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I. Centralized Procurement Signal: The Iteration of Wi-Fi 7 for Home Gateways Enters Substantive Stage The centralized procurement of home network terminals completed by China Telecom and China Mobile in 2026 sends a clear signal to the industry: the role of Wi-Fi 7 in operators' home gateways and FTTR products is shifting from "flagship configuration" to "mainstream configuration" .   In China Mobile's 2026-2027 smart home gateway centralized procurement, Tianyi Technology was shortlisted as the third successful bidder for Package 1 and the sixth successful bidder for Package 2, with an estimated value of 208 million yuan. In China Telecom's FTTR centralized procurement, Tianyi Technology won two packages, with an estimated value of 273.6 million yuan. Jiulian Technology was shortlisted for China Mobile's GPON and 10G GPON packages, with market shares of 14.63% and 12.20%, respectively. The significance of these centralized procurements lies in the fact that operators' technology choices for home network terminals directly determine the upstream module demand structure for OEMs over the next 12 to 18 months . From a penetration rate perspective, the proportion of Wi-Fi 7 in FTTR terminals is rapidly increasing. According to IIM Information's "Global FTTR All-Optical Network Industry Outlook In-Depth Analysis Report," the proportion of FTTR terminals supporting Wi-Fi 7 is expected to reach 38.6% in 2026 , an increase of 17.2 percentage points compared to 2025. This growth rate is significant in the iteration of communication terminal technology, reflecting operators' clear willingness to invest in the evolution from "whole-house gigabit" to "whole-house Wi-Fi 7." II. Engineering Constraints of FTTR Architecture on RF Modules The core architecture of FTTR is a distributed network consisting of a main gateway and multiple sub-routers. Fiber optic backhaul solves the wired bandwidth problem between nodes, but the wireless coverage quality of each node directly determines the user's true perception of "gigabit throughout the house." This architecture imposes three engineering constraints on the radio frequency module that differ from those in a single-router scenario. First, latency consistency during multi-node handover. When users move between rooms, terminal devices need to complete roaming handovers between different sub-routers. Traditional Wi-Fi roaming mechanisms experience service interruptions on the order of 100ms during handover. For real-time applications such as video calls and online games, this interruption is sufficient to cause noticeable experience degradation. Wi-Fi 7's Multi-Link Operation (MLO) and its Enhanced Single-Radio Implementation (EMLSR) significantly reduce handover interruptions through link pre-sense and fast handover mechanisms. Huawei explicitly claims an ultra-low latency of 10ms in its Wi-Fi 7 FTTR solution . This is not just marketing hype, but a scenario-based realization of Wi-Fi 7 MLO capabilities. Second, scheduling efficiency under dense device concurrency. Modern homes typically have more than 20 devices online simultaneously, and in mid-to-high-end scenarios, this can reach over 40. While FTTR's distributed architecture expands coverage, it also means more radio frequency nodes operating in the same spectrum space, leading to increased inter-node interference and terminal scheduling complexity. Wi-Fi 7's optimized OFDMA resource scheduling and multi-link redundancy mechanisms offer far greater value in this scenario than in a single-router environment. Third, matching the fiber backhaul bandwidth. When the fiber backhaul between the FTTR main gateway and sub-routers provides 2.5Gbps or even higher bandwidth, if the wireless side still relies on Wi-Fi 6's 160MHz channel capability, it will become a bottleneck for end-to-end throughput. Wi-Fi 7's 320MHz channel and tri-band capability enable the wireless side to have the basic bandwidth supply to match the fiber backhaul. In this architecture, the role of the RF module is to transform the chip's protocol capabilities into a mass-producible, testable, and reliably deliverable RF subsystem. The chip provides "what it can do," while the module determines "how much it actually accomplishes." III. Engineering Parameters and Scenario Adaptation Analysis of O2072PM/PB The O2072PM and O2072PB modules designed by Qogrisys based on the Qualcomm QCC2072 (FastConnect C7700) platform correspond to the engineering constraints of the aforementioned FTTR/gateway scenarios in terms of parameters . In terms of RF capabilities , the O2072PM supports the IEEE 802.11be standard, 2×2 MIMO, and tri-band 2.4/5/6GHz concurrent operation. The 6GHz band channel bandwidth can reach 320MHz , achieving a peak rate of 5.8Gbps with 4096-QAM modulation . This rate level provides ample margin in current FTTR gateway designs, matching fiber backhaul bandwidth and reserving scheduling space for multi-user concurrent scenarios. In terms of latency control , the O2072PM supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) . eMLSR, in engineering terms, means that in a single-radio hardware architecture, it uses an auxiliary radio (Aux Radio) to monitor the status of multiple frequency band links, quickly switching to a backup link when the primary link encounters interference or congestion, without undergoing a complete scan-association process . Qualcomm describes Aux Radio in its technical documentation as "automatically shutting down or waking up the primary radio by monitoring the TX/RX status," while also performing low-latency background scanning to reduce the impact of scanning on throughput . For cost-sensitive and space-constrained design scenarios such as FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture. In terms of power management , the independent listening mechanism of the Aux Radio allows the main radio to enter a low-power state when idle, and is only awakened when the auxiliary radio detects a signal that needs to be transmitted or received. This mechanism has practical significance for the heat dissipation design and long-term operating power consumption of FTTR sub-routers—distributed networking means that multiple nodes are continuously online, and the cumulative effect of power consumption of a single node cannot be ignored. In terms of packaging , the O2072PM uses the M.2 2230 Key E standard interface, while the O2072PB is a 13×15mm surface-mount package . These two forms correspond to different overall hardware architectures: the M.2 interface is suitable for slot-based gateway/router products, while the surface-mount version is suitable for high-density onboard sub-routers or space-constrained FTTR slave gateways. This packaging option itself demonstrates engineering adaptability , as different OEMs' hardware platforms differ significantly in interface definitions, PCB space, and heat dissipation paths. Regarding platform compatibility , the O2072PM is compatible with Intel x86 platforms for kernel versions 5.15.24+, 6.1.99, and 6.12.0, and also has V1 compatibility with OpenWrt . This information is valuable for OEMs in their selection process: the maturity of driver compatibility directly impacts product development cycles and post-mass production stability risks . Mature compatibility with Linux platforms means that gateway solutions based on x86 or ARM Linux can complete RF subsystem debugging in a shorter time, while OpenWrt compatibility provides a foundation for customized routing/gateway products. IV. The Value Position of the Module Segment in the Industry Chain According to IIM Information's "Global and China WiFi Module Market Analysis and Survey Report," the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026 , with Wi-Fi 7 module shipments expected to climb to 17.2% , reaching approximately 234 million units for the year. IndexBox's market analysis further indicates that Wi-Fi 7 modules have a 40% to 70% price premium compared to their predecessors , and high-end modules (tri-band, 320MHz, 16+ spatial streams) are priced between US$250 and US$1500 . This pricing structure reflects an industry reality: the added value of the module segment largely depends on its "conversion efficiency" to chip capabilities . The same Wi-Fi 7 chip can exhibit significantly different RF performance, heat dissipation characteristics, power consumption curves, and driver compatibility in designs from different module manufacturers. As a carrier-grade product, FTTR gateways have higher requirements for long-term operational stability, environmental adaptability, and batch consistency than consumer-grade products. When selecting module solutions, OEMs focus not only on "Wi-Fi 7 support" but also on "whether the nominal performance can be stably reproduced under mass production conditions." From a supply chain perspective, Qualcomm's QCC2072 provides the foundational capabilities for the protocol layer as a chip platform, while module manufacturers focus on RF front-end matching, antenna design coordination, power management optimization, driver adaptation and verification, and engineering implementation for different package types. The value of this layer lies not in the chip definition stage, but in the product realization stage. V. Conclusion: Module Selection Logic in Centralized Procurement Scenarios The successful procurement of home gateways by China Telecom and China Mobile in 2026 marks the official launch of large-scale deployment of Wi-Fi 7 in operator home network terminals. The distributed architecture of FTTR and the product requirements for carriers impose engineering constraints on radio frequency modules that differ from those on consumer-grade routers. In a supply chain system driven by centralized procurement, the competitiveness of a module solution depends on the comprehensive performance of three dimensions: protocol compatibility with FTTR scenarios, hardware adaptability across multiple packaging forms, and driver maturity under the Linux/OpenWrt platform. The O2072PM's eMLSR implementation, Aux Radio power management, and tri-band 320MHz capability technically address the core needs of FTTR sub-routers and home gateways; its M.2 and surface-mount dual packaging forms cover the hardware architecture choices of different OEMs; and its Intel x86 and OpenWrt driver adaptation provides a verifiable starting point for complete system development. The transmission cycle of operator centralized procurement dictates that OEMs' module selection decisions often occur during the solution design phase before the procurement announcement. Within this time window, module solutions with a complete RF parameter system, multiple packaging options, and verifiable driver adaptation records occupy a more advantageous position in OEMs' technical evaluations .  

In the first half of 2026, China's newly connected photovoltaic (PV) capacity reached 71.77 million kilowatts, of which distributed PV accounted for 42.22 million kilowatts, or approximately 58.8%. Globally, according to the "Global and China Distributed PV System Market In-Depth Research and Consulting Analysis Report (2026)" released by IIM Information, as of the first half of 2026, the global cumulative installed capacity of distributed PV had exceeded 480 GW, with the Asia-Pacific region contributing more than 55% of the increase. It is projected that by the end of 2026, the global annual new installed capacity will reach between 98 GW and 115 GW, representing a year-on-year increase of approximately 12% . The large-scale production of distributed photovoltaics is propelling PLC (Power Line Carrier Communication) modules into a certain incremental market. This certainty stems from the convergence of three factors: mandatory policy support, the uniqueness of the technological path, and the completion of commercial validation. I. Policy-driven: Component-level safe shutdown becomes a global mandatory requirement The core application scenarios for PLC modules in the photovoltaic field are module-level rapid shutdown and module-level monitoring. These two functions are directly driven by mandatory standards in major global markets. In the North American market, NEC 2026 further revised the fast shutdown requirements of Article 690.12. According to SurgePV's NEC 2026 Fast Shutdown Compliance Guide, the 2026 version of NEC retains the existing voltage limit targets: conductors outside the array boundary must be reduced to no more than 30V within 30 seconds, and conductors inside the array boundary must be reduced to no more than 80V within 30 seconds or use certified PVHCS equipment . This means that each photovoltaic module needs to be equipped with a shutdown device with PLC communication capabilities. In the European market, the EN50065-1 standard clearly specifies communication equipment applicable to the frequency range of 3kHz to 526.5kHz on low-voltage power lines. Its typical applications include DC bus communication between photovoltaic panels and inverters in photovoltaic power generation systems. In the Chinese market, the new national standard GB/T 34932-2025 officially came into effect on April 1, 2026. Under the "four requirements" for dispatching, it mandates that new grid-connected equipment must support standard interfaces, collect data at a frequency of no less than one point every five minutes, and enforce identity authentication, data encryption, and access control. In 2026, the EU carbon tariff adjustment mechanism enters the mandatory compliance phase. Traditional inverter-level monitoring cannot meet the accuracy requirements for component-level carbon footprint tracing, making component-level power electronics and intelligent monitoring a crucial technological path for obtaining accurate carbon emission data . The core policy shift is that PLC communication modules are transforming from "optional accessories" in photovoltaic systems into "compliance necessities." Whether it's North America's rapid shutdown, Europe's module-level monitoring, or China's "four capabilities," all require reliable data communication links between module-level devices. II. Technology Adaptation: Why PLCs are Irreplaceable in Photovoltaic Applications The physical structure of a photovoltaic system dictates the choice of communication scheme. Each photovoltaic panel is connected to a DC power line, and each inverter is connected to the grid via an AC power line. PLC communication can fully reuse existing power lines for data transmission, eliminating the need for additional communication cables or wireless access points. Metal roofs and complex electromagnetic environments pose significant challenges to the reliability of wireless communication, while PLCs, using power lines as the physical medium, possess strong anti-interference capabilities. Although RS485 bus solutions offer reliable communication, they require additional communication cabling within the photovoltaic array, increasing installation costs, construction time, and potential points of failure. In photovoltaic module-level shutdown and monitoring scenarios, PLCs offer virtually no equivalent alternatives. III. Commercialization Validation: From Technology Introduction to Mass Shipment The photovoltaic PLC module market has completed the crucial leap from "technology verification" to "mass shipment. " PLC chips have achieved mass production in the photovoltaic module-level power electronics field , and module-level shutdown devices and power optimizers with built-in PLC modules are being exported in bulk to overseas markets such as Southeast Asia, and are widely used in residential and commercial distributed photovoltaic scenarios. This large-scale market achievement demonstrates that PLC communication technology has undergone long-term operational verification in the complex electromagnetic environment of the photovoltaic DC side, maintaining a high level of communication online rate . From a market perspective, each GW of photovoltaic power requires approximately 2 million photovoltaic panels. If each panel is equipped with one shutdown chip, the global annual demand exceeds 400 million panels. Currently, North America and Europe have mandated that distributed photovoltaic projects have module-level rapid shutdown capabilities. If China introduces similar mandatory standards, it will bring an even larger volume of incremental demand. IV. Photovoltaic Scenarios Solution for Qogrisys PLC Modules Qogrisys has established a clear product portfolio in the PLC module field, with both the S130N-ISI and 3121N-H modules being officially listed as recommended solutions for photovoltaic communication scenarios . S130N-ISI: A compact solution for shutdown and optimizer The S130N-ISI is based on the Leadcore VC6330 chip design, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module uses an LCC package, measuring only 20.6×12.6×2.5mm, and features an integrated on-chip wire driver, low power consumption, strong noise immunity, and an operating temperature range of -40°C to +85°C . This module supports dual communication protocols: China SGCC Q/GDW 11612 and IEEE 1901.1, and supports BPSK, QPSK, and 16QAM modulation . The S130N-ISI's ultra-small size and low power consumption make it suitable for integration into space-constrained photovoltaic (PV) shutdown devices or power optimizers. These shutdown devices are powered by the PV panels themselves and need to continuously monitor PLC signals on the power line at microwatt-level power consumption; the S130N-ISI's low-power design aligns with this requirement. 3121N-H: Multi-node networking solution for component-level monitoring The 3121N-H is developed based on the HiSilicon PS0211 chip, operating in frequency bands of 0.5-3.7MHz and 2.5-5.7MHz. The protocol is based on a subset of the IEEE 1901.1 standard, with an application layer rate of 80Kbps, and is equipped with a 200MHz ARM Cortex-M3 processor. A single CCO supports up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be formed within 10 seconds . The 3121N-H's multi-node networking capability adapts to the unified access requirements of multiple components and devices in distributed photovoltaic systems. In component-level monitoring solutions, the 3121N-H can serve as a PLC monitoring module within the component junction box, collecting voltage, current, and temperature data in real time and coupling it to the string via DC power lines. At the bus layer, this module can replace the traditional RS485 bus, enabling wireless bidirectional communication with inverters, data acquisition units, and cloud platforms. Conclusion Qogrisys has listed "new energy" as an independent application area, with its products clearly covering photovoltaic panels, photovoltaic inverters, energy storage, and charging piles. In scenarios such as smart streetlights, smart parking, and charging piles, Qogrisys's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal . Currently, Qogrisys is targeting emerging markets in Southeast Asia .    

9th to 11th, 2026 , the 27th China International Optoelectronic Exposition (CIOE), in conjunction with the IICIE International Integrated Circuit Innovation Expo and Elexcon Shenzhen International Electronics Exhibition & Embedded Systems Exhibition, will be held concurrently at the Shenzhen World Exhibition & Convention Center. The three exhibitions will be held together, covering a total exhibition area of 320,000 square meters, bringing together more than 5,000 exhibitors and attracting over 240,000 professional visitors . This is a grand industry event covering the entire optoelectronics, semiconductor, and electronics industry chain.   For the Wi-Fi module industry, this exhibition sent a clear signal: the value proposition of Wi-Fi 7 modules is undergoing a fundamental shift—from providing "high-speed connectivity channels" to becoming "industrial-grade intelligent nodes" that integrate sensing, positioning, and edge intelligence. The Industry Logic Revealed by the Collaboration of Three Exhibitions: Why "Sensory Integration" Has Become a Must-Answer Question The essence of the three exhibitions working together is a forced "alignment" of the upstream and downstream of the industry chain. In the past, the optoelectronic industry focused on optical chips and devices, the semiconductor industry focused on chip design and advanced packaging, and the electronics industry focused on the development of terminal equipment and embedded systems. The three major industry systems were fragmented, with different technical standards and poor supply and demand matching, forming obvious industry barriers . The rapid popularization of large-scale AI models and supercomputing clusters has changed this landscape. The industry's demand for ultra-high bandwidth, ultra-low power consumption, and ultra-high integration has increased significantly. The previously independent industry boundaries have been completely broken down. Optical engines and switching chips are deeply integrated, and optoelectronic devices are directly embedded inside chip packages, forcing optical design, semiconductor processes, advanced packaging, and electronic systems to develop in a coordinated manner . This trend is particularly evident in the Wi-Fi module industry. Wi-Fi 7 is not only a generational upgrade in communication speed, but also provides a technological foundation for "integrated communication and sensing" due to its introduction of Multi-Link Operation (MLO), 320MHz channels, and fine-grained timing measurement capabilities. The China Academy of Information and Communications Technology (CAICT) explicitly proposed in its research report on 10 Gigabit AI Park Networks that wireless access points should be upgraded to "integrated communication and sensing" anchor points, natively integrating IoT access, environmental perception, and terminal positioning capabilities to break the data silos and protocol fragmentation dilemmas caused by traditional siloed network construction. The competitive logic in the module industry has therefore undergone a qualitative change: connectivity itself is "depreciating," and "intelligent connectivity" that integrates perception and edge intelligence is the new pricing power. The triple capability leap of Wi-Fi 7 modules The "integration" of Wi-Fi 7 modules is not a functional aggregation, but rather a fusion of capabilities at the underlying chip architecture level. Solutions represented by Qualcomm FastConnect C7700 (chip code name QCC2072) integrate three capabilities that previously belonged to different radio frequency domains on a single chip. The first capability: an industrial-grade leap in Wi-Fi 7 communication performance. The QCC2072 supports 320MHz channel bandwidth, 4096-QAM modulation, and 2×2 MU-MIMO, achieving a peak PHY rate of 5.8 Gbps . Its introduced Enhanced Multi-Link Single Radio (eMLSR) technology allows data to be transmitted through other links when interference occurs in a certain frequency band, effectively maintaining high throughput and low latency . This is crucial for deterministic transmission requirements in industrial environments. The second capability: Wi-Fi sensing and high-precision positioning. This chip solution supports IEEE 802.11az Wi-Fi ranging. 802.11az uses Time-of-Flight (ToF) technology to measure the actual distance between the device and the access point, replacing the traditional RSSI fingerprint comparison method, achieving sub-meter positioning accuracy of less than 1 meter. In industrial scenarios, this means that the Wi-Fi module can not only transmit data but also accurately sense the device's location and spatial status. The third capability: Bluetooth 6.0 Channel Sounding and Aux Radio. Bluetooth 6.0 introduces Channel Sounding technology, improving Bluetooth positioning accuracy to sub-meter levels . Simultaneously, this solution is equipped with a dedicated Wi-Fi Aux Radio for background scanning and low-latency listening while the main radio is in sleep mode, balancing power consumption and response speed . The integration of these three capabilities enables a single Wi-Fi 7 module to possess integrated "communication + sensing + positioning" capabilities for the first time. VOXMICRO's AIRETOS C27 industrial-grade module is a typical example of this architecture. It integrates capabilities that were previously belonging to three independent radio frequency domains into a single module package, enabling industrial OEMs to shift their design goals from "adding a radio" to "accomplishing more tasks with a single industrial-grade module" . Market data: The inflection point for the large-scale deployment of Wi-Fi 7 modules has arrived. The global Wi-Fi module market is currently experiencing a period of structural growth. According to market research reports, the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026, a 17.9% increase from US$14.27 billion in 2025. Among these, Wi-Fi 7 modules are rapidly increasing their market share to 17.2%, with projected shipments reaching 234 million units for the year . From a broader perspective, the global Wi-Fi 7 module market was valued at $3.8 billion in 2025 and is projected to reach $22.6 billion by 2034, representing a CAGR of 21.9% . The Wi-Fi Alliance predicts that global shipments of Wi-Fi 7 devices will reach approximately 1.1 billion units in 2026, of which approximately 196 million will be IoT devices. The Industrial Internet of Things (IIoT) is one of the fastest-growing sub-sectors. Global demand for IIoT modules is projected to reach $9.81 billion, with an annual growth rate of 17.8% . The reliability requirements of industrial applications—wide operating temperature range, interference resistance, and deterministic low latency—are driving the accelerated evolution of Wi-Fi 7 modules from consumer to industrial applications. Qogrisys early strategic moves: from chip solutions to module productization O2072PM and O2072PB, launched simultaneously by O2072 with the QCC2072 chip, is not simply an expansion of the product line, but rather an engineering choice for different deployment scenarios. The O2072PM uses an M.2 Key E standard interface (2230 specification), a 2T2R dual-antenna design, and supports both Wi-Fi and Bluetooth operation. This module incorporates all the functions of the QCC2072: the Wi-Fi portion covers the full IEEE 802.11a/b/g/n/ac/ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with a channel bandwidth of up to 40 MHz at 2.4 GHz, 160 MHz at 5 GHz, and 320 MHz at 6 GHz. The Bluetooth portion is compatible with Bluetooth 6.0, supporting LE Audio, 2 Mbps BLE, and high-precision distance measurement (HADM channel sounding) . In terms of driver adaptation, the O2072PM has been adapted and is running stably on Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB uses a 13×15mm surface mount package, targeting space-constrained embedded scenarios. Its core functions are identical to the O2072PM, also supporting a peak data rate of 5.8 Gbps, a 320MHz channel, 4K QAM modulation, Bluetooth 6.0 channel detection, and 802.11az Wi-Fi ranging . The O2072PB explicitly supports various operating modes including AP/AP+STA/P2P/Monitor, providing a PCIe interface for Wi-Fi and a UART/PCM interface for Bluetooth, supporting Class 1 and Class 2 power level transmission without the need for an external power amplifier . The differentiated positioning of the two modules reflects a profound change in the module industry: as chip capabilities become highly integrated, the core competitiveness of module manufacturers is shifting from "how much throughput can be achieved" to "whether the full capabilities of the chip can be efficiently released under specific physical constraints." The M.2 interface module targets industrial PCs, gateways, and edge computing devices that require standard slots and replaceable designs; the surface-mount module targets embedded terminals with extremely limited PCB space, requiring module manufacturers to possess more refined engineering capabilities in RF design, antenna matching, and thermal management. Validation in industrial scenarios: from technical feasibility to deployment Wi-Fi 7 sensing technology is being practically validated in industrial scenarios. In the mining sector, Shanxi Coal International's Hequ Open-pit Coal Mine's pilot project of a 10-gigabit optical network based on 50G-PON + Wi-Fi 7 has passed the Ministry of Industry and Information Technology's acceptance test. Fifty-seven Wi-Fi 7 gateways have been deployed in the core area, allowing dispatchers to remotely control unmanned mining trucks several kilometers away via Wi-Fi 7 tablets. In the field of smart buildings, the Longgang International Art Center uses Wi-Fi 7 + CSI sensing technology to accurately detect the presence of people, achieving a reduction of over 15% in venue energy consumption and a 30% improvement in operation and maintenance efficiency . These cases share a common characteristic: Wi-Fi networks are no longer just for data transmission, but have also become the infrastructure for environmental sensing and spatial positioning. For the module industry, this means that downstream customers' needs are upgrading from "providing stable wireless connectivity" to "providing integrated capabilities that converge connectivity, sensing, and positioning." Conclusion The industry landscape revealed by the three exhibitions is clear and definite: the demand for AI computing power is driving the deep integration of the optoelectronics, semiconductor, and embedded electronics industries, and Wi-Fi 7 modules are at the intersection of this integration. The shift from "high-speed connectivity" to "integrated sensing" is not just a product iteration, but a systemic reconstruction of the value proposition of the module industry. For Wi-Fi module manufacturers, their ability to establish competitive advantages in chip solution integration, cross-platform adaptation, and industrial-grade reliability will determine their position in the new industry cycle. However, the real test lies in whether module manufacturers can continue to efficiently translate chip capabilities into deployable industrial-grade products as "integrated sensing" transitions from a technological trend to an industry standard.