China Shenzhen Ofeixin Technology Co., Ltd Company News

On November 3, 2026, Universal Scientific Industrial (USI) officially announced its Wi-Fi 8 product roadmap, expecting to launch Wi-Fi 8 modules based on SiP packaging in the first quarter of 2027. This news sparked considerable discussion within the module industry , and we've also been following this development . We'd like to discuss a more practical topic: Wi-Fi 8 is the "next step" worth paying attention to, while Wi-Fi 7 is currently the "mainstay" being delivered in large quantities .   For hardware teams that are defining their products, recognizing this time lag is more important than chasing trends.   I. The Big Moves of Wi-Fi 8: How Far Away is Mass Production? Universal Scientific Industrial (USI)'s roadmap reveals two key pieces of information. First, a clear timeline: products will launch in Q1 2027. Second, a shift in technological focus: Wi-Fi 8 (IEEE 802.11bn) will no longer prioritize peak speeds as its primary selling point, but will instead focus on ultra-high reliability (UHR), energy efficiency, and a consistent user experience. Key technologies listed in the announcement include Co-BF/Co-SR, Dynamic Subchannel Operation (DSO), and physical layer technologies such as Distributed Resource Unit (DRU), Enhanced Long-Range Transmission (ELR), and Unequal Modulation (UEQM). These technologies target specific scenarios: miniaturized terminals with extremely limited antenna space, limited battery capacity, and highly complex radio frequency environments, such as AI glasses, smart rings, and TWS earphones. However, as a module solution provider, our habit when looking at this kind of news is to follow the timeline and see where the standard is finalized and the certification is opened. According to ABI Research's tracking report, the standardization progress of 802.11bn is as follows: Draft 2.0 entered the working group vote in August 2026, the Draft 3.0 letter ballot is scheduled for January 2027 , the Draft 4.0/initial standards association ballot is in May 2027 , final working group approval is expected in March 2028 , and IEEE Standards Board (RevCom) ratification is in May 2028. The Wi-Fi Alliance's Wi-Fi 8 certification project is not expected to start until January 2028 . What does this mean? If a product launches in Q1 2027, it will be facing a stage where standards are not yet finalized and certification channels are not yet open. Draft 3.0 has not yet been voted on, Draft 4.0 has not yet entered the SA ballot, and the Wi-Fi Alliance's certification program has not even set its start date for another year. For the vast majority of terminal products that need to go through type approval and alliance certification before they can be launched, this timeframe does not meet the conditions for mass production. Dell'Oro Group shares this view: Wi-Fi 7's market share exceeded 50% by September 2026, while early revenue from Wi-Fi 8 is not expected until 2027 at the earliest. ABI Research directly used the phrase "lucrative opportunities and unprecedented challenges" in the title of its report, indicating that opportunities and challenges coexist, but the window of opportunity is in 2028, not in Q1 of 2027. II. Why Wi-Fi 7 is the realistic choice for customers today Looking only at news trending topics can easily create a misconception. But the data presents a completely different picture. According to Dell'Oro Group data, by September 2026, Wi-Fi 7 devices accounted for over 50% of the global WLAN market share . In the Chinese router market, Sandalwood's e-commerce monitoring data provides a more concrete picture: by September 2026, Wi-Fi 7's market share rose from 26% to 32% , while Wi-Fi 5's fell from 22% to 12%, indicating a rapid shift in market structure towards next-generation protocols. The BE3600 specification has become the mainstream adoption level for Wi-Fi 7, with its share rising from 13% to 17%. The replacement cycle in the home consumer market has entered an accelerated phase, rather than just beginning. At its earnings call in early 2026, Realtek gave its forecast for the chip sector: Wi-Fi 7 penetration in PCs and routers is expected to double in 2026, reaching 30% in PCs and 25% in routers. Considering that Realtek is one of the major suppliers of Wi-Fi chips, this forecast reflects the capacity allocation rhythm of the upstream supply side. For customers, a more direct criterion is this: if your current product project is planned for mass production between the end of 2026 and 2027, Wi-Fi 7 is the only option with a complete supply chain support. Wi-Fi 8's modular solution won't be ready for evaluation until certification opens in 2028 at the earliest. During this one-year window, customers' products cannot wait, and production lines cannot stop. III. OFEIXIN Wi-Fi 7 Strategic Deployment Returning to our own products , our two Wi-Fi 7 modules, based on the Qualcomm QCC2072 platform, cater to the needs of two mainstream hardware architectures currently on the market. Our initial motivation for this dual-package layout was simple: different customer decision-making stages necessitate different module forms. The O2072PM uses an M.2 2230 Key E slot and is designed for devices with standard M.2 interfaces, such as gateways, routers, and industrial PCs. These customers typically require pluggable modules for easy maintenance and upgrades, and have specific requirements for driver compatibility with the Intel x86 platform. The O2072PM is already compatible with kernels 5.15.24+, 6.1.99, and 6.12.0, and also supports OpenWrt version V1. Customers can immediately debug the module without having to figure out the driver from scratch , which is where we invested the most in software adaptation. For many customers evaluating Wi-Fi 7 modules, the first hurdle isn't RF performance, but whether the driver will work and the SDK will be compatible. We've addressed this issue beforehand. The O2072PB is a 13×15×2.3mm surface-mount package, designed for PCB space-constrained scenarios such as FTTR gateways, sub-routers, and high-density IoT terminals. It supports Wi-Fi via PCIe and Bluetooth via UART/PCM, integrating Bluetooth 6.0 and supporting multiple operating modes including AP/AP+STA/P2P/Monitor. Surface-mount customers typically lock in the module size and pin definitions during the onboard design phase, giving them a longer selection window than slot-based designs . This is why the O2072PB needs to coexist with the O2072PM. If a customer locks in a surface-mount solution at the schematic stage and wants to switch to a slot-based solution before mass production, the redesign costs will be very high. Both modules share the same core Wi-Fi 7 capabilities: 802.11be, 2×2 MIMO, tri-band 2.4/5/6GHz, 320MHz bandwidth in the 6GHz band, 4096-QAM, and a peak speed of 5.8Gbps . The only differences lie in their physical form factor and interfaces; customers can choose according to their hardware architecture. It's worth mentioning the engineering value of eMLSR (Enhanced Multi-Link Single Radio). The O2072PM supports 320MHz eMLSR. In a single-radio hardware architecture, it monitors the status of multiple frequency band links via an auxiliary radio, quickly switching to a backup link when the primary link encounters interference, without needing to go through a complete scan-association process. For cost-sensitive and space-constrained designs like FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture . This is also one of the most noteworthy engineering improvements of Wi-Fi 7 compared to Wi-Fi 6, changing the cost structure of high-density networking. IV. A variable to be aware of: the impact of memory shortage A recent report by Dell'Oro Group makes a noteworthy assessment: the shortage and price increase of DDR4 memory chips may accelerate the adoption of some enterprise-grade Wi-Fi 8 systems, as suppliers are incentivized to reduce their reliance on high-cost memory by switching designs. Realtek also explicitly mentioned in its earnings call that it faces the challenge of "memory shortages and price increases" in 2026. However, this does not contradict the statement that "Wi-Fi 7 remains the mainstay of shipments." Dell'Oro explicitly stated in the same report that Wi-Fi 7 revenue growth will continue, with peak annual revenue expected to exceed the total revenue of Wi-Fi 6E over its entire lifecycle . The memory shortage is driving some enterprise customers to assess the feasibility of Wi-Fi 8 as early as 2027, while the replacement cycle for Wi-Fi 7 in numerous scenarios such as consumer routers, industrial control systems, CPEs, and FTTRs is only just entering the accelerated phase shown by Sandalwood data. For customers, a more realistic assessment is: if your product is planned to enter mass production before the first half of 2027, Wi-Fi 7 is currently the only option that can guarantee delivery schedule. If the product cycle is longer, cost sensitivity is lower, and it targets high-end enterprise scenarios, you can pay attention to the standardization progress of Wi-Fi 8, but the module selection decision will still be made after the second half of 2027. In conclusion Universal Scientific Industrial's (USI) Wi-Fi 8 roadmap provides valuable forward-looking information. It tells the industry that the next-generation standard prioritizes reliability over speed, with module form factors evolving towards SiP miniaturization, and target applications expanding from mobile phones/PCs to AI glasses and wearable devices. Oufexin is also monitoring the evolution of Wi-Fi 8 and will promote modular adaptation as the standard is finalized and certification is opened. However, between the blueprint and mass production lies four stages: standard finalization, certification openness, chip maturity, and module adaptation . ABI Research's timeline shows that all four stages will be completed by May 2028. Meanwhile, Wi-Fi 7's shipment data reflects what is happening now: a global market share exceeding 50% by September 2026 and a 32% sales share in the Chinese router market . Behind these figures is a well-established supply chain and terminal projects being delivered in batches. For Oufexin, the key is that when customers need a Wi-Fi 7 module that can be immediately integrated into a project, has mature driver compatibility, and offers two packaging options, we already have one on our shelf . In the module industry, delivery speed is far more important than news pace. Data sources for this article: ABI Research, Dell'Oro Group, Sandalwood, and publicly available information from Realtek's earnings calls. Information on Oufexix products is from official specification documents.  

On October 27, 2026, the long-standing shortage of domestically produced Wi-Fi AP chips was broken. The launch of the WQ9301 from Wuqi provided a realistic foundation for the mass production and adoption of "all-domestic AP solutions" for the first time. For terminal manufacturers, however, the chip itself is only the starting point—what truly determines whether a product can be launched on time and shipped stably is the engineering capability of the module stage . I. Why is the AP chip the most difficult part of domestic Wi-Fi development? Wi-Fi chips are functionally categorized into STA (Station) and AP (Access Point). Over the past few years, breakthroughs in domestically produced Wi-Fi have primarily focused on the STA field—Wi-Fi modules in set-top boxes, cameras, and IoT devices—where domestically produced chips have already captured a significant market share. However, the situation is quite different for AP chips. The AP chip is the central hub of a Wi-Fi network, handling concurrent access from multiple devices, scheduling channel resources, managing QoS queues, and ensuring overall network stability. It is widely acknowledged in the industry that the R&D difficulty and investment required for AP chips are far greater than those for STA chips. According to data from Shangpu Consulting, Broadcom, Qualcomm, and MediaTek collectively hold over 70% of the global high-end Wi-Fi chip market share, while domestic companies account for only about 4.86%. In core AP scenarios such as routers and smart gateways, the penetration rate of domestically produced chips has long remained low. The direct consequence of this situation is that domestic manufacturers of routers, gateways, and optical modems have almost no domestically produced chips to choose from in their AP product lines. Supply chain security is one layer of pressure, and cost control is another—without alternatives, bargaining power is extremely limited. The significance of the WQ9301 lies in the fact that it has, for the first time, transformed the concept of "domestic AP chip" into a product that can be inquired about, sampled, and evaluated for mass production. II. To what extent has the Wuqi WQ9301 achieved this? The WQ9301, launched by Wuqi Microelectronics, is one of the very few mass-produced RISC-V architecture Wi-Fi 6 router chips in China. Based on its publicly available specifications, it is positioned to directly compete with mainstream Wi-Fi 6 access point (AP) solutions.   The architecture employs a RISC-V multi-core instruction set, runs the IEEE 802.11ax protocol stack, and is backward compatible with 802.11 a/b/g/n/ac. In terms of speed, it supports 160MHz bandwidth and 1024QAM modulation, utilizes DL/UL MU-MIMO and OFDMA technologies, and achieves a maximum dual-band concurrent speed of 3Gbps at the physical layer, targeting 4K/8K video and large-scale online gaming scenarios. The radio frequency (RF) is the chip's core differentiator: It features a self-developed 2.4GHz and 5GHz dual-band RF circuit and a unique high-performance CMOS PA technology, controlling power consumption and heat generation while ensuring transmit power. In terms of integration, a single chip integrates baseband, RF, and FEM, while also supporting external FEM solutions to meet diverse needs. More importantly, there's the progress of industrialization. The WQ9301 has passed authoritative industry certification and domestic production assessment, and has already achieved small-batch supply to ZTE Microelectronics and Changhong. It is expected to be adopted by major terminal customers such as China Mobile by 2026. Simultaneously, Wuqi is advancing the development of Wi-Fi 7 AP chips, aiming to complete Wi-Fi Alliance certification as early as the end of 2026. This means that the WQ9301 is not just a chip that remains in the release draft, but has already entered the evaluation and adoption process by real customers. For terminal manufacturers that make routers, smart gateways, and set-top boxes, there is finally a domestic AP solution that they can seriously evaluate. III. From Chips to Modules: Ofeixix Role is "Translation" A Wi-Fi chip is shipped as a packaged bare die, but terminal manufacturers need a module that can be plugged in and run immediately. Antenna matching, RF calibration, driver adaptation, heat dissipation design, protocol stack verification, certification testing—if these tasks are not completed, the chip's performance cannot be released, and the terminal product cannot be launched . This is what OufiXin does. It's a proven fact that the Wuqi WQ9201 chip has been adopted by multiple China Mobile set-top boxes and has achieved mass production. The O9201SB module developed by Oufexin based on this chip is a crucial link in this mass production chain. This module, measuring only 13×15mm, supports 2×2 MU-MIMO and dual-band concurrency, addressing the pain points of video stuttering and game latency in set-top box scenarios. From chip to module to bulk procurement by operators, this path has been successfully established. Designed for industrial applications, the O9201PM module from Oufexin adopts an M.2 interface and PCIe protocol, and has completed driver adaptation on domestic platforms such as RK3588, Allwinner, and Rockchip. Power consumption is reduced by 40% when Wi-Fi and Bluetooth work together. This demonstrates that Oufexin's capabilities extend beyond consumer-grade modules, and it also has delivery experience in domestic IT innovation and industrial control scenarios. When the WQ9301 entered the modularization stage, Oufexin's existing mass production experience with the Wuqi solution constituted a real first-mover advantage. New module manufacturers would need to go through the entire process of RF calibration, driver adaptation, and certification testing from scratch, while Oufexin had already accumulated a large amount of reusable engineering data and production line experience on the Wuqi platform. IV. Market Window: Wi-Fi 6 Remains the Core Market, and the Time is Ripe for Domestic APs. A common misconception is that Wi-Fi 7 is rapidly becoming widespread, so is it too late to develop Wi-Fi 6 AP chips now? The data tells us otherwise. According to a report by Luotu Technology, in the first half of 2026, Wi-Fi 6 accounted for 57.5% of the online market share for home routers in China, while Wi-Fi 7 accounted for 30.1%. Wi-Fi 6, with its cost-effectiveness advantage in the core price range of 100-300 yuan, covers the replacement needs of the vast majority of ordinary families and remains the absolute market mainstream. More macro-level data comes from Shangpu Consulting: in 2024, China's Wi-Fi chip shipments exceeded 2 billion units, with a market size approaching 40 billion yuan; it is projected that the Chinese market size will reach 100 billion yuan by 2030, but domestic companies currently only hold about 4.86% of the high-end chip market share. This figure itself illustrates the substitution potential of domestic AP chips—not a competition for existing market share, but a climb from almost zero to a double-digit market share. For Oufexin's target customers—set-top box manufacturers, gateway manufacturers, and industrial control equipment manufacturers—Wi-Fi 6 is currently the product line with the largest shipment volume, and the availability of domestic AP chips is directly related to BOM cost and supply chain security. V. Conclusion: When choosing chips, it's even more important to choose module partners who have already proven their capabilities. While the options for domestically produced Wi-Fi AP chips are indeed increasing, more options do not equate to easier implementation. The transition from "sampleable" to "mass-producible module" for a new chip involves a series of significant challenges, including RF debugging, driver adaptation, certification cycles, and production line yield ramp-up. If a terminal manufacturer chooses a module supplier without experience in mass-producing that chip platform, the project risks will not automatically disappear simply because "domestic chips are available." Oufeixin's core value lies not in its "distribution" of Wuqi's chips, but in its completion of a full engineering loop from chip to module on the Wuqi platform, which has been validated by mass shipments of China Mobile set-top boxes. When the WQ9301 enters the modularization stage, this proven engineering system can be directly reused, significantly reducing the adoption cycle for end customers. Congratulations again to Wuqi on the successful deployment of its WQ9301. For router, gateway, and set-top box manufacturers evaluating domestic AP solutions, the most pragmatic choice is not to wait for "more chip options," but to find a module partner that has already successfully run mass production using domestic chips . The combination of Oufexin and Wuqi provides a starting point for immediate evaluation. Data source notes : Wuqi WQ9301 parameters and industrialization progress are from reports by China Electronics Network and IT Times, as well as Wuqi's IPO prospectus; Oufexin module and mass production information are from Oufexin's official public information and reports by Electronic Engineering Times; market size data is from Shangpu Consulting's "WiFi Chip Industry Research Report (2026)"; router market structure data is from Luotu Technology's online market statistics for the first half of 2026.  

In October 2026, the "Opinions on Developing New Productive Forces" issued by the Central Committee of the Communist Party of China and the State Council listed humanoid robots as one of the key tasks for the application of next-generation intelligent terminals. Dai Jianjun, Deputy Director of the Innovation and Development Research Department of the Development Research Center of the State Council, pointed out in an interview with the China Economic Times that humanoid robots "are not isolated consumer products, but rather super carriers integrating hardware and software and spanning the entire industrial chain," capable of driving upstream computing power, chips, algorithms, and sensors, and simultaneously promoting the systematic upgrading of traditional supporting industries and manufacturing chains.   The industrial implications of this assessment are that the large-scale deployment of humanoid robots tests not only the manufacturing capabilities of the robots themselves, but also the maturity of the entire supporting supply chain. Dai Jianjun also pointed out the current core pain points: poor adaptability to unstructured environments, high costs of modifying the entire robot and its on-site components, and a high degree of scenario customization, making rapid deployment difficult . At the wireless connectivity level, these pain points directly translate into engineering requirements for link determinism, anti-interference capabilities, and integration efficiency.   1. In Dai Jianjun's judgment, which aspects are directly related to wireless connectivity? In Dai Jianjun's interview, there are three statements that have a technical mapping relationship with the Wi-Fi industry. Firstly, the implementation path is "starting with structured industrial scenarios and gradually expanding to semi-structured and home scenarios ." In structured factory environments, the dense metal structures and complex electromagnetic reflections make traditional Wi-Fi prone to jitter and momentary disconnections on a single frequency band. The primary requirement for robots in wireless links is not peak speed, but continuity of connection in interference-prone environments . Secondly, "poor adaptability to unstructured environments" is listed as a core pain point . Unstructured environments mean that robots need to perceive and make decisions in real time in dynamic spaces. Their bandwidth requirements for uplink data (vision, point cloud, force) and their sensitivity to the latency of control commands are significantly higher than those of industrial equipment with fixed workstations. Third, humanoid robots will "drive the development of intelligent manufacturing equipment in the short term ." As robots move from demonstration to mass deployment, the communication modules and radio frequency devices that support them will no longer be small-batch customized products, but will need to meet the requirements of large-scale industrial products with consistency, reliability, and supply stability. Key findings: The “poor adaptability to unstructured environments” and “systematic upgrade of manufacturing links” pointed out by Dai Jianjun correspond to two technical issues at the wireless connectivity level: link determinism in complex electromagnetic environments and quality convergence of communication modules from customized parts to mass-produced industrial parts. II. Which capabilities of Wi-Fi 7 substantially correspond to the above requirements? Among the core features of Wi-Fi 7, three are directly relevant to humanoid robot scenarios: Multi-Link Operation (MLO), 6GHz band support, and higher-order modulation and wider channels. However, it is necessary to distinguish between "technically corresponding" and "engineerably feasible." The industrial value of MLO lies in "uninterrupted connectivity," not "faster speed." In manufacturing environments with densely packed metal racks, AGVs and robots frequently experience jitter and momentary disconnections on a single frequency band. MLO allows devices to maintain two links simultaneously, switching traffic to the other when one band is interfered with. However, it must be objectively noted that MLO exists in two forms: STR (Simultaneous Transmit and Receive) and NSTR (Near-Switchover). As of 2026, most enterprise-level clients only support NSTR, and the proportion of industrial IoT devices supporting MLO remains limited. The industrial value of MLO is real, but the maturity of the client ecosystem will take time. The significance of the 6GHz band lies in spectrum isolation, but its availability in China is constrained by policy. The 320MHz channel relies on the 6GHz band, but China has not yet allocated the 6GHz band for Wi-Fi. This means that in domestic industrial scenarios, the peak bandwidth advantage of Wi-Fi 7 cannot be fully realized; what can actually be relied upon is the 160MHz channel and MLO redundancy capability under the 5GHz band. For module products targeting the global market, this regional difference needs to be clearly distinguished in selection and deployment strategies. A useful benchmark for implementation comes from the overall penetration rate of industrial Wi-Fi. Industry analysis indicates that by 2026, Wi-Fi 7 device shipments had surpassed Wi-Fi 6 shipments, with Huawei, H3C, and other manufacturers seeing industrial-grade Wi-Fi 7 AP shipments increase by over 120% year-on-year. In warehousing scenarios, Wi-Fi 7 upgrades the network from "best-effort" to industrial-grade determinism, with millisecond latency and extremely low packet loss significantly improving AGV scheduling efficiency. These data demonstrate that the industrial value of Wi-Fi 7 is being validated, but the validation scenarios are concentrated in warehouses, logistics centers, and manufacturing workshops with stable power supply and network infrastructure , rather than all industrial environments. Key findings: The core value of Wi-Fi 7 for humanoid robots lies in the link continuity provided by MLO (Mean Link Optimization), rather than peak speed. Given the constraint of the unopened 6GHz band in China, the actual competitiveness of module products depends more on the RF tuning capabilities of the 5GHz band and the engineering implementation quality of MLO. III. Specifications and Positioning of O2072PM/O2072PB from O2072PM O2Flytek's Wi-Fi 7 module, based on the Qualcomm QCC2072 (FastConnect C7700) platform, comes in two form factors: O2072PM uses the M.2 Key E standard interface (22×30mm), while O2072PB is a surface-mount package (13×15mm), designed for high-density onboard layouts. Core specifications include: 2T2R dual antennas, 2.4/5/6GHz tri-band, 320MHz channel bandwidth at 6GHz, peak data rate of 5.8Gbps, 4096-QAM modulation, and integrated Bluetooth 6.0. From the perspective of humanoid robot applications, the following three areas have value for industry analysis: The strategy of differentiating interface forms is engineeringly sound. M.2 Key E is a mature standard interface in embedded platforms, suitable for integration into robot main control boards with low design change costs; the surface-mount version O2072PB is geared towards space-constrained sub-modules or sensor nodes. Dai Jianjun pointed out that humanoid robots have a "high degree of scenario customization, making rapid promotion difficult," and the parallel use of the two packaging forms is actually using packaging flexibility to offset scenario fragmentation . The tri-band support and Bluetooth coexistence design are geared towards multi-wireless collaboration. The module explicitly supports Bluetooth and 2.4GHz WLAN sharing an antenna, while simultaneously operating in parallel with 5GHz/6GHz WLAN. In humanoid robots, Wi-Fi handles data transmission, while Bluetooth handles low-power sensor and remote control access; the quality of their coexistence directly impacts the overall wireless experience. This design choice aims for the collaborative operation of multiple wireless systems within a compact space , rather than maximizing the performance of a single link. The disclosure regarding platform compatibility is noteworthy. According to official information from Oufexin, the O2072PM is compatible with kernels 5.15.24+, 6.1.99, and 6.12.0 on the Intel x86 platform, but "further debugging and adaptation are needed" on the Arm platform . Customers should pay attention to whether the kernel version fully supports Wi-Fi 7. This disclosure highlights an industry reality: humanoid robots utilize diverse main control platforms (x86, Arm, and RISC-V are all under exploration), and the maturity of the Wi-Fi 7 module's drivers will directly affect its usability on different robot platforms. For robot main control solutions primarily based on the Arm architecture, this compatibility progress is a variable that must be considered during the selection process. IV. A necessary sober assessment: the pace of Wi-Fi 7 penetration in industrial scenarios When discussing the combination of Wi-Fi 7 and humanoid robots, there is a fact from the industry side that needs to be addressed. There is a significant discrepancy between Wi-Fi 7 shipment figures and actual deployments in industrial settings. Huawei cites Wi-Fi Alliance data stating that 625 million Wi-Fi 7 devices will be shipped globally in 2025, but the replacement cycle in industrial scenarios is much slower than in consumer electronics. The core considerations for industrial wireless selection are reliability and latency, while the market promotion of Wi-Fi 7 has long focused on "ultra-high throughput." This narrative mismatch may lead to slower-than-expected adoption of Wi-Fi 7 by industrial customers. Meanwhile, Wi-Fi 8 is expected to be released in 2028, and some industrial customers may choose to wait and see or jump directly from Wi-Fi 6 to Wi-Fi 8. The market size of humanoid robots also needs to be examined within reasonable expectations. Morgan Stanley raised its forecast for humanoid robot shipments in China to 50,000 units in June 2026, with a market size of approximately $2 billion; the forecast from China Business Industry Research Institute is more conservative, predicting shipments of approximately 38,000 units and a market size of 3.4 billion yuan in 2026. Regardless of which set of data is used, this size represents a meaningful segment for the Wi-Fi module industry, but it is not enough to change the overall penetration curve of Wi-Fi 7 in the short term . A more pragmatic perspective is that the demand for Wi-Fi 7 in humanoid robots is essentially a projection of industrial-grade reliability requirements onto a new terminal product category. Regardless of whether the terminal form is a robot, AGV, or CNC machine tool, the requirements for MLO (Mean Allocation), interference resistance, and multi-wireless coexistence are the same. While the value spillover from Oufexin's accumulation in this area may not be limited to the humanoid robot category alone, it cannot be expected that humanoid robots alone will support significant revenue growth. Key findings: The penetration of Wi-Fi 7 in industrial settings is a gradual process, with humanoid robots representing a new source of demand rather than the sole driving force. For module manufacturers, the strategic significance of humanoid robots lies in providing a real-world scenario to validate industrial-grade reliability design capabilities, rather than a short-term window for mass production. Conclusion For the Wi-Fi industry, this calibration manifests in: a shift from pursuing peak speeds to ensuring link determinism, from a consumer-grade cost-oriented approach to an industrial-grade reliability-oriented approach, and from single-device connectivity to the coexistence of multiple wireless systems. However, its actual position in the humanoid robot market will depend on three verifiable variables: the deployment timeline driven by the Arm platform, the measured stability of 5GHz MLO under domestic 6GHz unavailability conditions, and whether the modules can win customers with the consistency of industrial-grade quality rather than the technical specifications of prototypes when humanoid robots are truly deployed in large quantities . This chain is long, and Wi-Fi 7 is only one link, but it is precisely the engineering maturity of this link that determines whether the robot's "nervous system" can support the industry expectations described by Dai Jianjun.  

The global smart street light market is undergoing a structural expansion. A report released by Research and Markets in January 2026 shows that the market is projected to grow from $35.6 billion in 2026 to $74.9 billion in 2030, representing a CAGR of 20.4%. Europe is accelerating the renovation of existing infrastructure driven by mandatory replacement policies, while emerging markets in the Asia-Pacific region are releasing incremental demand through urbanization. However, a overlooked fact is that market expansion does not equate to simpler communication solution selection. On the contrary, as the focus of renovation shifts from "new construction" to "existing infrastructure," the primary constraint on communication solutions changes from technical specifications to the question: "Can this road be dug?" The position of PLC (Power Line Carrier Communication) under this constraint is clear: the streetlights themselves are connected to the power line, the PLC uses the same cable as both a power supply and data channel, and the communication signal is transmitted along the existing line without the need for any additional communication cables. Europe: Policy mandates have created the most certain scenarios for upgrading existing PLC systems. Europe is the region with the strongest policy drive for smart street light upgrades globally. A 2026 report by Mordor Intelligence points out that the EU's Mercury Regulation 2024/1849 requires the complete phase-out of compact fluorescent lamps by December 2025 and linear fluorescent lamps by December 2026. These compliance deadlines directly triggered a surge in municipal tenders. Simultaneously, the EU requires the public sector to reduce energy consumption by 11.7% by 2030, transforming the transition to network-connected LED lighting from an "optional" to a "compliance necessity." The unique aspect of this policy window is that it targets "replacement of existing infrastructure" rather than "new construction." Many streetlights in Europe were installed decades ago, with intact power cables but missing communication cables. Adopting a solution requiring separate communication cabling would mean excavating or re-laying conduits along the entire route, resulting in unpredictable costs and time. The ability of PLCs to reuse existing power cables perfectly matches the policy's mandated time pressure with the construction constraints of upgrading existing infrastructure. German practice provides a reference: the LED upgrade of 48,000 streetlights in Munich, combined with adaptive dimming, reduced energy consumption by 93% during off-peak hours. For these types of projects, communication reliability is more important than bandwidth; the millisecond-level latency of PLCs and the engineering advantages of no-wiring are more significant than wireless solutions in this scenario. However, the European market also presents a strict cost scrutiny. Smart retrofitting costs between €300 and €500 per pole, while basic LED replacement only costs €150 to €200. This price difference means that the selection of PLC modules must withstand scrutiny regarding the question of "why not use wireless?" The answer lies not in technological superiority, but in the engineering certainty under existing wiring conditions : wireless solutions are affected by terrain and building obstructions in dense urban areas, requiring additional relay nodes in practical testing, while PLCs, assuming the power supply cable is intact, have a physically existing communication link.   China and Asia Pacific: Differences in PLC Positioning in Incremental Markets Data from China's smart light pole market presents a different picture. QYResearch statistics show that the global smart city light pole market sales reached approximately $412 million in 2025 and are projected to reach $796 million by 2032, representing a compound annual growth rate of 10.0%. Unlike Europe's "replacement of existing stock," China's growth is largely driven by new "multi-purpose" projects: light poles simultaneously serve functions such as lighting, monitoring, 5G micro base stations, and environmental monitoring. Communication solutions tend to favor fiber optic or wireless backhaul because the civil engineering of the light pole itself is already included, thus amortizing the marginal cost of laying separate communication cables. This means that the main opportunity for PLCs in the Chinese street lighting market lies not in "building new smart light poles," but in the niche scenario of "energy-saving retrofitting of existing road lighting." Many urban roads in China only have power cables in their lighting circuits, lacking communication lines. If only single-lamp control, dimming, and fault feedback are required, PLCs offer better engineering economics than rewiring. A study published in the 8th issue of *China Lighting Appliances* in 2026 points to this logic: traditional control modes are energy-intensive and difficult to maintain, while mainstream wireless communication solutions are easily affected by terrain obstruction in densely populated urban areas. PLCs, utilizing existing cables for data transmission, offer advantages such as low cost and reliable connection. The Southeast Asian market is in an earlier stage. In March 2026, Terengganu, Malaysia, installed the state's first 5G smart lamppost at the Kedebayan Market, integrating smart lighting, monitoring, environmental monitoring, and electric vehicle charging functions. These markets share common characteristics: real incremental demand, but projects are small-scale, budgets are fragmented, and there is a higher sensitivity to module costs than to brand premiums. In these markets, PLC modules are more likely to follow lighting solution providers overseas rather than independently building brand recognition.   The strategic position of the Qogrisys S130N-ISI in this landscape The product parameters of the S130N-ISI need to be understood within the context of the aforementioned market differences. It is based on the Leadcore VC6330, with an LCC package size of 20.6×12.6mm, supports both Q/GDW 11612 and IEEE 1901.1 protocols, and provides UART, PWM, GPIO, ADC, and SPI interfaces, integrating a built-in wire driver. According to official data from Leadcore regarding the VC6330 chip, application-layer communication rates can reach 1Mbps, with attenuation resistance exceeding 112dB, and a 99.99% communication success rate in actual projects. These parameters address the question of "whether it can be used," but the "usability" in different markets depends on the line conditions and system integration quality. The aging of the lines in European projects, the distribution of interference sources in Chinese projects, and the differences in construction specifications in Southeast Asian projects all affect the actual performance of the PLC. In street lighting scenarios, the value of the S130N-ISI lies not in promising "it will work immediately after installation," but in providing a hardware option that meets basic engineering requirements in three dimensions: protocol matching (Q/GDW 11612, IEEE 1901.1), size adaptation (20.6×12.6mm can be embedded in a single lamp controller), and interface integration (PWM dimming, ADC acquisition). One fact that requires careful consideration is that publicly available authoritative data on the actual global adoption rate of PLCs in smart streetlights is limited. What can be confirmed is that PLCs are one of the official options for smart streetlight connectivity, with academic research and engineering practice supporting their feasibility under specific conditions. However, conclusions such as "PLCs will dominate streetlight communication" lack data support. For engineering teams evaluating solutions, a more pragmatic approach is to test the wiring first, then select the modules. Only when the line impedance and signal-to-noise ratio are within reasonable ranges can the wiring-free advantage of PLCs translate into savings in construction time and costs; if test results are unsatisfactory, the costs of forcing PLC implementation may only become apparent during the commissioning phase.   Conclusion: The window of opportunity belongs to solution providers who clearly explain the "constraints". The global smart street light market's 20.4% CAGR provides a real window, but this window opens differently in different regions. In Europe, mandatory policies have created a definite demand for retrofitting existing infrastructure, where the wiring-free advantage of PLCs has the clearest engineering logic. In China, incremental growth is concentrated in the construction of new multi-functional light poles, where PLCs have opportunities in the energy-saving retrofitting of existing roads. In Southeast Asia, the early-stage market is testing the cost competitiveness of modules. In this context, the S130N-ISI isn't a "universal street light module," but rather a PLC hardware option that adapts to the needs of single-lamp controllers in terms of protocol, size, and interface. Its value lies not in the absolute values of its specifications, but in its compatibility with the specific project's wiring conditions. For the engineering team, this means resolving the "do we need to break the road?" question at the project initiation meeting, rather than discovering during the commissioning phase that line noise is causing communication success rates far below expectations. Testing the line first, then selecting the module—reversing this order might save you a quote, but cost you the entire road's commissioning time.  

I. The Real-World Coordinates of the Wi-Fi 8 Standard Progress Just two days ago, Qualcomm's Dragonwing platform released a signal at Network X 2026 – the Wi-Fi 8 gateway solution was launched. To understand this, we need to clarify the current standard stage of Wi-Fi 8. At the IEEE plenary meeting in Montreal in July 2026, the 802.11bn task force voted to submit Draft 2.0 to the working group for a vote, thus finalizing the core features of Wi-Fi 8. According to the timeline disclosed by ABI Research, Draft 3.0 voting is scheduled for January 2027, Draft 4.0/initial standards association voting is targeted for May 2027, final working group approval is set for March 2028, IEEE standards committee approval is expected for May 2028, and the Wi-Fi Alliance certification program is expected to launch in January 2028. The key implication of this timeline is that Wi-Fi 8 will still be in the draft standard stage in 2026, with certified products and large-scale commercialization not truly starting until 2028. However, chip platform and module solution providers have already significantly accelerated their product development pace. Broadcom was the first to release Wi-Fi 8 chipsets in October 2025, followed by MediaTek and Qualcomm. By September 2026, the Wi-Fi Alliance had already held its first Wi-Fi 8 pre-certification interoperability Plugfest in Beijing, Taipei, and California. While the standard has not yet been finalized, the industry's engineering preparations are already in full swing. II. The Differentiated Deployment Logic of Qualcomm's Dragonwing Platform Qualcomm's Dragonwing product portfolio, showcased at Network X 2026, presents a clear market segmentation strategy. designed for mainstream fiber broadband gateways . According to Qualcomm's official product briefing, the F8 integrates Wi-Fi 8 connectivity and native PON architecture support, targeting Home Gateway Units (HGUs) and Single Units (SFUs). Key specifications include: peak wireless capacity of 23Gbps, support for up to 750 concurrent clients, up to three-band operation and a 14-antenna configuration , flexible RF configuration allowing for a 5x5 mode or splitting into dual-band simultaneous 2x2+3x3 modes, and native support for GPON, XG-PON, and XGS-PON standards. The platform supports open-source middleware such as prplOS, OpenWRT, RDK, and OpenSync, and is equipped with a dedicated scanning radio frequency for automatic channel selection and radar detection. designed for high-end enterprise access points (APs) and flagship home routers . Its specifications are significantly improved: peak wireless capacity of 33Gbps, support for up to 1500 concurrent clients, up to five frequency bands and a 20-antenna configuration , integrated five-core CPU and Hexagon NPU, and support for edge AI inference. Developed in collaboration with GFiber, this platform, a Wi-Fi 8 Premium Gateway, aims to support symmetric 20Gig broadband services, redefining the gateway from a "connected device" to a "smart service platform." Meig Smart chose to launch its Wi-Fi 8 gateway solution on the N8 platform, officially announcing it at Network X 2026 on October 14th. The industry significance of this launch lies in the fact that the entire engineering transformation chain of a Wi-Fi 8 gateway, from chip platform to deliverable solution, has been fully demonstrated for the first time. For downstream customers, the Wi-Fi 8 gateway is no longer a distant concept "waiting for the standard to be finalized," but rather an evaluable chip base and a referenceable solution design. III. Generational Positioning of Qogrisys Gateway Module Product Line Although manufacturers are currently rushing to implement their strategies in advance, WiFi 7 and WiFi 6 remain the mainstays of shipments. They are more mature than WiFi 8 and are still the preferred choice. During this window of opportunity before the Wi-Fi 8 standard is finalized, gateway module solution providers need to strike a balance between technological foresight and market deliverability in their product strategies. Qogrisys's two main gateway module products are precisely designed to meet different levels of demand during this transition period. Wi-Fi 7 Platform: O2072PM and O2072PB The O2072PM is based on the Qualcomm FastConnect C7700 (QCC2072) chip, uses a standard M.2 Key E interface (22×30mm), and supports Wi-Fi 7 (802.11be) and Bluetooth 6.0. Its core capabilities include: tri-band 2.4/5/6GHz concurrent operation; the 6GHz band supports 320MHz channel bandwidth and 4096QAM modulation, with a peak rate of 5.8Gbps ; and it supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) , enabling millisecond-level switching when the link is interfered with. This module has completed driver adaptation for Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB is based on the same QCC2072 chip and uses a 15×13mm surface mount package, targeting space-constrained onboard integration scenarios. Wi-Fi 6E Platform: O2066PM and O2066PB The O2066PM is based on the Qualcomm QCA2066 chip and uses a standard M.2 2230 Key E interface (22×30×2.7mm), supporting Wi-Fi 6E (802.11ax) and Bluetooth 5.2. Key specifications include: tri-band 2.4/5/6GHz support, dual-band simultaneous (DBS) operation, and a maximum speed of 2975.6Mbps ; support for 2×2 MU-MIMO, 160MHz channel bandwidth, and dynamic frequency selection (DFS radar detection). The Bluetooth interface supports both UART/PCM and USB configurations. The module operates in a temperature range of -30℃ to +85℃ , exhibiting industrial-grade stability. In VR products, it has achieved a measured throughput of 2.1Gbit/s and has been designed into customer VR products, which were showcased at CES 2023. The O2066PB is based on the same QCA2066 chip, and its core capabilities are identical to the O2066PM; the difference lies in its package form. It uses a small SMT LGA package, measuring 13×15×2.3mm , targeting space-constrained onboard integration scenarios. Wi-Fi uses a PCIe interface, and Bluetooth uses a UART/PCM interface. Its operating temperature range is -30℃ to +70℃ , making it suitable for consumer-grade terminal devices. the O2072 series is logically consistent with the "high reliability connection" emphasized by Wi-Fi 8—Wi-Fi 7's MLO provides an engineering implementation of link redundancy, while Wi-Fi 8's Multi-AP Coordination (MAPC) extends the coordination scope from a single device to a multi-node network. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-end and mid-range gateways, Wi-Fi 6E's 6GHz band capability provides cost-sensitive customers with a "partial generational upgrade" option . IV. Generational Transition Logic Between Chip Platforms and Module Products From Wi-Fi 6E to Wi-Fi 7 and then to Wi-Fi 8, the technological evolution path of gateway modules shows a clear continuity. The core improvement of Wi-Fi 8 over Wi-Fi 7 lies not in peak speed . According to industry technical analysis, Wi-Fi 8 is compatible with Wi-Fi 7's 2.4/5/6GHz tri-band, 320MHz channel, and 4096QAM. Existing Wi-Fi 7 RF architectures can support these core features through firmware upgrades . Wi-Fi 8 offers approximately double the actual throughput and reduces P99 latency to about one-sixth of Wi-Fi 7. Its core value lies in reliability, coverage, and concurrency efficiency in high-density/long-distance scenarios , achieved through multi-AP collaboration, dynamic resource scheduling, and enhanced link design. Wi-Fi 7 addressed "speed," while Wi-Fi 8 addresses "stability." The eMLSR multi-link operation capability and tri-band concurrent architecture already possessed by the O2072 series from Qogrisys are engineering implementations on the Wi-Fi 7 platform. As the Wi-Fi 8 MAPC protocol stack and enhanced long-range response (ELR) features mature, module products based on the Wi-Fi 7 RF architecture have the engineering foundation to migrate to Wi-Fi 8 features at the hardware level . The core challenges lie in upgrading the software protocol stack and implementing multi-AP coordination functions. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-to-mid-range gateways, the 6GHz band capability of Wi-Fi 6E provides cost-sensitive customers with a "partial generational upgrade" option . V. Conclusion Qualcomm's Dragonwing platform was publicly launched as a Wi-Fi 8 gateway solution during Network X 2026, marking the transition of Wi-Fi 8 from the standard draft and chip prototype stages to the gateway product engineering stage . Meig Smart's solution release validates the transformation path from chip platform to deliverable gateway, and also indicates that the competitive pace among module solution providers has shifted from "following after the standard is frozen" to "parallel development during the standard draft stage." For gateway module solution providers, the core task at this stage is not to "get a head start" on the Wi-Fi 8 platform, but to accumulate transferable engineering capabilities on the Wi-Fi 7 and Wi-Fi 6E platforms. The experience of O2072PM / O2072P B in eMLSR multi-link operation, the accumulated RF engineering expertise in tri-band concurrent architecture, and the cost optimization path of O2066PM / O2066P B in the 6GHz band together constitute the product positioning for the transition to the Wi-Fi 8 era. From a longer-term perspective, Wi-Fi 8 redefines the gateway from a "wireless coverage device" to an "access node in a multi-AP coordinated network." This role change requires module solution providers to extend their capabilities beyond simple RF engineering and driver adaptation to system-level capabilities such as network topology planning, multi-node collaborative scheduling, and deployment scenario adaptation. During the standard window of 2026-2027, module solution providers' product strategies need to find a balance between "technological foresight" and "current deliverability"—Wi -Fi 7 modules serve current high-end gateway needs, Wi-Fi 6E modules cover cost-sensitive scenarios, and Wi-Fi 8 productization preparation needs to be quickly integrated as soon as the chip platform becomes available.  

I. The acceptance logic has changed: from "whether it's installed or not" to "only counts if it's tested". Rooftop photovoltaic projects in Shenzhen are undergoing a substantial upgrade in acceptance standards. Shenzhen's local engineering construction standard SJG 220-2026 has been implemented , which sets precise quantitative indicators for rapid shutdown: the shutdown action should be completed in no more than 30 seconds, the voltage within 1 meter of the photovoltaic array should drop to below 80V, and the voltage outside 1 meter should drop to below 30V. This isn't something that can be simply dismissed as "installing fast shutdown." On-site acceptance personnel will first locate all shutdown trigger points, confirming the consistency of logic at fire exits, near the inverter, and at the remote control terminal; then verify the correspondence between the shutdown devices and components; finally, record the time and voltage at the measurement points specified in the drawings, confirming that the array boundary, both inside and outside the project's adopted version, meets the requirements. Simply stating "RSD is written in the bill of materials" is no longer sufficient for acceptance; the system-level voltage control performance is the final criterion. The Shanghai group standard T/ESETA 000007—2026 further refined the requirements: shutdown must be completed within 30 seconds after triggering, and the external voltage of the reachable boundary must be ≤30V, the internal voltage must be ≤120V, and the output power must be ≤1W. It also clearly states that "shutdown is divided into component-level and string-level, and component-level solutions should be given priority in densely populated places." The North American market has more stringent entry barriers. NEC 690.12 requires that controlled conductors outside the array boundary must drop below 30V within 30 seconds, and that electric shock protection for firefighters within the boundary must be achieved through a listed PVHCS device or voltage limiting method. When selecting a PLC solution, the chip's modulation method and noise immunity directly determine the number of components the system can support. II. SunSpec's hierarchical logic: Chip compliance ≠ Module certification ≠ Complete system approval This is a critical issue that is most easily overlooked by switch manufacturers and module purchasers. The SunSpec Alliance's "Communication Signal for Rapid Shutdown" specification defines the communication protocol between the transmitter and receiver: the transmitter continuously sends a signal in an "operational" state, and the receiver triggers shutdown upon detecting a signal loss. The SunSpec Alliance explicitly states: "Only the 'SunSpec Certified' mark proves the complete and successful implementation of the SunSpec Rapid Shutdown communication signal functionality specification. Claims of 'SunSpec compliance' or 'SunSpec compatibility' by manufacturers or other third parties are not equivalent to a certificate issued by SunSpec." This means that chip support for protocols, module passing conformance testing, and complete device certification are three independent verification levels. Module-level protocol compatibility is only the first hurdle; safety certifications such as UL 1741 and CSA C22.2 at the whole-unit level are the passports to market entry. This understanding is crucial for circuit breaker manufacturers' selection decisions.   III. Three Engineering Dimensions for Module Selection: Size, Power Consumption, and Networking Capability For circuit breaker manufacturers, the "PLC support" and "integrated line driver" features on the chip specifications are just the starting point. What truly determines whether a solution can be mass-produced and implemented is the engineering adaptability at the module level. The first dimension is size. The circuit breaker is installed on the back panel of each photovoltaic module, where space is extremely limited, and it shares this limited area with junction boxes and cables. The module's package size directly determines the design space and installation method of the circuit breaker housing. PLC modules using the Hisilicon PS0211 chipset typically use a 28.12×18.00mm pin header package or a 20.0×14.2mm gold finger package, while some module manufacturers have launched a further miniaturized version of 20.0×11.0mm. The second dimension is power consumption. The shutdown device is powered by the photovoltaic panel itself and has no independent power input. The static power consumption of the HiSilicon PS0211 solution is ≤0.15W (in the grid-connected, non-packet-sending state), and the dynamic operating power is ≤0.5W. During periods of insufficient sunlight, when the modules are shaded, or at night, the module must rely on extremely low standby power consumption to maintain its monitoring capability, waiting for the "operation allowed" signal sent by the inverter transmitter. The third dimension is networking capability. PLC signals are transmitted via DC power lines, and the shutdown device, acting as a STA node, needs to establish a reliable communication link with the CCO at the inverter end. The HiSilicon PS0211 solution supports rapid networking in 10 seconds in a typical 200-node, 2-tier network scenario, supporting dynamic routing and multi-path addressing, and unicast, multicast, and broadcast command propagation methods. For the requirement of unified access for multiple components and devices in distributed photovoltaic systems, the networking scale and time performance of the modules directly affect the system commissioning efficiency. IV. Scene Alignment of Two PLC Modules from Qogrisysy In the selection of photovoltaic shutdown PLC modules, Qogrisysy provides two products based on different chip solutions, each corresponding to different engineering focuses. the S130N-ISI (Linktronics VC6330 solution) is its ultra-small size. This module uses LCC packaging, with a PCB size controlled at 12.6×20.6×2.5mm. It operates in temperatures ranging from -20°C to 80°C and in storage temperatures from -40°C to 125°C, supporting SGCC 0~12MHz bandwidth and the IEEE 1901.1 communication protocol. For switchgear designs with extremely limited space, the physical size of the module is often the first screening hurdle. For the design of rapid shutdown unit (RSU) enclosures where space is severely constrained, the physical dimensions of the module often serve as the primary screening criterion. For RSU manufacturers, engineering compatibility at the module level is more critical than specific chip parameters: the unit is mounted on the back of the PV module—an area with extremely limited space—and is powered by the PV panel itself, requiring it to continuously monitor PLC signals while operating at a microwatt-level power draw. Engineering metrics across three dimensions—module dimensions, power consumption characteristics, and reliability over a wide temperature range—directly determine whether the complete RSU can operate stably in real-world rooftop environments. V. Key Conclusions First, PLCs are the optimal technical solution for rapid shutdown at the component level. The SunSpec specification explicitly uses PLCs as the communication signal carrier, multiplexing DC power lines to transmit control signals, thus avoiding the cost and reliability risks of laying separate communication lines for each component. Second, the acceptance criteria are shifting from "functionality" to "measurable effectiveness." The 30-second/80V/30V specifications in SJG 220-2026 and the quantitative requirements of the Shanghai group standard mean that the design of a fast shutdown solution must withstand on-site testing. Third, the core consideration for module selection should shift from "chip parameters" to "engineering adaptability." The three engineering indicators—space constraints of the shutdown unit, power consumption constraints under self-powered conditions, and network scale constraints in distributed scenarios—are the key to determining whether a solution can be mass-produced and implemented. Fourth, awareness of certification levels is a capability that circuit breaker manufacturers must establish. Chip support for the SunSpec protocol, module certification through SunSpec, and complete unit certification through UL 1741 safety standards are three independent verification levels. The Hisilicon PS0211 chip explicitly indicates support for the SunSpec standard, and the Qogrisysy 3121N-H module, based on this chip, provides a fundamental protocol-level guarantee for circuit breaker manufacturers' complete unit certification. Fifth, the role of module suppliers is expanding from "device delivery" to "certification assistance." Switch manufacturers need more than just "usable modules"; they need technical partners who can "help understand SunSpec test logic, optimize system networking design, and assist in passing overall system certification."  

In October 2026, the TP-Link Archer 8 Ultra will be available for pre-order simultaneously in the UK, Germany, and Australia, priced at £669.99. This is the world's first complete Wi-Fi 8 series product aimed at the consumer market . However, what is truly noteworthy is not the router's theoretical aggregation speed of 19Gbps, but a more fundamental technological shift: Wi-Fi 8 (IEEE 802.11bn) is abandoning the traditional path of "each generation must be faster," and shifting its focus to reliability, coverage, and concurrency efficiency in real-world network environments . What does this shift mean for Wi-Fi module solution providers? If Wi-Fi 7 addressed the "peak speed ceiling" problem, Wi-Fi 8 aims to solve the "lower limit of actual user experience." The two technologies have different technical logics, and the corresponding module design approaches, chip selection criteria, and supply chain preparation schedules will also change accordingly. The "time difference" between the standard timeline and the commercial pace To understand the commercialization process of Wi-Fi 8, we first need to clarify a key fact: there is a significant time lag between product launch and standard finalization . According to the latest progress from the IEEE 802.11 working group, final approval of the Wi-Fi 8 standard is expected in May 2028 , while the Wi-Fi Alliance's certification program is scheduled to launch during CES in January 2028. Rolf de Vegt, Qualcomm's Vice President of Technical Standards, confirmed that Draft 2.0 will be finalized at the IEEE meeting in July 2026; this version is generally considered a sign that core technical features are stabilizing . This "product-first, standards-undefined" approach presents unique selection challenges for module solution providers: early chip solutions may have inconsistent feature completeness, and some Wi-Fi 8 functions require subsequent firmware updates to activate. TP-Link has explicitly stated that features such as DSO (Dynamic Subband Operation), ELR (Enhanced Long Distance Transmission), and DRU (Distributed Resource Unit) on the Archer 8 Ultra will be gradually released through OTA updates . A shift in technological logic: from "peak rate" to "consistent throughput" The technical goals of Wi-Fi 8 can be summarized by a set of figures: 25% increase in data rate, 25% reduction in tail latency, and 25% reduction in lost MAC protocol data units . The design intent of these goals is clear—not to make a single device run faster, but to make connections more stable across multiple devices, over long distances, and in environments with interference. The specific technical mechanisms include several levels: Multi-AP Coordination is the core architectural change in Wi-Fi 8. Unlike Wi-Fi 7 where each AP works independently, Wi-Fi 8 allows multiple routers to form a coordinated network, even serving a single device simultaneously . This means that in Mesh networking or enterprise deployments, interference between APs can be actively managed, rather than passively avoided. Enhanced Long Range Transmission (ELR) and Distributed Resource Units (DRUs) are designed for edge-of-signal scenarios. TP-Link's test data shows that over medium to large distances, Wi-Fi 8 offers a 33% improvement in throughput consistency compared to Wi-Fi 7 ; in interference environments, throughput consistency is improved by 24% . Receiver sensitivity is improved by 1-3 dB in the 5GHz and 6GHz bands . Non-Primary Channel Access (NPCA) and Dynamic Sub-Band Operation (DSO) address the issue of spectrum coexistence. NPCA allows APs to dynamically switch when the primary channel is congested, while DSO supports the efficient coexistence of devices with different bandwidth capabilities within the same network . MediaTek claims that its NPCA+ technology can improve throughput by approximately 80% in high-density environments with overlapping multi-networks . From a physical layer perspective, Wi-Fi 8 introduces a new 3888-bit LDPC code , an extension of the existing 648, 1296, and 1944-bit codes. This longer code block provides a coding gain of 0.5–1.0 dB at higher MCS levels and in multi-spatial-stream scenarios , at the cost of requiring parallel decoding capabilities, which may limit its performance in narrow-channel 2.4 GHz bands . An overlooked accelerating factor: storage cost pressures Behind the accelerated commercialization of Wi-Fi 8 lies a driving force unrelated to wireless technology itself: the continuous rise in memory chip prices . A Dell'Oro Group report in August 2026 indicated that the introduction of enterprise-grade Wi-Fi 8 could be brought forward to 2027 due to tight DDR4 memory supply and rising prices , allowing vendors to reduce their reliance on high-cost storage components through new architectural designs . The report's author, Siân Morgan, concluded: "The faster vendors change their AP designs to reduce their reliance on the highest-cost memory components, the more competitive they will be on price. This constitutes a strong incentive to move to Wi-Fi 8." This logic also applies to Wi-Fi modules. If the architectural optimizations of Wi-Fi 8 can reduce the reliance on large-capacity memory in module solutions, then in an environment of high storage costs, the overall BOM cost structure of Wi-Fi 8 modules may be more competitive than that of Wi-Fi 7. The driving force behind technological upgrades comes not only from performance requirements but also from cost pressures from the upstream supply chain. Complementary rather than substitutive technologies: Wi-Fi 7 addresses the question of "how fast can it be," while Wi-Fi 8 addresses the question of "how stable can it be." To understand the relationship between Wi-Fi 7 and Wi-Fi 8, we need to go back to the core design goals of IEEE 802.11bn. The technical logic behind Wi-Fi 7 (IEEE 802.11be, Extremely High Throughput) is to push peak speeds to the limit : 320MHz channels, 4096-QAM, Multi-Link Operation (MLO), Multi-Resource Unit (Multi-RU), and preamble puncturing . Research published in IEEE Communications Standards Magazine indicates that Wi-Fi 7 aims to achieve "throughputs up to 30 Gbps and lower latency than Wi-Fi 6." These characteristics correspond to high-bandwidth, low-latency scenarios such as 8K video streaming, VR/AR, and cloud gaming. The technical logic of Wi-Fi 8 (IEEE 802.11bn, Ultra High Reliability) has undergone a fundamental shift. According to the technical lecture summary of IEEE Region 6, Wi-Fi 8 "maintains peak rates" while shifting its focus to "reliability, lower latency, less packet loss, and stable throughput under load ." Its core technical means include multi-AP coordination, coordinated spatial multiplexing, non-primary channel access, and enhanced long-distance operation—all pointing to the same goal: to allow users to experience throughput closer to theoretical values in real-world network environments with dense interference, diverse devices, and proximity to the edge . This difference in positioning determines the complementarity of Wi-Fi 7 and Wi-Fi 8 in application scenarios. For scenarios requiring extreme speeds (VR wireless streaming, 8K live streaming, high-speed file transfer), Wi-Fi 7's 320MHz and MLO are core capabilities; for scenarios requiring extreme reliability (industrial automation, AGV/AMR, telemedicine, smart home whole-house coverage), Wi-Fi 8's Multi-AP coordination and ELR are key. The two are not in a "new generation replacing the old generation" relationship, but rather a coexistence relationship where each leverages its strengths in different scenarios. The practical significance of Qogrisys Wi-Fi 7 module solution During this window of time when generations coexist, the value of module solution providers lies not in "betting on which generation of technology will win," but in providing suitable Wi-Fi 7 module options for different scenarios, while reserving the ability to switch to Wi-Fi 8 technology . Taking the O2072PM module from Qogrisys as an example, this module is based on the Qualcomm QCC2072 (FastConnect C7700) design, supports 320MHz channels, 4096-QAM, MLO, tri-band 2.4/5/6GHz concurrent operation, peak data rate of 5.8 Gbps, and Bluetooth supports BLE 6.0 and LE Audio . These features directly correspond to the core capabilities of Wi-Fi 7, making it suitable for industrial gateways, smart terminals, and embedded systems that require high throughput and low latency. The market viability of these Wi-Fi 7 module solutions in the current and next two years is based on the following facts: First, the Wi-Fi 7 terminal ecosystem is already mature. Intel's Wi-Fi 7 product line has been continuously iterated from BE200 (Q3 2023) to BE213/BE211 (Q4 2025) , and the Wi-Fi 7 platform has been fully deployed in routers, mobile phones, and PCs. Module solution providers do not need to wait for "terminal readiness" because terminals are already being shipped. Secondly, the chip production capacity and supply chain for Wi-Fi 7 have stabilized. The capacity utilization rate of Wi-Fi 7 modules is projected to be only 62.3% in 2026, indicating a structural oversupply . This means that chip supply is no longer a bottleneck, and module manufacturers can obtain competitive procurement costs and stable delivery times. Third, early demand for Wi-Fi 8 modules will primarily appear in enterprise and industrial applications, rather than consumer applications. Dell'Oro Group predicts that enterprise-grade Wi-Fi 8 may be introduced as early as 2027, driven by storage cost pressures rather than end-user demand . Large-scale demand for consumer-grade Wi-Fi 8 modules will require waiting for the standard to be finalized in 2028 and for end devices to fully adopt it. Key conclusions First, the dominant position of Wi-Fi 7 modules in shipments from 2026 to 2028 will be determined by the terminal iteration cycle, rather than by technological superiority or inferiority. The expected annual shipment of 234 million units and a 46% contribution rate to sales revenue indicate that Wi-Fi 7 has entered a period of large-scale returns. Secondly, Wi-Fi 8's "reliability-first" positioning makes it complementary to Wi-Fi 7 in various scenarios, rather than a simple replacement. Wi-Fi 7 addresses "speed," while Wi-Fi 8 addresses "stability." The two will coexist in high-density, long-distance, and multi-device coexistence scenarios for a long time. Third, the core strategy of module solution providers at this stage is to cover mature terminal needs with Wi-Fi 7 solutions, while reserving a technical window for Wi-Fi 8 FEM pre-research and chip platform evaluation. Wi-Fi 8 RF front-end pre-research needs to be coordinated with the SoC ecosystem, and this preparation should be completed in 2026-2027.      

I. A trillion-yuan existing market is opening up China's hotel industry has entered a stock era. Over the next three years, 732,000 rooms older than 15 years will enter a concentrated renovation cycle , with the market size already exceeding 100 billion yuan . Since 2026, the number of renovation contracts signed has already surpassed the total number for the entire previous year, and "renovation" and "rebranding" are becoming accompanying actions in the upgrading of China's hotel stock . The core challenge of renovating existing hotels lies in the need to upgrade guest rooms with smart technology while maintaining operations and minimizing disruption to guests. This places demands on the construction costs and deployment flexibility of communication technologies far exceeding those of new projects. II . Market Trends The smart hotel market is currently experiencing a period of structural expansion. Market research firms predict that the global smart hotel market will grow to US$90.46 billion by 2032 , representing a compound annual growth rate of 14.20% . The Asia-Pacific region is the fastest-growing area, driven by high smartphone penetration, urban tourism expansion, and large-scale hotel modernization . In terms of connectivity technology, PLCs are transforming from a "supplement to wireless solutions" to a "connection base for hotel guest room control ." This judgment is based not only on Lihe Micro's implementation data but also on changes in the competitive landscape: Honeywell's INNCOM FLEX intelligent hotel guest room control system, released in September 2026, explicitly supports "wired and wireless dual deployment solutions" and is compatible with mainstream building protocols such as BACnet IP and Modbus TCP, reflecting the leading building automation manufacturers' recognition of the "multi-protocol compatibility and open deployment" approach . III . The Dilemma Between Wired and Wireless Traditional hotel guest room control systems face a structural dilemma. Wired solutions (RS-485 bus, TCP/IP Ethernet) offer stable and reliable communication with strong anti-interference capabilities and no data packet loss issues, but require the laying of dedicated communication cables. In existing renovation scenarios, this means trenching, ceiling removal, and wall repair, resulting in long construction periods and often requiring closure or phased construction, significantly impacting hotel operations . This type of solution is more suitable for new construction or complete renovation of high-end hotels . Wireless solutions (Bluetooth Mesh, Zigbee, Wi-Fi) offer flexible deployment options, requiring only the laying of power lines, making them cost-effective and easy to install in converted hotels . However, wireless signals face challenges in complex hotel structures, such as wall attenuation, metal cabinet obstruction, and co-channel interference, resulting in weaker communication stability compared to wired methods. Furthermore, the location of the equipment significantly impacts signal quality . No single technological approach can simultaneously meet the dual requirements of "uninterrupted transformation" and "highly reliable communication." What the industry needs is a third path. IV . PLC: Resolving the conflict between "existing power lines" and "new wiring". The core logic of PLC (Power Line Carrier Communication) differs fundamentally from traditional solutions. Wireless solutions rely on electromagnetic wave propagation, and signals experience significant attenuation when passing through load-bearing concrete walls and metal structures. In contrast, PLC uses the building's existing 220V/380V power lines as the data transmission medium. Signals travel along the power lines and are unaffected by physical obstructions from walls, floors, or metal structures—as long as the circuit is powered, the communication link remains stable . Real-world test data supports these technical characteristics: PLC-IoT end-to-end response latency is consistently below 50 milliseconds , and the communication success rate is nominally as high as 99.99% ; a single host can support 128–384 device nodes; academic research confirms that PLC-IoT has comprehensive advantages over ZigBee and KNX technologies in terms of stability, cost-effectiveness, and anti-interference capabilities . For hotel renovation projects, the most valuable feature of PLCs is that they eliminate the need for wiring. V. Open ecosystems are replacing closed solutions The accelerated adoption of PLC technology in the hotel industry also benefits from the industry's reflection on "closed-loop guest room control solutions". Currently, most hotel smart guest room control projects adopt closed-loop solutions, with hotel systems, equipment, and platforms highly dependent on a single supplier. If a vendor experiences operational or technical issues, the entire guest room control system may be paralyzed. Furthermore, incompatible communication protocols between gateway devices from different brands prevent interoperability and hinder system expansion, resulting in persistently high costs for subsequent hotel upgrades, maintenance, and iterations . Based on a unified protocol standard, the PLCP ecosystem brings together products such as switch panels, light drivers, curtain motors, and temperature control panels from numerous equipment manufacturers. Hotels can flexibly select from multiple brands and categories, eliminating the supply chain risks of "one vendor monopolizing" products. This trend offers a clear message for module manufacturers: hotel customers are no longer simply buying "a gateway + a set of equipment," but are looking for "a standard + an ecosystem." As the underlying communication layer, modules need to be compatible with mainstream protocol stacks. VI . PLC module slots of Qogrisys Shenzhen Ofeixin Technology Co., Ltd. has developed two core module products for hotel scenarios in the PLC field. The 3121N-H (based on the HiSilicon Hi3121S) is based on a subset of the IEEE 1901.1 standard. A single CCO supports up to 200 STA nodes , dynamic routing, and automatic multi-path addressing. A typical 200-node, two-tier network can be set up within 10 seconds . The module size is 23.5×30mm, integrating built-in line drivers and onboard coupling circuitry, and providing interfaces such as UART, PWM, GPIO, I2C, and ADC. Qogrisys has also designed an integrated PLC + power supply kit with a built-in conversion transformer for direct connection to 220V bidirectional AC power, facilitating rapid product adoption by customer control solution providers . The S130N-ISI (based on the Leadcore VC6330) uses an LCC package, measuring only 20.6×12.6mm , making its ultra-miniaturized design suitable for space-constrained hotel panel devices. It integrates a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor, supporting both China SGCC Q/GDW 11612 and IEEE 1901.1 protocols . The Leadcore VC6330 chip achieves an application-layer communication rate of up to 1Mbps, with a 99.99% communication success rate in actual projects and a Level 1 network communication latency of

I. Centralized Procurement Signal: The Iteration of Wi-Fi 7 for Home Gateways Enters Substantive Stage The centralized procurement of home network terminals completed by China Telecom and China Mobile in 2026 sends a clear signal to the industry: the role of Wi-Fi 7 in operators' home gateways and FTTR products is shifting from "flagship configuration" to "mainstream configuration" .   In China Mobile's 2026-2027 smart home gateway centralized procurement, Tianyi Technology was shortlisted as the third successful bidder for Package 1 and the sixth successful bidder for Package 2, with an estimated value of 208 million yuan. In China Telecom's FTTR centralized procurement, Tianyi Technology won two packages, with an estimated value of 273.6 million yuan. Jiulian Technology was shortlisted for China Mobile's GPON and 10G GPON packages, with market shares of 14.63% and 12.20%, respectively. The significance of these centralized procurements lies in the fact that operators' technology choices for home network terminals directly determine the upstream module demand structure for OEMs over the next 12 to 18 months . From a penetration rate perspective, the proportion of Wi-Fi 7 in FTTR terminals is rapidly increasing. According to IIM Information's "Global FTTR All-Optical Network Industry Outlook In-Depth Analysis Report," the proportion of FTTR terminals supporting Wi-Fi 7 is expected to reach 38.6% in 2026 , an increase of 17.2 percentage points compared to 2025. This growth rate is significant in the iteration of communication terminal technology, reflecting operators' clear willingness to invest in the evolution from "whole-house gigabit" to "whole-house Wi-Fi 7." II. Engineering Constraints of FTTR Architecture on RF Modules The core architecture of FTTR is a distributed network consisting of a main gateway and multiple sub-routers. Fiber optic backhaul solves the wired bandwidth problem between nodes, but the wireless coverage quality of each node directly determines the user's true perception of "gigabit throughout the house." This architecture imposes three engineering constraints on the radio frequency module that differ from those in a single-router scenario. First, latency consistency during multi-node handover. When users move between rooms, terminal devices need to complete roaming handovers between different sub-routers. Traditional Wi-Fi roaming mechanisms experience service interruptions on the order of 100ms during handover. For real-time applications such as video calls and online games, this interruption is sufficient to cause noticeable experience degradation. Wi-Fi 7's Multi-Link Operation (MLO) and its Enhanced Single-Radio Implementation (EMLSR) significantly reduce handover interruptions through link pre-sense and fast handover mechanisms. Huawei explicitly claims an ultra-low latency of 10ms in its Wi-Fi 7 FTTR solution . This is not just marketing hype, but a scenario-based realization of Wi-Fi 7 MLO capabilities. Second, scheduling efficiency under dense device concurrency. Modern homes typically have more than 20 devices online simultaneously, and in mid-to-high-end scenarios, this can reach over 40. While FTTR's distributed architecture expands coverage, it also means more radio frequency nodes operating in the same spectrum space, leading to increased inter-node interference and terminal scheduling complexity. Wi-Fi 7's optimized OFDMA resource scheduling and multi-link redundancy mechanisms offer far greater value in this scenario than in a single-router environment. Third, matching the fiber backhaul bandwidth. When the fiber backhaul between the FTTR main gateway and sub-routers provides 2.5Gbps or even higher bandwidth, if the wireless side still relies on Wi-Fi 6's 160MHz channel capability, it will become a bottleneck for end-to-end throughput. Wi-Fi 7's 320MHz channel and tri-band capability enable the wireless side to have the basic bandwidth supply to match the fiber backhaul. In this architecture, the role of the RF module is to transform the chip's protocol capabilities into a mass-producible, testable, and reliably deliverable RF subsystem. The chip provides "what it can do," while the module determines "how much it actually accomplishes." III. Engineering Parameters and Scenario Adaptation Analysis of O2072PM/PB The O2072PM and O2072PB modules designed by Qogrisys based on the Qualcomm QCC2072 (FastConnect C7700) platform correspond to the engineering constraints of the aforementioned FTTR/gateway scenarios in terms of parameters . In terms of RF capabilities , the O2072PM supports the IEEE 802.11be standard, 2×2 MIMO, and tri-band 2.4/5/6GHz concurrent operation. The 6GHz band channel bandwidth can reach 320MHz , achieving a peak rate of 5.8Gbps with 4096-QAM modulation . This rate level provides ample margin in current FTTR gateway designs, matching fiber backhaul bandwidth and reserving scheduling space for multi-user concurrent scenarios. In terms of latency control , the O2072PM supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) . eMLSR, in engineering terms, means that in a single-radio hardware architecture, it uses an auxiliary radio (Aux Radio) to monitor the status of multiple frequency band links, quickly switching to a backup link when the primary link encounters interference or congestion, without undergoing a complete scan-association process . Qualcomm describes Aux Radio in its technical documentation as "automatically shutting down or waking up the primary radio by monitoring the TX/RX status," while also performing low-latency background scanning to reduce the impact of scanning on throughput . For cost-sensitive and space-constrained design scenarios such as FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture. In terms of power management , the independent listening mechanism of the Aux Radio allows the main radio to enter a low-power state when idle, and is only awakened when the auxiliary radio detects a signal that needs to be transmitted or received. This mechanism has practical significance for the heat dissipation design and long-term operating power consumption of FTTR sub-routers—distributed networking means that multiple nodes are continuously online, and the cumulative effect of power consumption of a single node cannot be ignored. In terms of packaging , the O2072PM uses the M.2 2230 Key E standard interface, while the O2072PB is a 13×15mm surface-mount package . These two forms correspond to different overall hardware architectures: the M.2 interface is suitable for slot-based gateway/router products, while the surface-mount version is suitable for high-density onboard sub-routers or space-constrained FTTR slave gateways. This packaging option itself demonstrates engineering adaptability , as different OEMs' hardware platforms differ significantly in interface definitions, PCB space, and heat dissipation paths. Regarding platform compatibility , the O2072PM is compatible with Intel x86 platforms for kernel versions 5.15.24+, 6.1.99, and 6.12.0, and also has V1 compatibility with OpenWrt . This information is valuable for OEMs in their selection process: the maturity of driver compatibility directly impacts product development cycles and post-mass production stability risks . Mature compatibility with Linux platforms means that gateway solutions based on x86 or ARM Linux can complete RF subsystem debugging in a shorter time, while OpenWrt compatibility provides a foundation for customized routing/gateway products. IV. The Value Position of the Module Segment in the Industry Chain According to IIM Information's "Global and China WiFi Module Market Analysis and Survey Report," the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026 , with Wi-Fi 7 module shipments expected to climb to 17.2% , reaching approximately 234 million units for the year. IndexBox's market analysis further indicates that Wi-Fi 7 modules have a 40% to 70% price premium compared to their predecessors , and high-end modules (tri-band, 320MHz, 16+ spatial streams) are priced between US$250 and US$1500 . This pricing structure reflects an industry reality: the added value of the module segment largely depends on its "conversion efficiency" to chip capabilities . The same Wi-Fi 7 chip can exhibit significantly different RF performance, heat dissipation characteristics, power consumption curves, and driver compatibility in designs from different module manufacturers. As a carrier-grade product, FTTR gateways have higher requirements for long-term operational stability, environmental adaptability, and batch consistency than consumer-grade products. When selecting module solutions, OEMs focus not only on "Wi-Fi 7 support" but also on "whether the nominal performance can be stably reproduced under mass production conditions." From a supply chain perspective, Qualcomm's QCC2072 provides the foundational capabilities for the protocol layer as a chip platform, while module manufacturers focus on RF front-end matching, antenna design coordination, power management optimization, driver adaptation and verification, and engineering implementation for different package types. The value of this layer lies not in the chip definition stage, but in the product realization stage. V. Conclusion: Module Selection Logic in Centralized Procurement Scenarios The successful procurement of home gateways by China Telecom and China Mobile in 2026 marks the official launch of large-scale deployment of Wi-Fi 7 in operator home network terminals. The distributed architecture of FTTR and the product requirements for carriers impose engineering constraints on radio frequency modules that differ from those on consumer-grade routers. In a supply chain system driven by centralized procurement, the competitiveness of a module solution depends on the comprehensive performance of three dimensions: protocol compatibility with FTTR scenarios, hardware adaptability across multiple packaging forms, and driver maturity under the Linux/OpenWrt platform. The O2072PM's eMLSR implementation, Aux Radio power management, and tri-band 320MHz capability technically address the core needs of FTTR sub-routers and home gateways; its M.2 and surface-mount dual packaging forms cover the hardware architecture choices of different OEMs; and its Intel x86 and OpenWrt driver adaptation provides a verifiable starting point for complete system development. The transmission cycle of operator centralized procurement dictates that OEMs' module selection decisions often occur during the solution design phase before the procurement announcement. Within this time window, module solutions with a complete RF parameter system, multiple packaging options, and verifiable driver adaptation records occupy a more advantageous position in OEMs' technical evaluations .  

In the first half of 2026, China's newly connected photovoltaic (PV) capacity reached 71.77 million kilowatts, of which distributed PV accounted for 42.22 million kilowatts, or approximately 58.8%. Globally, according to the "Global and China Distributed PV System Market In-Depth Research and Consulting Analysis Report (2026)" released by IIM Information, as of the first half of 2026, the global cumulative installed capacity of distributed PV had exceeded 480 GW, with the Asia-Pacific region contributing more than 55% of the increase. It is projected that by the end of 2026, the global annual new installed capacity will reach between 98 GW and 115 GW, representing a year-on-year increase of approximately 12% . The large-scale production of distributed photovoltaics is propelling PLC (Power Line Carrier Communication) modules into a certain incremental market. This certainty stems from the convergence of three factors: mandatory policy support, the uniqueness of the technological path, and the completion of commercial validation. I. Policy-driven: Component-level safe shutdown becomes a global mandatory requirement The core application scenarios for PLC modules in the photovoltaic field are module-level rapid shutdown and module-level monitoring. These two functions are directly driven by mandatory standards in major global markets. In the North American market, NEC 2026 further revised the fast shutdown requirements of Article 690.12. According to SurgePV's NEC 2026 Fast Shutdown Compliance Guide, the 2026 version of NEC retains the existing voltage limit targets: conductors outside the array boundary must be reduced to no more than 30V within 30 seconds, and conductors inside the array boundary must be reduced to no more than 80V within 30 seconds or use certified PVHCS equipment . This means that each photovoltaic module needs to be equipped with a shutdown device with PLC communication capabilities. In the European market, the EN50065-1 standard clearly specifies communication equipment applicable to the frequency range of 3kHz to 526.5kHz on low-voltage power lines. Its typical applications include DC bus communication between photovoltaic panels and inverters in photovoltaic power generation systems. In the Chinese market, the new national standard GB/T 34932-2025 officially came into effect on April 1, 2026. Under the "four requirements" for dispatching, it mandates that new grid-connected equipment must support standard interfaces, collect data at a frequency of no less than one point every five minutes, and enforce identity authentication, data encryption, and access control. In 2026, the EU carbon tariff adjustment mechanism enters the mandatory compliance phase. Traditional inverter-level monitoring cannot meet the accuracy requirements for component-level carbon footprint tracing, making component-level power electronics and intelligent monitoring a crucial technological path for obtaining accurate carbon emission data . The core policy shift is that PLC communication modules are transforming from "optional accessories" in photovoltaic systems into "compliance necessities." Whether it's North America's rapid shutdown, Europe's module-level monitoring, or China's "four capabilities," all require reliable data communication links between module-level devices. II. Technology Adaptation: Why PLCs are Irreplaceable in Photovoltaic Applications The physical structure of a photovoltaic system dictates the choice of communication scheme. Each photovoltaic panel is connected to a DC power line, and each inverter is connected to the grid via an AC power line. PLC communication can fully reuse existing power lines for data transmission, eliminating the need for additional communication cables or wireless access points. Metal roofs and complex electromagnetic environments pose significant challenges to the reliability of wireless communication, while PLCs, using power lines as the physical medium, possess strong anti-interference capabilities. Although RS485 bus solutions offer reliable communication, they require additional communication cabling within the photovoltaic array, increasing installation costs, construction time, and potential points of failure. In photovoltaic module-level shutdown and monitoring scenarios, PLCs offer virtually no equivalent alternatives. III. Commercialization Validation: From Technology Introduction to Mass Shipment The photovoltaic PLC module market has completed the crucial leap from "technology verification" to "mass shipment. " PLC chips have achieved mass production in the photovoltaic module-level power electronics field , and module-level shutdown devices and power optimizers with built-in PLC modules are being exported in bulk to overseas markets such as Southeast Asia, and are widely used in residential and commercial distributed photovoltaic scenarios. This large-scale market achievement demonstrates that PLC communication technology has undergone long-term operational verification in the complex electromagnetic environment of the photovoltaic DC side, maintaining a high level of communication online rate . From a market perspective, each GW of photovoltaic power requires approximately 2 million photovoltaic panels. If each panel is equipped with one shutdown chip, the global annual demand exceeds 400 million panels. Currently, North America and Europe have mandated that distributed photovoltaic projects have module-level rapid shutdown capabilities. If China introduces similar mandatory standards, it will bring an even larger volume of incremental demand. IV. Photovoltaic Scenarios Solution for Qogrisys PLC Modules Qogrisys has established a clear product portfolio in the PLC module field, with both the S130N-ISI and 3121N-H modules being officially listed as recommended solutions for photovoltaic communication scenarios . S130N-ISI: A compact solution for shutdown and optimizer The S130N-ISI is based on the Leadcore VC6330 chip design, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module uses an LCC package, measuring only 20.6×12.6×2.5mm, and features an integrated on-chip wire driver, low power consumption, strong noise immunity, and an operating temperature range of -40°C to +85°C . This module supports dual communication protocols: China SGCC Q/GDW 11612 and IEEE 1901.1, and supports BPSK, QPSK, and 16QAM modulation . The S130N-ISI's ultra-small size and low power consumption make it suitable for integration into space-constrained photovoltaic (PV) shutdown devices or power optimizers. These shutdown devices are powered by the PV panels themselves and need to continuously monitor PLC signals on the power line at microwatt-level power consumption; the S130N-ISI's low-power design aligns with this requirement. 3121N-H: Multi-node networking solution for component-level monitoring The 3121N-H is developed based on the HiSilicon PS0211 chip, operating in frequency bands of 0.5-3.7MHz and 2.5-5.7MHz. The protocol is based on a subset of the IEEE 1901.1 standard, with an application layer rate of 80Kbps, and is equipped with a 200MHz ARM Cortex-M3 processor. A single CCO supports up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be formed within 10 seconds . The 3121N-H's multi-node networking capability adapts to the unified access requirements of multiple components and devices in distributed photovoltaic systems. In component-level monitoring solutions, the 3121N-H can serve as a PLC monitoring module within the component junction box, collecting voltage, current, and temperature data in real time and coupling it to the string via DC power lines. At the bus layer, this module can replace the traditional RS485 bus, enabling wireless bidirectional communication with inverters, data acquisition units, and cloud platforms. Conclusion Qogrisys has listed "new energy" as an independent application area, with its products clearly covering photovoltaic panels, photovoltaic inverters, energy storage, and charging piles. In scenarios such as smart streetlights, smart parking, and charging piles, Qogrisys's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal . Currently, Qogrisys is targeting emerging markets in Southeast Asia .