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As the Global Smart Streetlight Window Opens, PLC Module Selection Logic Is Being Rewritten

The global smart street light market is undergoing a structural expansion. A report released by Research and Markets in January 2026 shows that the market is projected to grow from $35.6 billion in 2026 to $74.9 billion in 2030, representing a CAGR of 20.4%. Europe is accelerating the renovation of existing infrastructure driven by mandatory replacement policies, while emerging markets in the Asia-Pacific region are releasing incremental demand through urbanization. However, a overlooked fact is that market expansion does not equate to simpler communication solution selection. On the contrary, as the focus of renovation shifts from "new construction" to "existing infrastructure," the primary constraint on communication solutions changes from technical specifications to the question: "Can this road be dug?" The position of PLC (Power Line Carrier Communication) under this constraint is clear: the streetlights themselves are connected to the power line, the PLC uses the same cable as both a power supply and data channel, and the communication signal is transmitted along the existing line without the need for any additional communication cables. Europe: Policy mandates have created the most certain scenarios for upgrading existing PLC systems. Europe is the region with the strongest policy drive for smart street light upgrades globally. A 2026 report by Mordor Intelligence points out that the EU's Mercury Regulation 2024/1849 requires the complete phase-out of compact fluorescent lamps by December 2025 and linear fluorescent lamps by December 2026. These compliance deadlines directly triggered a surge in municipal tenders. Simultaneously, the EU requires the public sector to reduce energy consumption by 11.7% by 2030, transforming the transition to network-connected LED lighting from an "optional" to a "compliance necessity." The unique aspect of this policy window is that it targets "replacement of existing infrastructure" rather than "new construction." Many streetlights in Europe were installed decades ago, with intact power cables but missing communication cables. Adopting a solution requiring separate communication cabling would mean excavating or re-laying conduits along the entire route, resulting in unpredictable costs and time. The ability of PLCs to reuse existing power cables perfectly matches the policy's mandated time pressure with the construction constraints of upgrading existing infrastructure. German practice provides a reference: the LED upgrade of 48,000 streetlights in Munich, combined with adaptive dimming, reduced energy consumption by 93% during off-peak hours. For these types of projects, communication reliability is more important than bandwidth; the millisecond-level latency of PLCs and the engineering advantages of no-wiring are more significant than wireless solutions in this scenario. However, the European market also presents a strict cost scrutiny. Smart retrofitting costs between €300 and €500 per pole, while basic LED replacement only costs €150 to €200. This price difference means that the selection of PLC modules must withstand scrutiny regarding the question of "why not use wireless?" The answer lies not in technological superiority, but in the engineering certainty under existing wiring conditions : wireless solutions are affected by terrain and building obstructions in dense urban areas, requiring additional relay nodes in practical testing, while PLCs, assuming the power supply cable is intact, have a physically existing communication link.   China and Asia Pacific: Differences in PLC Positioning in Incremental Markets Data from China's smart light pole market presents a different picture. QYResearch statistics show that the global smart city light pole market sales reached approximately $412 million in 2025 and are projected to reach $796 million by 2032, representing a compound annual growth rate of 10.0%. Unlike Europe's "replacement of existing stock," China's growth is largely driven by new "multi-purpose" projects: light poles simultaneously serve functions such as lighting, monitoring, 5G micro base stations, and environmental monitoring. Communication solutions tend to favor fiber optic or wireless backhaul because the civil engineering of the light pole itself is already included, thus amortizing the marginal cost of laying separate communication cables. This means that the main opportunity for PLCs in the Chinese street lighting market lies not in "building new smart light poles," but in the niche scenario of "energy-saving retrofitting of existing road lighting." Many urban roads in China only have power cables in their lighting circuits, lacking communication lines. If only single-lamp control, dimming, and fault feedback are required, PLCs offer better engineering economics than rewiring. A study published in the 8th issue of *China Lighting Appliances* in 2026 points to this logic: traditional control modes are energy-intensive and difficult to maintain, while mainstream wireless communication solutions are easily affected by terrain obstruction in densely populated urban areas. PLCs, utilizing existing cables for data transmission, offer advantages such as low cost and reliable connection. The Southeast Asian market is in an earlier stage. In March 2026, Terengganu, Malaysia, installed the state's first 5G smart lamppost at the Kedebayan Market, integrating smart lighting, monitoring, environmental monitoring, and electric vehicle charging functions. These markets share common characteristics: real incremental demand, but projects are small-scale, budgets are fragmented, and there is a higher sensitivity to module costs than to brand premiums. In these markets, PLC modules are more likely to follow lighting solution providers overseas rather than independently building brand recognition.   The strategic position of the Qogrisys S130N-ISI in this landscape The product parameters of the S130N-ISI need to be understood within the context of the aforementioned market differences. It is based on the Leadcore VC6330, with an LCC package size of 20.6×12.6mm, supports both Q/GDW 11612 and IEEE 1901.1 protocols, and provides UART, PWM, GPIO, ADC, and SPI interfaces, integrating a built-in wire driver. According to official data from Leadcore regarding the VC6330 chip, application-layer communication rates can reach 1Mbps, with attenuation resistance exceeding 112dB, and a 99.99% communication success rate in actual projects. These parameters address the question of "whether it can be used," but the "usability" in different markets depends on the line conditions and system integration quality. The aging of the lines in European projects, the distribution of interference sources in Chinese projects, and the differences in construction specifications in Southeast Asian projects all affect the actual performance of the PLC. In street lighting scenarios, the value of the S130N-ISI lies not in promising "it will work immediately after installation," but in providing a hardware option that meets basic engineering requirements in three dimensions: protocol matching (Q/GDW 11612, IEEE 1901.1), size adaptation (20.6×12.6mm can be embedded in a single lamp controller), and interface integration (PWM dimming, ADC acquisition). One fact that requires careful consideration is that publicly available authoritative data on the actual global adoption rate of PLCs in smart streetlights is limited. What can be confirmed is that PLCs are one of the official options for smart streetlight connectivity, with academic research and engineering practice supporting their feasibility under specific conditions. However, conclusions such as "PLCs will dominate streetlight communication" lack data support. For engineering teams evaluating solutions, a more pragmatic approach is to test the wiring first, then select the modules. Only when the line impedance and signal-to-noise ratio are within reasonable ranges can the wiring-free advantage of PLCs translate into savings in construction time and costs; if test results are unsatisfactory, the costs of forcing PLC implementation may only become apparent during the commissioning phase.   Conclusion: The window of opportunity belongs to solution providers who clearly explain the "constraints". The global smart street light market's 20.4% CAGR provides a real window, but this window opens differently in different regions. In Europe, mandatory policies have created a definite demand for retrofitting existing infrastructure, where the wiring-free advantage of PLCs has the clearest engineering logic. In China, incremental growth is concentrated in the construction of new multi-functional light poles, where PLCs have opportunities in the energy-saving retrofitting of existing roads. In Southeast Asia, the early-stage market is testing the cost competitiveness of modules. In this context, the S130N-ISI isn't a "universal street light module," but rather a PLC hardware option that adapts to the needs of single-lamp controllers in terms of protocol, size, and interface. Its value lies not in the absolute values of its specifications, but in its compatibility with the specific project's wiring conditions. For the engineering team, this means resolving the "do we need to break the road?" question at the project initiation meeting, rather than discovering during the commissioning phase that line noise is causing communication success rates far below expectations. Testing the line first, then selecting the module—reversing this order might save you a quote, but cost you the entire road's commissioning time.  

2026

10/21

Qualcomm Dragonwing Wi-Fi 8 Gateway Lands at Network X 2026: What It Means for Wi-Fi 7 and Wi-Fi 6E Module Products

I. The Real-World Coordinates of the Wi-Fi 8 Standard Progress Just two days ago, Qualcomm's Dragonwing platform released a signal at Network X 2026 – the Wi-Fi 8 gateway solution was launched. To understand this, we need to clarify the current standard stage of Wi-Fi 8. At the IEEE plenary meeting in Montreal in July 2026, the 802.11bn task force voted to submit Draft 2.0 to the working group for a vote, thus finalizing the core features of Wi-Fi 8. According to the timeline disclosed by ABI Research, Draft 3.0 voting is scheduled for January 2027, Draft 4.0/initial standards association voting is targeted for May 2027, final working group approval is set for March 2028, IEEE standards committee approval is expected for May 2028, and the Wi-Fi Alliance certification program is expected to launch in January 2028. The key implication of this timeline is that Wi-Fi 8 will still be in the draft standard stage in 2026, with certified products and large-scale commercialization not truly starting until 2028. However, chip platform and module solution providers have already significantly accelerated their product development pace. Broadcom was the first to release Wi-Fi 8 chipsets in October 2025, followed by MediaTek and Qualcomm. By September 2026, the Wi-Fi Alliance had already held its first Wi-Fi 8 pre-certification interoperability Plugfest in Beijing, Taipei, and California. While the standard has not yet been finalized, the industry's engineering preparations are already in full swing. II. The Differentiated Deployment Logic of Qualcomm's Dragonwing Platform Qualcomm's Dragonwing product portfolio, showcased at Network X 2026, presents a clear market segmentation strategy. designed for mainstream fiber broadband gateways . According to Qualcomm's official product briefing, the F8 integrates Wi-Fi 8 connectivity and native PON architecture support, targeting Home Gateway Units (HGUs) and Single Units (SFUs). Key specifications include: peak wireless capacity of 23Gbps, support for up to 750 concurrent clients, up to three-band operation and a 14-antenna configuration , flexible RF configuration allowing for a 5x5 mode or splitting into dual-band simultaneous 2x2+3x3 modes, and native support for GPON, XG-PON, and XGS-PON standards. The platform supports open-source middleware such as prplOS, OpenWRT, RDK, and OpenSync, and is equipped with a dedicated scanning radio frequency for automatic channel selection and radar detection. designed for high-end enterprise access points (APs) and flagship home routers . Its specifications are significantly improved: peak wireless capacity of 33Gbps, support for up to 1500 concurrent clients, up to five frequency bands and a 20-antenna configuration , integrated five-core CPU and Hexagon NPU, and support for edge AI inference. Developed in collaboration with GFiber, this platform, a Wi-Fi 8 Premium Gateway, aims to support symmetric 20Gig broadband services, redefining the gateway from a "connected device" to a "smart service platform." Meig Smart chose to launch its Wi-Fi 8 gateway solution on the N8 platform, officially announcing it at Network X 2026 on October 14th. The industry significance of this launch lies in the fact that the entire engineering transformation chain of a Wi-Fi 8 gateway, from chip platform to deliverable solution, has been fully demonstrated for the first time. For downstream customers, the Wi-Fi 8 gateway is no longer a distant concept "waiting for the standard to be finalized," but rather an evaluable chip base and a referenceable solution design. III. Generational Positioning of Qogrisys Gateway Module Product Line Although manufacturers are currently rushing to implement their strategies in advance, WiFi 7 and WiFi 6 remain the mainstays of shipments. They are more mature than WiFi 8 and are still the preferred choice. During this window of opportunity before the Wi-Fi 8 standard is finalized, gateway module solution providers need to strike a balance between technological foresight and market deliverability in their product strategies. Qogrisys's two main gateway module products are precisely designed to meet different levels of demand during this transition period. Wi-Fi 7 Platform: O2072PM and O2072PB The O2072PM is based on the Qualcomm FastConnect C7700 (QCC2072) chip, uses a standard M.2 Key E interface (22×30mm), and supports Wi-Fi 7 (802.11be) and Bluetooth 6.0. Its core capabilities include: tri-band 2.4/5/6GHz concurrent operation; the 6GHz band supports 320MHz channel bandwidth and 4096QAM modulation, with a peak rate of 5.8Gbps ; and it supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) , enabling millisecond-level switching when the link is interfered with. This module has completed driver adaptation for Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB is based on the same QCC2072 chip and uses a 15×13mm surface mount package, targeting space-constrained onboard integration scenarios. Wi-Fi 6E Platform: O2066PM and O2066PB The O2066PM is based on the Qualcomm QCA2066 chip and uses a standard M.2 2230 Key E interface (22×30×2.7mm), supporting Wi-Fi 6E (802.11ax) and Bluetooth 5.2. Key specifications include: tri-band 2.4/5/6GHz support, dual-band simultaneous (DBS) operation, and a maximum speed of 2975.6Mbps ; support for 2×2 MU-MIMO, 160MHz channel bandwidth, and dynamic frequency selection (DFS radar detection). The Bluetooth interface supports both UART/PCM and USB configurations. The module operates in a temperature range of -30℃ to +85℃ , exhibiting industrial-grade stability. In VR products, it has achieved a measured throughput of 2.1Gbit/s and has been designed into customer VR products, which were showcased at CES 2023. The O2066PB is based on the same QCA2066 chip, and its core capabilities are identical to the O2066PM; the difference lies in its package form. It uses a small SMT LGA package, measuring 13×15×2.3mm , targeting space-constrained onboard integration scenarios. Wi-Fi uses a PCIe interface, and Bluetooth uses a UART/PCM interface. Its operating temperature range is -30℃ to +70℃ , making it suitable for consumer-grade terminal devices. the O2072 series is logically consistent with the "high reliability connection" emphasized by Wi-Fi 8—Wi-Fi 7's MLO provides an engineering implementation of link redundancy, while Wi-Fi 8's Multi-AP Coordination (MAPC) extends the coordination scope from a single device to a multi-node network. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-end and mid-range gateways, Wi-Fi 6E's 6GHz band capability provides cost-sensitive customers with a "partial generational upgrade" option . IV. Generational Transition Logic Between Chip Platforms and Module Products From Wi-Fi 6E to Wi-Fi 7 and then to Wi-Fi 8, the technological evolution path of gateway modules shows a clear continuity. The core improvement of Wi-Fi 8 over Wi-Fi 7 lies not in peak speed . According to industry technical analysis, Wi-Fi 8 is compatible with Wi-Fi 7's 2.4/5/6GHz tri-band, 320MHz channel, and 4096QAM. Existing Wi-Fi 7 RF architectures can support these core features through firmware upgrades . Wi-Fi 8 offers approximately double the actual throughput and reduces P99 latency to about one-sixth of Wi-Fi 7. Its core value lies in reliability, coverage, and concurrency efficiency in high-density/long-distance scenarios , achieved through multi-AP collaboration, dynamic resource scheduling, and enhanced link design. Wi-Fi 7 addressed "speed," while Wi-Fi 8 addresses "stability." The eMLSR multi-link operation capability and tri-band concurrent architecture already possessed by the O2072 series from Qogrisys are engineering implementations on the Wi-Fi 7 platform. As the Wi-Fi 8 MAPC protocol stack and enhanced long-range response (ELR) features mature, module products based on the Wi-Fi 7 RF architecture have the engineering foundation to migrate to Wi-Fi 8 features at the hardware level . The core challenges lie in upgrading the software protocol stack and implementing multi-AP coordination functions. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-to-mid-range gateways, the 6GHz band capability of Wi-Fi 6E provides cost-sensitive customers with a "partial generational upgrade" option . V. Conclusion Qualcomm's Dragonwing platform was publicly launched as a Wi-Fi 8 gateway solution during Network X 2026, marking the transition of Wi-Fi 8 from the standard draft and chip prototype stages to the gateway product engineering stage . Meig Smart's solution release validates the transformation path from chip platform to deliverable gateway, and also indicates that the competitive pace among module solution providers has shifted from "following after the standard is frozen" to "parallel development during the standard draft stage." For gateway module solution providers, the core task at this stage is not to "get a head start" on the Wi-Fi 8 platform, but to accumulate transferable engineering capabilities on the Wi-Fi 7 and Wi-Fi 6E platforms. The experience of O2072PM / O2072P B in eMLSR multi-link operation, the accumulated RF engineering expertise in tri-band concurrent architecture, and the cost optimization path of O2066PM / O2066P B in the 6GHz band together constitute the product positioning for the transition to the Wi-Fi 8 era. From a longer-term perspective, Wi-Fi 8 redefines the gateway from a "wireless coverage device" to an "access node in a multi-AP coordinated network." This role change requires module solution providers to extend their capabilities beyond simple RF engineering and driver adaptation to system-level capabilities such as network topology planning, multi-node collaborative scheduling, and deployment scenario adaptation. During the standard window of 2026-2027, module solution providers' product strategies need to find a balance between "technological foresight" and "current deliverability"—Wi -Fi 7 modules serve current high-end gateway needs, Wi-Fi 6E modules cover cost-sensitive scenarios, and Wi-Fi 8 productization preparation needs to be quickly integrated as soon as the chip platform becomes available.  

2026

10/19

PV Shutdown Acceptance Testing Tightens: What Really Matters When Choosing PLC Modules

I. The acceptance logic has changed: from "whether it's installed or not" to "only counts if it's tested". Rooftop photovoltaic projects in Shenzhen are undergoing a substantial upgrade in acceptance standards. Shenzhen's local engineering construction standard SJG 220-2026 has been implemented , which sets precise quantitative indicators for rapid shutdown: the shutdown action should be completed in no more than 30 seconds, the voltage within 1 meter of the photovoltaic array should drop to below 80V, and the voltage outside 1 meter should drop to below 30V. This isn't something that can be simply dismissed as "installing fast shutdown." On-site acceptance personnel will first locate all shutdown trigger points, confirming the consistency of logic at fire exits, near the inverter, and at the remote control terminal; then verify the correspondence between the shutdown devices and components; finally, record the time and voltage at the measurement points specified in the drawings, confirming that the array boundary, both inside and outside the project's adopted version, meets the requirements. Simply stating "RSD is written in the bill of materials" is no longer sufficient for acceptance; the system-level voltage control performance is the final criterion. The Shanghai group standard T/ESETA 000007—2026 further refined the requirements: shutdown must be completed within 30 seconds after triggering, and the external voltage of the reachable boundary must be ≤30V, the internal voltage must be ≤120V, and the output power must be ≤1W. It also clearly states that "shutdown is divided into component-level and string-level, and component-level solutions should be given priority in densely populated places." The North American market has more stringent entry barriers. NEC 690.12 requires that controlled conductors outside the array boundary must drop below 30V within 30 seconds, and that electric shock protection for firefighters within the boundary must be achieved through a listed PVHCS device or voltage limiting method. When selecting a PLC solution, the chip's modulation method and noise immunity directly determine the number of components the system can support. II. SunSpec's hierarchical logic: Chip compliance ≠ Module certification ≠ Complete system approval This is a critical issue that is most easily overlooked by switch manufacturers and module purchasers. The SunSpec Alliance's "Communication Signal for Rapid Shutdown" specification defines the communication protocol between the transmitter and receiver: the transmitter continuously sends a signal in an "operational" state, and the receiver triggers shutdown upon detecting a signal loss. The SunSpec Alliance explicitly states: "Only the 'SunSpec Certified' mark proves the complete and successful implementation of the SunSpec Rapid Shutdown communication signal functionality specification. Claims of 'SunSpec compliance' or 'SunSpec compatibility' by manufacturers or other third parties are not equivalent to a certificate issued by SunSpec." This means that chip support for protocols, module passing conformance testing, and complete device certification are three independent verification levels. Module-level protocol compatibility is only the first hurdle; safety certifications such as UL 1741 and CSA C22.2 at the whole-unit level are the passports to market entry. This understanding is crucial for circuit breaker manufacturers' selection decisions.   III. Three Engineering Dimensions for Module Selection: Size, Power Consumption, and Networking Capability For circuit breaker manufacturers, the "PLC support" and "integrated line driver" features on the chip specifications are just the starting point. What truly determines whether a solution can be mass-produced and implemented is the engineering adaptability at the module level. The first dimension is size. The circuit breaker is installed on the back panel of each photovoltaic module, where space is extremely limited, and it shares this limited area with junction boxes and cables. The module's package size directly determines the design space and installation method of the circuit breaker housing. PLC modules using the Hisilicon PS0211 chipset typically use a 28.12×18.00mm pin header package or a 20.0×14.2mm gold finger package, while some module manufacturers have launched a further miniaturized version of 20.0×11.0mm. The second dimension is power consumption. The shutdown device is powered by the photovoltaic panel itself and has no independent power input. The static power consumption of the HiSilicon PS0211 solution is ≤0.15W (in the grid-connected, non-packet-sending state), and the dynamic operating power is ≤0.5W. During periods of insufficient sunlight, when the modules are shaded, or at night, the module must rely on extremely low standby power consumption to maintain its monitoring capability, waiting for the "operation allowed" signal sent by the inverter transmitter. The third dimension is networking capability. PLC signals are transmitted via DC power lines, and the shutdown device, acting as a STA node, needs to establish a reliable communication link with the CCO at the inverter end. The HiSilicon PS0211 solution supports rapid networking in 10 seconds in a typical 200-node, 2-tier network scenario, supporting dynamic routing and multi-path addressing, and unicast, multicast, and broadcast command propagation methods. For the requirement of unified access for multiple components and devices in distributed photovoltaic systems, the networking scale and time performance of the modules directly affect the system commissioning efficiency. IV. Scene Alignment of Two PLC Modules from Qogrisysy In the selection of photovoltaic shutdown PLC modules, Qogrisysy provides two products based on different chip solutions, each corresponding to different engineering focuses. the S130N-ISI (Linktronics VC6330 solution) is its ultra-small size. This module uses LCC packaging, with a PCB size controlled at 12.6×20.6×2.5mm. It operates in temperatures ranging from -20°C to 80°C and in storage temperatures from -40°C to 125°C, supporting SGCC 0~12MHz bandwidth and the IEEE 1901.1 communication protocol. For switchgear designs with extremely limited space, the physical size of the module is often the first screening hurdle. For the design of rapid shutdown unit (RSU) enclosures where space is severely constrained, the physical dimensions of the module often serve as the primary screening criterion. For RSU manufacturers, engineering compatibility at the module level is more critical than specific chip parameters: the unit is mounted on the back of the PV module—an area with extremely limited space—and is powered by the PV panel itself, requiring it to continuously monitor PLC signals while operating at a microwatt-level power draw. Engineering metrics across three dimensions—module dimensions, power consumption characteristics, and reliability over a wide temperature range—directly determine whether the complete RSU can operate stably in real-world rooftop environments. V. Key Conclusions First, PLCs are the optimal technical solution for rapid shutdown at the component level. The SunSpec specification explicitly uses PLCs as the communication signal carrier, multiplexing DC power lines to transmit control signals, thus avoiding the cost and reliability risks of laying separate communication lines for each component. Second, the acceptance criteria are shifting from "functionality" to "measurable effectiveness." The 30-second/80V/30V specifications in SJG 220-2026 and the quantitative requirements of the Shanghai group standard mean that the design of a fast shutdown solution must withstand on-site testing. Third, the core consideration for module selection should shift from "chip parameters" to "engineering adaptability." The three engineering indicators—space constraints of the shutdown unit, power consumption constraints under self-powered conditions, and network scale constraints in distributed scenarios—are the key to determining whether a solution can be mass-produced and implemented. Fourth, awareness of certification levels is a capability that circuit breaker manufacturers must establish. Chip support for the SunSpec protocol, module certification through SunSpec, and complete unit certification through UL 1741 safety standards are three independent verification levels. The Hisilicon PS0211 chip explicitly indicates support for the SunSpec standard, and the Qogrisysy 3121N-H module, based on this chip, provides a fundamental protocol-level guarantee for circuit breaker manufacturers' complete unit certification. Fifth, the role of module suppliers is expanding from "device delivery" to "certification assistance." Switch manufacturers need more than just "usable modules"; they need technical partners who can "help understand SunSpec test logic, optimize system networking design, and assist in passing overall system certification."  

2026

10/14

Wi-Fi 8 Is Coming Fast — So Why Does Wi-Fi 7 Still Dominate Module Shipments?

In October 2026, the TP-Link Archer 8 Ultra will be available for pre-order simultaneously in the UK, Germany, and Australia, priced at £669.99. This is the world's first complete Wi-Fi 8 series product aimed at the consumer market . However, what is truly noteworthy is not the router's theoretical aggregation speed of 19Gbps, but a more fundamental technological shift: Wi-Fi 8 (IEEE 802.11bn) is abandoning the traditional path of "each generation must be faster," and shifting its focus to reliability, coverage, and concurrency efficiency in real-world network environments . What does this shift mean for Wi-Fi module solution providers? If Wi-Fi 7 addressed the "peak speed ceiling" problem, Wi-Fi 8 aims to solve the "lower limit of actual user experience." The two technologies have different technical logics, and the corresponding module design approaches, chip selection criteria, and supply chain preparation schedules will also change accordingly. The "time difference" between the standard timeline and the commercial pace To understand the commercialization process of Wi-Fi 8, we first need to clarify a key fact: there is a significant time lag between product launch and standard finalization . According to the latest progress from the IEEE 802.11 working group, final approval of the Wi-Fi 8 standard is expected in May 2028 , while the Wi-Fi Alliance's certification program is scheduled to launch during CES in January 2028. Rolf de Vegt, Qualcomm's Vice President of Technical Standards, confirmed that Draft 2.0 will be finalized at the IEEE meeting in July 2026; this version is generally considered a sign that core technical features are stabilizing . This "product-first, standards-undefined" approach presents unique selection challenges for module solution providers: early chip solutions may have inconsistent feature completeness, and some Wi-Fi 8 functions require subsequent firmware updates to activate. TP-Link has explicitly stated that features such as DSO (Dynamic Subband Operation), ELR (Enhanced Long Distance Transmission), and DRU (Distributed Resource Unit) on the Archer 8 Ultra will be gradually released through OTA updates . A shift in technological logic: from "peak rate" to "consistent throughput" The technical goals of Wi-Fi 8 can be summarized by a set of figures: 25% increase in data rate, 25% reduction in tail latency, and 25% reduction in lost MAC protocol data units . The design intent of these goals is clear—not to make a single device run faster, but to make connections more stable across multiple devices, over long distances, and in environments with interference. The specific technical mechanisms include several levels: Multi-AP Coordination is the core architectural change in Wi-Fi 8. Unlike Wi-Fi 7 where each AP works independently, Wi-Fi 8 allows multiple routers to form a coordinated network, even serving a single device simultaneously . This means that in Mesh networking or enterprise deployments, interference between APs can be actively managed, rather than passively avoided. Enhanced Long Range Transmission (ELR) and Distributed Resource Units (DRUs) are designed for edge-of-signal scenarios. TP-Link's test data shows that over medium to large distances, Wi-Fi 8 offers a 33% improvement in throughput consistency compared to Wi-Fi 7 ; in interference environments, throughput consistency is improved by 24% . Receiver sensitivity is improved by 1-3 dB in the 5GHz and 6GHz bands . Non-Primary Channel Access (NPCA) and Dynamic Sub-Band Operation (DSO) address the issue of spectrum coexistence. NPCA allows APs to dynamically switch when the primary channel is congested, while DSO supports the efficient coexistence of devices with different bandwidth capabilities within the same network . MediaTek claims that its NPCA+ technology can improve throughput by approximately 80% in high-density environments with overlapping multi-networks . From a physical layer perspective, Wi-Fi 8 introduces a new 3888-bit LDPC code , an extension of the existing 648, 1296, and 1944-bit codes. This longer code block provides a coding gain of 0.5–1.0 dB at higher MCS levels and in multi-spatial-stream scenarios , at the cost of requiring parallel decoding capabilities, which may limit its performance in narrow-channel 2.4 GHz bands . An overlooked accelerating factor: storage cost pressures Behind the accelerated commercialization of Wi-Fi 8 lies a driving force unrelated to wireless technology itself: the continuous rise in memory chip prices . A Dell'Oro Group report in August 2026 indicated that the introduction of enterprise-grade Wi-Fi 8 could be brought forward to 2027 due to tight DDR4 memory supply and rising prices , allowing vendors to reduce their reliance on high-cost storage components through new architectural designs . The report's author, Siân Morgan, concluded: "The faster vendors change their AP designs to reduce their reliance on the highest-cost memory components, the more competitive they will be on price. This constitutes a strong incentive to move to Wi-Fi 8." This logic also applies to Wi-Fi modules. If the architectural optimizations of Wi-Fi 8 can reduce the reliance on large-capacity memory in module solutions, then in an environment of high storage costs, the overall BOM cost structure of Wi-Fi 8 modules may be more competitive than that of Wi-Fi 7. The driving force behind technological upgrades comes not only from performance requirements but also from cost pressures from the upstream supply chain. Complementary rather than substitutive technologies: Wi-Fi 7 addresses the question of "how fast can it be," while Wi-Fi 8 addresses the question of "how stable can it be." To understand the relationship between Wi-Fi 7 and Wi-Fi 8, we need to go back to the core design goals of IEEE 802.11bn. The technical logic behind Wi-Fi 7 (IEEE 802.11be, Extremely High Throughput) is to push peak speeds to the limit : 320MHz channels, 4096-QAM, Multi-Link Operation (MLO), Multi-Resource Unit (Multi-RU), and preamble puncturing . Research published in IEEE Communications Standards Magazine indicates that Wi-Fi 7 aims to achieve "throughputs up to 30 Gbps and lower latency than Wi-Fi 6." These characteristics correspond to high-bandwidth, low-latency scenarios such as 8K video streaming, VR/AR, and cloud gaming. The technical logic of Wi-Fi 8 (IEEE 802.11bn, Ultra High Reliability) has undergone a fundamental shift. According to the technical lecture summary of IEEE Region 6, Wi-Fi 8 "maintains peak rates" while shifting its focus to "reliability, lower latency, less packet loss, and stable throughput under load ." Its core technical means include multi-AP coordination, coordinated spatial multiplexing, non-primary channel access, and enhanced long-distance operation—all pointing to the same goal: to allow users to experience throughput closer to theoretical values in real-world network environments with dense interference, diverse devices, and proximity to the edge . This difference in positioning determines the complementarity of Wi-Fi 7 and Wi-Fi 8 in application scenarios. For scenarios requiring extreme speeds (VR wireless streaming, 8K live streaming, high-speed file transfer), Wi-Fi 7's 320MHz and MLO are core capabilities; for scenarios requiring extreme reliability (industrial automation, AGV/AMR, telemedicine, smart home whole-house coverage), Wi-Fi 8's Multi-AP coordination and ELR are key. The two are not in a "new generation replacing the old generation" relationship, but rather a coexistence relationship where each leverages its strengths in different scenarios. The practical significance of Qogrisys Wi-Fi 7 module solution During this window of time when generations coexist, the value of module solution providers lies not in "betting on which generation of technology will win," but in providing suitable Wi-Fi 7 module options for different scenarios, while reserving the ability to switch to Wi-Fi 8 technology . Taking the O2072PM module from Qogrisys as an example, this module is based on the Qualcomm QCC2072 (FastConnect C7700) design, supports 320MHz channels, 4096-QAM, MLO, tri-band 2.4/5/6GHz concurrent operation, peak data rate of 5.8 Gbps, and Bluetooth supports BLE 6.0 and LE Audio . These features directly correspond to the core capabilities of Wi-Fi 7, making it suitable for industrial gateways, smart terminals, and embedded systems that require high throughput and low latency. The market viability of these Wi-Fi 7 module solutions in the current and next two years is based on the following facts: First, the Wi-Fi 7 terminal ecosystem is already mature. Intel's Wi-Fi 7 product line has been continuously iterated from BE200 (Q3 2023) to BE213/BE211 (Q4 2025) , and the Wi-Fi 7 platform has been fully deployed in routers, mobile phones, and PCs. Module solution providers do not need to wait for "terminal readiness" because terminals are already being shipped. Secondly, the chip production capacity and supply chain for Wi-Fi 7 have stabilized. The capacity utilization rate of Wi-Fi 7 modules is projected to be only 62.3% in 2026, indicating a structural oversupply . This means that chip supply is no longer a bottleneck, and module manufacturers can obtain competitive procurement costs and stable delivery times. Third, early demand for Wi-Fi 8 modules will primarily appear in enterprise and industrial applications, rather than consumer applications. Dell'Oro Group predicts that enterprise-grade Wi-Fi 8 may be introduced as early as 2027, driven by storage cost pressures rather than end-user demand . Large-scale demand for consumer-grade Wi-Fi 8 modules will require waiting for the standard to be finalized in 2028 and for end devices to fully adopt it. Key conclusions First, the dominant position of Wi-Fi 7 modules in shipments from 2026 to 2028 will be determined by the terminal iteration cycle, rather than by technological superiority or inferiority. The expected annual shipment of 234 million units and a 46% contribution rate to sales revenue indicate that Wi-Fi 7 has entered a period of large-scale returns. Secondly, Wi-Fi 8's "reliability-first" positioning makes it complementary to Wi-Fi 7 in various scenarios, rather than a simple replacement. Wi-Fi 7 addresses "speed," while Wi-Fi 8 addresses "stability." The two will coexist in high-density, long-distance, and multi-device coexistence scenarios for a long time. Third, the core strategy of module solution providers at this stage is to cover mature terminal needs with Wi-Fi 7 solutions, while reserving a technical window for Wi-Fi 8 FEM pre-research and chip platform evaluation. Wi-Fi 8 RF front-end pre-research needs to be coordinated with the SoC ecosystem, and this preparation should be completed in 2026-2027.      

2026

10/12

Smart Hotel Renovation: PLC Power Line Communication as the Connectivity Backbone

I. A trillion-yuan existing market is opening up China's hotel industry has entered a stock era. Over the next three years, 732,000 rooms older than 15 years will enter a concentrated renovation cycle , with the market size already exceeding 100 billion yuan . Since 2026, the number of renovation contracts signed has already surpassed the total number for the entire previous year, and "renovation" and "rebranding" are becoming accompanying actions in the upgrading of China's hotel stock . The core challenge of renovating existing hotels lies in the need to upgrade guest rooms with smart technology while maintaining operations and minimizing disruption to guests. This places demands on the construction costs and deployment flexibility of communication technologies far exceeding those of new projects. II . Market Trends The smart hotel market is currently experiencing a period of structural expansion. Market research firms predict that the global smart hotel market will grow to US$90.46 billion by 2032 , representing a compound annual growth rate of 14.20% . The Asia-Pacific region is the fastest-growing area, driven by high smartphone penetration, urban tourism expansion, and large-scale hotel modernization . In terms of connectivity technology, PLCs are transforming from a "supplement to wireless solutions" to a "connection base for hotel guest room control ." This judgment is based not only on Lihe Micro's implementation data but also on changes in the competitive landscape: Honeywell's INNCOM FLEX intelligent hotel guest room control system, released in September 2026, explicitly supports "wired and wireless dual deployment solutions" and is compatible with mainstream building protocols such as BACnet IP and Modbus TCP, reflecting the leading building automation manufacturers' recognition of the "multi-protocol compatibility and open deployment" approach . III . The Dilemma Between Wired and Wireless Traditional hotel guest room control systems face a structural dilemma. Wired solutions (RS-485 bus, TCP/IP Ethernet) offer stable and reliable communication with strong anti-interference capabilities and no data packet loss issues, but require the laying of dedicated communication cables. In existing renovation scenarios, this means trenching, ceiling removal, and wall repair, resulting in long construction periods and often requiring closure or phased construction, significantly impacting hotel operations . This type of solution is more suitable for new construction or complete renovation of high-end hotels . Wireless solutions (Bluetooth Mesh, Zigbee, Wi-Fi) offer flexible deployment options, requiring only the laying of power lines, making them cost-effective and easy to install in converted hotels . However, wireless signals face challenges in complex hotel structures, such as wall attenuation, metal cabinet obstruction, and co-channel interference, resulting in weaker communication stability compared to wired methods. Furthermore, the location of the equipment significantly impacts signal quality . No single technological approach can simultaneously meet the dual requirements of "uninterrupted transformation" and "highly reliable communication." What the industry needs is a third path. IV . PLC: Resolving the conflict between "existing power lines" and "new wiring". The core logic of PLC (Power Line Carrier Communication) differs fundamentally from traditional solutions. Wireless solutions rely on electromagnetic wave propagation, and signals experience significant attenuation when passing through load-bearing concrete walls and metal structures. In contrast, PLC uses the building's existing 220V/380V power lines as the data transmission medium. Signals travel along the power lines and are unaffected by physical obstructions from walls, floors, or metal structures—as long as the circuit is powered, the communication link remains stable . Real-world test data supports these technical characteristics: PLC-IoT end-to-end response latency is consistently below 50 milliseconds , and the communication success rate is nominally as high as 99.99% ; a single host can support 128–384 device nodes; academic research confirms that PLC-IoT has comprehensive advantages over ZigBee and KNX technologies in terms of stability, cost-effectiveness, and anti-interference capabilities . For hotel renovation projects, the most valuable feature of PLCs is that they eliminate the need for wiring. V. Open ecosystems are replacing closed solutions The accelerated adoption of PLC technology in the hotel industry also benefits from the industry's reflection on "closed-loop guest room control solutions". Currently, most hotel smart guest room control projects adopt closed-loop solutions, with hotel systems, equipment, and platforms highly dependent on a single supplier. If a vendor experiences operational or technical issues, the entire guest room control system may be paralyzed. Furthermore, incompatible communication protocols between gateway devices from different brands prevent interoperability and hinder system expansion, resulting in persistently high costs for subsequent hotel upgrades, maintenance, and iterations . Based on a unified protocol standard, the PLCP ecosystem brings together products such as switch panels, light drivers, curtain motors, and temperature control panels from numerous equipment manufacturers. Hotels can flexibly select from multiple brands and categories, eliminating the supply chain risks of "one vendor monopolizing" products. This trend offers a clear message for module manufacturers: hotel customers are no longer simply buying "a gateway + a set of equipment," but are looking for "a standard + an ecosystem." As the underlying communication layer, modules need to be compatible with mainstream protocol stacks. VI . PLC module slots of Qogrisys Shenzhen Ofeixin Technology Co., Ltd. has developed two core module products for hotel scenarios in the PLC field. The 3121N-H (based on the HiSilicon Hi3121S) is based on a subset of the IEEE 1901.1 standard. A single CCO supports up to 200 STA nodes , dynamic routing, and automatic multi-path addressing. A typical 200-node, two-tier network can be set up within 10 seconds . The module size is 23.5×30mm, integrating built-in line drivers and onboard coupling circuitry, and providing interfaces such as UART, PWM, GPIO, I2C, and ADC. Qogrisys has also designed an integrated PLC + power supply kit with a built-in conversion transformer for direct connection to 220V bidirectional AC power, facilitating rapid product adoption by customer control solution providers . The S130N-ISI (based on the Leadcore VC6330) uses an LCC package, measuring only 20.6×12.6mm , making its ultra-miniaturized design suitable for space-constrained hotel panel devices. It integrates a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor, supporting both China SGCC Q/GDW 11612 and IEEE 1901.1 protocols . The Leadcore VC6330 chip achieves an application-layer communication rate of up to 1Mbps, with a 99.99% communication success rate in actual projects and a Level 1 network communication latency of

2026

09/22

Carrier Procurement Guide to Wi-Fi 7 RF Modules: FTTR Gateway Needs and O2072PM/PB Engineering Fit

I. Centralized Procurement Signal: The Iteration of Wi-Fi 7 for Home Gateways Enters Substantive Stage The centralized procurement of home network terminals completed by China Telecom and China Mobile in 2026 sends a clear signal to the industry: the role of Wi-Fi 7 in operators' home gateways and FTTR products is shifting from "flagship configuration" to "mainstream configuration" .   In China Mobile's 2026-2027 smart home gateway centralized procurement, Tianyi Technology was shortlisted as the third successful bidder for Package 1 and the sixth successful bidder for Package 2, with an estimated value of 208 million yuan. In China Telecom's FTTR centralized procurement, Tianyi Technology won two packages, with an estimated value of 273.6 million yuan. Jiulian Technology was shortlisted for China Mobile's GPON and 10G GPON packages, with market shares of 14.63% and 12.20%, respectively. The significance of these centralized procurements lies in the fact that operators' technology choices for home network terminals directly determine the upstream module demand structure for OEMs over the next 12 to 18 months . From a penetration rate perspective, the proportion of Wi-Fi 7 in FTTR terminals is rapidly increasing. According to IIM Information's "Global FTTR All-Optical Network Industry Outlook In-Depth Analysis Report," the proportion of FTTR terminals supporting Wi-Fi 7 is expected to reach 38.6% in 2026 , an increase of 17.2 percentage points compared to 2025. This growth rate is significant in the iteration of communication terminal technology, reflecting operators' clear willingness to invest in the evolution from "whole-house gigabit" to "whole-house Wi-Fi 7." II. Engineering Constraints of FTTR Architecture on RF Modules The core architecture of FTTR is a distributed network consisting of a main gateway and multiple sub-routers. Fiber optic backhaul solves the wired bandwidth problem between nodes, but the wireless coverage quality of each node directly determines the user's true perception of "gigabit throughout the house." This architecture imposes three engineering constraints on the radio frequency module that differ from those in a single-router scenario. First, latency consistency during multi-node handover. When users move between rooms, terminal devices need to complete roaming handovers between different sub-routers. Traditional Wi-Fi roaming mechanisms experience service interruptions on the order of 100ms during handover. For real-time applications such as video calls and online games, this interruption is sufficient to cause noticeable experience degradation. Wi-Fi 7's Multi-Link Operation (MLO) and its Enhanced Single-Radio Implementation (EMLSR) significantly reduce handover interruptions through link pre-sense and fast handover mechanisms. Huawei explicitly claims an ultra-low latency of 10ms in its Wi-Fi 7 FTTR solution . This is not just marketing hype, but a scenario-based realization of Wi-Fi 7 MLO capabilities. Second, scheduling efficiency under dense device concurrency. Modern homes typically have more than 20 devices online simultaneously, and in mid-to-high-end scenarios, this can reach over 40. While FTTR's distributed architecture expands coverage, it also means more radio frequency nodes operating in the same spectrum space, leading to increased inter-node interference and terminal scheduling complexity. Wi-Fi 7's optimized OFDMA resource scheduling and multi-link redundancy mechanisms offer far greater value in this scenario than in a single-router environment. Third, matching the fiber backhaul bandwidth. When the fiber backhaul between the FTTR main gateway and sub-routers provides 2.5Gbps or even higher bandwidth, if the wireless side still relies on Wi-Fi 6's 160MHz channel capability, it will become a bottleneck for end-to-end throughput. Wi-Fi 7's 320MHz channel and tri-band capability enable the wireless side to have the basic bandwidth supply to match the fiber backhaul. In this architecture, the role of the RF module is to transform the chip's protocol capabilities into a mass-producible, testable, and reliably deliverable RF subsystem. The chip provides "what it can do," while the module determines "how much it actually accomplishes." III. Engineering Parameters and Scenario Adaptation Analysis of O2072PM/PB The O2072PM and O2072PB modules designed by Qogrisys based on the Qualcomm QCC2072 (FastConnect C7700) platform correspond to the engineering constraints of the aforementioned FTTR/gateway scenarios in terms of parameters . In terms of RF capabilities , the O2072PM supports the IEEE 802.11be standard, 2×2 MIMO, and tri-band 2.4/5/6GHz concurrent operation. The 6GHz band channel bandwidth can reach 320MHz , achieving a peak rate of 5.8Gbps with 4096-QAM modulation . This rate level provides ample margin in current FTTR gateway designs, matching fiber backhaul bandwidth and reserving scheduling space for multi-user concurrent scenarios. In terms of latency control , the O2072PM supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) . eMLSR, in engineering terms, means that in a single-radio hardware architecture, it uses an auxiliary radio (Aux Radio) to monitor the status of multiple frequency band links, quickly switching to a backup link when the primary link encounters interference or congestion, without undergoing a complete scan-association process . Qualcomm describes Aux Radio in its technical documentation as "automatically shutting down or waking up the primary radio by monitoring the TX/RX status," while also performing low-latency background scanning to reduce the impact of scanning on throughput . For cost-sensitive and space-constrained design scenarios such as FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture. In terms of power management , the independent listening mechanism of the Aux Radio allows the main radio to enter a low-power state when idle, and is only awakened when the auxiliary radio detects a signal that needs to be transmitted or received. This mechanism has practical significance for the heat dissipation design and long-term operating power consumption of FTTR sub-routers—distributed networking means that multiple nodes are continuously online, and the cumulative effect of power consumption of a single node cannot be ignored. In terms of packaging , the O2072PM uses the M.2 2230 Key E standard interface, while the O2072PB is a 13×15mm surface-mount package . These two forms correspond to different overall hardware architectures: the M.2 interface is suitable for slot-based gateway/router products, while the surface-mount version is suitable for high-density onboard sub-routers or space-constrained FTTR slave gateways. This packaging option itself demonstrates engineering adaptability , as different OEMs' hardware platforms differ significantly in interface definitions, PCB space, and heat dissipation paths. Regarding platform compatibility , the O2072PM is compatible with Intel x86 platforms for kernel versions 5.15.24+, 6.1.99, and 6.12.0, and also has V1 compatibility with OpenWrt . This information is valuable for OEMs in their selection process: the maturity of driver compatibility directly impacts product development cycles and post-mass production stability risks . Mature compatibility with Linux platforms means that gateway solutions based on x86 or ARM Linux can complete RF subsystem debugging in a shorter time, while OpenWrt compatibility provides a foundation for customized routing/gateway products. IV. The Value Position of the Module Segment in the Industry Chain According to IIM Information's "Global and China WiFi Module Market Analysis and Survey Report," the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026 , with Wi-Fi 7 module shipments expected to climb to 17.2% , reaching approximately 234 million units for the year. IndexBox's market analysis further indicates that Wi-Fi 7 modules have a 40% to 70% price premium compared to their predecessors , and high-end modules (tri-band, 320MHz, 16+ spatial streams) are priced between US$250 and US$1500 . This pricing structure reflects an industry reality: the added value of the module segment largely depends on its "conversion efficiency" to chip capabilities . The same Wi-Fi 7 chip can exhibit significantly different RF performance, heat dissipation characteristics, power consumption curves, and driver compatibility in designs from different module manufacturers. As a carrier-grade product, FTTR gateways have higher requirements for long-term operational stability, environmental adaptability, and batch consistency than consumer-grade products. When selecting module solutions, OEMs focus not only on "Wi-Fi 7 support" but also on "whether the nominal performance can be stably reproduced under mass production conditions." From a supply chain perspective, Qualcomm's QCC2072 provides the foundational capabilities for the protocol layer as a chip platform, while module manufacturers focus on RF front-end matching, antenna design coordination, power management optimization, driver adaptation and verification, and engineering implementation for different package types. The value of this layer lies not in the chip definition stage, but in the product realization stage. V. Conclusion: Module Selection Logic in Centralized Procurement Scenarios The successful procurement of home gateways by China Telecom and China Mobile in 2026 marks the official launch of large-scale deployment of Wi-Fi 7 in operator home network terminals. The distributed architecture of FTTR and the product requirements for carriers impose engineering constraints on radio frequency modules that differ from those on consumer-grade routers. In a supply chain system driven by centralized procurement, the competitiveness of a module solution depends on the comprehensive performance of three dimensions: protocol compatibility with FTTR scenarios, hardware adaptability across multiple packaging forms, and driver maturity under the Linux/OpenWrt platform. The O2072PM's eMLSR implementation, Aux Radio power management, and tri-band 320MHz capability technically address the core needs of FTTR sub-routers and home gateways; its M.2 and surface-mount dual packaging forms cover the hardware architecture choices of different OEMs; and its Intel x86 and OpenWrt driver adaptation provides a verifiable starting point for complete system development. The transmission cycle of operator centralized procurement dictates that OEMs' module selection decisions often occur during the solution design phase before the procurement announcement. Within this time window, module solutions with a complete RF parameter system, multiple packaging options, and verifiable driver adaptation records occupy a more advantageous position in OEMs' technical evaluations .  

2026

09/20

Photovoltaic New Energy: The Most Certain Incremental Market for PLC Modules

In the first half of 2026, China's newly connected photovoltaic (PV) capacity reached 71.77 million kilowatts, of which distributed PV accounted for 42.22 million kilowatts, or approximately 58.8%. Globally, according to the "Global and China Distributed PV System Market In-Depth Research and Consulting Analysis Report (2026)" released by IIM Information, as of the first half of 2026, the global cumulative installed capacity of distributed PV had exceeded 480 GW, with the Asia-Pacific region contributing more than 55% of the increase. It is projected that by the end of 2026, the global annual new installed capacity will reach between 98 GW and 115 GW, representing a year-on-year increase of approximately 12% . The large-scale production of distributed photovoltaics is propelling PLC (Power Line Carrier Communication) modules into a certain incremental market. This certainty stems from the convergence of three factors: mandatory policy support, the uniqueness of the technological path, and the completion of commercial validation. I. Policy-driven: Component-level safe shutdown becomes a global mandatory requirement The core application scenarios for PLC modules in the photovoltaic field are module-level rapid shutdown and module-level monitoring. These two functions are directly driven by mandatory standards in major global markets. In the North American market, NEC 2026 further revised the fast shutdown requirements of Article 690.12. According to SurgePV's NEC 2026 Fast Shutdown Compliance Guide, the 2026 version of NEC retains the existing voltage limit targets: conductors outside the array boundary must be reduced to no more than 30V within 30 seconds, and conductors inside the array boundary must be reduced to no more than 80V within 30 seconds or use certified PVHCS equipment . This means that each photovoltaic module needs to be equipped with a shutdown device with PLC communication capabilities. In the European market, the EN50065-1 standard clearly specifies communication equipment applicable to the frequency range of 3kHz to 526.5kHz on low-voltage power lines. Its typical applications include DC bus communication between photovoltaic panels and inverters in photovoltaic power generation systems. In the Chinese market, the new national standard GB/T 34932-2025 officially came into effect on April 1, 2026. Under the "four requirements" for dispatching, it mandates that new grid-connected equipment must support standard interfaces, collect data at a frequency of no less than one point every five minutes, and enforce identity authentication, data encryption, and access control. In 2026, the EU carbon tariff adjustment mechanism enters the mandatory compliance phase. Traditional inverter-level monitoring cannot meet the accuracy requirements for component-level carbon footprint tracing, making component-level power electronics and intelligent monitoring a crucial technological path for obtaining accurate carbon emission data . The core policy shift is that PLC communication modules are transforming from "optional accessories" in photovoltaic systems into "compliance necessities." Whether it's North America's rapid shutdown, Europe's module-level monitoring, or China's "four capabilities," all require reliable data communication links between module-level devices. II. Technology Adaptation: Why PLCs are Irreplaceable in Photovoltaic Applications The physical structure of a photovoltaic system dictates the choice of communication scheme. Each photovoltaic panel is connected to a DC power line, and each inverter is connected to the grid via an AC power line. PLC communication can fully reuse existing power lines for data transmission, eliminating the need for additional communication cables or wireless access points. Metal roofs and complex electromagnetic environments pose significant challenges to the reliability of wireless communication, while PLCs, using power lines as the physical medium, possess strong anti-interference capabilities. Although RS485 bus solutions offer reliable communication, they require additional communication cabling within the photovoltaic array, increasing installation costs, construction time, and potential points of failure. In photovoltaic module-level shutdown and monitoring scenarios, PLCs offer virtually no equivalent alternatives. III. Commercialization Validation: From Technology Introduction to Mass Shipment The photovoltaic PLC module market has completed the crucial leap from "technology verification" to "mass shipment. " PLC chips have achieved mass production in the photovoltaic module-level power electronics field , and module-level shutdown devices and power optimizers with built-in PLC modules are being exported in bulk to overseas markets such as Southeast Asia, and are widely used in residential and commercial distributed photovoltaic scenarios. This large-scale market achievement demonstrates that PLC communication technology has undergone long-term operational verification in the complex electromagnetic environment of the photovoltaic DC side, maintaining a high level of communication online rate . From a market perspective, each GW of photovoltaic power requires approximately 2 million photovoltaic panels. If each panel is equipped with one shutdown chip, the global annual demand exceeds 400 million panels. Currently, North America and Europe have mandated that distributed photovoltaic projects have module-level rapid shutdown capabilities. If China introduces similar mandatory standards, it will bring an even larger volume of incremental demand. IV. Photovoltaic Scenarios Solution for Qogrisys PLC Modules Qogrisys has established a clear product portfolio in the PLC module field, with both the S130N-ISI and 3121N-H modules being officially listed as recommended solutions for photovoltaic communication scenarios . S130N-ISI: A compact solution for shutdown and optimizer The S130N-ISI is based on the Leadcore VC6330 chip design, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module uses an LCC package, measuring only 20.6×12.6×2.5mm, and features an integrated on-chip wire driver, low power consumption, strong noise immunity, and an operating temperature range of -40°C to +85°C . This module supports dual communication protocols: China SGCC Q/GDW 11612 and IEEE 1901.1, and supports BPSK, QPSK, and 16QAM modulation . The S130N-ISI's ultra-small size and low power consumption make it suitable for integration into space-constrained photovoltaic (PV) shutdown devices or power optimizers. These shutdown devices are powered by the PV panels themselves and need to continuously monitor PLC signals on the power line at microwatt-level power consumption; the S130N-ISI's low-power design aligns with this requirement. 3121N-H: Multi-node networking solution for component-level monitoring The 3121N-H is developed based on the HiSilicon PS0211 chip, operating in frequency bands of 0.5-3.7MHz and 2.5-5.7MHz. The protocol is based on a subset of the IEEE 1901.1 standard, with an application layer rate of 80Kbps, and is equipped with a 200MHz ARM Cortex-M3 processor. A single CCO supports up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be formed within 10 seconds . The 3121N-H's multi-node networking capability adapts to the unified access requirements of multiple components and devices in distributed photovoltaic systems. In component-level monitoring solutions, the 3121N-H can serve as a PLC monitoring module within the component junction box, collecting voltage, current, and temperature data in real time and coupling it to the string via DC power lines. At the bus layer, this module can replace the traditional RS485 bus, enabling wireless bidirectional communication with inverters, data acquisition units, and cloud platforms. Conclusion Qogrisys has listed "new energy" as an independent application area, with its products clearly covering photovoltaic panels, photovoltaic inverters, energy storage, and charging piles. In scenarios such as smart streetlights, smart parking, and charging piles, Qogrisys's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal . Currently, Qogrisys is targeting emerging markets in Southeast Asia .    

2026

09/16

Wi-Fi 7 Modules: From High-Speed Pipeline to Intelligent Node – Industrial-Grade Sensory Integration

9th to 11th, 2026 , the 27th China International Optoelectronic Exposition (CIOE), in conjunction with the IICIE International Integrated Circuit Innovation Expo and Elexcon Shenzhen International Electronics Exhibition & Embedded Systems Exhibition, will be held concurrently at the Shenzhen World Exhibition & Convention Center. The three exhibitions will be held together, covering a total exhibition area of 320,000 square meters, bringing together more than 5,000 exhibitors and attracting over 240,000 professional visitors . This is a grand industry event covering the entire optoelectronics, semiconductor, and electronics industry chain.   For the Wi-Fi module industry, this exhibition sent a clear signal: the value proposition of Wi-Fi 7 modules is undergoing a fundamental shift—from providing "high-speed connectivity channels" to becoming "industrial-grade intelligent nodes" that integrate sensing, positioning, and edge intelligence. The Industry Logic Revealed by the Collaboration of Three Exhibitions: Why "Sensory Integration" Has Become a Must-Answer Question The essence of the three exhibitions working together is a forced "alignment" of the upstream and downstream of the industry chain. In the past, the optoelectronic industry focused on optical chips and devices, the semiconductor industry focused on chip design and advanced packaging, and the electronics industry focused on the development of terminal equipment and embedded systems. The three major industry systems were fragmented, with different technical standards and poor supply and demand matching, forming obvious industry barriers . The rapid popularization of large-scale AI models and supercomputing clusters has changed this landscape. The industry's demand for ultra-high bandwidth, ultra-low power consumption, and ultra-high integration has increased significantly. The previously independent industry boundaries have been completely broken down. Optical engines and switching chips are deeply integrated, and optoelectronic devices are directly embedded inside chip packages, forcing optical design, semiconductor processes, advanced packaging, and electronic systems to develop in a coordinated manner . This trend is particularly evident in the Wi-Fi module industry. Wi-Fi 7 is not only a generational upgrade in communication speed, but also provides a technological foundation for "integrated communication and sensing" due to its introduction of Multi-Link Operation (MLO), 320MHz channels, and fine-grained timing measurement capabilities. The China Academy of Information and Communications Technology (CAICT) explicitly proposed in its research report on 10 Gigabit AI Park Networks that wireless access points should be upgraded to "integrated communication and sensing" anchor points, natively integrating IoT access, environmental perception, and terminal positioning capabilities to break the data silos and protocol fragmentation dilemmas caused by traditional siloed network construction. The competitive logic in the module industry has therefore undergone a qualitative change: connectivity itself is "depreciating," and "intelligent connectivity" that integrates perception and edge intelligence is the new pricing power. The triple capability leap of Wi-Fi 7 modules The "integration" of Wi-Fi 7 modules is not a functional aggregation, but rather a fusion of capabilities at the underlying chip architecture level. Solutions represented by Qualcomm FastConnect C7700 (chip code name QCC2072) integrate three capabilities that previously belonged to different radio frequency domains on a single chip. The first capability: an industrial-grade leap in Wi-Fi 7 communication performance. The QCC2072 supports 320MHz channel bandwidth, 4096-QAM modulation, and 2×2 MU-MIMO, achieving a peak PHY rate of 5.8 Gbps . Its introduced Enhanced Multi-Link Single Radio (eMLSR) technology allows data to be transmitted through other links when interference occurs in a certain frequency band, effectively maintaining high throughput and low latency . This is crucial for deterministic transmission requirements in industrial environments. The second capability: Wi-Fi sensing and high-precision positioning. This chip solution supports IEEE 802.11az Wi-Fi ranging. 802.11az uses Time-of-Flight (ToF) technology to measure the actual distance between the device and the access point, replacing the traditional RSSI fingerprint comparison method, achieving sub-meter positioning accuracy of less than 1 meter. In industrial scenarios, this means that the Wi-Fi module can not only transmit data but also accurately sense the device's location and spatial status. The third capability: Bluetooth 6.0 Channel Sounding and Aux Radio. Bluetooth 6.0 introduces Channel Sounding technology, improving Bluetooth positioning accuracy to sub-meter levels . Simultaneously, this solution is equipped with a dedicated Wi-Fi Aux Radio for background scanning and low-latency listening while the main radio is in sleep mode, balancing power consumption and response speed . The integration of these three capabilities enables a single Wi-Fi 7 module to possess integrated "communication + sensing + positioning" capabilities for the first time. VOXMICRO's AIRETOS C27 industrial-grade module is a typical example of this architecture. It integrates capabilities that were previously belonging to three independent radio frequency domains into a single module package, enabling industrial OEMs to shift their design goals from "adding a radio" to "accomplishing more tasks with a single industrial-grade module" . Market data: The inflection point for the large-scale deployment of Wi-Fi 7 modules has arrived. The global Wi-Fi module market is currently experiencing a period of structural growth. According to market research reports, the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026, a 17.9% increase from US$14.27 billion in 2025. Among these, Wi-Fi 7 modules are rapidly increasing their market share to 17.2%, with projected shipments reaching 234 million units for the year . From a broader perspective, the global Wi-Fi 7 module market was valued at $3.8 billion in 2025 and is projected to reach $22.6 billion by 2034, representing a CAGR of 21.9% . The Wi-Fi Alliance predicts that global shipments of Wi-Fi 7 devices will reach approximately 1.1 billion units in 2026, of which approximately 196 million will be IoT devices. The Industrial Internet of Things (IIoT) is one of the fastest-growing sub-sectors. Global demand for IIoT modules is projected to reach $9.81 billion, with an annual growth rate of 17.8% . The reliability requirements of industrial applications—wide operating temperature range, interference resistance, and deterministic low latency—are driving the accelerated evolution of Wi-Fi 7 modules from consumer to industrial applications. Qogrisys early strategic moves: from chip solutions to module productization O2072PM and O2072PB, launched simultaneously by O2072 with the QCC2072 chip, is not simply an expansion of the product line, but rather an engineering choice for different deployment scenarios. The O2072PM uses an M.2 Key E standard interface (2230 specification), a 2T2R dual-antenna design, and supports both Wi-Fi and Bluetooth operation. This module incorporates all the functions of the QCC2072: the Wi-Fi portion covers the full IEEE 802.11a/b/g/n/ac/ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with a channel bandwidth of up to 40 MHz at 2.4 GHz, 160 MHz at 5 GHz, and 320 MHz at 6 GHz. The Bluetooth portion is compatible with Bluetooth 6.0, supporting LE Audio, 2 Mbps BLE, and high-precision distance measurement (HADM channel sounding) . In terms of driver adaptation, the O2072PM has been adapted and is running stably on Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB uses a 13×15mm surface mount package, targeting space-constrained embedded scenarios. Its core functions are identical to the O2072PM, also supporting a peak data rate of 5.8 Gbps, a 320MHz channel, 4K QAM modulation, Bluetooth 6.0 channel detection, and 802.11az Wi-Fi ranging . The O2072PB explicitly supports various operating modes including AP/AP+STA/P2P/Monitor, providing a PCIe interface for Wi-Fi and a UART/PCM interface for Bluetooth, supporting Class 1 and Class 2 power level transmission without the need for an external power amplifier . The differentiated positioning of the two modules reflects a profound change in the module industry: as chip capabilities become highly integrated, the core competitiveness of module manufacturers is shifting from "how much throughput can be achieved" to "whether the full capabilities of the chip can be efficiently released under specific physical constraints." The M.2 interface module targets industrial PCs, gateways, and edge computing devices that require standard slots and replaceable designs; the surface-mount module targets embedded terminals with extremely limited PCB space, requiring module manufacturers to possess more refined engineering capabilities in RF design, antenna matching, and thermal management. Validation in industrial scenarios: from technical feasibility to deployment Wi-Fi 7 sensing technology is being practically validated in industrial scenarios. In the mining sector, Shanxi Coal International's Hequ Open-pit Coal Mine's pilot project of a 10-gigabit optical network based on 50G-PON + Wi-Fi 7 has passed the Ministry of Industry and Information Technology's acceptance test. Fifty-seven Wi-Fi 7 gateways have been deployed in the core area, allowing dispatchers to remotely control unmanned mining trucks several kilometers away via Wi-Fi 7 tablets. In the field of smart buildings, the Longgang International Art Center uses Wi-Fi 7 + CSI sensing technology to accurately detect the presence of people, achieving a reduction of over 15% in venue energy consumption and a 30% improvement in operation and maintenance efficiency . These cases share a common characteristic: Wi-Fi networks are no longer just for data transmission, but have also become the infrastructure for environmental sensing and spatial positioning. For the module industry, this means that downstream customers' needs are upgrading from "providing stable wireless connectivity" to "providing integrated capabilities that converge connectivity, sensing, and positioning." Conclusion The industry landscape revealed by the three exhibitions is clear and definite: the demand for AI computing power is driving the deep integration of the optoelectronics, semiconductor, and embedded electronics industries, and Wi-Fi 7 modules are at the intersection of this integration. The shift from "high-speed connectivity" to "integrated sensing" is not just a product iteration, but a systemic reconstruction of the value proposition of the module industry. For Wi-Fi module manufacturers, their ability to establish competitive advantages in chip solution integration, cross-platform adaptation, and industrial-grade reliability will determine their position in the new industry cycle. However, the real test lies in whether module manufacturers can continue to efficiently translate chip capabilities into deployable industrial-grade products as "integrated sensing" transitions from a technological trend to an industry standard.  

2026

09/14

Small Size, Low Power, High Stability: The Ultimate IoT Module Solution

I. The "Impossible Triangle" of IoT Terminals With the rapid iteration of IoT terminals, more and more devices are moving towards miniaturization and battery power, while products are facing design challenges such as limited PCB space, insufficient battery life, and unstable wireless connectivity . This is not an isolated phenomenon in a particular sub-sector, but rather a systemic challenge facing the entire Internet of Things (IoT) industry. In 2026, global shipments of wireless modules reached 870 million units, with a market size exceeding US$41.2 billion. By 2030, global shipments are projected to climb to 1.52 billion units, with a CAGR of 11.8%, and the market size is expected to reach US$79.8 billion. During the same period, the number of connected IoT devices worldwide is expected to exceed 39 billion. This explosive growth in device numbers is amplifying the challenges of every design dimension into key factors determining product success or failure. Small size, low power consumption, and high stability—these three requirements are forming the "impossible triangle" in IoT terminal design. In traditional solutions, these three often constrain each other: pursuing small size limits antenna performance, pursuing low power consumption sacrifices transmission rate, and pursuing stability increases power consumption and size. Finding a balance among these three has become a core issue for module solution providers. II. Challenge 1: Extremely tight PCB space Industrial driving force of space compression From smart rings and TWS earphones to micro sensors and smart locks, the physical space of terminal devices is being continuously compressed. The micro battery market is projected to grow from $1.59 billion in 2025 to $1.81 billion in 2026, representing a CAGR of 13.5%. This rapid growth in the micro battery market is a direct reflection of the trend towards device miniaturization —the smaller the device, the higher the requirements for battery volume and energy density. One of the most challenging problems faced by hardware engineers is achieving high-density, high-stability electrical connections between the daughterboard and the motherboard under extremely limited overall device thickness and PCB space. As an indispensable radio frequency component in the device, the footprint of the wireless module directly determines the feasibility of the overall device layout. Solution path for miniaturized modules The industry is addressing the spatial challenges from multiple perspectives. The O9101SA module from Qogrisys has compressed its size to 12×12mm , while supporting dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps . This size is among the industry-leading levels for Wi-Fi 6 + Bluetooth Combo modules. This extreme size reduction not only allows for more space to be packed in, but also frees up valuable PCB space for other components such as the battery, sensors, and main control chip – the smaller module footprint allows for more storage . Multi-protocol single-chip integration is another key path. Two independent modules, plus their respective peripheral circuits and antenna clearance, occupy a much larger PCB area than a single multi-protocol integrated module. In small-sized products such as smart bulbs and panel switches, this area is the biggest limiting factor. The Wi-Fi/Bluetooth Combo solution fundamentally reduces PCB footprint by integrating the two protocols into a single chip. The area occupied by antennas is also significant. Traditional antenna implementations consume 15%-25% of the total PCB area in mobile devices and IoT applications. The emergence of antenna-in-package (AiP) technology integrates the antenna into the module package, achieving space savings of 40%-60% . Challenge 2: Severely Inadequate Battery Life The Economics of Range Anxiety For battery-powered IoT devices, battery life is not a "nice-to-have" but a "life-or-death" issue. The global IoT battery market was valued at $15.9 billion in 2024 and is projected to grow to $36.88 billion by 2033, representing a CAGR of 9.8%. This continued expansion reflects the rigid demand from end devices for longer battery life. The operational lifespan of battery-powered nodes directly impacts maintenance costs and deployment scalability . The industrial value of low power consumption technology The low-power Wi-Fi module market is projected to reach $4.142 billion in 2025 and $11.79 billion in 2032, representing a CAGR of 16.4%. The BLE module market is expected to grow to $68.27 billion in 2032, with a CAGR of 13.80%. The robust growth of these two segments confirms that low power consumption has become one of the most crucial competitive dimensions in the module industry. IV. Challenge 3: Unstable wireless connection Crowded 2.4GHz and limited antennas The root cause of unstable wireless connections lies in two structural contradictions. The first problem is frequency congestion. The 2.4GHz ISM band is shared by multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, resulting in severe co-channel interference. In high-density deployment scenarios such as smart homes and offices, signal conflicts and data rate degradation are commonplace. The second contradiction is the limitation of antenna performance. Device miniaturization means that the available space for the antenna is compressed, and the antenna efficiency and bandwidth decrease accordingly. There is an inherent physical constraint between radio frequency performance and device size —the smaller the antenna size, the lower the radiation efficiency, and the worse the communication distance and stability. V. Qogrisys Systemic Solutions To address the aforementioned triple design challenges, QOGRISYS offers a comprehensive product portfolio, providing end-to-end solutions from chips to modules and from hardware to software. Extremely Miniaturized Product Matrix Qogrisys has achieved complete coverage in the field of small-sized modules, from Wi-Fi 6 to Wi-Fi 5, and from Combo to single Wi-Fi. The O9101SA boasts a compact size of 12×12mm , supports dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps, and utilizes an SDIO 3.0 interface . It supports a 2.4GHz/5GHz dual-band simultaneous (DBS) architecture , uplink/downlink MU-OFDMA and MU-MIMO, and BT/BLE dual-mode operation . The O9101SA, along with the O9101UE and O9101UD, belongs to the Oufixin 1×1 Wi-Fi 6 module series developed based on the WQ9101 chip . The O9101UE measures 13×12.2mm and uses a USB 2.0 interface; the O9201SB measures only 13×15mm, is also based on the WQ9201 chip, and offers speeds up to 1200Mbps. The O9201UB shares the same platform as the O9201SB and uses a USB 2.0 interface. The O8852PB measures 13×15mm, is based on the Realtek RTL8852BE chip, supports Wi-Fi 6 and Bluetooth 5.2 with a speed of 1200Mbps, and uses a PCIe interface. For scenarios with stricter space constraints, the small size of these modules is particularly advantageous. The smaller module footprint frees up valuable PCB space for other components such as the battery, sensors, and main control chip. Low-power design: Co-optimization from chip to system Qogrisys's low-power capability stems primarily from the selection and deep collaboration with upstream chips. The Wuqi WQ9201 chip, with its stable transmission performance and internationally leading low-power consumption , stood out from 364 products from 280 chip companies, winning the 2024 "China Chip" Excellent Technological Innovation Product Award. Interference Resistance and Stable Connection: Breakthrough Technologies in Dual-Band and Multi-Protocol Integration O9201SB, O9101UE , and O8852PB all support 2.4GHz/5GHz dual-band Wi-Fi 6. The core value of the dual-band architecture lies in "selectivity"—when the 2.4GHz band becomes congested due to the coexistence of protocols such as Bluetooth and Zigbee, the device can switch to the 5GHz band to ensure transmission speed and connection stability. Dual-band Wi-Fi 6 also brings core technologies such as OFDMA and MU-MIMO, improving spectrum utilization efficiency in scenarios with multiple concurrent devices. In high-density deployment environments such as smart homes and offices, these technologies directly translate into improved user experience—lower latency, fewer dropped connections, and more stable connections. Multi-protocol integration is another approach. A single module can simultaneously support multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, and can intelligently select the best connection method according to the environment, flexibly switching between different scenarios. VI. Industry Outlook: From "Usable" to "Effective" Looking ahead to 2026-2032, the design trend for small-size, low-power modules will continue to evolve along the following directions: First, the limits of size will continue to be broken . The competition for module size is far from over, and the approach of physical limits is forcing continuous innovation in packaging technology. Secondly, low power consumption will shift from a "feature" to a "standard feature." QYResearch data shows that the low-power Wi-Fi module market will continue to expand at a compound annual growth rate of 16.4%. Low power consumption will no longer be a differentiating selling point for high-end modules, but rather a basic requirement for all module products. Third, multi-protocol integration, miniaturization, and low power consumption will be deeply intertwined. Integrating multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread onto a single chip is a fundamental solution to the space and power consumption issues. The widespread adoption of the Matter protocol will further strengthen this trend— future modules will no longer require users to "select" protocols, but will automatically adapt to the optimal connectivity solution based on the environment and application. Fourth, module selection is evolving from "component procurement" to "strategic decision-making." Under the dual constraints of miniaturization and low power consumption, module selection is no longer merely a comparison of technical parameters, but a strategic choice concerning product definition, development cycle, and time-to-market. A suitable module solution can compress the development cycle from months to weeks and simplify a four-layer PCB to a two-layer PCB .  

2026

09/09

Qualcomm's New Chips Put Edge AI First – Smarter Modules Ahead

By 2026, edge AI will no longer be a concept that needs to be "defined," but a reality that is being "quantified"—and the speed and scale of this quantification far exceed the expectations of most analysts a year ago. Edge AI is moving from "proof of concept" to "large-scale deployment." I. Qualcomm's Strategic Move: Dragonwing Dual-Processor Chip Released to Boost Edge AI On the eve of the 2026 IFA Berlin, Qualcomm officially launched two processors , the Dragonwing Q-2390 and IQ-2390. The Q-2390 highly integrates edge AI inference, cellular connectivity, positioning, and display support into a single chip, aiming to lower the development threshold for edge AI devices. The IQ-2390 focuses on enhancing machine vision acceleration, TSN (Time-Sensitive Networking) support, and has a wide operating temperature range of -30°C to +115°C , designed for demanding scenarios such as industrial automation, machine vision, and energy management. Qualcomm's core intention in this announcement is to reduce the complexity of implementing edge AI in industrial scenarios through chip-level integration and industrial hardening. II . Edge AI Market: A Trillion-Dollar Track Accelerating The market size of edge AI is expanding at an astonishing rate. According to a recent report by Global Market Insights, the global edge AI market is valued at approximately $25.2 billion in 2025, projected to reach $30.9 billion in 2026, and is expected to grow to $225.5 billion by 2035, representing a compound annual growth rate (CAGR) of 24.7% from 2026 to 2035. Data from Mordor Intelligence also corroborates this trend: the edge AI hardware market is projected to grow from $25.08 billion in 2025 to $30.74 billion in 2026, reaching $68.73 billion in 2031 . The global edge AI market (hardware + software + services) is approaching $47-50 billion in size by 2026, with a year-on-year growth rate exceeding 28% . IDC predicts that the overall edge computing market will reach $450 billion by 2029, with AI being the primary growth engine . From a regional perspective, the Asia-Pacific region is the fastest-growing edge AI market globally . China, as a core growth engine, leads the world in shipments of edge devices equipped with domestically produced computing chips. Bulk procurement in areas such as smart security, smart cities, and factory automation continues to drive demand, with the domestic market growing at an annual rate exceeding 34% . III . The AI-driven transformation of the module industry: From "connectivity" to "computing + connectivity" The explosive growth of the edge AI market is profoundly reshaping the competitive logic of the module industry. Traditional module manufacturers heavily rely on the number of connections and shipment growth, but this model is encountering bottlenecks. In the first quarter of 2026, shipments of AI embedded cellular IoT modules declined by 17% year-on-year, marking the first decline after 12 consecutive quarters of growth in the market. The penetration rate of AI modules in global cellular IoT modules is currently only about 6%—meaning that edge AI modules are still on the verge of explosive growth, rather than a red ocean market . Meanwhile, leading companies in the industry are accelerating their transformation towards "connectivity + intelligence." Quectel Wireless Solutions' revenue in the first half of 2026 reached RMB 15.259 billion, a year-on-year increase of 32.16%, with automotive, intelligent, and solutions businesses accounting for 46.76% of revenue. Furthermore, the gross profit margin of this segment (21.42%) is significantly higher than that of traditional communication module businesses (16.28%) . Andrew Zignani, Senior Research Director at ABI Research, pointed out that wireless connectivity is no longer just about connecting devices; it's also about enabling scalable edge AI in consumer, enterprise, and industrial markets . IV . Trends in Module Products Driven by Edge AI The large-scale deployment of edge AI is reshaping the definition of module products from three dimensions. Trend 1: From "Communication Modules" to "Computing Modules" . The integration of AI edge computing chips has become the core differentiator for modules in 2026. Shipments of modules supporting edge inference exceeded 80 million units in 2025, and this proportion is expected to rise to 35% of total module shipments by 2030. The compound annual growth rate of high-performance computing modules is projected to reach 60% over seven years, and the proportion of intelligent and AI modules in cellular IoT modules will continue to increase. Trend Two: Industrial-grade wide operating temperature range becomes the "entry ticket ." Wide operating temperature capability reflects the stringent reliability requirements of modules in industrial edge AI scenarios. Industrial-grade modules typically require an operating temperature range of -40℃ to +85℃. In scenarios such as oil and gas, power, and outdoor infrastructure, wide operating temperature capability directly determines whether the equipment can operate stably in real-world environments. Trend 3: Multi-technology integration becomes standard . Edge AI scenarios often require simultaneous support for multiple connectivity methods—industrial automation needs Wi-Fi/Bluetooth for inter-device communication, energy management needs PLCs to solve the problems of transmission through walls and over long distances, and industrial gateways need cellular networks to upload data to the cloud. Modules with single communication methods are being replaced by integrated solutions that combine multiple modes . V. Qogrisys's Product Strategy: AI Capabilities Connected to the Base Amid the industry wave of module manufacturers moving towards AI, QOGRISYS's strategic path clearly demonstrates the industry logic of integrating "connectivity + computing". Qogrisys's strategic path can be summarized as follows: using high-speed connectivity as the foundation and edge AI as the incremental factor, to build an intelligent module product matrix covering multiple scenarios. Wi-Fi 7 Module: Full Product Lineup In the Wi-Fi 7 field, O2072PM and O2072PB, two Wi-Fi 7 + Bluetooth 6.0 combo modules based on the Qualcomm QCC2072 chip, fully support 4K QAM, 320MHz channels, MLO (Multi-Link Operation), with a peak rate of 5.8Gbps and eMLSR enhanced multi-link switching. The O2072PM uses an M.2 Key E interface (22×30mm), making it suitable for high-end robots and industrial equipment. From an industry trend perspective, Wi-Fi 7 is rapidly entering a large-scale deployment phase. IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN-dependent AP revenue. The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next stage . Multi-platform and multi-scenario coverage Qogrisys's core R&D team has long been deeply involved in mainstream global wireless chip platforms such as Qualcomm, Realtek, and MediaTek, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing . This multi-platform, full-stack technical capability enables Qogrisys to provide compatible connectivity solutions across different customers' main control solution ecosystems. In terms of application scenarios, Qogrisys's product matrix has extended to multiple core areas of edge AI: industry and intelligent manufacturing , modules such as O9201PM have completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in scenarios such as industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, and digital signage. robotics and embodied intelligence , the ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form an invisible infrastructure for cloud-edge-device collaboration—robots upload sensor data to edge servers in real time for VLA model inference, receive decision commands, and execute them instantly. Qogrisys's Wi-Fi 7 module product line already covers the needs of high-end robots and industrial equipment. VI. Trend Analysis: Three Certain Directions for Edge AI Modules Based on Qualcomm's chip release trends, three definite trends can be identified in the field of edge AI modules: First, AI capabilities will become a standard feature rather than an optional feature for modules. As the report "Edge Intelligence 2026: The First Year of Large-Scale Deployment" points out, 2026 has become a crucial turning point for edge intelligence, moving from proof-of-concept to large-scale deployment. The market space for pure connectivity modules lacking AI acceleration capabilities will continue to shrink. The seven-year compound annual growth rate of intelligent modules and AI modules reached 60% and 28% respectively , and this difference in growth rate is the strongest evidence of this. Second, industrial scenarios represent the most certain high-value market for edge AI modules. The industrial AI accelerator chip market is expanding at an average annual growth rate of 40%. Industrial visual inspection is migrating from traditional algorithms to deep learning, and predictive maintenance is generating explosive demand for edge inference computing power. Third, the convergence of "connectivity + computing" modules will become the infrastructure of the AIoT era. Wi-Fi 7 provides a connection base with ultra-low latency and ultra-high throughput, while edge AI provides localized intelligent decision-making capabilities. When the coverage density of Wi-Fi 7 and the computing power density of edge AI converge at the device end, the module will be upgraded from a "communication component" to an "intelligent computing node".    

2026

09/07

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