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QOGRISYS is professionally committed to providing customers with complete IoT connection solutions.The company focuses on the communication industry. After years of industry market and customer service experience, it has the courage to face extreme technical challenges and help customers solve difficulties. The company has high-quality supporting resources from broadband short-range wireless connection, wide area network cellular communication to deep vertical integration industry, providing ...
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Say Goodbye to Lag! This High-Tech Module O9201SB Revolutionizes Home Entertainment with a Full-Scale Upgrade!
It’s late at night, and you’re deep into your favorite show when suddenly, the screen freezes into a slideshow. The whole family is fighting for bandwidth, and your game’s latency is skyrocketing. Are these frustrating network issues disrupting your smart home experience? Don’t worry! Qogrisys has developed a cutting-edge module equipped with **Wi-Fi 6 + BT5.4**—O9201SB—that is quietly revolutionizing the set-top box industry with an unparalleled "experience upgrade"! 1. The Pain Points of Home Entertainment: Is Your Set-Top Box Truly "Smart"? With the rise of 4K/8K ultra-high-definition videos, cloud gaming, and smart home devices, home networks are under immense pressure: "One Network, Multiple Devices" Leads to Lag**: When the TV, phone, tablet, and smart speaker are all online, Wi-Fi 4/5 simply can’t keep up!   High-Definition Videos Turn into "Mosaic"**: 8K video requires over 100Mbps bandwidth per second, and traditional modules struggle to deliver.   High Costs of Core Chips**: Customization is complex and expensive, leaving manufacturers frustrated.   2. Introducing O9201SB: Wi-Fi 6 + BT5.4 Redefines "Smooth" 1. Speed Boost: Instant 8K Video Streaming Dual-Band Simultaneous Technology**: 2.4GHz for stable wall penetration, 5GHz for blazing-fast speeds, with 2T2R rates up to 1200Mbps. 8K videos load instantly, with zero buffering when dragging the progress bar! MU-MIMO + OFDMA**: Multiple devices can connect simultaneously without competing for bandwidth. 2. Bluetooth 5.4: Unlocking New Smart Possibilities Bluetooth Remote Control with Instant Response**: Enjoy more sensitive voice control and seamless operation. Connect External Speakers and Game Controllers with Zero Latency**: Dive into a fully immersive gaming and entertainment experience.   3. Leading Technology + High-Level Service: A Win-Win for Manufacturers and Users 1. Self-Reliant and Secure, Ensuring Complete Safety Chips comply with international technical standards, ensuring stability and security. Data encryption + localized servers provide comprehensive privacy protection. 2. Flexible Customization, Rapid Response A professional R&D team supports "deep adaptation," completing customization from design to mass production in just 30 days. An optimized supply chain reduces costs by 20% and shortens delivery cycles by 50%.   4. The Future is Here: Seizing the "Golden Gateway" to Smart Homes For users, O9201SB offers a seamless and smooth experience upgrade. For manufacturers, it’s a powerful tool for reducing costs and increasing efficiency. Set-top boxes equipped with this module can not only become the center of home entertainment but also integrate seamlessly with smart home appliances, transforming into a smart control hub. This positions them to capture the core gateway to the trillion-dollar smart home market!     From "usable" to "excellent," and from technological dependence to technological leadership, the O9201SB module developed by Qogrisys is rewriting the rules of the set-top box industry with its outstanding performance and high-level service. Choosing O9201SB isn’t just choosing a module—it’s choosing a future-oriented "experience revolution."  
O9201UB Current State of the Projector Industry: Wireless Connectivity Pain Points Need Urgent Breakthrough
As smart projectors become increasingly common today, user demands for image quality and functionality are continuously increasing. However, the stability and speed of wireless connectivity have become bottlenecks hindering the upgrade of user experience: · 4K/8K Content Transmission Stuttering: High-resolution videos require extremely high bandwidth, and traditional Wi-Fi modules often suffer from delays and buffering in complex environments. · Severe Interference Among Multi-Devices: When projectors are connected simultaneously with multiple devices such as smartphones, tablets, and speakers, network congestion frequently leads to signal interruptions. · Poor Bluetooth Peripheral Experience: Older protocols suffer from high latency and weak anti-interference capabilities, resulting in unstable connections for wireless speakers, game controllers, and other devices. · Conflict Between Power Consumption and Heat Dissipation: High-speed transmission comes with high power consumption, affecting device battery life and even causing heat dissipation issues.       These pain points are undermining your brand's credibility I. O9201UB Module: The "Wireless Heart" Designed for Projectors QOGRISYS has been deeply involved in wireless communication for 12 years. The Wi-Fi 6 + Bluetooth 5.4 dual-mode module O9201UB is designed with four core advantages to restructure the wireless experience in projection scenarios: 1. Wi-Fi 6 Ultra-Speed Transmission, 4K/8K Smooth and Uninterrupted Infinity · Dual-Band Simaltaneous, Smart Switching: 2.4GHz offers strong wall-penetration capabilities, The speed can be up to 1200Mbps while 5GHz, supporting 2T2R DBAC and 1T1R DBDC mode, allowing simultaneous use of different frequency bands for internet access and screen casting, say goodbye to stuttering. · MU-MIMO + OFDMA Technology: Supports high-speed transmission among multiple devices simultaneously, ensuring stable and smooth projection even when multiple users share the network. · Beamforming Technology: Accurately locates device positions, enhances signal strength dynamically, and eliminates projection dead zones, ensuring full signal coverage whether in the living room or conference   ② Bluetooth 5.4 + Low Latency, "Zero Perception" Audio-Video Synchronization · 2Mbps High-Speed Bluetooth: Wireless speakers/headphones’ latency as low as 28ms (industry average : 50ms), delivering concert-like audio effects with "audio-video synchronization." · AFH Anti-Interference Technology: Automatically avoids congested 2.4G channels, allowing multiple devices (remote control + microphone + speakers) to coexist without interference, enabling "instant response" for voice control. · HCI Technology: Provides an intermediate reserve, compatible across kernel versions; USB interface can also connect to Bluetooth speakers, offering premium voice effects, saving debugging time, and reducing pin usage in PCM interface   ③ Compact Size + Low Power Consumption, Greater Design Freedom · Compact Dimension: Ultra-small size of 15×13×2.3mm, suitable for ultra-thin projector designs, saving internal space. · Smart Power Management: Wi-Fi + Bluetooth collaborative power consumption reduced by 20%, extending built-in battery projector runtime by 1.5 hours, ensuring uninterrupted during outdoor campin   4. Flexible Adaptation, Easy Integration · USB 2.0 Interface: Compatible with mainstream projector models, reducing development costs for manufacturers. · Multiple Certifications: Supports WPA3 encryption, BLE Audio, and other standards, ensuring data security and compatibility. ​​II.Seize the New Blue Ocean of "Wireless Projection" Now! The global smart projector market exceeds $80 billion by 2025, with wireless experience becoming a core decision-making factor for users. Projectors equipped with O9201UB are not just "viewing tools" but also home entertainment hubs, business collaboration centers, and smart home gateways. Home Entertainment Scenarios: Wireless game screen casting: Supports 4K@60fps low-latency transmission, paired with immersive Bluetooth speakers. Smart home integration: Direct Wi-Fi connection to control screens/lights, creating an immersive theater system. Business Office Scenarios: Multi-device wireless screen sharing among multiple-devices:Support demonstrations from multiple terminals, improving meeting efficiency by 50%. Remote collaboration optimization: QoS intelligent bandwidth allocation ensures video conferences stable Educational Scenarios: Online classroom assurance: Anti-interference design ensures 4K courseware display smooth. Interactive teaching support: Bluetooth microphone latency < 30ms, enabling zero-lag teacher-student interaction. III.Choosing O9201UB Means You Gain More Than Just a Module ▶Advanced Technology, Performance Benchmark: Based on IEEE 802.11ax and Bluetooth 5.4 protocols, performance surpasses traditional modules completely. ▶ Service Assurance: 7x24 technical support, providing "module + driver + scenario optimization" comprehensive services. ▶ Ecosystem Collaboration, Expanding Scenarios: Beyond projectors, it can integrate with smart home devices (e.g., lights, screens), helping projectors upgrade into smart control hubs. Conclusion: The Future of Wireless Projection is Defined by You! The O9201UB module, with its core advantages of "fast, stable, and efficient," provides the ultimate wireless connectivity solution for the projector industry. Whether it's the home theater’s ultimate experience or efficient business collaboration, it can be handled easily. QOGRISYS is ready to collaborate with you, driving industry transformation through technological innovation, and making every projector a gateway to "wireless freedom"!
Live from Shenzhen IOTE 2026: Deep Integration of Edge AI and Wireless Modules
From August 26th to 28th, 2026, the 25th IOTE International Internet of Things Exhibition was grandly held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall) . With a massive exhibition area of 80,000 square meters, this year's exhibition brought together over 1,000 high-quality exhibitors from around the world, attracting 48,109 industry professionals and over 3,000 overseas visitors on the first day . The exhibition, themed "Edge Intelligence, Scenario Deepening, and Green Sustainability," was a major collaboration between AGIC 2026 Shenzhen International General Artificial Intelligence Industry Expo and GERX Global Embossed Intelligent Robot Industry Expo, achieving deep integration of IoT technology with general AI and robot intelligence .   The strongest signal released by this exhibition is that edge AI and wireless connectivity are moving from "evolving independently" to "deeply coupled". Hall 12 showcases top achievements such as AI chips, edge computing, and embodied intelligent robots , while Hall 10 focuses on industrial IoT and communication modules . The coordinated layout of the two halls itself constitutes a spatial interpretation of the "AI + connectivity" industrial logic. I. Industry Logic: Why "Connectivity" Must Embrace "Computing" The integration of edge AI and wireless modules is essentially a technological evolution driven by industry demands. The centralized model, which relies solely on cloud computing power, is encountering multiple bottlenecks: industrial control scenarios require millisecond-level response times, which cloud round-trip latency cannot meet; medical and security scenarios are highly sensitive to data privacy, and uploading data to the cloud poses compliance risks; and the continuous uploading of data by massive IoT devices is driving up bandwidth and cloud computing costs. The standard architecture for AI implementation is becoming one where the terminal handles perception, the edge handles inference, and the cloud handles training and coordination—each with its own specific role. This trend is clearly supported by data. According to a report released by IIM Information, the global wireless module market is expected to reach $48.62 billion in 2026, a 17.8% increase from $41.27 billion in 2025. Among these developments, the integration rate of AI-dedicated acceleration chips in modules continues to climb , and shipments of emerging AI edge inference modules (integrated NPU) exceeded 12 million units in the second quarter of 2026 , marking a shift in modules from simple transmission units to computing power nodes. Meanwhile, Wi-Fi 7 modules support 320MHz bandwidth and 4096-QAM modulation, and are expected to see significant adoption in routers, VR/AR devices, and other applications in 2026 . Wireless modules are evolving from "data transmission pipelines" to "intelligent connectivity bases" with local intelligent processing capabilities. The competitive logic of next-generation wireless communication modules is undergoing profound changes: from single Wi-Fi connectivity to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence . II. IOTE 2026 Exhibition Confirms: Integration Has Become an Industry Consensus At IOTE 2026, leading global wireless connectivity companies clearly outlined the industry landscape of this trend through their respective product portfolios. From chip manufacturers to module solution providers, the core positions of their booths were generally occupied by edge AI-related solutions—whether it was a wireless SoC integrating AI/ML hardware accelerators or a main control platform for embodied intelligence and generative AI terminals, the strategic focus of leading players in the industry has clearly shifted towards dual-core capabilities of "communication + computing". Among the numerous innovative product awards presented concurrently with the exhibition, edge AI computing modules and high-performance AI chips occupied prominent positions. Several exhibitors showcased edge AI demonstration solutions supporting features such as local keyword wake-up and real-time face and gesture recognition. Meanwhile, the exhibition of supporting technologies such as high-precision wireless sensing and multi-protocol fusion further enriched the capabilities of wireless connectivity in AI scenarios. The exhibition clearly demonstrates that competition in the wireless connectivity field has evolved from a simple contest of "communication performance" to a comprehensive competition of "communication + computing" capabilities . Simply providing high-speed, stable data transmission channels is no longer sufficient to create a differentiated advantage. The ability to provide computing power support and intelligent collaboration for edge AI applications on top of connectivity capabilities is becoming a new benchmark for measuring the technological strength of module manufacturers. III. Application Scenarios: Where to Deploy Edge AI + Wireless Modules The integration of edge AI and wireless modules is being rapidly implemented in multiple vertical scenarios.   Industrial manufacturing is one of the most mature scenarios for the integration of edge AI and wireless modules. Hall 10 of the exhibition focuses specifically on industrial IoT and embedded solutions, connecting three major technology tracks: intelligent sensing, IoT communication, and precise positioning . In intelligent manufacturing scenarios, AGV/AMR autonomous transport vehicles, industrial sensors, and monitoring systems have rigid requirements for low-latency wireless connectivity and local AI inference capabilities. Wireless modules need to provide stable connectivity in high-interference industrial environments, while providing a communication foundation for AI applications such as visual inspection and predictive maintenance on the equipment side. Smart homes and smart buildings are another important scenario. In the smart home scenario, local AI processing means that voice commands can be responded to without being uploaded to the cloud, which reduces latency and protects user privacy—this is the core value of edge AI. Smart retail and smart cities also benefit from this trend. The exhibition comprehensively covered more than 20 core application scenarios, including smart logistics and smart consumption . In the smart retail scenario, AI POS terminals, smart vending machines, and other devices need to complete inference tasks such as image recognition and behavior analysis locally, while relying on wireless modules to achieve data synchronization and remote management with the cloud. Drones and robots represent emerging high-growth sectors. Drone solutions integrate Wi-Fi modules, 5G communication, and edge AI computing capabilities, supporting applications such as long-distance image transmission, remote control, real-time image recognition, and intelligent monitoring. With the rapid development of embodied intelligent robots, the demand for high-bandwidth, low-latency wireless connectivity and local AI inference capabilities will continue to surge. IV. Qogrisys's Solution Layout: A "Smart Connection Dock" with Wi-Fi 7 + Bluetooth 6.0 In light of this industry trend, the layout of QOGRISYS Technology Co., Ltd., headquartered in Shenzhen, is highly representative. Founded in 2014, Qogrisys Technology focuses on the communication connectivity industry, committed to providing customers with comprehensive IoT connectivity solutions. The company partners upstream with chip manufacturers such as Qualcomm, Realtek, Woogi, and HiSilicon, and downstream with end customers in smart home, industrial IoT, and automotive electronics sectors. Its main products cover 2.4G/5.8G Wi-Fi modules, BLE modules, PLC modules , RF antenna components, and smart hardware solutions. Core Product: O2072PM Wi-Fi 7 + Bluetooth 6.0 Combination Module Qogrisys has launched two Wi-Fi 7 + Bluetooth 6.0 combo modules, the O2072PM and O2072PB , based on the Qualcomm FastConnect C7700 (chip code QCC2072) chip . The QCC2072 is designed to provide ultra-high-speed connectivity, with peak speeds up to 5.8Gbps, and features a 320MHz channel, 4K QAM, and Multi-Link Operation (MLO) capabilities . The O2072PM uses an M.2 Key E standard interface (22×30mm) , fully supporting 4K QAM, 320MHz channels, and MLO (Multi-Link Operation), with a peak rate of 5.8Gbps . The Wi-Fi portion complies with IEEE 802.11a/b/g/n/ ac /ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with each band supporting up to 4096 QAM modulation . The Bluetooth portion is compatible with Bluetooth 6.0, supporting dual-mode Bluetooth, Tx beamforming, MRC, LE Audio, and 2 Mbps Bluetooth Low Energy (BLE) . Of particular note is that the O2072PM also supports high-precision distance measurement (HADM/channel detection) , providing new technological possibilities for scenarios such as indoor positioning and asset tracking. The O2072PM is clearly designed to meet the "connectivity foundation" requirement in edge AI scenarios—providing stable, high-bandwidth, and low-latency wireless connectivity for high-performance edge platforms. With the continuous improvement of edge AI computing power, the low latency and high reliability of Wi-Fi 7 are becoming the core communication foundation for edge computing. The higher speed and lower latency offered by Wi-Fi 7 enable the module to achieve a better product experience across a wider range of devices . Domestic platform adaptation capabilities Qogrisys's foray into the Wi-Fi 6 field is also noteworthy. Its O9201 SB/ O9 1 01 SA/ O9201PM series modules have completed driver adaptation and verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in industrial tablets, edge computing gateways, industrial control equipment, and other scenarios. This demonstrates Qogrisys's deep technical accumulation in adapting to domestic platforms and wireless connectivity. In terms of product portfolio, Qogrisys is building a complete wireless connectivity solution covering Wi-Fi 4/5/6/7 and BLE, following the path of "using a full hardware platform as the foundation and vertical scenarios as the direction" . V. Outlook: The Era of "Intelligent Connectivity" in the Module Industry Looking ahead to 2026-2030, the industry will enter the era of "intelligent connectivity." Edge AI modules have become a new growth engine for the wireless module industry. According to an IIM report, the global wireless module market is projected to exceed $90 billion by 2030, with edge AI and satellite direct connection modules expected to grow at a compound annual growth rate of over 30%. The deep integration of edge AI and wireless modules is not an optional "icing on the cake," but an inevitable path for industry development . For wireless module manufacturers, their ability to synergize with edge AI platforms beyond mere connectivity, and to provide a highly reliable communication foundation for edge AI applications, will determine their position in the next stage of competition. The IOTE 2026 exhibition showcases a true picture of this ongoing transformation—from "connecting everything" to "intelligently connecting everything." Qogrisys Technology, with Shenzhen as its origin, Wi-Fi 7 + Bluetooth 6.0 as its connectivity platform, and full-scenario coverage as its goal, is contributing its strength to this transformation.  

2026

08/31

The Two-Way Connectivity Revolution in Smart Connected Vehicles: From Intelligent Cockpits to Charging Infrastructure
Smart connected vehicles are emerging as one of the most确定性 growth trajectories in the global technology industry.   China's intelligent connected vehicle production is projected to reach 14.064 million units in 2026, with market penetration expanding to 38.40%. From 4.6915 million units in 2021 to 14.064 million units in 2026, this figure has nearly tripled in just five years, representing a compound annual growth rate of 24.8%. Revenue from in-vehicle intelligent connected solutions is expected to reach 236.5 billion yuan. iiMedia Research data shows that China's intelligent connected vehicle application service market has already reached 222.3 billion yuan in 2025. On a global scale, the growth trajectory is equally steep. Research and Markets data indicates that the global connected vehicle technology market will grow from $45.99 billion in 2025 to $51.86 billion in 2026, reaching $84.54 billion by 2030 at a CAGR of 13%**. The broader connected cars market is forecast to expand from $105.67 billion in 2025 to $121.23 billion in 2026, and further to **$214.42 billion by 2030 at a CAGR of 15.3%. According to TechNavio, the global connected car market is forecast to grow by $161.69 billion during 2025-2030, accelerating at a CAGR of 17.2%. Communication and navigation terminals are transitioning from vehicle "options" to "standard equipment" —this is not incremental improvement but a structural reconfiguration of the industry's underlying logic. The connectivity demands of intelligent connected vehicles are extending in two directions: inside the vehicle, intelligent cockpits require high-bandwidth, low-latency wireless connectivity; outside the vehicle, charging infrastructure demands intelligent communication via power line carrier technology. Ofeixin Technology delivers a full-stack connectivity solution covering both the "vehicle side" and the "energy side" of intelligent connected vehicles, with Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions and PLC charging pile communication solutions. I. The Bandwidth Revolution in Intelligent Cockpits: Wi-Fi 7 Ushers in a New Era of In-Vehicle Connectivity Wi-Fi 7, as the next-generation standard following Wi-Fi 6, is becoming the core infrastructure for wireless connectivity in intelligent cockpits. In January 2026, the Wi-Fi Alliance officially opened Wi-Fi 7 certification. From certification opening to module mass production delivery, the pace of commercialization for this technological iteration has far exceeded market expectations. Automotive-grade Wi-Fi 7 modules completed AEC-Q104 qualification and entered small-batch trial production in Q4 2025, with theoretical peak data rates 4.8 times higher than Wi-Fi 6, significantly supporting high-bandwidth scenarios such as high-definition map streaming updates and in-vehicle AR navigation. Industry players have already demonstrated clear commercialization signals—LG Innotek has secured orders from a leading European automotive parts supplier to begin shipping automotive-grade Wi-Fi 7 and Bluetooth wireless communication modules in 2027, with the order valued at approximately $68 million. The global automotive Wi-Fi/Bluetooth module market is projected to reach $4.28 billion in 2026, surpassing $6.83 billion by 2030. Wi-Fi modules have become a core procurement category in the intelligent cockpit domain, accounting for 76% of Wi-Fi module procurement demand. Single-chip solution shipments accounted for 42.5% of total volume in 2025 and are expected to exceed 50% in 2026. Chinese domestic OEM procurement demand for dual-band concurrent modules grew 23% year-over-year in 2025, making China the fastest-growing single market globally. In the Wi-Fi 7 automotive module space, Ofeixin Technology has completed a flagship product lineup. The O2072PM (PCIe M.2 interface) and O2072PB (SMD version) are automotive-grade Wi-Fi 7 modules designed based on Qualcomm's QCC2072 (FastConnect C7700) chipset. Both modules comply with IEEE 802.11a/b/g/n/ac/ax/be standards, support tri-band 2.4 GHz/5 GHz/6 GHz concurrent operation, with 6 GHz band channel bandwidth up to 320 MHz, and peak data rates reaching 5.8 Gbps. Both modules support Enhanced Multi-Link Single Radio (eMLSR) and 2×2 Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling flexible frequency resource scheduling in scenarios with multiple in-vehicle concurrent connections and complex signal interference. The O2072PM and O2072PB are among the few module products on the market that simultaneously support Wi-Fi 7 and Bluetooth 6.0, with the Bluetooth section directly supporting Bluetooth 6.0 and Channel Sounding functionality—providing a complete technology foundation for high-precision positioning scenarios such as digital car keys. II. From "Connectivity" to "Perception": Bluetooth 6.0 Redefines Human-Vehicle Interaction Bluetooth technology is undergoing an upgrade from a "connectivity tool" to a "perception infrastructure." Bluetooth 6.0's introduction of Channel Sounding technology brings centimeter-level high-precision distance measurement capability to Bluetooth. Channel Sounding combines RTT (Round-Trip Time) and phase-based ranging to achieve high-precision distance measurement, representing a qualitative leap from the meter-level error of traditional BLE solutions that relied on RSSI (Received Signal Strength Indicator). Bluetooth Channel Sounding technology achieves accuracy within 0.5 meters with relay attack protection, and will be the first to be deployed in automotive digital car keys in 2026. Industry solutions have already matured. Quectel released its next-generation automotive digital key solution in April 2026, featuring BLE 6.0 + UWB + NFC tri-mode fusion technology. Yuanfeng Technology also announced it will be the industry's first to launch a multi-node Bluetooth 6.0 Channel Sounding technology solution in the second half of 2026. Industry data shows that over 13.2 million vehicles were equipped with digital key functionality as standard in 2025. Bluetooth device annual shipments are projected to reach 5.9 billion units in 2026, with the 2030 annual shipment forecast reaching 8.1 billion units. The Bluetooth 6.0 market was valued at $5.42 billion in 2025 and is expected to grow to $17.47 billion by 2035. According to DIGITIMES, Bluetooth Channel Sounding, leveraging its established ecosystem advantages, is penetrating the precision ranging market, with large-scale adoption by application vendors expected to commence from the second half of 2026 through 2027. The O2072PM and O2072PB modules from Ofeixin Technology, with their integrated Bluetooth 6.0 functionality, offer distinct advantages in digital car keys, in-vehicle personnel positioning, and other scenarios. Both modules support High Accuracy Distance Measurement (HADM), LE Audio, 2 Mbps Bluetooth Low Energy, and other complete Bluetooth features. Bluetooth shares an antenna with 2.4 GHz WLAN while operating concurrently with 5 GHz/6 GHz WLAN, providing flexible configuration options for in-vehicle multi-protocol concurrency. Wi-Fi/Bluetooth combo module shipments reached 71% in 2026 and are expected to exceed 85% by 2030. Ofeixin's O2072PM/O2072PB solution is a representative example of this trend—delivering high-speed Wi-Fi connectivity and precise Bluetooth perception simultaneously on a single module, providing intelligent cockpits with an integrated "one network, multiple capabilities" solution. III. The "Invisible Communication Network" of Charging Infrastructure: PLC's Mandatory Upgrade Window In the industrial landscape of intelligent connected vehicles, charging infrastructure is an indispensable component. And PLC (Power Line Communication) technology is emerging as the core solution for electric vehicle charging pile communication. EU regulations are mandating a comprehensive upgrade of charging pile communication methods. Under EU Delegated Regulation (EU) 2025/656, which sets a mandatory compliance deadline of 2027, developing next-generation smart AC charging piles that comply with EN ISO 15118-20:2022 has become the only path for products to enter the European market. This means the traditional PWM communication method will be phased out, with a complete transition to high-layer communication based on GreenPHY Power Line Communication (PLC), with mandatory integration of Plug & Charge (PnC) and Vehicle-to-Grid (V2G) capabilities. The global Power Line Communication (PLC) market is projected to grow from $12.74 billion in 2025 to $14.29 billion in 2026 at a CAGR of 12.1%. By 2030, the market is expected to reach $22.66 billion. Among the key growth drivers are the expansion of electric vehicle charging networks. As electrification, distributed energy resources, electric vehicle charging, and smart city programs expand, PLC is becoming an important layer in the broader industrial IoT and smart grid communications ecosystem. PLC communication requires no additional communication wiring—it transmits data while transmitting power. This "two-in-one" characteristic gives PLC a natural advantage in charging pile scenarios: no need for rewiring, directly utilizing existing power lines to complete two-way data exchange between vehicle and charging pile, and between charging pile and the cloud. Effective from January 8, 2026, all newly installed or significantly upgraded publicly accessible AC charging piles must support EN ISO 15118-2:2016. This means PLC communication capability is transitioning from a "nice-to-have" to a "must-have." Ofeixin Technology offers a complete PLC module product portfolio. The S130N-ISI is a fully integrated Power Line Communication module, designed based on the LianXinTong VC6330 chip, integrating a 32-bit ARM Cortex M3 MCU, 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module adopts LCC packaging with ultra-compact dimensions, integrating line drivers on-chip with low power consumption and strong anti-noise capability. In charging piles, photovoltaic communications, and other scenarios, Ofeixin's S130N-ISI module enables reliable device communication through existing power lines—one power line, simultaneously delivering power and data. With the mandatory implementation of EU regulations and the continued expansion of global electric vehicle charging infrastructure, market demand for PLC modules in charging pile scenarios is poised for explosive growth. IV. From Cockpit to Infrastructure: The Connectivity Foundation of Intelligent Connected Vehicles Intelligent connected vehicles and the Internet of Vehicles are racing ahead at a compound annual growth rate exceeding 30%. In this process, in-vehicle wireless communication modules have transitioned from "behind-the-scenes配角" to "core hub." On the intelligent cockpit side, they are the transmission channels for multi-screen interaction, the positioning foundation for digital car keys enabling keyless entry, and the connectivity safeguard for OTA upgrades ensuring continuous vehicle evolution. On the charging infrastructure side, they are the communication cornerstone enabling intelligent functions such as Plug & Charge and V2G bidirectional charging. Ofeixin Technology's in-vehicle connectivity solutions present a clear "dual-track" architecture: On the intelligent cockpit and digital key front, the O2072PM and O2072PB deliver Wi-Fi 7 + Bluetooth 6.0 combination, covering differentiated requirements from high-end intelligent cockpits to next-generation digital car keys. The 5.8 Gbps peak data rate supports the high-bandwidth demands of multi-screen HD video streaming and in-vehicle AR navigation; Bluetooth 6.0 Channel Sounding provides centimeter-level precise positioning foundation for digital car keys. The interface format differences between the two modules—PCIe M.2 versus SMD package—offer flexible selection options for different in-vehicle hardware architectures. On the charging infrastructure front, the S130N-ISI and other PLC module products are addressing the mandatory upgrade requirements brought by new EU regulations, providing GreenPHY PLC communication capability compliant with ISO 15118-20 standards for charging piles. With upstream partnerships with Qualcomm and other leading chip original equipment manufacturers, Ofeixin Technology rapidly transforms the latest chip platforms into mass-producible module products. From Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions to charging pile PLC communication solutions, the full-stack coverage enables Ofeixin to deliver complete wireless module solutions for intelligent connected vehicles—from in-vehicle connectivity to infrastructure communication. This represents both the completeness of the product portfolio and the flexibility to address different scenarios and requirements. Looking ahead to 2027-2030, composite communication modules integrating 5G cellular are gradually penetrating mid-to-low-end vehicle segments, while software-defined vehicle architectures demand higher programmability and security isolation capabilities from modules. The rigid demand of intelligent cockpits and autonomous driving for high-speed, reliable data links, combined with the mandatory upgrade window created by EU charging pile regulations, will together ensure the long-term positive fundamentals of both the in-vehicle wireless communication and charging infrastructure communication module markets.  

2026

08/25

From Stunts to Delivery: How Communication Modules Are Becoming the Nervous System of Embodied AI at WRC 2026
On August 19, 2026, the 11th World Robot Conference (WRC) officially opened at the Beiren Yichuang International Convention Center in Beijing’s E-Town, running through August 23 under the theme “Human-Robot Symbiosis, Production-Demand Convergence.” The scale set new records: more than 300 exhibitors (up 36% year-over-year) presented over 2,000 exhibits, with more than 150 products making their global debut. More than 17,800 contestants from 26 countries are competing across the conference‘s robotics contests. If previous WRC editions were “technology showcases,” WRC 2026 is an “industrial acceptance test.” The most significant shift is structural, not cosmetic. The conference introduced four themed days — Launch Day (Aug 19), a first-ever Procurement Day (Aug 20), Developer Day (Aug 21), and Public Days (Aug 22–23). A dedicated pavilion gathered 49 centrally administered state-owned enterprises presenting 12 real-world application scenarios — one of the strongest procurement signals the Chinese robot industry has ever staged. As one observer put it: last year‘s WRC answered whether robots can work; this year the industry answers how well they work, how much they cost, who buys them, and whether they can be deployed at scale. I. WRC 2026 Signals: The “Acceptance Test” of Physical AI The signals from this year’s conference are clear and strong: the robotics industry is moving from “single-technology demonstrations” to a new phase of “technological innovation + industry-demand alignment + global collaborative governance.” Trend One: From “Muscle” to “Brain.” Goldman Sachs’ July 2026 research report explicitly noted that the industry’s center of gravity is shifting from “physical capabilities” to “intelligent decision-making.” On the WRC floor, the Beijing Humanoid Robot Innovation Center unveiled the Pelican-Unify 1.0 unified embodied model and the Tiangong Omni — a lightweight humanoid robot open platform designed for the embodied AI ecosystem. Xinghaitu demonstrated the application results of the world’s first end-to-end full-body control model. The industry consensus is forming: the ultimate competition in embodied intelligence is not in motors and joints, but in foundational models and the data flywheel accumulated through continuous interaction with the real physical world. Trend Two: From “Showing Off” to “Real Work.” On the exhibition floor, robots are doing real work rather than performing. The firefighting humanoid robot Linglong L2.0 can easily climb over rubble and stairs. Fourier’s GR-3 humanoid robot acts as an “intelligent butler assistant” in simulated home scenarios. Keenon Robotics’ XMAN series autonomously completes the entire coffee extraction process. As Li Tong, founder and CEO of Keenon Robotics, stated: “Whether robots can actually do real work is the essence of humanoid robot commercialization.” Trend Three: Accelerated Industry Chain Closure. IDC’s latest MarketGlance: China Embodied AI Robotics, 3Q26 report divides the current industry into six market segments: computing infrastructure, model algorithms, data engines, robot bodies, core components and infrastructure, and industry application agents. The four exhibition halls of WRC 2026 — Innovation, Exchange, Manufacturing, and Fun — precisely cover the complete chain from underlying technology and core components to finished robot applications. Guangdong sent 34 companies spanning the full robot supply chain, from upstream EVE Energy batteries and ORBBEC 3D vision sensors, through midstream CVTE control boards and Neoway 5G communication modules, to downstream UBTECH, Dobot, and LimX Dynamics full machines. II. Communication Modules: The Underestimated “Nervous System” When industry attention focuses on the “brain” (AI models) and the “body” (joints and actuators), a critical question emerges: connectivity is becoming a key factor in determining whether robots are truly deployable. If large models are the robot’s “brain,” then the communication network is its “nervous system” — this “brain” must process massive heterogeneous data from dozens of sensors distributed across the body within milliseconds, and issue synchronized instructions to actuators within microseconds. Whether humanoid robots or autonomous mobile robots (AMRs), actual deployment imposes unprecedented demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency. Industry research indicates that the internal and external communication architectures of robots are facing unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits. The market size for embodied AI robot-dedicated communication is expected to expand rapidly from $42 million in 2026 to approximately $300 million by 2030. More宏观 data confirms this trajectory. QYResearch shows that the global robot communication module market was approximately $8.12 billion in 2025 and is projected to reach $21.61 billion by 2032, with a compound annual growth rate of 15.1% from 2026 to 2032. Research institutions further point out that driven by market prosperity and chip specialization, communication modules will witness nearly RMB 10 billion in incremental growth. The value of the communication link is undergoing a structural reorganization — from “general industrial component” to “dedicated core component.” III. The Communication Module Ecosystem at WRC 2026 WRC 2026 clearly displays the complete ecosystem of robot communication modules. In wireless communication, Neoway Technology showcased its 5G communication modules for the midstream industry, demonstrating a rich portfolio of products and solutions for robot collaborative communication scenarios. Realtek Semiconductor exhibited its communication transmission chip integration solutions for humanoid and industrial robots, featuring Wi-Fi 8 2×2 and 5GHz 3T3R high-end wireless modules to ensure real-time protocol and high-speed data exchange between robots. The 34 Guangdong companies formed a complete closed loop from upstream power batteries and 3D vision sensors, through midstream control motherboards and 5G communication modules, to downstream finished robots. In control and communication integration, GigaDevice demonstrated joint module solutions based on GD32 series MCUs, compatible with CANopenNode protocol and equipped with CANFD and RS485 dual industrial buses. JWIPC and CVTE provided control motherboards and edge computing platforms. These highly integrated control solutions represent the typical application of PLC (Power Line Communication) technology in robot motion control — achieving precise, real-time joint control through industrial buses, which is the key neural pathway through which the robot’s “brain” commands its “body.” In perception and safety, ORBBEC demonstrated robot-dedicated 3D depth camera modules, while Lingsi Intelligent and Saigan Technology provided perception and safety modules. These modules constitute the robot’s “sensory system,” forming the foundation for environmental perception and safe interaction. IV. Qogrisys Business Portfolio: A Full-Stack Connectivity Foundation from Wi-Fi 7 to PLC In the industry landscape revealed by WRC 2026, the role of communication module suppliers is upgrading from “standard component providers” to “builders of robot nervous systems.” Qogrisys business portfolio precisely covers multiple critical dimensions of this transformation. Wi-Fi 7 Modules: High-Speed Neural Pathways for Embodied Intelligence. Qogrisys has launched Wi-Fi 7 module product lines for high-end robots and industrial equipment. Among them, the O2072PM, based on Qualcomm’s QCC2072 chip, is a Wi-Fi 7 + Bluetooth 6.0 tri-band 2×2 MIMO module supporting 2.4/5/6 GHz bands, with up to 320 MHz bandwidth across all bands, peak speeds of up to 5.8 Gbps, 4096-QAM modulation, and Multi-Link Operation (MLO) capabilities. Bluetooth supports BLE 6.0 and LE Audio. In addition, These performance metrics directly address the rigid demand for ultra-low latency and ultra-high bandwidth wireless connectivity in embodied AI robots. Bluetooth and Multi-Protocol Modules: The Foundation of Diverse Connectivity. Qogrisys‘ product portfolio covers 2.4G/5.8G/6G series Wi-Fi modules, Wi-Fi HaLow, Nearlink, and Bluetooth (BLE) modules. Its Bluetooth modules support the latest standards including BLE 6.0 and LE Audio. In robot scenarios, different communication protocols serve different connectivity needs — Wi-Fi carries high-bandwidth data backhaul, Bluetooth handles low-power device interconnection, and Wi-Fi HaLow is suitable for long-distance low-power scenarios. Multi-protocol parallelism has become a standard capability of robot communication modules. PLC Modules: The “Invisible Infrastructure” of Power Line Communication. In August 2026, Qogrisys has formed a complete technology matrix in the PLC domain. Its 3121N-H module, based on the HiSilicon Hi3121S chip, achieves a physical layer peak rate of 0.507 Mbit/s, with a single CCO supporting up to 200 STA nodes. The S130N-ISI module features an ultra-compact design measuring just 20.6 × 12.6 mm, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor. The 3121N-L module is a fully integrated power line carrier communication module equipped with an external LD amplifier and transmitter function. The unique value of PLC technology lies in “where there is power, there is network” — using existing power lines in homes or industrial settings as the data transmission medium, walls, floors, or metal structures blocking the signal. Measured data shows that PLC-IoT end-to-end response latency is stable within 50 milliseconds, with communication success rates as high as 99.99%. In industrial and service scenarios where robots need to be deployed across floors and rooms, PLC provides a stable connectivity guarantee that wireless solutions cannot. Deep Customization Capability: From Modules to Solutions. Qogrisys‘ core R&D team has long the world’s leading wireless chip platforms including Qualcomm, Realtek, WUQI, and HiSilicon, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing. In the trend of the module industry moving from standardization to deep customization, this capability enables the company to provide customized connectivity solutions for different robot form factors and application scenarios. V. Challenges and Opportunities: The Module Industry‘s “Acceptance Test” The industry trends revealed by WRC 2026 bring structural opportunities to the module industry — but challenges are equally. Supply chain pressure continues to intensify. In July 2026, the module industry experienced the most severe component price surge in recent years. PCB prices rose 10%-30%, crystal oscillators 10%-30%, inductors 30%-70%, and MLCCs 10%-70%. Packaging giant ASE officially announced price increases of up to over 20%. Passing down to the module segment, the BOM cost of every Wi-Fi/Bluetooth module is being passively pushed up. Industry report data shows that the industry‘s average gross margin in 2025 fell by 8 percentage points compared to 2024. The market side also faces divergence. Consumer IoT growth has significantly slowed, Wi-Fi 7 penetration is only 8%, and AI module shipments still account for single-digit percentages. Meanwhile, the U.S. FCC is推行 component-level bans, and EU compliance thresholds continue to rise. However, the explosive growth of the robotics industry is opening a high-value growth curve for the module industry. As IDC points out, the robotics industry is transitioning from technology demonstrations and point breakthroughs to product delivery, scenario deployment, and industrial collaboration. IDC‘s 2026 Global CEO Survey shows that 35.2% of CEOs rank Physical AI as a key new technology investment area to focus on over the next 12-24 months. At the opening ceremony, Vice Minister of Industry and Information Technology Xin Guobin stated that Chinese robotics enterprises’ revenue topped RMB 300 billion ($44.45 billion) in 2025, with average annual growth exceeding 20% over the past five years. In the first half of 2026, revenue reached RMB 165.5 billion, up 24.5% year-on-year. Ministry of Industry and Information Technology data shows that China‘s annual humanoid robot production is expected to exceed 100,000 units in 2026. Morgan Stanley has raised its 2026 domestic humanoid robot shipment forecast from 28,000 to 50,000 units, projecting 446,000 units by 2030. Every robot requires communication modules as its “nervous system” — this is not only growth in volume but also a leap in the value of communication modules per robot.     Conclusion WRC 2026 clearly declares to the world: the robotics industry has crossed the stage of “can we build it” and officially entered a new era of “can we use it well and sell it.” In this new era, communication and connectivity technology is no longer an “optional accessory” for robots, but a “core organ.” From the high-speed wireless neural pathways of Wi-Fi 7, to the invisible backbone of PLC over power lines, from the low-power interconnection of Bluetooth, to the wide-area coordination of 5G — the module industry is moving from behind the scenes to center stage, becoming a key force in defining the performance boundaries of robots. For module manufacturers, this is not just a market opportunity to supply components, but a strategic opportunity to deeply participate in and define the future form of robots by providing smarter, more integrated, and more reliable connectivity solutions. As robots move from “showing off” to “delivery,” the module industry is likewise welcoming its own “acceptance test.”  

2026

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