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On November 8, 2026, Guangdong Province released the Action Plan for Accelerating the Innovative Development of the Whole-Home Smart Industry (2026–2028). It is China’s first provincial-level dedicated policy for whole-home intelligence, and it sets a clear target: by the end of 2028, whole-home smart systems will cover over 30,000 housing units and public building spaces across the province, while the provincial home appliance manufacturing sector’s revenue is expected to exceed RMB 1.1 trillion.   For module suppliers, the policy’s most important signal is not the coverage number. It is the explicit inclusion of “reliable communication” among the priority technology areas for provincial R&D support, alongside spatial intelligence, edge intelligence, and multimodal perception. That phrase sits at the exact intersection of what Shenzhen OFEIXIN Technology does: Wi-Fi, Bluetooth, and PLC modules—plus the system-level solutions built on top of them. The Policy Window: Reliable Communication as a Procurement Criterion The Guangdong plan is structured in three phases. By the end of 2026, the province aims to build over 60 whole-home smart projects covering more than 10,000 units. By 2028, that coverage expands to over 30,000 units, with all 21 prefecture-level cities participating. The plan also calls for developing “lightweight, modular, inclusive product bundles” to push whole-home intelligence from high-end residences into mainstream housing. For system integrators and developers bidding on these projects, “reliable communication” is not an abstract requirement. It is a design constraint. Wi-Fi and Bluetooth remain the default connectivity for most smart home devices, but they face well-documented limitations in wall penetration and network capacity, particularly for devices installed in cabinets, ceilings, or distant corners. PLC (Power Line Communication) addresses that gap by using existing electrical wiring as the transmission medium—no wall drilling, no wireless dead zones. The practical implication for module buyers is straightforward: a single wireless technology cannot cover every scenario in a whole-home deployment. The ability to combine Wi-Fi, Bluetooth, and PLC into one coherent BOM—and to back it with system-level integration support—is becoming a differentiator. OFEIXIN’s Position: Modules for Connectivity, Solutions for Delivery Shenzhen OFEIXIN Technology is not a single-technology module vendor. The company’s product portfolio spans Wi-Fi modules, BLE modules, Zigbee modules, PLC modules, and RF antenna components, with FCC, CE, SRRC, RoHS, and REACH compliance across the line. More importantly for whole-home projects, OFEIXIN also provides system-level smart home solutions—gateways, smart panels, lighting drivers, sensors, and thermostat controls—that sit on top of its communication modules. This two-tier structure matters because whole-home projects rarely fail at the chip level. They fail at integration. A developer can source a Wi-Fi 7 module and a PLC module from the same supplier, but if those modules are not designed to coexist within a unified network architecture, the integrator bears the cost of stitching them together. Tier 1: Communication Modules On the wireless side, OFEIXIN’s O2072PM is built on Qualcomm’s QCC2072 (FastConnect C7700) Wi-Fi 7 platform. It supports tri-band 2.4/5/6 GHz operation, 320 MHz channels on 6 GHz, 4096-QAM modulation, and peak data rates up to 5.8 Gbps. The module also integrates Bluetooth 6.0 with Channel Sounding for high-accuracy distance measurement, and is available in an M.2 Key E form factor with 2T2R dual-antenna design. For whole-home deployments requiring high-bandwidth backbone connections—4K control panels, multi-channel video intercoms, cloud-rendered interfaces—this module provides the wireless capacity. On the PLC side, OFEIXIN’s product line covers multiple chip platforms and scale requirements. The 3121N-H, based on HiSilicon’s Hi3121S, operates across 0.5–3.7 MHz and 2.5–5.7 MHz bands, follows the IEEE 1901.1 standard subset, and supports one CCO connecting up to 200 STAs with dynamic routing and multipath auto-addressing. For larger commercial spaces or hotel retrofits, this module provides the node density and network stability that wireless alone struggles to deliver. Tier 2: System-Level Smart Home Solutions Modules answer the question “can it connect?” Solutions answer the question “can the project be delivered?” OFEIXIN’s system-level offerings extend beyond the module itself into central gateway units, smart lighting drivers, interactive panels, shading controllers, HVAC thermostats, sensors, and protocol conversion modules. The architecture OFEIXIN supports is designed around resilience. A “super gateway + three PLC channels + wireless mesh” topology allows the local PLC network to continue operating basic lighting, curtain, and HVAC scenes even when the external internet connection is interrupted. For hotels, elderly care facilities, and high-end residential projects where “offline availability” is a non-negotiable requirement, this is not a feature—it is a procurement criterion. OFEIXIN also supports Tuya-native PLC access, with a “1 gateway + 3 channels + 6 subsystems” framework designed for plug-and-play integration and low-latency response. For integrators already building within the Tuya ecosystem, this reduces the engineering effort required to bring a PLC subsystem online. The combined capability can be summarized simply: OFEIXIN supplies production-ready Wi-Fi, Bluetooth, and PLC modules for customers who want to build their own systems, and it supplies complete gateway-to-sensor solution stacks for customers who want to shorten time-to-delivery. The customer chooses the delivery layer; the underlying communication logic stays consistent. Where This Fits: Hotels, Residences, and the “Corner Device” Problem The Guangdong policy explicitly targets both residential and non-residential scenarios, including elderly care, child monitoring, health monitoring, and low-carbon energy saving. Hotel retrofits are a particularly relevant adjacent market: China’s hotel industry is expected to see a significant wave of room renovations over the next three years, with a large share of rooms exceeding 15 years of age entering mandatory refresh cycles. The core constraint in hotel retrofits is “no shutdown, minimal guest disruption”—traditional wired solutions require wall channeling, while wireless solutions face channel contention in dense room layouts. In this scenario, OFEIXIN’s PLC modules handle in-room lighting, HVAC, and curtain control over existing power lines, eliminating the need to run separate communication cables to each endpoint. The gateway and panel solutions provide the guest-facing interface and management layer. Because the PLC network supports offline operation, a temporary external network outage does not disable basic room controls. For mainstream residential projects under the policy’s “inclusive product bundle” direction, the configuration can be scaled. Wi-Fi and Bluetooth modules handle the majority of device access, PLC modules cover the hard-to-reach corners, and a lightweight gateway provides the user-facing control layer. Not every project needs full PLC coverage—but every project has at least one corner where wireless drops, and that is where the combined portfolio earns its place.   Why This Matters Now The Guangdong action plan is a demand-side signal, but it is also a selection filter. As whole-home projects move from pilot to provincial rollout, the procurement questions will shift from “which module is cheapest” to “which supplier can guarantee the communication layer across the full project lifecycle.” The policy explicitly encourages cultivating specialized, boutique suppliers around core components and segmented application scenarios. Module suppliers that can demonstrate both component-level performance and system-level integration capability are better positioned to enter the reference lists of integrators and developers. OFEIXIN’s portfolio—Wi-Fi 7 and PLC modules on the component side, gateways and terminal devices on the solution side—is structured for exactly this transition. The modules are documented, certified, and production-ready. The solutions are built on the same communication logic. The customer decides where the boundary sits. For overseas integrators and OEMs evaluating supply partners for smart home or smart building projects, the question is not whether Guangdong’s policy affects your market directly. It is whether your module supplier can support the same dual-delivery model when your own projects demand it.  

Bluetooth HDT has been officially adopted by the Bluetooth SIG as an optional feature in Bluetooth Core Specification 7.0. The peak data rate of the Bluetooth Low Energy physical layer has increased from 2 Mbps to 7.5 Mbps, a 275% improvement. The first devices supporting HDT are expected to appear around early 2027, with the first flagship application targeting standardized high-end wireless audio. The key constraint is that HDT requires entirely new radio frequency hardware; existing Bluetooth modules cannot acquire this capability through firmware upgrades. I. The Technical Essence of HDT Standard Implementation: Three Facts That Need to Be Clarified On November 4, 2026, the Bluetooth Special Interest Group (SIG) officially adopted Bluetooth High Data Throughput (HDT) technology and incorporated it as an optional feature in Bluetooth Core Specification 7.0. This technology, by introducing a new physical layer (PHY), increases the peak bit rate of Bluetooth Low Energy from 2 Mbps to 7.5 Mbps while maintaining the 2.4 GHz band and 2 Msymbol/s symbol rate. It employs coherent π/4 QPSK, 8PSK, and 16QAM modulation combined with forward error correction. Fact 1: 7.5 Mbps is the physical layer peak bit rate, not the actual application layer throughput available to the user. Actual speed is affected by multiple factors, including distance, interference, device RF capabilities, protocol overhead, and connection configuration. HDT defines five speed levels—2, 3, 4, 6, and 7.5 Mbps—of which 4 Mbps and below are mandatory, while 6 and 7.5 Mbps are optional. This means that a device's stated support for HDT does not necessarily mean it can run at the highest speed. When selecting a device, the key question is which specific speed level it supports, rather than simply looking at the general label "supports HDT." Fact 2: The logic behind energy efficiency gains is "faster transmission, earlier sleep," but peak power consumption may increase. The Bluetooth SIG explains that when the same batch of data is transmitted in a shorter time, the time the RF circuit is in active transmission mode is reduced, and battery-powered devices have more time to maintain a low-power state. However, for wearable devices and sensors, changes in peak power consumption are also a design variable. This is not a simple equation of "faster = more energy-efficient"; actual power consumption performance needs to be verified through testing at the system level. Fact 3: HDT is an optional feature. Bluetooth 7.0 devices are not automatically HDT devices, and existing hardware cannot achieve this through software upgrades. The Bluetooth SIG has clarified that existing GFSK-only devices cannot obtain HDT rates solely through firmware updates because the new physical layer requires new RF hardware support. A report by Taiwan's CTIMES further reminds users that even if a device is labeled as supporting Bluetooth 7.0, it is still necessary to verify whether HDT is implemented at both ends of the connection. This constraint directly impacts module selection: customers cannot assume that modules purchased today will gain HDT capability through OTA updates in the future. From a market perspective, data from the Bluetooth Special Interest Group (SIG) market platform shows that global Bluetooth device shipments are projected to approach 6 billion units in 2026 and exceed 8 billion units in 2030 (data source: ABI Research, 2026). This massive existing device base and continuously growing shipment volume mean that HDT penetration will be a process measured in years, and the demand for existing Bluetooth 5.x/6.x modules will not suddenly disappear due to the emergence of a new standard. The transition period is long enough that module manufacturers and customers have time for rational planning, rather than panic-driven switching. II. The Engineering Gap Between Chip-Level Progress and Modularization Realtek's strategy at the HDT chip level is directly related to its supply chain with Oufexix, a module manufacturer. The RTL8773J series is positioned by Realtek as a "Bluetooth 7-ready" audio SoC, supporting Bluetooth 7 dual-mode technology (Classic + LE Audio) and HDT transmission, with a peak rate of 7.5 Mbps. Realtek has also implemented a proprietary HDT+ mode, claiming it can reach 15 Mbps. This chip uses a quad-core architecture (Cortex-M55 + Cortex-M33 + dual HiFi DSPs) and is targeted at products such as TWS earphones, gaming headsets, smart speakers, and AI glasses. According to Realtek's official website, its HDT transmission bandwidth is sufficient to support 24-bit/96kHz Hi-Res high-resolution and lossless audio. Another noteworthy chip is the RTL8922D, Realtek's Wi-Fi 7 / Bluetooth 6.2 Combo chip. It also supports HDT mode for Hi-Res lossless audio transmission and integrates Channel Sounding indoor positioning capabilities. As a Combo solution, it has potential for integration with the existing Wi-Fi/Bluetooth module product line of OFEIXIN. However, there is a clear engineering gap between chip-level products and module-level deliverable solutions. From SoC to mass-produced modules, RF front-end design, antenna matching and debugging, pre-certification testing (FCC/CE/SRRC), mass production ramp-up, and long-term supply commitments are required. The RTL8773J was first showcased at COMPUTEX in May 2026, and as of now, no reference design or turnkey solution for the general-purpose module market has been publicly released. As a module manufacturer, Oufexix is tracking the modular feasibility of Realtek's HDT chip solution. Only after RF design verification and certification paths are clear will it enter the product definition phase. Therefore, the advice to customers is not to "wait," but to make tiered judgments based on the project timeline . III. OFEIXIN Selection Recommendations: Decision-making based on project mass production window Projects slated for mass production by 2026 do not need to wait for HDT. Currently, OFEIXIN's Bluetooth 5.4/6.0 modules cover mainstream scenarios such as smart speakers, smart locks, industrial data acquisition, and wearable devices. Bluetooth 5.4's 2 Mbps PHY remains a sufficient baseline for audio streaming, sensor data synchronization, and OTA upgrades. Delaying product launches to wait for HDT, before HDT chip solutions mature and module prices stabilize, is not commercially viable. Projects planned for the second half of 2027 should reserve a window for HDT evaluation during the chip selection phase. If the product roadmap points to mass production by the end of 2027 or early 2028, and the scenarios involve lossless/high-resolution audio, smart glasses sensor fusion, large file OTA, or high-speed industrial data backhaul, then when selecting a Bluetooth chip platform, it should be confirmed whether the platform has a clear HDT support roadmap and modularization timeline. Realtek's RTL8773J is an option worth considering, but it is necessary to confirm the module-level reference design and mass production ramp-up plan with the original manufacturer or authorized distributor. A CTIMES report also suggests that terminal manufacturers can prioritize scenarios with clear requirements, such as high-end audio or wearable data synchronization, and work with upstream and downstream partners to verify cross-brand interoperability, actual application throughput, and overall power consumption. Do not believe claims that "existing module software can be upgraded to HDT." HDT requires new RF hardware, and existing devices that only support GFSK cannot achieve higher data rates through firmware updates. Any statement claiming that existing Bluetooth modules can support HDT via OTA upgrades is technically untenable. This judgment needs to be clearly communicated to customers to avoid making selection decisions based on flawed assumptions. IV. Selection Q&A: Key Judgments During the HDT Transition Period When customers are evaluating Bluetooth modules, the most common question they ask is, "Should we wait for HDT now?" Depending on the project's mass production timeline: projects scheduled for mass production in 2026 do not need to wait, as HDT chip solutions are still in their early stages and modular products are not yet ready; waiting will only delay the market launch window. For projects planned after the second half of 2027, it is recommended to assess HDT support during chip selection and confirm the delivery schedule with the module supplier. Regarding the upgradeability of existing modules, it is clear that they cannot be upgraded—HDT introduces a new physical layer and requires new RF hardware, which existing modules cannot acquire through firmware upgrades. Which scenarios require HDT most? The Bluetooth SIG's first flagship scenario is high-end wireless audio, including lossless and high-resolution audio, multi-channel surround sound, and spatial audio. This is followed by low-latency interaction for XR/spatial computing, data exchange for AI edge devices, commercial and industrial automation monitoring, and fast OTA synchronization for wearable devices. Regarding pricing, an accurate figure cannot be provided at this time. HDT initially appears as a high-end audio SoC, with Realtek's RTL8773J positioned for the TWS flagship and gaming headset market. Its cost structure differs from general-purpose BLE modules. OFEIXIN will evaluate its pricing strategy and share it with customers once the chip solution matures and modularization is feasible. In terms of current product coverage, OFEIXIN's Bluetooth 5.0 to 6.0 modules already cover smart home, wearable, and industrial terminal scenarios, making it a prudent choice for current projects until the HDT chip solution is available. If your product is geared towards 2027, you should confirm three things with the chip manufacturer when selecting a chip now: whether the platform supports the HDT physical layer, whether there is a module-level reference design or turnkey solution, and whether the mass production schedule and long-term supply commitment match the project milestones—don't just look at the chip launch date, look at the module's delivery time.  

On November 3, 2026, Universal Scientific Industrial (USI) officially announced its Wi-Fi 8 product roadmap, expecting to launch Wi-Fi 8 modules based on SiP packaging in the first quarter of 2027. This news sparked considerable discussion within the module industry , and we've also been following this development . We'd like to discuss a more practical topic: Wi-Fi 8 is the "next step" worth paying attention to, while Wi-Fi 7 is currently the "mainstay" being delivered in large quantities .   For hardware teams that are defining their products, recognizing this time lag is more important than chasing trends.   I. The Big Moves of Wi-Fi 8: How Far Away is Mass Production? Universal Scientific Industrial (USI)'s roadmap reveals two key pieces of information. First, a clear timeline: products will launch in Q1 2027. Second, a shift in technological focus: Wi-Fi 8 (IEEE 802.11bn) will no longer prioritize peak speeds as its primary selling point, but will instead focus on ultra-high reliability (UHR), energy efficiency, and a consistent user experience. Key technologies listed in the announcement include Co-BF/Co-SR, Dynamic Subchannel Operation (DSO), and physical layer technologies such as Distributed Resource Unit (DRU), Enhanced Long-Range Transmission (ELR), and Unequal Modulation (UEQM). These technologies target specific scenarios: miniaturized terminals with extremely limited antenna space, limited battery capacity, and highly complex radio frequency environments, such as AI glasses, smart rings, and TWS earphones. However, as a module solution provider, our habit when looking at this kind of news is to follow the timeline and see where the standard is finalized and the certification is opened. According to ABI Research's tracking report, the standardization progress of 802.11bn is as follows: Draft 2.0 entered the working group vote in August 2026, the Draft 3.0 letter ballot is scheduled for January 2027 , the Draft 4.0/initial standards association ballot is in May 2027 , final working group approval is expected in March 2028 , and IEEE Standards Board (RevCom) ratification is in May 2028. The Wi-Fi Alliance's Wi-Fi 8 certification project is not expected to start until January 2028 . What does this mean? If a product launches in Q1 2027, it will be facing a stage where standards are not yet finalized and certification channels are not yet open. Draft 3.0 has not yet been voted on, Draft 4.0 has not yet entered the SA ballot, and the Wi-Fi Alliance's certification program has not even set its start date for another year. For the vast majority of terminal products that need to go through type approval and alliance certification before they can be launched, this timeframe does not meet the conditions for mass production. Dell'Oro Group shares this view: Wi-Fi 7's market share exceeded 50% by September 2026, while early revenue from Wi-Fi 8 is not expected until 2027 at the earliest. ABI Research directly used the phrase "lucrative opportunities and unprecedented challenges" in the title of its report, indicating that opportunities and challenges coexist, but the window of opportunity is in 2028, not in Q1 of 2027. II. Why Wi-Fi 7 is the realistic choice for customers today Looking only at news trending topics can easily create a misconception. But the data presents a completely different picture. According to Dell'Oro Group data, by September 2026, Wi-Fi 7 devices accounted for over 50% of the global WLAN market share . In the Chinese router market, Sandalwood's e-commerce monitoring data provides a more concrete picture: by September 2026, Wi-Fi 7's market share rose from 26% to 32% , while Wi-Fi 5's fell from 22% to 12%, indicating a rapid shift in market structure towards next-generation protocols. The BE3600 specification has become the mainstream adoption level for Wi-Fi 7, with its share rising from 13% to 17%. The replacement cycle in the home consumer market has entered an accelerated phase, rather than just beginning. At its earnings call in early 2026, Realtek gave its forecast for the chip sector: Wi-Fi 7 penetration in PCs and routers is expected to double in 2026, reaching 30% in PCs and 25% in routers. Considering that Realtek is one of the major suppliers of Wi-Fi chips, this forecast reflects the capacity allocation rhythm of the upstream supply side. For customers, a more direct criterion is this: if your current product project is planned for mass production between the end of 2026 and 2027, Wi-Fi 7 is the only option with a complete supply chain support. Wi-Fi 8's modular solution won't be ready for evaluation until certification opens in 2028 at the earliest. During this one-year window, customers' products cannot wait, and production lines cannot stop. III. OFEIXIN Wi-Fi 7 Strategic Deployment Returning to our own products , our two Wi-Fi 7 modules, based on the Qualcomm QCC2072 platform, cater to the needs of two mainstream hardware architectures currently on the market. Our initial motivation for this dual-package layout was simple: different customer decision-making stages necessitate different module forms. The O2072PM uses an M.2 2230 Key E slot and is designed for devices with standard M.2 interfaces, such as gateways, routers, and industrial PCs. These customers typically require pluggable modules for easy maintenance and upgrades, and have specific requirements for driver compatibility with the Intel x86 platform. The O2072PM is already compatible with kernels 5.15.24+, 6.1.99, and 6.12.0, and also supports OpenWrt version V1. Customers can immediately debug the module without having to figure out the driver from scratch , which is where we invested the most in software adaptation. For many customers evaluating Wi-Fi 7 modules, the first hurdle isn't RF performance, but whether the driver will work and the SDK will be compatible. We've addressed this issue beforehand. The O2072PB is a 13×15×2.3mm surface-mount package, designed for PCB space-constrained scenarios such as FTTR gateways, sub-routers, and high-density IoT terminals. It supports Wi-Fi via PCIe and Bluetooth via UART/PCM, integrating Bluetooth 6.0 and supporting multiple operating modes including AP/AP+STA/P2P/Monitor. Surface-mount customers typically lock in the module size and pin definitions during the onboard design phase, giving them a longer selection window than slot-based designs . This is why the O2072PB needs to coexist with the O2072PM. If a customer locks in a surface-mount solution at the schematic stage and wants to switch to a slot-based solution before mass production, the redesign costs will be very high. Both modules share the same core Wi-Fi 7 capabilities: 802.11be, 2×2 MIMO, tri-band 2.4/5/6GHz, 320MHz bandwidth in the 6GHz band, 4096-QAM, and a peak speed of 5.8Gbps . The only differences lie in their physical form factor and interfaces; customers can choose according to their hardware architecture. It's worth mentioning the engineering value of eMLSR (Enhanced Multi-Link Single Radio). The O2072PM supports 320MHz eMLSR. In a single-radio hardware architecture, it monitors the status of multiple frequency band links via an auxiliary radio, quickly switching to a backup link when the primary link encounters interference, without needing to go through a complete scan-association process. For cost-sensitive and space-constrained designs like FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture . This is also one of the most noteworthy engineering improvements of Wi-Fi 7 compared to Wi-Fi 6, changing the cost structure of high-density networking. IV. A variable to be aware of: the impact of memory shortage A recent report by Dell'Oro Group makes a noteworthy assessment: the shortage and price increase of DDR4 memory chips may accelerate the adoption of some enterprise-grade Wi-Fi 8 systems, as suppliers are incentivized to reduce their reliance on high-cost memory by switching designs. Realtek also explicitly mentioned in its earnings call that it faces the challenge of "memory shortages and price increases" in 2026. However, this does not contradict the statement that "Wi-Fi 7 remains the mainstay of shipments." Dell'Oro explicitly stated in the same report that Wi-Fi 7 revenue growth will continue, with peak annual revenue expected to exceed the total revenue of Wi-Fi 6E over its entire lifecycle . The memory shortage is driving some enterprise customers to assess the feasibility of Wi-Fi 8 as early as 2027, while the replacement cycle for Wi-Fi 7 in numerous scenarios such as consumer routers, industrial control systems, CPEs, and FTTRs is only just entering the accelerated phase shown by Sandalwood data. For customers, a more realistic assessment is: if your product is planned to enter mass production before the first half of 2027, Wi-Fi 7 is currently the only option that can guarantee delivery schedule. If the product cycle is longer, cost sensitivity is lower, and it targets high-end enterprise scenarios, you can pay attention to the standardization progress of Wi-Fi 8, but the module selection decision will still be made after the second half of 2027. In conclusion Universal Scientific Industrial's (USI) Wi-Fi 8 roadmap provides valuable forward-looking information. It tells the industry that the next-generation standard prioritizes reliability over speed, with module form factors evolving towards SiP miniaturization, and target applications expanding from mobile phones/PCs to AI glasses and wearable devices. Oufexin is also monitoring the evolution of Wi-Fi 8 and will promote modular adaptation as the standard is finalized and certification is opened. However, between the blueprint and mass production lies four stages: standard finalization, certification openness, chip maturity, and module adaptation . ABI Research's timeline shows that all four stages will be completed by May 2028. Meanwhile, Wi-Fi 7's shipment data reflects what is happening now: a global market share exceeding 50% by September 2026 and a 32% sales share in the Chinese router market . Behind these figures is a well-established supply chain and terminal projects being delivered in batches. For Oufexin, the key is that when customers need a Wi-Fi 7 module that can be immediately integrated into a project, has mature driver compatibility, and offers two packaging options, we already have one on our shelf . In the module industry, delivery speed is far more important than news pace. Data sources for this article: ABI Research, Dell'Oro Group, Sandalwood, and publicly available information from Realtek's earnings calls. Information on Oufexix products is from official specification documents.