Quality WiFi7 Module & WiFi HaLow Module manufacturer

By 2026, edge AI will no longer be a concept that needs to be "defined," but a reality that is being "quantified"—and the speed and scale of this quantification far exceed the expectations of most analysts a year ago. Edge AI is moving from "proof of concept" to "large-scale deployment." I. Qualcomm's Strategic Move: Dragonwing Dual-Processor Chip Released to Boost Edge AI On the eve of the 2026 IFA Berlin, Qualcomm officially launched two processors , the Dragonwing Q-2390 and IQ-2390. The Q-2390 highly integrates edge AI inference, cellular connectivity, positioning, and display support into a single chip, aiming to lower the development threshold for edge AI devices. The IQ-2390 focuses on enhancing machine vision acceleration, TSN (Time-Sensitive Networking) support, and has a wide operating temperature range of -30°C to +115°C , designed for demanding scenarios such as industrial automation, machine vision, and energy management. Qualcomm's core intention in this announcement is to reduce the complexity of implementing edge AI in industrial scenarios through chip-level integration and industrial hardening. II . Edge AI Market: A Trillion-Dollar Track Accelerating The market size of edge AI is expanding at an astonishing rate. According to a recent report by Global Market Insights, the global edge AI market is valued at approximately $25.2 billion in 2025, projected to reach $30.9 billion in 2026, and is expected to grow to $225.5 billion by 2035, representing a compound annual growth rate (CAGR) of 24.7% from 2026 to 2035. Data from Mordor Intelligence also corroborates this trend: the edge AI hardware market is projected to grow from $25.08 billion in 2025 to $30.74 billion in 2026, reaching $68.73 billion in 2031 . The global edge AI market (hardware + software + services) is approaching $47-50 billion in size by 2026, with a year-on-year growth rate exceeding 28% . IDC predicts that the overall edge computing market will reach $450 billion by 2029, with AI being the primary growth engine . From a regional perspective, the Asia-Pacific region is the fastest-growing edge AI market globally . China, as a core growth engine, leads the world in shipments of edge devices equipped with domestically produced computing chips. Bulk procurement in areas such as smart security, smart cities, and factory automation continues to drive demand, with the domestic market growing at an annual rate exceeding 34% . III . The AI-driven transformation of the module industry: From "connectivity" to "computing + connectivity" The explosive growth of the edge AI market is profoundly reshaping the competitive logic of the module industry. Traditional module manufacturers heavily rely on the number of connections and shipment growth, but this model is encountering bottlenecks. In the first quarter of 2026, shipments of AI embedded cellular IoT modules declined by 17% year-on-year, marking the first decline after 12 consecutive quarters of growth in the market. The penetration rate of AI modules in global cellular IoT modules is currently only about 6%—meaning that edge AI modules are still on the verge of explosive growth, rather than a red ocean market . Meanwhile, leading companies in the industry are accelerating their transformation towards "connectivity + intelligence." Quectel Wireless Solutions' revenue in the first half of 2026 reached RMB 15.259 billion, a year-on-year increase of 32.16%, with automotive, intelligent, and solutions businesses accounting for 46.76% of revenue. Furthermore, the gross profit margin of this segment (21.42%) is significantly higher than that of traditional communication module businesses (16.28%) . Andrew Zignani, Senior Research Director at ABI Research, pointed out that wireless connectivity is no longer just about connecting devices; it's also about enabling scalable edge AI in consumer, enterprise, and industrial markets . IV . Trends in Module Products Driven by Edge AI The large-scale deployment of edge AI is reshaping the definition of module products from three dimensions. Trend 1: From "Communication Modules" to "Computing Modules" . The integration of AI edge computing chips has become the core differentiator for modules in 2026. Shipments of modules supporting edge inference exceeded 80 million units in 2025, and this proportion is expected to rise to 35% of total module shipments by 2030. The compound annual growth rate of high-performance computing modules is projected to reach 60% over seven years, and the proportion of intelligent and AI modules in cellular IoT modules will continue to increase. Trend Two: Industrial-grade wide operating temperature range becomes the "entry ticket ." Wide operating temperature capability reflects the stringent reliability requirements of modules in industrial edge AI scenarios. Industrial-grade modules typically require an operating temperature range of -40℃ to +85℃. In scenarios such as oil and gas, power, and outdoor infrastructure, wide operating temperature capability directly determines whether the equipment can operate stably in real-world environments. Trend 3: Multi-technology integration becomes standard . Edge AI scenarios often require simultaneous support for multiple connectivity methods—industrial automation needs Wi-Fi/Bluetooth for inter-device communication, energy management needs PLCs to solve the problems of transmission through walls and over long distances, and industrial gateways need cellular networks to upload data to the cloud. Modules with single communication methods are being replaced by integrated solutions that combine multiple modes . V. Qogrisys's Product Strategy: AI Capabilities Connected to the Base Amid the industry wave of module manufacturers moving towards AI, QOGRISYS's strategic path clearly demonstrates the industry logic of integrating "connectivity + computing". Qogrisys's strategic path can be summarized as follows: using high-speed connectivity as the foundation and edge AI as the incremental factor, to build an intelligent module product matrix covering multiple scenarios. Wi-Fi 7 Module: Full Product Lineup In the Wi-Fi 7 field, O2072PM and O2072PB, two Wi-Fi 7 + Bluetooth 6.0 combo modules based on the Qualcomm QCC2072 chip, fully support 4K QAM, 320MHz channels, MLO (Multi-Link Operation), with a peak rate of 5.8Gbps and eMLSR enhanced multi-link switching. The O2072PM uses an M.2 Key E interface (22×30mm), making it suitable for high-end robots and industrial equipment. From an industry trend perspective, Wi-Fi 7 is rapidly entering a large-scale deployment phase. IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN-dependent AP revenue. The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next stage . Multi-platform and multi-scenario coverage Qogrisys's core R&D team has long been deeply involved in mainstream global wireless chip platforms such as Qualcomm, Realtek, and MediaTek, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing . This multi-platform, full-stack technical capability enables Qogrisys to provide compatible connectivity solutions across different customers' main control solution ecosystems. In terms of application scenarios, Qogrisys's product matrix has extended to multiple core areas of edge AI: industry and intelligent manufacturing , modules such as O9201PM have completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in scenarios such as industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, and digital signage. robotics and embodied intelligence , the ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form an invisible infrastructure for cloud-edge-device collaboration—robots upload sensor data to edge servers in real time for VLA model inference, receive decision commands, and execute them instantly. Qogrisys's Wi-Fi 7 module product line already covers the needs of high-end robots and industrial equipment. VI. Trend Analysis: Three Certain Directions for Edge AI Modules Based on Qualcomm's chip release trends, three definite trends can be identified in the field of edge AI modules: First, AI capabilities will become a standard feature rather than an optional feature for modules. As the report "Edge Intelligence 2026: The First Year of Large-Scale Deployment" points out, 2026 has become a crucial turning point for edge intelligence, moving from proof-of-concept to large-scale deployment. The market space for pure connectivity modules lacking AI acceleration capabilities will continue to shrink. The seven-year compound annual growth rate of intelligent modules and AI modules reached 60% and 28% respectively , and this difference in growth rate is the strongest evidence of this. Second, industrial scenarios represent the most certain high-value market for edge AI modules. The industrial AI accelerator chip market is expanding at an average annual growth rate of 40%. Industrial visual inspection is migrating from traditional algorithms to deep learning, and predictive maintenance is generating explosive demand for edge inference computing power. Third, the convergence of "connectivity + computing" modules will become the infrastructure of the AIoT era. Wi-Fi 7 provides a connection base with ultra-low latency and ultra-high throughput, while edge AI provides localized intelligent decision-making capabilities. When the coverage density of Wi-Fi 7 and the computing power density of edge AI converge at the device end, the module will be upgraded from a "communication component" to an "intelligent computing node".    

On August 31, 2026, a report by CCTV Finance shook the entire semiconductor industry. According to industry research data, the demand for domestically produced AI chips in 2026 was approximately 4 million units, while actual deliveries were only around 3 million units, leaving a capacity gap of millions . Some high-end computing power companies already had orders booked three years into the future .   What is the connection between this "computing power famine" in the cloud computing field and the Wi-Fi, Bluetooth, and PLC modules shipped every day? The answer lies hidden in three transmission paths. I. Three transmission paths of computing power shortage Path 1: Structural shortage of memory chips The insane demand for high-bandwidth memory (HBM) from AI servers is reshaping the global DRAM supply landscape. Memory manufacturers are prioritizing capacity for the more profitable AI-grade HBM while cutting production of traditional memory chips such as LPDDR4 . According to TrendForce data, traditional DRAM contract prices rose by 90% to 95% quarter-on-quarter in the first quarter of 2026. Entering the second quarter, general DRAM contract prices continued to rise by 58% to 63% quarter-on-quarter, while NAND Flash contract prices rose by 70% to 75% . Changxin Memory Technologies, a leading memory chip company, reported revenue of 150.3 billion yuan in the first half of the year, a staggering 873.64% year-on-year increase. For Wi-Fi and Bluetooth modules that require the integration of DRAM and Flash, this means that the BOM cost is systematically increased . Path Two: Cost Resonance Across the Entire Industry Chain The surge in demand for AI chips has not only driven up storage prices but has also triggered a chain reaction of price increases across the entire industry chain. On July 1, 2026, ASE Technology Holding Co., Ltd., the world's leading semiconductor packaging and testing supplier, announced another round of price increases for its packaging products, with the highest increase exceeding 20% , primarily targeting advanced packaging categories such as CoWoS and FoCoS . There is still approximately a 10% supply-demand gap in advanced packaging technologies . From components such as crystal oscillators, PCBs, MLCCs, and inductors, to semiconductor stages such as chip packaging and testing, substrates, and silicon wafers, rising costs are passed down through each stage to the module stage. The BOM cost of each Wi-Fi/Bluetooth module is passively increasing . Path Three: The "Siphoning Effect" of Production Capacity AI chips are not only consuming advanced process capacity, but also taking up a large amount of mature 8-inch wafer capacity. Wafer fabs and packaging and testing plants are prioritizing capacity for high-profit AI computing power orders, squeezing the capacity of IoT chips. Yole projects the 2.5D/3D advanced packaging market to reach nearly $35 billion by 2030. Industry experts generally anticipate that the tight supply and demand situation for advanced packaging will continue . Counterpoint predicts that the average selling price of cellular IoT modules will face upward pressure in the second half of 2026 , primarily due to the continuously rising cost of memory . This means that the production capacity of IoT chips such as Wi-Fi and Bluetooth may face long-term pressure, with tight supply and extended delivery times becoming the norm. II. A Tale of Two Extremes: Industry Differentiation Amidst Computing Power Shortages The "Ice" Side: Short-Term Pain The most direct impact of the AI chip shortage on the module industry has already begun to appear in the data. According to a report released by Counterpoint Research, shipments of embedded AI cellular IoT modules declined by nearly 17% year-over-year in the first quarter of 2026 , marking the first decline after 12 consecutive quarters of growth . In 2025, this category maintained a year-over-year growth of 19% . As memory costs rise, the average selling price of embedded AI cellular modules has increased by double digits , forcing module manufacturers to raise prices. Ultimately, the increase in hardware costs has affected demand across various application areas . Meanwhile, global shipments of cellular IoT modules grew by only 4% year-on-year in the first quarter of 2026 , marking the first time they had fallen to single digits after seven consecutive quarters of double-digit growth . Shipments in the Chinese market declined by 2% year-on-year in the same quarter . The "Fire" Side: Long-Term Opportunities However, short-term cost pressures have not changed the industry's long-term direction. A report by Shanxi Securities points out that IoT modules are evolving from basic communication functions towards high computing power and intelligence. Counterpoint Research predicts that by 2030, the penetration rate of artificial intelligence in cellular modules will reach 25% . "Artificial intelligence will no longer be limited to a few niche applications, but will become a standard feature." In the Wi-Fi sector, the global Wi-Fi module market size is projected to reach $16.82 billion in 2026, representing a year-on-year growth of 17.9% . The market share of Wi-Fi 7 modules will rapidly climb to 17.2%, with an estimated 234 million units shipped throughout the year . IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN AP revenue, a significant increase compared to 11.8% in the first quarter of 2025. The Wi-Fi Alliance predicts that global Wi-Fi 7 device shipments will reach approximately 1.1 billion units in 2026 . III. The Response Logic of Module Manufacturers: From "Passive Pressure" to "Proactive Breakthrough" Faced with the cost impact across the entire industry chain caused by the shortage of cloud AI chips, Shenzhen Qogrisys has transformed external pressure into an upgrade impetus through its contingency strategies: On the supply chain side , we have established deep ecological collaborations with chip manufacturers such as Qualcomm, Realtek, Wuqi, and HiSilicon, upgrading the procurement relationship to a "joint development + capacity lock-in" model, so as to ensure supply stability during periods of tight capacity through large-scale operations and long-term cooperation. On the product side , the company aims to mitigate risks through full-scenario coverage. The Wi-Fi 7 module (O2072PM/ O2072PB ) is positioned to capitalize on the next-generation high-speed connectivity window, the PLC module (3121N-H/S130N-ISI) serves as a cost "ballast" with low storage dependence, and the domestic innovation module (O9201SB/O9201PM) enters the 2.66 trillion yuan domestic substitution market. At the same time, the company is also developing cutting-edge technologies such as Wi-Fi HaLow and AIoT modules. On the service side , the company is shifting from "selling standard products" to "selling deeply customized solutions," enhancing customer loyalty with a complete hardware platform foundation and full-chain technical services. On the compliance side , products have obtained certifications from multiple countries, including FCC, CE, and SRRC, circumventing trade barriers. This cost shock caused by the shortage of AI computing power is accelerating the weeding out of weaker players in the module industry, while deep ecosystem collaboration, a full-scenario product matrix, and customized service capabilities are becoming the core barriers for module solution providers to weather the cycle. IV. The "Safe Haven" Effect of PLCs In this round of AI chip shortages, PLC (Power Line Carrier) modules are relatively less affected . PLC modules have a lower reliance on high-bandwidth memory, unlike high-end Wi-Fi/Bluetooth modules which require the integration of large-capacity DRAM and Flash. PLC main control chips mostly use mature manufacturing processes, and although they also face some capacity constraints, the extent is far less than that of AI-related chips. In major PLC application scenarios such as smart lighting and smart homes, the requirements for real-time performance and stability are higher than computing power, and the impact of the AI chip price surge is relatively indirect. When Wi-Fi/Bluetooth modules face a comprehensive cost increase, PLC modules become a relatively cost-effective and stable connection solution. V. From “Selling Connectivity” to “Selling Connectivity + Computing”: A Paradigm Shift in the Module Industry This computing power shortage reveals a deeper industry trend: the module industry is moving from "single connectivity" to comprehensive competition involving "connectivity + computing + ecosystem". According to data from IoT Analytics, the number of connected IoT devices worldwide reached approximately 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030. This increase in the number of devices is only the first layer of change; more importantly, an increasing number of IoT devices are beginning to possess AI algorithms, NPUs, local inference, voice interaction, and edge computing capabilities . This means that the amount of data generated and processed by terminal devices is constantly increasing, which places higher demands on wireless modules— not only to "transmit faster", but also to "calculate closer and connect more stably" . VI. Conclusion While everyone is chasing the "brain" of computing power, even the most powerful brain needs a sensitive "neural network" to perceive the world and transmit instructions. Wireless modules are an indispensable neural network in this AI era. As CCTV Finance reported, the underlying reason for this round of growth is not just passive price increases due to "shortage," but also proactive choices driven by "ease of use." Domestically produced chips have crossed a critical point in terms of performance and stability, moving from "usable" to "easily usable." The same logic is unfolding in the wireless module industry— modules are moving from "connectivity" to "good connectivity," and from "connectivity" to "connectivity + intelligence . "  

From August 26th to 28th, 2026, the 25th IOTE International Internet of Things Exhibition was grandly held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall) . With a massive exhibition area of 80,000 square meters, this year's exhibition brought together over 1,000 high-quality exhibitors from around the world, attracting 48,109 industry professionals and over 3,000 overseas visitors on the first day . The exhibition, themed "Edge Intelligence, Scenario Deepening, and Green Sustainability," was a major collaboration between AGIC 2026 Shenzhen International General Artificial Intelligence Industry Expo and GERX Global Embossed Intelligent Robot Industry Expo, achieving deep integration of IoT technology with general AI and robot intelligence .   The strongest signal released by this exhibition is that edge AI and wireless connectivity are moving from "evolving independently" to "deeply coupled". Hall 12 showcases top achievements such as AI chips, edge computing, and embodied intelligent robots , while Hall 10 focuses on industrial IoT and communication modules . The coordinated layout of the two halls itself constitutes a spatial interpretation of the "AI + connectivity" industrial logic. I. Industry Logic: Why "Connectivity" Must Embrace "Computing" The integration of edge AI and wireless modules is essentially a technological evolution driven by industry demands. The centralized model, which relies solely on cloud computing power, is encountering multiple bottlenecks: industrial control scenarios require millisecond-level response times, which cloud round-trip latency cannot meet; medical and security scenarios are highly sensitive to data privacy, and uploading data to the cloud poses compliance risks; and the continuous uploading of data by massive IoT devices is driving up bandwidth and cloud computing costs. The standard architecture for AI implementation is becoming one where the terminal handles perception, the edge handles inference, and the cloud handles training and coordination—each with its own specific role. This trend is clearly supported by data. According to a report released by IIM Information, the global wireless module market is expected to reach $48.62 billion in 2026, a 17.8% increase from $41.27 billion in 2025. Among these developments, the integration rate of AI-dedicated acceleration chips in modules continues to climb , and shipments of emerging AI edge inference modules (integrated NPU) exceeded 12 million units in the second quarter of 2026 , marking a shift in modules from simple transmission units to computing power nodes. Meanwhile, Wi-Fi 7 modules support 320MHz bandwidth and 4096-QAM modulation, and are expected to see significant adoption in routers, VR/AR devices, and other applications in 2026 . Wireless modules are evolving from "data transmission pipelines" to "intelligent connectivity bases" with local intelligent processing capabilities. The competitive logic of next-generation wireless communication modules is undergoing profound changes: from single Wi-Fi connectivity to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence . II. IOTE 2026 Exhibition Confirms: Integration Has Become an Industry Consensus At IOTE 2026, leading global wireless connectivity companies clearly outlined the industry landscape of this trend through their respective product portfolios. From chip manufacturers to module solution providers, the core positions of their booths were generally occupied by edge AI-related solutions—whether it was a wireless SoC integrating AI/ML hardware accelerators or a main control platform for embodied intelligence and generative AI terminals, the strategic focus of leading players in the industry has clearly shifted towards dual-core capabilities of "communication + computing". Among the numerous innovative product awards presented concurrently with the exhibition, edge AI computing modules and high-performance AI chips occupied prominent positions. Several exhibitors showcased edge AI demonstration solutions supporting features such as local keyword wake-up and real-time face and gesture recognition. Meanwhile, the exhibition of supporting technologies such as high-precision wireless sensing and multi-protocol fusion further enriched the capabilities of wireless connectivity in AI scenarios. The exhibition clearly demonstrates that competition in the wireless connectivity field has evolved from a simple contest of "communication performance" to a comprehensive competition of "communication + computing" capabilities . Simply providing high-speed, stable data transmission channels is no longer sufficient to create a differentiated advantage. The ability to provide computing power support and intelligent collaboration for edge AI applications on top of connectivity capabilities is becoming a new benchmark for measuring the technological strength of module manufacturers. III. Application Scenarios: Where to Deploy Edge AI + Wireless Modules The integration of edge AI and wireless modules is being rapidly implemented in multiple vertical scenarios.   Industrial manufacturing is one of the most mature scenarios for the integration of edge AI and wireless modules. Hall 10 of the exhibition focuses specifically on industrial IoT and embedded solutions, connecting three major technology tracks: intelligent sensing, IoT communication, and precise positioning . In intelligent manufacturing scenarios, AGV/AMR autonomous transport vehicles, industrial sensors, and monitoring systems have rigid requirements for low-latency wireless connectivity and local AI inference capabilities. Wireless modules need to provide stable connectivity in high-interference industrial environments, while providing a communication foundation for AI applications such as visual inspection and predictive maintenance on the equipment side. Smart homes and smart buildings are another important scenario. In the smart home scenario, local AI processing means that voice commands can be responded to without being uploaded to the cloud, which reduces latency and protects user privacy—this is the core value of edge AI. Smart retail and smart cities also benefit from this trend. The exhibition comprehensively covered more than 20 core application scenarios, including smart logistics and smart consumption . In the smart retail scenario, AI POS terminals, smart vending machines, and other devices need to complete inference tasks such as image recognition and behavior analysis locally, while relying on wireless modules to achieve data synchronization and remote management with the cloud. Drones and robots represent emerging high-growth sectors. Drone solutions integrate Wi-Fi modules, 5G communication, and edge AI computing capabilities, supporting applications such as long-distance image transmission, remote control, real-time image recognition, and intelligent monitoring. With the rapid development of embodied intelligent robots, the demand for high-bandwidth, low-latency wireless connectivity and local AI inference capabilities will continue to surge. IV. Qogrisys's Solution Layout: A "Smart Connection Dock" with Wi-Fi 7 + Bluetooth 6.0 In light of this industry trend, the layout of QOGRISYS Technology Co., Ltd., headquartered in Shenzhen, is highly representative. Founded in 2014, Qogrisys Technology focuses on the communication connectivity industry, committed to providing customers with comprehensive IoT connectivity solutions. The company partners upstream with chip manufacturers such as Qualcomm, Realtek, Woogi, and HiSilicon, and downstream with end customers in smart home, industrial IoT, and automotive electronics sectors. Its main products cover 2.4G/5.8G Wi-Fi modules, BLE modules, PLC modules , RF antenna components, and smart hardware solutions. Core Product: O2072PM Wi-Fi 7 + Bluetooth 6.0 Combination Module Qogrisys has launched two Wi-Fi 7 + Bluetooth 6.0 combo modules, the O2072PM and O2072PB , based on the Qualcomm FastConnect C7700 (chip code QCC2072) chip . The QCC2072 is designed to provide ultra-high-speed connectivity, with peak speeds up to 5.8Gbps, and features a 320MHz channel, 4K QAM, and Multi-Link Operation (MLO) capabilities . The O2072PM uses an M.2 Key E standard interface (22×30mm) , fully supporting 4K QAM, 320MHz channels, and MLO (Multi-Link Operation), with a peak rate of 5.8Gbps . The Wi-Fi portion complies with IEEE 802.11a/b/g/n/ ac /ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with each band supporting up to 4096 QAM modulation . The Bluetooth portion is compatible with Bluetooth 6.0, supporting dual-mode Bluetooth, Tx beamforming, MRC, LE Audio, and 2 Mbps Bluetooth Low Energy (BLE) . Of particular note is that the O2072PM also supports high-precision distance measurement (HADM/channel detection) , providing new technological possibilities for scenarios such as indoor positioning and asset tracking. The O2072PM is clearly designed to meet the "connectivity foundation" requirement in edge AI scenarios—providing stable, high-bandwidth, and low-latency wireless connectivity for high-performance edge platforms. With the continuous improvement of edge AI computing power, the low latency and high reliability of Wi-Fi 7 are becoming the core communication foundation for edge computing. The higher speed and lower latency offered by Wi-Fi 7 enable the module to achieve a better product experience across a wider range of devices . Domestic platform adaptation capabilities Qogrisys's foray into the Wi-Fi 6 field is also noteworthy. Its O9201 SB/ O9 1 01 SA/ O9201PM series modules have completed driver adaptation and verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in industrial tablets, edge computing gateways, industrial control equipment, and other scenarios. This demonstrates Qogrisys's deep technical accumulation in adapting to domestic platforms and wireless connectivity. In terms of product portfolio, Qogrisys is building a complete wireless connectivity solution covering Wi-Fi 4/5/6/7 and BLE, following the path of "using a full hardware platform as the foundation and vertical scenarios as the direction" . V. Outlook: The Era of "Intelligent Connectivity" in the Module Industry Looking ahead to 2026-2030, the industry will enter the era of "intelligent connectivity." Edge AI modules have become a new growth engine for the wireless module industry. According to an IIM report, the global wireless module market is projected to exceed $90 billion by 2030, with edge AI and satellite direct connection modules expected to grow at a compound annual growth rate of over 30%. The deep integration of edge AI and wireless modules is not an optional "icing on the cake," but an inevitable path for industry development . For wireless module manufacturers, their ability to synergize with edge AI platforms beyond mere connectivity, and to provide a highly reliable communication foundation for edge AI applications, will determine their position in the next stage of competition. The IOTE 2026 exhibition showcases a true picture of this ongoing transformation—from "connecting everything" to "intelligently connecting everything." Qogrisys Technology, with Shenzhen as its origin, Wi-Fi 7 + Bluetooth 6.0 as its connectivity platform, and full-scenario coverage as its goal, is contributing its strength to this transformation.