: Reliability Becomes the Core Design Philosophy Although Wi-Fi 8 emphasizes reliability, this does not mean performance improvements are being overlooked. In fact, during MWC Barcelona this week, Qualcomm introduced several new Dragonwing Wi-Fi 8 networking platforms, whose performance specifications significantly exceed those of the previous generation. Qualcomm launched five new AI-native networking SoC platforms, covering a wide range of deployment scenarios from home networking to enterprise-grade infrastructure. The flagship platform, Dragonwing NPro A8 Elite, delivers extremely powerful networking capabilities. According to Qualcomm, it can achieve a peak capacity of up to 33 Gbps while supporting up to 1,500 simultaneous client connections. Therefore, assuming that Wi-Fi 8 is no longer focused on speed would be a misunderstanding. While its main objective is to improve network stability, a true generational upgrade still requires chipset manufacturers to make comprehensive breakthroughs in performance, capacity, and efficiency. The new platforms unveiled at MWC clearly reflect this integrated technological evolution.     The Integration of AI and Wi-Fi Is Accelerating All newly released Wi-Fi 8 platforms feature native AI capabilities. Qualcomm integrates an Agentic AI engine directly into the networking platform and leverages the Hexagon NPU to provide computing power. This enables networks to perform more intelligent traffic scheduling, interference management, and resource optimization. At the same time, the new platforms introduce a 5×5 radio architecture, supporting up to five frequency bands and 20 antenna configurations, significantly enhancing network capacity and coverage. According to official Qualcomm data, under typical transmission distances, the new platforms can deliver up to 40% higher throughput compared to the previous generation, while network latency can be reduced by approximately 2.5×. Ganesh Swaminathan, Vice President and General Manager at Qualcomm, stated: “Our new Wi-Fi 8 portfolio is designed to build the connectivity foundation for the AI era. Beyond wireless performance improvements, we have also introduced power optimization modes that can reduce energy consumption by up to 30%. The platforms will continue to operate on RDK-B and prpl middleware, enabling service providers to deploy services more rapidly.” As the number of AI applications, cloud computing workloads, and IoT devices continues to grow, future networks will require not only higher speeds but also stable, intelligent, and efficient wireless connectivity.     From Network Platforms to End Devices: Connectivity Becomes a Critical Element   The continuous evolution of Wi-Fi technology also raises higher requirements for wireless connectivity solutions on the device side. Achieving better stability, power efficiency, and system integration while maintaining strong performance has become a key focus for device manufacturers.   Against this backdrop,QOGRISYS leveraging years of expertise in wireless communication R&D, has developed mature end-to-end product solutions for the IoT and smart device markets. Among them, the O2072PM Wi-Fi module is a core product designed to meet high-performance wireless connectivity requirements, enabling device manufacturers to integrate wireless networking capabilities more efficiently.   The O2072PM module combines high performance, strong stability, and high system integration, making it suitable for a wide range of applications such as smart home devices, IoT terminals, smart gateways, and various network access equipment, providing a reliable wireless connectivity foundation for next-generation intelligent devices.     As Wi-Fi technology continues to evolve toward greater reliability and intelligence, stable and high-performance wireless connectivity solutions will become a fundamental capability for smart devices. With mature module solutions and system-level support, device manufacturers can accelerate the adoption of next-generation wireless technologies in real-world products.   Related Videos: https://www.bilibili.com/video/BV1AkPizNELB/?spm_id_from=333.337.search-card.all.click&vd_source=6ee4c8f8e96d252c5e52264db64e87bd #WiFi8 #MWC2026 #Qualcomm #WiFiModule #IoT #SmartHome #QOGRISYS #O2072PM  

2026

03/11

From the “Laboratory” to the “Sky” How Hangzhou Is Powering the Takeoff of the Low-Altitude Economy

  Embodied intelligence accelerating its start, the low-altitude economy gaining momentum, and artificial intelligence penetrating public governance and livelihood services—amid a new wave of technological and industrial transformation, Hangzhou is leveraging institutional innovation, scenario openness, and ecosystem collaboration to accelerate the journey of scientific achievements from laboratories to the market. The city is striving to build a nationally influential hub for artificial intelligence innovation.   Last October, under the theme of “building a city of innovation and vitality,” the General Office of the Hangzhou Municipal Party Committee openly addressed challenges such as talent attraction, policy coordination, and insufficient application scenarios during a televised public governance program. These issues drew widespread public attention. Have the rectifications been implemented? Have the commitments been fulfilled? Recently, a follow-up inspection group composed of municipal departments, deputies to the People’s Congress, CPPCC members, and media representatives conducted on-site investigations and provided interim answers.   Breaking Bottlenecks in Scenario Data Ensuring Innovation Goes Beyond the Laboratory   In Linping District’s Computing Power Town, an intelligent robot named “Turing No.1” has become a new “colleague” in daily cleaning operations. From automatically identifying stains to completing cleaning tasks, human–machine collaboration has moved from concept to reality within minutes.   For technology-driven enterprises, real-world application scenarios are not only showcases but also critical data sources for rapid iteration. In the past, insufficient scenario openness was a frequent concern. Today, as public spaces such as citizen service centers, airports, and streets are gradually opened to enterprises, companies can validate and optimize technologies in real environments, accelerating the transition from “usable” to “highly usable.”   Relevant departments in Linping District have also introduced systematic support measures for technology enterprises, ranging from innovation funds and computing subsidies to talent and land guarantees. Together, these form a long-term support mechanism covering the journey “from 0 to 1,” providing institutional backing for enterprises to overcome growth bottlenecks.   Amplifying the “First-to-Fly” Advantage Building a Hangzhou Model for the Low-Altitude Economy At the Future Science Park of Nanhu in Yuhang District, the “China Fly Valley” has officially been approved as a civil drone test flight and operation base, offering one-stop services such as R&D testing, flight verification, training, and education for low-altitude industry enterprises. This platform directly addresses long-standing pain points faced by drone companies, including high testing costs and fragmented test sites.   Companies deeply engaged in the drone sector generally believe that the scaled development of the low-altitude economy requires not only application scenarios but also the parallel improvement of standards and infrastructure. Currently, Yuhang District is promoting the accelerated deployment of drones in urban inspection, emergency firefighting, and agricultural and forestry operations through measures such as standardized takeoff and landing points, testing service systems, and fiscal support—continuously strengthening its “first-mover” industrial advantage.   Expanding the Boundaries of Intelligent Services Bringing Technological Achievements into Public Life   From exoskeleton robots entering parks to intelligent assistive devices being included in age-friendly subsidy programs, Hangzhou is pushing artificial intelligence technologies from “laboratory results” into “doorstep services.” To address the challenge that some technological products are well-received but not widely adopted, the government is helping enterprises enhance market visibility and expand application reach through platform matchmaking, scenario trials, and coordinated mechanisms.   This demand-driven innovation path—where scenarios feed back into technology development—is gradually forming Hangzhou’s distinctive model of “localized technology commercialization,” laying a practical foundation for the deep integration of artificial intelligence and the low-altitude economy.   From “Able to Fly” to “Flying Stably” The Connectivity Foundation Behind Low-Altitude Applications Takes Shape   As drones are increasingly used in urban governance, emergency response, and industrial services, stable, long-range, and interference-resistant wireless connectivity has become critical infrastructure for the scaled development of the low-altitude economy. In complex electromagnetic environments and cross-regional operations, the reliability of communication systems directly determines the safety boundaries and efficiency limits of low-altitude applications.   Against this backdrop, Shenzhen Ofeixin Technology Co., Ltd. is closely following the trend of the low-altitude economy. Targeting low-altitude flight application scenarios, Qogrisys has launched a mature, end-to-end product solution—the O9201UDH drone communication module—specifically designed for low-altitude flight and capable of seamlessly supporting such applications. Based on a Wi-Fi 6 and Bluetooth 5.4 architecture, the module supports an external FEM solution, with maximum transmit power up to 30 dBm, significantly enhancing link budget and coverage. It also supports 5 MHz and 10 MHz narrowband operating modes, offering clear advantages in long-distance, low-interference, and high-stability scenarios.   Whether for city-wide drone inspection networks or campus-scale, clustered low-altitude deployments, the O9201UDH strikes a balance between power, stability, and bandwidth flexibility, providing a reliable device-side wireless connectivity foundation for the low-altitude economy. When policy, scenarios, and technology work in synergy, the low-altitude economy is no longer just about “taking off,” but about flying stably, farther, and longer. Hangzhou stands at the forefront of this transformation.    

2026

01/16

Qualcomm Launches a New Generation of Full-Stack Robotics Technologies, Accelerating the Adoption of Physical AI for Home and Humanoid Robots

At the recently concluded CES, a clear consensus emerged: Robots are no longer mere “concept demonstrations” of technology, but are rapidly becoming intelligent productivity tools capable of large-scale deployment.   Chip and platform vendors represented by Qualcomm are reshaping robot architectures through “Physical Artificial Intelligence (Physical AI)” — spanning computing, perception, decision-making, communication, and collaboration to form truly end-to-end system capabilities. This transformation enables robots to continuously learn, understand their environments, and make autonomous decisions, covering a wide range of form factors from personal service robots and logistics or retail AMRs to full-size humanoid robots.   From “Point Intelligence” to “System-Level Intelligence”   The core of next-generation robot architectures is no longer the simple stacking of computing power, but system-level collaboration that combines high performance, low power consumption, and strong connectivity.   The latest robot platforms showcased at CES commonly feature: - High-efficiency computing architectures optimized for edge AI - Heterogeneous computing capabilities supporting complex perception and motion planning - Industrial-grade safety, reliability, and real-time design - Open software stacks capable of working with large models (VLA / VLM)   These architectural changes allow robots to evolve from passively executing commands into intelligent agents capable of understanding, reasoning, and decision-making, accelerating deployment across manufacturing, logistics, warehousing, and service scenarios.   A Key Bottleneck in Large-Scale Robot Deployment Is Being Underestimated   As computing platforms and AI capabilities mature, connectivity is becoming one of the decisive factors determining whether robots are truly usable in real-world environments.   Whether humanoid robots or AMRs, real deployments impose unprecedented requirements on wireless connectivity: - Ultra-low latency for real-time perception, remote collaboration, and cloud-edge coordination - Ultra-high bandwidth for multi-channel vision, radar, and sensor data transmission - High reliability for stable communication in complex industrial environments - Multi-device concurrency for robot fleet coordination and scheduling   This means traditional Wi-Fi solutions are approaching their limits. Next-generation robots require future-oriented connectivity technologies as their “neural network.”   Wi-Fi 7 Is Becoming a Standard Capability for Next-Generation Robots   Across multiple robot demonstrations at CES, Wi-Fi 7 (802.11be) was frequently highlighted. Compared with previous standards, Wi-Fi 7 offers particularly significant value for robotic applications: - 320 MHz ultra-wide bandwidth for high-throughput data transmission - Multi-Link Operation (MLO) to significantly reduce latency and jitter - Higher-order modulation (4K QAM) to improve spectral efficiency - Better suitability for high-density industrial and commercial environments with many devices online simultaneously   Wi-Fi 7 is not merely a speed upgrade — it is a connectivity foundation purpose-built for the Physical AI era.   From Computing to Connectivity, Truly Complete Robot Systems Are Just Taking Shape   As high-performance robot processors mature and ecosystem partners continue to join, the robotics industry is entering a new phase — transitioning from “working prototypes” to “replicable and scalable intelligent systems.”   In this process, whoever can first provide mature, stable, and mass-producible next-generation communication modules will occupy a critical position in the robotics value chain.   Building Truly Deployable Wi-Fi 7 Connectivity for the Next Generation of Robots   Against this industry backdrop, QOGRISYS has launched the O2072PM Wi-Fi 7 communication module.   O2072PM is a Wi-Fi 7 + Bluetooth 6.0 tri-band 2×2 MIMO module designed for high-end robots, industrial equipment, and intelligent terminals. It supports 2.4 / 5 / 6 GHz bands with up to 320 MHz bandwidth across all bands and delivers peak data rates of up to 5.8 Gbps, meeting stringent requirements for multi-sensor fusion, high-definition video transmission, and low-latency control.   More importantly, in the Chinese market, QOGRISYS is one of the pioneers in the Wi-Fi 7 module space. Only a handful of vendors truly possess comprehensive Wi-Fi 7 engineering capabilities, mass-production readiness, and real-world deployment experience — and QOGRISYS has already taken the lead by bridging the gap from solutions to modules, and from laboratories to real application scenarios.   As robots move beyond exhibition halls into the real world, stable, high-performance, and future-ready connectivity will become indispensable infrastructure. O2072PM is the connectivity module built for this era.  

2026

01/15

Qualcomm Completes Acquisition of Ventana, Accelerating RISC-V Ecosystem Layout

  On December 10, Qualcomm announced the completion of its acquisition of Ventana Micro Systems, further strengthening its technological footprint in the RISC-V architecture and high-performance computing fields. The global leading chip and wireless connectivity platform supplier Qualcomm announced it has officially completed the acquisition of Ventana Micro Systems. As a leader specializing in high-performance RISC-V architecture, the addition of Ventana will significantly enhance Qualcomm's computing power layout for the AI era, heterogeneous computing architecture design capabilities, and open ecosystem building capabilities, providing a stronger underlying foundation for future smart terminals, industrial equipment, and edge computing systems. Architecture Capabilities, Accelerating Heterogeneous Computing Innovation As demands for AI inference, local computing, security isolation, and low-power processing continue to rise, the requirements for CPU scalability and energy efficiency in terminal devices are constantly increasing. Ventana specializes in scalable RISC-V compute chiplets, and its team is deeply involved in advancing open instruction set standards, which will provide Qualcomm's Oryon CPU architecture with further room for architectural innovation. Qualcomm stated that the new team will collaborate with the existing CPU R&D department to promote the development of more versatile, efficient, and open processor capabilities for future mobile terminals, XR, automotive electronics, industrial equipment, and AI edge nodes. Enhancing System-Level Design Capabilities, Expanding Future SoC Product Roadmap With the integration of Ventana's technology, Qualcomm's future SoC architectures will possess stronger modular expansion capabilities, enabling more efficient coordination among processors, DSPs, AI engines, and connectivity subsystems. The company stated that this move will significantly enhance its competitiveness in fields such as data center edge, industrial control, and high-efficiency computing, and will attract more partners through a more open RISC-V ecosystem, promoting the standardization of next-generation system platforms Driving Industry Collaboration with an Open Ecosystem, Providing More Flexible Technological Paths for Terminal Devices Ventana's entry not only completes a key piece of Qualcomm's puzzle in the RISC-V ecosystem but also means that future OEMs, ODMs, and IoT device manufacturers will have access to more open and customizable reference architectures. With more controllable core IP, a more transparent ecosystem model, and a more efficient computing power structure, Qualcomm hopes this strategic move will accelerate the iteration of various smart devices in terms of security, energy efficiency, and local intelligent processing. Integrating Industry Chain Innovation, Accelerating Next-Generation Wireless Terminal Development As computing power and architectural capabilities improve, the demand for wireless connectivity in next-generation terminals is also upgrading. To ensure stable device performance in high-density, low-latency, multi-link environments, QOGRISYS has launched the O2072PM tri-band Wi-Fi 7 + Bluetooth 6.0 module based on the Qualcomm platform. This module features deep optimizations on 320MHz, 4K QAM, eMLSR multi-link, and Qualcomm's advanced RF architecture, enabling more reliable high-bandwidth connections in homes, industrial settings, campuses, and smart devices. With its compact packaging and PCIe design, the O2072PM provides terminal manufacturers with a quickly mass-producible, stable-performance, future-ready Wi-Fi 7 connectivity foundation.  

2025

12/25

LitePoint 2025: Driving Next-Generation Wireless Innovation with Wi-Fi 8 and Optical Communication Testing

Amid accelerating convergence between AI and wireless technologies, LitePoint hosted its annual technical seminar in Hsinchu and Taipei in September 2025 under the theme “Intelligent Connectivity Without Boundaries: Test-Driven Innovation.” As a global leader in wireless test solutions, LitePoint highlighted key challenges of the multi-technology era and showcased advances in Wi-Fi 8, 5G RedCap, Bluetooth 6.0, UWB, and optical communication testing. Figure 1. Glenn Farris, Global Vice President of Sales, LitePoint   Multi-Technology Convergence as a Core Industry Trend The event began with remarks from Glenn Farris, LitePoint’s Vice President of Global Sales, who emphasized that expanding wireless applications and increasingly complex deployment environments are placing higher demands on testing systems. Adam Smith, Vice President of Marketing, noted that AI-driven wireless innovation is moving toward multi-technology collaboration, where 5G RedCap, Wi-Fi, Bluetooth, and UWB will coexist and complement one another. Security, stability, and interference resistance will be essential competitive factors for future devices.   Smith added that while 6G development remains cautious, 5G FWA is rapidly expanding globally. Meanwhile, mid- and high-end devices are upgrading to Wi-Fi 7, laying the foundation for Wi-Fi 8. Wireless experience metrics will shift from being speed-centric to prioritizing low latency, high reliability, and coordinated multi-device operation.   Wi-Fi 8: From High Speed to High Reliability A MediaTek representative detailed four major enhancements coming with Wi-Fi 8: Enhanced Long Range (ELR), Coordinated Spatial Reuse (Co-SR), Dynamic Subchannel Operation (DSO), and Non-Primary Channel Access (NPCA). These features aim to strengthen Wi-Fi performance in crowded, high-interference environments. ELR improves connectivity at greater distances; Co-SR enhances efficiency in multi-router Mesh deployments; and NPCA improves link stability under heavy interference. MediaTek expects Wi-Fi 8 to become foundational for home, enterprise, and industrial scenarios, supported by LitePoint’s comprehensive testing ecosystem.   Optical Communication and CPO Rising AI compute demands are accelerating bandwidth growth in data centers, making optical communication a key topic at the seminar. Quantifi Photonics presented parallel testing solutions for silicon photonics and co-packaged optics (CPO). With 800 Gbps and 1.6 Tbps modules entering mass production, full-chain testing from wafer to finished system is becoming increasingly critical. Quantifi demonstrated multi-channel automated testing on a PXI platform, emphasizing its importance for large-scale optical module manufacturing.   Bluetooth 6.0, UWB, and RedCap: Joint Evolution of Multi-Radio Technologies The seminar also highlighted advancements in Bluetooth 6.0, UWB 802.15.4ab, and 5G RedCap. Bluetooth 6.0 enables sub-meter precision for tracking and indoor navigation; UWB’s new narrowband auxiliary link enhances long-distance stability; and 5G RedCap/eRedCap supports wider IoT adoption with lower power consumption and costs. LitePoint’s IQxel, IQgig, and IQcell platforms support comprehensive testing for these technologies. Figure 2. Zhiwei Huang, Deputy Director of Applications Engineering, LitePoint   IIoT and Edge AI: New Opportunities Through Industry Collaboration A roundtable discussion explored the integration of IIoT and edge AI. Experts noted that high-reliability wireless connectivity is becoming essential for AMR robots, smart warehousing, medical systems, and urban infrastructure. Wi-Fi 7, 5G RedCap, GNSS, and UWB together form the communication backbone for next-generation intelligent devices. Mature testing platforms will be key to enabling large-scale deployment.   As multi-technology collaboration deepens, wireless capability is becoming a core device attribute. Whether it is Wi-Fi 8’s high reliability or Wi-Fi 7’s rapid adoption, the ability of devices to evolve with network upgrades will be crucial. Device manufacturers are now asking: in complex, high-concurrency environments, what wireless foundation is needed for devices to fully leverage next-generation networks?   QOGRISYS is advancing its Wi-Fi 7 module development using LitePoint’s MX Wi-Fi 7 test platform. The new O2072PM and O2072PB tri-band Wi-Fi 7 + Bluetooth 6.0 modules provide optimized 320 MHz bandwidth, eMLSR multi-link performance, 4K QAM, and CSI sensing. These features enhance performance in high-density and low-latency environments. With a compact design and PCIe interface, O2072PM integrates easily into smart devices, industrial equipment, and IoT nodes, providing a strong foundation for the transition into the Wi-Fi 7 era.    

2025

12/22

Huawei Nanjing Research Institute's Integrated Sensing and Communication Smart Campus Project Selected as WAA Excellent Case, Setting a New Benchmark for Industry Digital-Intelligent Transformation

Figure1: WAA Presents the WLAN Integrated Sensing and Communication Excellent Case Certificate to Huawei The "Digital-Intelligent Campus Innovation Practice Meetup", focused on network experience upgrades and intelligent innovation for office campuses, concluded successfully at Huawei's Nanjing Research Institute. Industry organizations, enterprise customers, and ecosystem partners gathered on-site for in-depth exchanges on new campus network technologies, architectures, and scenarios, and experienced a series of innovative implementations such as smart meeting rooms, inspection care, asset inventory, and AI navigation. Notably, the Huawei Nanjing Research Institute AI Integrated Sensing and Communication Smart Campus (hereafter referred to as "AI Digital-Intelligent NRI") was successfully selected as the "WLAN Integrated Sensing and Communication Excellent Case" by the World Wireless LAN Application Development Alliance (WAA). Latest Network Technologies First Applied to Own Campus, Creating a "Replicable" Future Campus Model In his speech, Zhao Shaoqi, President of the Campus Network Domain, Data Communication Product Line at Huawei, stated that Huawei consistently prioritizes applying the latest technologies to its own campuses, adhering to the practical spirit of "testing one's own parachute first" to create a benchmark model for the industry to reference. The "AI Digital-Intelligent NRI" project is precisely based on this philosophy. By integrating "Wi-Fi + Sensing" and "Wi-Fi + IoT" capabilities, it infuses powerful intelligence and visualization capabilities into the 10 Gigabit campus network, setting a new direction for digital-intelligent upgrades for industry customers. WAA: Excellent Case Provides Demonstrative Value for Global Campus Network Construction WAA Secretary-General Yang He pointed out that the alliance continuously promotes global WLAN industry innovation, supporting campus network construction through white papers and evaluation methodology systems. The emergence of cases like "AI Digital-Intelligent NRI" provides the industry with a high-quality reference model that can be promoted top-down, accelerating the large-scale application of integrated sensing and communication technology in smart campuses. Deep Integration with Business Scenarios, Driving Campuses Towards "Fully Digital, Fully Perceptive, Fully Intelligent" In a keynote speech, Lu Xin, Vice President of Huawei's IT Platform Service Department, shared the construction philosophy of "AI Digital-Intelligent NRI". Centered around typical scenarios like office work, access, inspection, and security, the project leverages Huawei's Galaxy AI 10 Gigabit Campus Network and HIS Digital Operating System. Through digital element aggregation, AI governance, and scenario-based applications, it achieves a comprehensive improvement in employee office experience and enables more efficient, real-time intelligent operational capabilities for the campus. Chen Jiefu from the Shanghai Institute of Architectural Design & Research also shared his experience in intelligent building renovation for urban structures. He mentioned that in the Shanghai Design Mansion project, Huawei's 10 Gigabit Campus Office Network Solution was adopted. The All-Optical Ethernet architecture and Wi-Fi 7 Integrated Sensing and Communication technology together built a stable wireless foundation, enabling the building to achieve a genuine digital advancement. AI-Driven Network Evolution, Achieving "Dual Upgrade" in Operations and Experience Chen Yongxing, Vice President of the Campus Network Domain, Data Communication Product Line at Huawei, emphasized that the introduction of AI has significantly enhanced campus network security, application performance, wireless experience, and operational management. Huawei aims to create a campus network foundation characterized by high stability, high intelligence, and high operational efficiency for its customers through deep synergy between technology and business. The "Tiangang Laboratory" open house on the day allowed attendees to deeply experience the real-world application results of integrated sensing and communication capabilities in office scenarios. For example, using CSI sensing technology to enable smart meeting room features like "lights on when people enter, off when they leave" and "automatic release when unoccupied"; achieving precise security inspections at night by sensing human figures; enabling automatic asset inventory in warehouses, significantly reducing loss probability; realizing visual, self-optimizing, and intelligent diagnosis full-process operations through iMaster NCE and the AI Network Agent; and the AI navigation function enabling meter-level precise location of office resources, bringing great convenience to large-campus work. Figure2 Chen Yongxing, Vice President of the Campus Network Domain, Data Communication Product Line at Huawei This series of achievements not only demonstrates the maturity and replicability of integrated sensing and communication technology but also reflects the crucial transition of campus networks from "connectivity" to "intelligence". Looking Forward: O2072PM Empowers More Smart Campus Devices Towards Wi-Fi 7 As campus networks rapidly evolve from "high-bandwidth" to "intelligent sensing" and "multi-service integration", various terminal devices are also moving towards higher performance, lower latency, and stronger sensing capabilities. In response to this trend, QOGRISYS introduces the O2072PM Tri-Band Wi-Fi 7 + Bluetooth 6.0 Module, providing more flexible and powerful wireless foundational capabilities for the new generation of smart campus terminals. The O2072PM adopts a tri-band architecture and supports key Wi-Fi 7 features such as 320MHz bandwidth, eMLSR multi-link operation, 4K QAM, and CSI sensing. It can deliver more stable and controllable connection experiences in high-density offices, smart inspection terminals, indoor positioning devices, and general IoT equipment. Its compact package design allows various campus terminals to integrate Wi-Fi 7 capability with lightweight design, accelerating the large-scale deployment of "smart scenarios + wireless sensing" technology and bringing higher value to smart campus construction.

2025

12/18

Enterprise Wireless Enters into the "Intelligent Era": Future Network Evolution Directions from Cisco's Trends

As enterprise-grade wireless networks rapidly advance towards intelligence, automation, and visualization, global vendors are re-evaluating the foundational capability planning for next-generation Wi-Fi and the Internet of Things (IoT). At the WWC conference in Dubai, Cisco executives systematically outlined key future directions for enterprise wireless: simpler network assurance, more intelligent AI-powered operations and maintenance (O&M), lower-latency wireless backhaul, higher-level security, and the accelerated evolution of enterprise spaces from "traditional connectivity" to "intelligent spaces." AI-Driven Enterprise Wireless: From Reactive Response to Proactive Optimization Enterprise wireless technology is undergoing a profound transformation. Bahador Amiri, Senior Director of Wireless Engineering at Cisco, pointed out that IT team sizes are generally being compressed while the number of devices continues to grow, necessitating that network assurance becomes more automated and predictable. He stated that enterprise wireless is transitioning from a manual, reactive model to an AI-based automated assurance model: networks proactively analyze status, perform automated remediation, and predict potential risks in the background, significantly improving overall availability. The AI-RRM (AI Radio Resource Management) demonstrated by Cisco is a typical case of this shift. This technology, trained on real traffic trends, can automatically optimize wireless resource allocation based on user mobility, device density, and scenario changes, reducing the complexity of traditional spectrum and power tuning. Simultaneously, the capability for "natural language query of network status" is becoming an important direction for next-generation network O&M, enabling IT personnel to perform diagnostics and issue commands in a more intuitive way. Post-Quantum Cryptography Gradually Becoming Baseline Beyond the trend of intelligentization, security has also become a significant focus for the next phase of enterprise wireless. With the development of quantum computing, traditional cryptographic systems face new challenges. At the conference, Cisco emphasized its investment in the PQC (Post-Quantum Cryptography) direction, aiming to ensure network security even in the context of potential future quantum attacks. Strengthening Role of Wi-Fi in Critical Scenarios In industry scenarios such as transportation, energy, and industrial automation, the demand for "ultra-reliable, ultra-low latency" is continuously increasing. Cisco is configuring its high-end access points to support proprietary ultra-low latency wireless backhaul technology, enabling Wi-Fi to undertake more tasks akin to "quasi-5G communication," granting wireless a higher priority in mission-critical operations. Moving from Fragmented Systems Towards a Unified Platform Cisco revealed that its access points used for IoT connectivity have grown significantly, from 1 million in 2023 to 4.9 million. Previously, IoT connectivity was long fragmented by disparate protocols and independent systems. Today, enterprises are progressively integrating towards unified platforms, utilizing a single AP to carry more sensing, tracking, positioning, and energy management capabilities. In this direction, Cisco Spaces has become a typical solution, supporting functions like asset tracking, navigation, environmental monitoring, and occupancy analysis through a unified platform. To underpin these capabilities, Cisco has integrated four Wi-Fi radio modules, BLE 6.0, UWB, and GPS into its flagship AP 9178, transforming it into a multi-modal information entry point. . (Bahador Amiri, Senior Director of Wireless Engineering at Cisco, delivering a speech at the WWC conference in Dubai on November 19, 2025) Wireless Module Requirements for New Scenarios Are Evolving With the growth of intelligent spaces, low-latency backhaul, and concurrent multi-service demands, the requirements for wireless modules in new-generation enterprise terminals and IoT devices are also changing: higher performance, lower latency, smaller size, and stronger multi-modal compatibility are becoming mainstream market directions. Following this trend, QOGRISYS has launched the O2072PB Tri-Band Wi-Fi 7 + Bluetooth 6.0 Module. This product features a 2×2 MIMO and 320MHz ultra-wide bandwidth design. It achieves a peak rate of 5.8Gbps in the 6GHz band and supports key Wi-Fi 7 capabilities such as eMLSR, Multi-Link Operation, 4K QAM, and 802.11az distance measurement. Its compact 15×13×2.3 mm package and PCIe interface enable lightweight adaptation for enterprise terminals, intelligent space devices, and industrial IoT, accelerating the deployment of next-generation high-performance wireless capabilities in more scenarios.

2025

12/15

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