China Shenzhen Ofeixin Technology Co., Ltd Company News

I. A trillion-yuan existing market is opening up China's hotel industry has entered a stock era. Over the next three years, 732,000 rooms older than 15 years will enter a concentrated renovation cycle , with the market size already exceeding 100 billion yuan . Since 2026, the number of renovation contracts signed has already surpassed the total number for the entire previous year, and "renovation" and "rebranding" are becoming accompanying actions in the upgrading of China's hotel stock . The core challenge of renovating existing hotels lies in the need to upgrade guest rooms with smart technology while maintaining operations and minimizing disruption to guests. This places demands on the construction costs and deployment flexibility of communication technologies far exceeding those of new projects. II . Market Trends The smart hotel market is currently experiencing a period of structural expansion. Market research firms predict that the global smart hotel market will grow to US$90.46 billion by 2032 , representing a compound annual growth rate of 14.20% . The Asia-Pacific region is the fastest-growing area, driven by high smartphone penetration, urban tourism expansion, and large-scale hotel modernization . In terms of connectivity technology, PLCs are transforming from a "supplement to wireless solutions" to a "connection base for hotel guest room control ." This judgment is based not only on Lihe Micro's implementation data but also on changes in the competitive landscape: Honeywell's INNCOM FLEX intelligent hotel guest room control system, released in September 2026, explicitly supports "wired and wireless dual deployment solutions" and is compatible with mainstream building protocols such as BACnet IP and Modbus TCP, reflecting the leading building automation manufacturers' recognition of the "multi-protocol compatibility and open deployment" approach . III . The Dilemma Between Wired and Wireless Traditional hotel guest room control systems face a structural dilemma. Wired solutions (RS-485 bus, TCP/IP Ethernet) offer stable and reliable communication with strong anti-interference capabilities and no data packet loss issues, but require the laying of dedicated communication cables. In existing renovation scenarios, this means trenching, ceiling removal, and wall repair, resulting in long construction periods and often requiring closure or phased construction, significantly impacting hotel operations . This type of solution is more suitable for new construction or complete renovation of high-end hotels . Wireless solutions (Bluetooth Mesh, Zigbee, Wi-Fi) offer flexible deployment options, requiring only the laying of power lines, making them cost-effective and easy to install in converted hotels . However, wireless signals face challenges in complex hotel structures, such as wall attenuation, metal cabinet obstruction, and co-channel interference, resulting in weaker communication stability compared to wired methods. Furthermore, the location of the equipment significantly impacts signal quality . No single technological approach can simultaneously meet the dual requirements of "uninterrupted transformation" and "highly reliable communication." What the industry needs is a third path. IV . PLC: Resolving the conflict between "existing power lines" and "new wiring". The core logic of PLC (Power Line Carrier Communication) differs fundamentally from traditional solutions. Wireless solutions rely on electromagnetic wave propagation, and signals experience significant attenuation when passing through load-bearing concrete walls and metal structures. In contrast, PLC uses the building's existing 220V/380V power lines as the data transmission medium. Signals travel along the power lines and are unaffected by physical obstructions from walls, floors, or metal structures—as long as the circuit is powered, the communication link remains stable . Real-world test data supports these technical characteristics: PLC-IoT end-to-end response latency is consistently below 50 milliseconds , and the communication success rate is nominally as high as 99.99% ; a single host can support 128–384 device nodes; academic research confirms that PLC-IoT has comprehensive advantages over ZigBee and KNX technologies in terms of stability, cost-effectiveness, and anti-interference capabilities . For hotel renovation projects, the most valuable feature of PLCs is that they eliminate the need for wiring. V. Open ecosystems are replacing closed solutions The accelerated adoption of PLC technology in the hotel industry also benefits from the industry's reflection on "closed-loop guest room control solutions". Currently, most hotel smart guest room control projects adopt closed-loop solutions, with hotel systems, equipment, and platforms highly dependent on a single supplier. If a vendor experiences operational or technical issues, the entire guest room control system may be paralyzed. Furthermore, incompatible communication protocols between gateway devices from different brands prevent interoperability and hinder system expansion, resulting in persistently high costs for subsequent hotel upgrades, maintenance, and iterations . Based on a unified protocol standard, the PLCP ecosystem brings together products such as switch panels, light drivers, curtain motors, and temperature control panels from numerous equipment manufacturers. Hotels can flexibly select from multiple brands and categories, eliminating the supply chain risks of "one vendor monopolizing" products. This trend offers a clear message for module manufacturers: hotel customers are no longer simply buying "a gateway + a set of equipment," but are looking for "a standard + an ecosystem." As the underlying communication layer, modules need to be compatible with mainstream protocol stacks. VI . PLC module slots of Qogrisys Shenzhen Ofeixin Technology Co., Ltd. has developed two core module products for hotel scenarios in the PLC field. The 3121N-H (based on the HiSilicon Hi3121S) is based on a subset of the IEEE 1901.1 standard. A single CCO supports up to 200 STA nodes , dynamic routing, and automatic multi-path addressing. A typical 200-node, two-tier network can be set up within 10 seconds . The module size is 23.5×30mm, integrating built-in line drivers and onboard coupling circuitry, and providing interfaces such as UART, PWM, GPIO, I2C, and ADC. Qogrisys has also designed an integrated PLC + power supply kit with a built-in conversion transformer for direct connection to 220V bidirectional AC power, facilitating rapid product adoption by customer control solution providers . The S130N-ISI (based on the Leadcore VC6330) uses an LCC package, measuring only 20.6×12.6mm , making its ultra-miniaturized design suitable for space-constrained hotel panel devices. It integrates a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor, supporting both China SGCC Q/GDW 11612 and IEEE 1901.1 protocols . The Leadcore VC6330 chip achieves an application-layer communication rate of up to 1Mbps, with a 99.99% communication success rate in actual projects and a Level 1 network communication latency of

I. Centralized Procurement Signal: The Iteration of Wi-Fi 7 for Home Gateways Enters Substantive Stage The centralized procurement of home network terminals completed by China Telecom and China Mobile in 2026 sends a clear signal to the industry: the role of Wi-Fi 7 in operators' home gateways and FTTR products is shifting from "flagship configuration" to "mainstream configuration" .   In China Mobile's 2026-2027 smart home gateway centralized procurement, Tianyi Technology was shortlisted as the third successful bidder for Package 1 and the sixth successful bidder for Package 2, with an estimated value of 208 million yuan. In China Telecom's FTTR centralized procurement, Tianyi Technology won two packages, with an estimated value of 273.6 million yuan. Jiulian Technology was shortlisted for China Mobile's GPON and 10G GPON packages, with market shares of 14.63% and 12.20%, respectively. The significance of these centralized procurements lies in the fact that operators' technology choices for home network terminals directly determine the upstream module demand structure for OEMs over the next 12 to 18 months . From a penetration rate perspective, the proportion of Wi-Fi 7 in FTTR terminals is rapidly increasing. According to IIM Information's "Global FTTR All-Optical Network Industry Outlook In-Depth Analysis Report," the proportion of FTTR terminals supporting Wi-Fi 7 is expected to reach 38.6% in 2026 , an increase of 17.2 percentage points compared to 2025. This growth rate is significant in the iteration of communication terminal technology, reflecting operators' clear willingness to invest in the evolution from "whole-house gigabit" to "whole-house Wi-Fi 7." II. Engineering Constraints of FTTR Architecture on RF Modules The core architecture of FTTR is a distributed network consisting of a main gateway and multiple sub-routers. Fiber optic backhaul solves the wired bandwidth problem between nodes, but the wireless coverage quality of each node directly determines the user's true perception of "gigabit throughout the house." This architecture imposes three engineering constraints on the radio frequency module that differ from those in a single-router scenario. First, latency consistency during multi-node handover. When users move between rooms, terminal devices need to complete roaming handovers between different sub-routers. Traditional Wi-Fi roaming mechanisms experience service interruptions on the order of 100ms during handover. For real-time applications such as video calls and online games, this interruption is sufficient to cause noticeable experience degradation. Wi-Fi 7's Multi-Link Operation (MLO) and its Enhanced Single-Radio Implementation (EMLSR) significantly reduce handover interruptions through link pre-sense and fast handover mechanisms. Huawei explicitly claims an ultra-low latency of 10ms in its Wi-Fi 7 FTTR solution . This is not just marketing hype, but a scenario-based realization of Wi-Fi 7 MLO capabilities. Second, scheduling efficiency under dense device concurrency. Modern homes typically have more than 20 devices online simultaneously, and in mid-to-high-end scenarios, this can reach over 40. While FTTR's distributed architecture expands coverage, it also means more radio frequency nodes operating in the same spectrum space, leading to increased inter-node interference and terminal scheduling complexity. Wi-Fi 7's optimized OFDMA resource scheduling and multi-link redundancy mechanisms offer far greater value in this scenario than in a single-router environment. Third, matching the fiber backhaul bandwidth. When the fiber backhaul between the FTTR main gateway and sub-routers provides 2.5Gbps or even higher bandwidth, if the wireless side still relies on Wi-Fi 6's 160MHz channel capability, it will become a bottleneck for end-to-end throughput. Wi-Fi 7's 320MHz channel and tri-band capability enable the wireless side to have the basic bandwidth supply to match the fiber backhaul. In this architecture, the role of the RF module is to transform the chip's protocol capabilities into a mass-producible, testable, and reliably deliverable RF subsystem. The chip provides "what it can do," while the module determines "how much it actually accomplishes." III. Engineering Parameters and Scenario Adaptation Analysis of O2072PM/PB The O2072PM and O2072PB modules designed by Qogrisys based on the Qualcomm QCC2072 (FastConnect C7700) platform correspond to the engineering constraints of the aforementioned FTTR/gateway scenarios in terms of parameters . In terms of RF capabilities , the O2072PM supports the IEEE 802.11be standard, 2×2 MIMO, and tri-band 2.4/5/6GHz concurrent operation. The 6GHz band channel bandwidth can reach 320MHz , achieving a peak rate of 5.8Gbps with 4096-QAM modulation . This rate level provides ample margin in current FTTR gateway designs, matching fiber backhaul bandwidth and reserving scheduling space for multi-user concurrent scenarios. In terms of latency control , the O2072PM supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) . eMLSR, in engineering terms, means that in a single-radio hardware architecture, it uses an auxiliary radio (Aux Radio) to monitor the status of multiple frequency band links, quickly switching to a backup link when the primary link encounters interference or congestion, without undergoing a complete scan-association process . Qualcomm describes Aux Radio in its technical documentation as "automatically shutting down or waking up the primary radio by monitoring the TX/RX status," while also performing low-latency background scanning to reduce the impact of scanning on throughput . For cost-sensitive and space-constrained design scenarios such as FTTR sub-routers, eMLSR provides a feasible path to achieve near-multi-radio latency performance on a single-radio architecture. In terms of power management , the independent listening mechanism of the Aux Radio allows the main radio to enter a low-power state when idle, and is only awakened when the auxiliary radio detects a signal that needs to be transmitted or received. This mechanism has practical significance for the heat dissipation design and long-term operating power consumption of FTTR sub-routers—distributed networking means that multiple nodes are continuously online, and the cumulative effect of power consumption of a single node cannot be ignored. In terms of packaging , the O2072PM uses the M.2 2230 Key E standard interface, while the O2072PB is a 13×15mm surface-mount package . These two forms correspond to different overall hardware architectures: the M.2 interface is suitable for slot-based gateway/router products, while the surface-mount version is suitable for high-density onboard sub-routers or space-constrained FTTR slave gateways. This packaging option itself demonstrates engineering adaptability , as different OEMs' hardware platforms differ significantly in interface definitions, PCB space, and heat dissipation paths. Regarding platform compatibility , the O2072PM is compatible with Intel x86 platforms for kernel versions 5.15.24+, 6.1.99, and 6.12.0, and also has V1 compatibility with OpenWrt . This information is valuable for OEMs in their selection process: the maturity of driver compatibility directly impacts product development cycles and post-mass production stability risks . Mature compatibility with Linux platforms means that gateway solutions based on x86 or ARM Linux can complete RF subsystem debugging in a shorter time, while OpenWrt compatibility provides a foundation for customized routing/gateway products. IV. The Value Position of the Module Segment in the Industry Chain According to IIM Information's "Global and China WiFi Module Market Analysis and Survey Report," the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026 , with Wi-Fi 7 module shipments expected to climb to 17.2% , reaching approximately 234 million units for the year. IndexBox's market analysis further indicates that Wi-Fi 7 modules have a 40% to 70% price premium compared to their predecessors , and high-end modules (tri-band, 320MHz, 16+ spatial streams) are priced between US$250 and US$1500 . This pricing structure reflects an industry reality: the added value of the module segment largely depends on its "conversion efficiency" to chip capabilities . The same Wi-Fi 7 chip can exhibit significantly different RF performance, heat dissipation characteristics, power consumption curves, and driver compatibility in designs from different module manufacturers. As a carrier-grade product, FTTR gateways have higher requirements for long-term operational stability, environmental adaptability, and batch consistency than consumer-grade products. When selecting module solutions, OEMs focus not only on "Wi-Fi 7 support" but also on "whether the nominal performance can be stably reproduced under mass production conditions." From a supply chain perspective, Qualcomm's QCC2072 provides the foundational capabilities for the protocol layer as a chip platform, while module manufacturers focus on RF front-end matching, antenna design coordination, power management optimization, driver adaptation and verification, and engineering implementation for different package types. The value of this layer lies not in the chip definition stage, but in the product realization stage. V. Conclusion: Module Selection Logic in Centralized Procurement Scenarios The successful procurement of home gateways by China Telecom and China Mobile in 2026 marks the official launch of large-scale deployment of Wi-Fi 7 in operator home network terminals. The distributed architecture of FTTR and the product requirements for carriers impose engineering constraints on radio frequency modules that differ from those on consumer-grade routers. In a supply chain system driven by centralized procurement, the competitiveness of a module solution depends on the comprehensive performance of three dimensions: protocol compatibility with FTTR scenarios, hardware adaptability across multiple packaging forms, and driver maturity under the Linux/OpenWrt platform. The O2072PM's eMLSR implementation, Aux Radio power management, and tri-band 320MHz capability technically address the core needs of FTTR sub-routers and home gateways; its M.2 and surface-mount dual packaging forms cover the hardware architecture choices of different OEMs; and its Intel x86 and OpenWrt driver adaptation provides a verifiable starting point for complete system development. The transmission cycle of operator centralized procurement dictates that OEMs' module selection decisions often occur during the solution design phase before the procurement announcement. Within this time window, module solutions with a complete RF parameter system, multiple packaging options, and verifiable driver adaptation records occupy a more advantageous position in OEMs' technical evaluations .  

In the first half of 2026, China's newly connected photovoltaic (PV) capacity reached 71.77 million kilowatts, of which distributed PV accounted for 42.22 million kilowatts, or approximately 58.8%. Globally, according to the "Global and China Distributed PV System Market In-Depth Research and Consulting Analysis Report (2026)" released by IIM Information, as of the first half of 2026, the global cumulative installed capacity of distributed PV had exceeded 480 GW, with the Asia-Pacific region contributing more than 55% of the increase. It is projected that by the end of 2026, the global annual new installed capacity will reach between 98 GW and 115 GW, representing a year-on-year increase of approximately 12% . The large-scale production of distributed photovoltaics is propelling PLC (Power Line Carrier Communication) modules into a certain incremental market. This certainty stems from the convergence of three factors: mandatory policy support, the uniqueness of the technological path, and the completion of commercial validation. I. Policy-driven: Component-level safe shutdown becomes a global mandatory requirement The core application scenarios for PLC modules in the photovoltaic field are module-level rapid shutdown and module-level monitoring. These two functions are directly driven by mandatory standards in major global markets. In the North American market, NEC 2026 further revised the fast shutdown requirements of Article 690.12. According to SurgePV's NEC 2026 Fast Shutdown Compliance Guide, the 2026 version of NEC retains the existing voltage limit targets: conductors outside the array boundary must be reduced to no more than 30V within 30 seconds, and conductors inside the array boundary must be reduced to no more than 80V within 30 seconds or use certified PVHCS equipment . This means that each photovoltaic module needs to be equipped with a shutdown device with PLC communication capabilities. In the European market, the EN50065-1 standard clearly specifies communication equipment applicable to the frequency range of 3kHz to 526.5kHz on low-voltage power lines. Its typical applications include DC bus communication between photovoltaic panels and inverters in photovoltaic power generation systems. In the Chinese market, the new national standard GB/T 34932-2025 officially came into effect on April 1, 2026. Under the "four requirements" for dispatching, it mandates that new grid-connected equipment must support standard interfaces, collect data at a frequency of no less than one point every five minutes, and enforce identity authentication, data encryption, and access control. In 2026, the EU carbon tariff adjustment mechanism enters the mandatory compliance phase. Traditional inverter-level monitoring cannot meet the accuracy requirements for component-level carbon footprint tracing, making component-level power electronics and intelligent monitoring a crucial technological path for obtaining accurate carbon emission data . The core policy shift is that PLC communication modules are transforming from "optional accessories" in photovoltaic systems into "compliance necessities." Whether it's North America's rapid shutdown, Europe's module-level monitoring, or China's "four capabilities," all require reliable data communication links between module-level devices. II. Technology Adaptation: Why PLCs are Irreplaceable in Photovoltaic Applications The physical structure of a photovoltaic system dictates the choice of communication scheme. Each photovoltaic panel is connected to a DC power line, and each inverter is connected to the grid via an AC power line. PLC communication can fully reuse existing power lines for data transmission, eliminating the need for additional communication cables or wireless access points. Metal roofs and complex electromagnetic environments pose significant challenges to the reliability of wireless communication, while PLCs, using power lines as the physical medium, possess strong anti-interference capabilities. Although RS485 bus solutions offer reliable communication, they require additional communication cabling within the photovoltaic array, increasing installation costs, construction time, and potential points of failure. In photovoltaic module-level shutdown and monitoring scenarios, PLCs offer virtually no equivalent alternatives. III. Commercialization Validation: From Technology Introduction to Mass Shipment The photovoltaic PLC module market has completed the crucial leap from "technology verification" to "mass shipment. " PLC chips have achieved mass production in the photovoltaic module-level power electronics field , and module-level shutdown devices and power optimizers with built-in PLC modules are being exported in bulk to overseas markets such as Southeast Asia, and are widely used in residential and commercial distributed photovoltaic scenarios. This large-scale market achievement demonstrates that PLC communication technology has undergone long-term operational verification in the complex electromagnetic environment of the photovoltaic DC side, maintaining a high level of communication online rate . From a market perspective, each GW of photovoltaic power requires approximately 2 million photovoltaic panels. If each panel is equipped with one shutdown chip, the global annual demand exceeds 400 million panels. Currently, North America and Europe have mandated that distributed photovoltaic projects have module-level rapid shutdown capabilities. If China introduces similar mandatory standards, it will bring an even larger volume of incremental demand. IV. Photovoltaic Scenarios Solution for Qogrisys PLC Modules Qogrisys has established a clear product portfolio in the PLC module field, with both the S130N-ISI and 3121N-H modules being officially listed as recommended solutions for photovoltaic communication scenarios . S130N-ISI: A compact solution for shutdown and optimizer The S130N-ISI is based on the Leadcore VC6330 chip design, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module uses an LCC package, measuring only 20.6×12.6×2.5mm, and features an integrated on-chip wire driver, low power consumption, strong noise immunity, and an operating temperature range of -40°C to +85°C . This module supports dual communication protocols: China SGCC Q/GDW 11612 and IEEE 1901.1, and supports BPSK, QPSK, and 16QAM modulation . The S130N-ISI's ultra-small size and low power consumption make it suitable for integration into space-constrained photovoltaic (PV) shutdown devices or power optimizers. These shutdown devices are powered by the PV panels themselves and need to continuously monitor PLC signals on the power line at microwatt-level power consumption; the S130N-ISI's low-power design aligns with this requirement. 3121N-H: Multi-node networking solution for component-level monitoring The 3121N-H is developed based on the HiSilicon PS0211 chip, operating in frequency bands of 0.5-3.7MHz and 2.5-5.7MHz. The protocol is based on a subset of the IEEE 1901.1 standard, with an application layer rate of 80Kbps, and is equipped with a 200MHz ARM Cortex-M3 processor. A single CCO supports up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be formed within 10 seconds . The 3121N-H's multi-node networking capability adapts to the unified access requirements of multiple components and devices in distributed photovoltaic systems. In component-level monitoring solutions, the 3121N-H can serve as a PLC monitoring module within the component junction box, collecting voltage, current, and temperature data in real time and coupling it to the string via DC power lines. At the bus layer, this module can replace the traditional RS485 bus, enabling wireless bidirectional communication with inverters, data acquisition units, and cloud platforms. Conclusion Qogrisys has listed "new energy" as an independent application area, with its products clearly covering photovoltaic panels, photovoltaic inverters, energy storage, and charging piles. In scenarios such as smart streetlights, smart parking, and charging piles, Qogrisys's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal . Currently, Qogrisys is targeting emerging markets in Southeast Asia .    

9th to 11th, 2026 , the 27th China International Optoelectronic Exposition (CIOE), in conjunction with the IICIE International Integrated Circuit Innovation Expo and Elexcon Shenzhen International Electronics Exhibition & Embedded Systems Exhibition, will be held concurrently at the Shenzhen World Exhibition & Convention Center. The three exhibitions will be held together, covering a total exhibition area of 320,000 square meters, bringing together more than 5,000 exhibitors and attracting over 240,000 professional visitors . This is a grand industry event covering the entire optoelectronics, semiconductor, and electronics industry chain.   For the Wi-Fi module industry, this exhibition sent a clear signal: the value proposition of Wi-Fi 7 modules is undergoing a fundamental shift—from providing "high-speed connectivity channels" to becoming "industrial-grade intelligent nodes" that integrate sensing, positioning, and edge intelligence. The Industry Logic Revealed by the Collaboration of Three Exhibitions: Why "Sensory Integration" Has Become a Must-Answer Question The essence of the three exhibitions working together is a forced "alignment" of the upstream and downstream of the industry chain. In the past, the optoelectronic industry focused on optical chips and devices, the semiconductor industry focused on chip design and advanced packaging, and the electronics industry focused on the development of terminal equipment and embedded systems. The three major industry systems were fragmented, with different technical standards and poor supply and demand matching, forming obvious industry barriers . The rapid popularization of large-scale AI models and supercomputing clusters has changed this landscape. The industry's demand for ultra-high bandwidth, ultra-low power consumption, and ultra-high integration has increased significantly. The previously independent industry boundaries have been completely broken down. Optical engines and switching chips are deeply integrated, and optoelectronic devices are directly embedded inside chip packages, forcing optical design, semiconductor processes, advanced packaging, and electronic systems to develop in a coordinated manner . This trend is particularly evident in the Wi-Fi module industry. Wi-Fi 7 is not only a generational upgrade in communication speed, but also provides a technological foundation for "integrated communication and sensing" due to its introduction of Multi-Link Operation (MLO), 320MHz channels, and fine-grained timing measurement capabilities. The China Academy of Information and Communications Technology (CAICT) explicitly proposed in its research report on 10 Gigabit AI Park Networks that wireless access points should be upgraded to "integrated communication and sensing" anchor points, natively integrating IoT access, environmental perception, and terminal positioning capabilities to break the data silos and protocol fragmentation dilemmas caused by traditional siloed network construction. The competitive logic in the module industry has therefore undergone a qualitative change: connectivity itself is "depreciating," and "intelligent connectivity" that integrates perception and edge intelligence is the new pricing power. The triple capability leap of Wi-Fi 7 modules The "integration" of Wi-Fi 7 modules is not a functional aggregation, but rather a fusion of capabilities at the underlying chip architecture level. Solutions represented by Qualcomm FastConnect C7700 (chip code name QCC2072) integrate three capabilities that previously belonged to different radio frequency domains on a single chip. The first capability: an industrial-grade leap in Wi-Fi 7 communication performance. The QCC2072 supports 320MHz channel bandwidth, 4096-QAM modulation, and 2×2 MU-MIMO, achieving a peak PHY rate of 5.8 Gbps . Its introduced Enhanced Multi-Link Single Radio (eMLSR) technology allows data to be transmitted through other links when interference occurs in a certain frequency band, effectively maintaining high throughput and low latency . This is crucial for deterministic transmission requirements in industrial environments. The second capability: Wi-Fi sensing and high-precision positioning. This chip solution supports IEEE 802.11az Wi-Fi ranging. 802.11az uses Time-of-Flight (ToF) technology to measure the actual distance between the device and the access point, replacing the traditional RSSI fingerprint comparison method, achieving sub-meter positioning accuracy of less than 1 meter. In industrial scenarios, this means that the Wi-Fi module can not only transmit data but also accurately sense the device's location and spatial status. The third capability: Bluetooth 6.0 Channel Sounding and Aux Radio. Bluetooth 6.0 introduces Channel Sounding technology, improving Bluetooth positioning accuracy to sub-meter levels . Simultaneously, this solution is equipped with a dedicated Wi-Fi Aux Radio for background scanning and low-latency listening while the main radio is in sleep mode, balancing power consumption and response speed . The integration of these three capabilities enables a single Wi-Fi 7 module to possess integrated "communication + sensing + positioning" capabilities for the first time. VOXMICRO's AIRETOS C27 industrial-grade module is a typical example of this architecture. It integrates capabilities that were previously belonging to three independent radio frequency domains into a single module package, enabling industrial OEMs to shift their design goals from "adding a radio" to "accomplishing more tasks with a single industrial-grade module" . Market data: The inflection point for the large-scale deployment of Wi-Fi 7 modules has arrived. The global Wi-Fi module market is currently experiencing a period of structural growth. According to market research reports, the global Wi-Fi module market size is projected to reach US$16.82 billion in 2026, a 17.9% increase from US$14.27 billion in 2025. Among these, Wi-Fi 7 modules are rapidly increasing their market share to 17.2%, with projected shipments reaching 234 million units for the year . From a broader perspective, the global Wi-Fi 7 module market was valued at $3.8 billion in 2025 and is projected to reach $22.6 billion by 2034, representing a CAGR of 21.9% . The Wi-Fi Alliance predicts that global shipments of Wi-Fi 7 devices will reach approximately 1.1 billion units in 2026, of which approximately 196 million will be IoT devices. The Industrial Internet of Things (IIoT) is one of the fastest-growing sub-sectors. Global demand for IIoT modules is projected to reach $9.81 billion, with an annual growth rate of 17.8% . The reliability requirements of industrial applications—wide operating temperature range, interference resistance, and deterministic low latency—are driving the accelerated evolution of Wi-Fi 7 modules from consumer to industrial applications. Qogrisys early strategic moves: from chip solutions to module productization O2072PM and O2072PB, launched simultaneously by O2072 with the QCC2072 chip, is not simply an expansion of the product line, but rather an engineering choice for different deployment scenarios. The O2072PM uses an M.2 Key E standard interface (2230 specification), a 2T2R dual-antenna design, and supports both Wi-Fi and Bluetooth operation. This module incorporates all the functions of the QCC2072: the Wi-Fi portion covers the full IEEE 802.11a/b/g/n/ac/ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with a channel bandwidth of up to 40 MHz at 2.4 GHz, 160 MHz at 5 GHz, and 320 MHz at 6 GHz. The Bluetooth portion is compatible with Bluetooth 6.0, supporting LE Audio, 2 Mbps BLE, and high-precision distance measurement (HADM channel sounding) . In terms of driver adaptation, the O2072PM has been adapted and is running stably on Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB uses a 13×15mm surface mount package, targeting space-constrained embedded scenarios. Its core functions are identical to the O2072PM, also supporting a peak data rate of 5.8 Gbps, a 320MHz channel, 4K QAM modulation, Bluetooth 6.0 channel detection, and 802.11az Wi-Fi ranging . The O2072PB explicitly supports various operating modes including AP/AP+STA/P2P/Monitor, providing a PCIe interface for Wi-Fi and a UART/PCM interface for Bluetooth, supporting Class 1 and Class 2 power level transmission without the need for an external power amplifier . The differentiated positioning of the two modules reflects a profound change in the module industry: as chip capabilities become highly integrated, the core competitiveness of module manufacturers is shifting from "how much throughput can be achieved" to "whether the full capabilities of the chip can be efficiently released under specific physical constraints." The M.2 interface module targets industrial PCs, gateways, and edge computing devices that require standard slots and replaceable designs; the surface-mount module targets embedded terminals with extremely limited PCB space, requiring module manufacturers to possess more refined engineering capabilities in RF design, antenna matching, and thermal management. Validation in industrial scenarios: from technical feasibility to deployment Wi-Fi 7 sensing technology is being practically validated in industrial scenarios. In the mining sector, Shanxi Coal International's Hequ Open-pit Coal Mine's pilot project of a 10-gigabit optical network based on 50G-PON + Wi-Fi 7 has passed the Ministry of Industry and Information Technology's acceptance test. Fifty-seven Wi-Fi 7 gateways have been deployed in the core area, allowing dispatchers to remotely control unmanned mining trucks several kilometers away via Wi-Fi 7 tablets. In the field of smart buildings, the Longgang International Art Center uses Wi-Fi 7 + CSI sensing technology to accurately detect the presence of people, achieving a reduction of over 15% in venue energy consumption and a 30% improvement in operation and maintenance efficiency . These cases share a common characteristic: Wi-Fi networks are no longer just for data transmission, but have also become the infrastructure for environmental sensing and spatial positioning. For the module industry, this means that downstream customers' needs are upgrading from "providing stable wireless connectivity" to "providing integrated capabilities that converge connectivity, sensing, and positioning." Conclusion The industry landscape revealed by the three exhibitions is clear and definite: the demand for AI computing power is driving the deep integration of the optoelectronics, semiconductor, and embedded electronics industries, and Wi-Fi 7 modules are at the intersection of this integration. The shift from "high-speed connectivity" to "integrated sensing" is not just a product iteration, but a systemic reconstruction of the value proposition of the module industry. For Wi-Fi module manufacturers, their ability to establish competitive advantages in chip solution integration, cross-platform adaptation, and industrial-grade reliability will determine their position in the new industry cycle. However, the real test lies in whether module manufacturers can continue to efficiently translate chip capabilities into deployable industrial-grade products as "integrated sensing" transitions from a technological trend to an industry standard.  

I. The "Impossible Triangle" of IoT Terminals With the rapid iteration of IoT terminals, more and more devices are moving towards miniaturization and battery power, while products are facing design challenges such as limited PCB space, insufficient battery life, and unstable wireless connectivity . This is not an isolated phenomenon in a particular sub-sector, but rather a systemic challenge facing the entire Internet of Things (IoT) industry. In 2026, global shipments of wireless modules reached 870 million units, with a market size exceeding US$41.2 billion. By 2030, global shipments are projected to climb to 1.52 billion units, with a CAGR of 11.8%, and the market size is expected to reach US$79.8 billion. During the same period, the number of connected IoT devices worldwide is expected to exceed 39 billion. This explosive growth in device numbers is amplifying the challenges of every design dimension into key factors determining product success or failure. Small size, low power consumption, and high stability—these three requirements are forming the "impossible triangle" in IoT terminal design. In traditional solutions, these three often constrain each other: pursuing small size limits antenna performance, pursuing low power consumption sacrifices transmission rate, and pursuing stability increases power consumption and size. Finding a balance among these three has become a core issue for module solution providers. II. Challenge 1: Extremely tight PCB space Industrial driving force of space compression From smart rings and TWS earphones to micro sensors and smart locks, the physical space of terminal devices is being continuously compressed. The micro battery market is projected to grow from $1.59 billion in 2025 to $1.81 billion in 2026, representing a CAGR of 13.5%. This rapid growth in the micro battery market is a direct reflection of the trend towards device miniaturization —the smaller the device, the higher the requirements for battery volume and energy density. One of the most challenging problems faced by hardware engineers is achieving high-density, high-stability electrical connections between the daughterboard and the motherboard under extremely limited overall device thickness and PCB space. As an indispensable radio frequency component in the device, the footprint of the wireless module directly determines the feasibility of the overall device layout. Solution path for miniaturized modules The industry is addressing the spatial challenges from multiple perspectives. The O9101SA module from Qogrisys has compressed its size to 12×12mm , while supporting dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps . This size is among the industry-leading levels for Wi-Fi 6 + Bluetooth Combo modules. This extreme size reduction not only allows for more space to be packed in, but also frees up valuable PCB space for other components such as the battery, sensors, and main control chip – the smaller module footprint allows for more storage . Multi-protocol single-chip integration is another key path. Two independent modules, plus their respective peripheral circuits and antenna clearance, occupy a much larger PCB area than a single multi-protocol integrated module. In small-sized products such as smart bulbs and panel switches, this area is the biggest limiting factor. The Wi-Fi/Bluetooth Combo solution fundamentally reduces PCB footprint by integrating the two protocols into a single chip. The area occupied by antennas is also significant. Traditional antenna implementations consume 15%-25% of the total PCB area in mobile devices and IoT applications. The emergence of antenna-in-package (AiP) technology integrates the antenna into the module package, achieving space savings of 40%-60% . Challenge 2: Severely Inadequate Battery Life The Economics of Range Anxiety For battery-powered IoT devices, battery life is not a "nice-to-have" but a "life-or-death" issue. The global IoT battery market was valued at $15.9 billion in 2024 and is projected to grow to $36.88 billion by 2033, representing a CAGR of 9.8%. This continued expansion reflects the rigid demand from end devices for longer battery life. The operational lifespan of battery-powered nodes directly impacts maintenance costs and deployment scalability . The industrial value of low power consumption technology The low-power Wi-Fi module market is projected to reach $4.142 billion in 2025 and $11.79 billion in 2032, representing a CAGR of 16.4%. The BLE module market is expected to grow to $68.27 billion in 2032, with a CAGR of 13.80%. The robust growth of these two segments confirms that low power consumption has become one of the most crucial competitive dimensions in the module industry. IV. Challenge 3: Unstable wireless connection Crowded 2.4GHz and limited antennas The root cause of unstable wireless connections lies in two structural contradictions. The first problem is frequency congestion. The 2.4GHz ISM band is shared by multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, resulting in severe co-channel interference. In high-density deployment scenarios such as smart homes and offices, signal conflicts and data rate degradation are commonplace. The second contradiction is the limitation of antenna performance. Device miniaturization means that the available space for the antenna is compressed, and the antenna efficiency and bandwidth decrease accordingly. There is an inherent physical constraint between radio frequency performance and device size —the smaller the antenna size, the lower the radiation efficiency, and the worse the communication distance and stability. V. Qogrisys Systemic Solutions To address the aforementioned triple design challenges, QOGRISYS offers a comprehensive product portfolio, providing end-to-end solutions from chips to modules and from hardware to software. Extremely Miniaturized Product Matrix Qogrisys has achieved complete coverage in the field of small-sized modules, from Wi-Fi 6 to Wi-Fi 5, and from Combo to single Wi-Fi. The O9101SA boasts a compact size of 12×12mm , supports dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps, and utilizes an SDIO 3.0 interface . It supports a 2.4GHz/5GHz dual-band simultaneous (DBS) architecture , uplink/downlink MU-OFDMA and MU-MIMO, and BT/BLE dual-mode operation . The O9101SA, along with the O9101UE and O9101UD, belongs to the Oufixin 1×1 Wi-Fi 6 module series developed based on the WQ9101 chip . The O9101UE measures 13×12.2mm and uses a USB 2.0 interface; the O9201SB measures only 13×15mm, is also based on the WQ9201 chip, and offers speeds up to 1200Mbps. The O9201UB shares the same platform as the O9201SB and uses a USB 2.0 interface. The O8852PB measures 13×15mm, is based on the Realtek RTL8852BE chip, supports Wi-Fi 6 and Bluetooth 5.2 with a speed of 1200Mbps, and uses a PCIe interface. For scenarios with stricter space constraints, the small size of these modules is particularly advantageous. The smaller module footprint frees up valuable PCB space for other components such as the battery, sensors, and main control chip. Low-power design: Co-optimization from chip to system Qogrisys's low-power capability stems primarily from the selection and deep collaboration with upstream chips. The Wuqi WQ9201 chip, with its stable transmission performance and internationally leading low-power consumption , stood out from 364 products from 280 chip companies, winning the 2024 "China Chip" Excellent Technological Innovation Product Award. Interference Resistance and Stable Connection: Breakthrough Technologies in Dual-Band and Multi-Protocol Integration O9201SB, O9101UE , and O8852PB all support 2.4GHz/5GHz dual-band Wi-Fi 6. The core value of the dual-band architecture lies in "selectivity"—when the 2.4GHz band becomes congested due to the coexistence of protocols such as Bluetooth and Zigbee, the device can switch to the 5GHz band to ensure transmission speed and connection stability. Dual-band Wi-Fi 6 also brings core technologies such as OFDMA and MU-MIMO, improving spectrum utilization efficiency in scenarios with multiple concurrent devices. In high-density deployment environments such as smart homes and offices, these technologies directly translate into improved user experience—lower latency, fewer dropped connections, and more stable connections. Multi-protocol integration is another approach. A single module can simultaneously support multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, and can intelligently select the best connection method according to the environment, flexibly switching between different scenarios. VI. Industry Outlook: From "Usable" to "Effective" Looking ahead to 2026-2032, the design trend for small-size, low-power modules will continue to evolve along the following directions: First, the limits of size will continue to be broken . The competition for module size is far from over, and the approach of physical limits is forcing continuous innovation in packaging technology. Secondly, low power consumption will shift from a "feature" to a "standard feature." QYResearch data shows that the low-power Wi-Fi module market will continue to expand at a compound annual growth rate of 16.4%. Low power consumption will no longer be a differentiating selling point for high-end modules, but rather a basic requirement for all module products. Third, multi-protocol integration, miniaturization, and low power consumption will be deeply intertwined. Integrating multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread onto a single chip is a fundamental solution to the space and power consumption issues. The widespread adoption of the Matter protocol will further strengthen this trend— future modules will no longer require users to "select" protocols, but will automatically adapt to the optimal connectivity solution based on the environment and application. Fourth, module selection is evolving from "component procurement" to "strategic decision-making." Under the dual constraints of miniaturization and low power consumption, module selection is no longer merely a comparison of technical parameters, but a strategic choice concerning product definition, development cycle, and time-to-market. A suitable module solution can compress the development cycle from months to weeks and simplify a four-layer PCB to a two-layer PCB .  

By 2026, edge AI will no longer be a concept that needs to be "defined," but a reality that is being "quantified"—and the speed and scale of this quantification far exceed the expectations of most analysts a year ago. Edge AI is moving from "proof of concept" to "large-scale deployment." I. Qualcomm's Strategic Move: Dragonwing Dual-Processor Chip Released to Boost Edge AI On the eve of the 2026 IFA Berlin, Qualcomm officially launched two processors , the Dragonwing Q-2390 and IQ-2390. The Q-2390 highly integrates edge AI inference, cellular connectivity, positioning, and display support into a single chip, aiming to lower the development threshold for edge AI devices. The IQ-2390 focuses on enhancing machine vision acceleration, TSN (Time-Sensitive Networking) support, and has a wide operating temperature range of -30°C to +115°C , designed for demanding scenarios such as industrial automation, machine vision, and energy management. Qualcomm's core intention in this announcement is to reduce the complexity of implementing edge AI in industrial scenarios through chip-level integration and industrial hardening. II . Edge AI Market: A Trillion-Dollar Track Accelerating The market size of edge AI is expanding at an astonishing rate. According to a recent report by Global Market Insights, the global edge AI market is valued at approximately $25.2 billion in 2025, projected to reach $30.9 billion in 2026, and is expected to grow to $225.5 billion by 2035, representing a compound annual growth rate (CAGR) of 24.7% from 2026 to 2035. Data from Mordor Intelligence also corroborates this trend: the edge AI hardware market is projected to grow from $25.08 billion in 2025 to $30.74 billion in 2026, reaching $68.73 billion in 2031 . The global edge AI market (hardware + software + services) is approaching $47-50 billion in size by 2026, with a year-on-year growth rate exceeding 28% . IDC predicts that the overall edge computing market will reach $450 billion by 2029, with AI being the primary growth engine . From a regional perspective, the Asia-Pacific region is the fastest-growing edge AI market globally . China, as a core growth engine, leads the world in shipments of edge devices equipped with domestically produced computing chips. Bulk procurement in areas such as smart security, smart cities, and factory automation continues to drive demand, with the domestic market growing at an annual rate exceeding 34% . III . The AI-driven transformation of the module industry: From "connectivity" to "computing + connectivity" The explosive growth of the edge AI market is profoundly reshaping the competitive logic of the module industry. Traditional module manufacturers heavily rely on the number of connections and shipment growth, but this model is encountering bottlenecks. In the first quarter of 2026, shipments of AI embedded cellular IoT modules declined by 17% year-on-year, marking the first decline after 12 consecutive quarters of growth in the market. The penetration rate of AI modules in global cellular IoT modules is currently only about 6%—meaning that edge AI modules are still on the verge of explosive growth, rather than a red ocean market . Meanwhile, leading companies in the industry are accelerating their transformation towards "connectivity + intelligence." Quectel Wireless Solutions' revenue in the first half of 2026 reached RMB 15.259 billion, a year-on-year increase of 32.16%, with automotive, intelligent, and solutions businesses accounting for 46.76% of revenue. Furthermore, the gross profit margin of this segment (21.42%) is significantly higher than that of traditional communication module businesses (16.28%) . Andrew Zignani, Senior Research Director at ABI Research, pointed out that wireless connectivity is no longer just about connecting devices; it's also about enabling scalable edge AI in consumer, enterprise, and industrial markets . IV . Trends in Module Products Driven by Edge AI The large-scale deployment of edge AI is reshaping the definition of module products from three dimensions. Trend 1: From "Communication Modules" to "Computing Modules" . The integration of AI edge computing chips has become the core differentiator for modules in 2026. Shipments of modules supporting edge inference exceeded 80 million units in 2025, and this proportion is expected to rise to 35% of total module shipments by 2030. The compound annual growth rate of high-performance computing modules is projected to reach 60% over seven years, and the proportion of intelligent and AI modules in cellular IoT modules will continue to increase. Trend Two: Industrial-grade wide operating temperature range becomes the "entry ticket ." Wide operating temperature capability reflects the stringent reliability requirements of modules in industrial edge AI scenarios. Industrial-grade modules typically require an operating temperature range of -40℃ to +85℃. In scenarios such as oil and gas, power, and outdoor infrastructure, wide operating temperature capability directly determines whether the equipment can operate stably in real-world environments. Trend 3: Multi-technology integration becomes standard . Edge AI scenarios often require simultaneous support for multiple connectivity methods—industrial automation needs Wi-Fi/Bluetooth for inter-device communication, energy management needs PLCs to solve the problems of transmission through walls and over long distances, and industrial gateways need cellular networks to upload data to the cloud. Modules with single communication methods are being replaced by integrated solutions that combine multiple modes . V. Qogrisys's Product Strategy: AI Capabilities Connected to the Base Amid the industry wave of module manufacturers moving towards AI, QOGRISYS's strategic path clearly demonstrates the industry logic of integrating "connectivity + computing". Qogrisys's strategic path can be summarized as follows: using high-speed connectivity as the foundation and edge AI as the incremental factor, to build an intelligent module product matrix covering multiple scenarios. Wi-Fi 7 Module: Full Product Lineup In the Wi-Fi 7 field, O2072PM and O2072PB, two Wi-Fi 7 + Bluetooth 6.0 combo modules based on the Qualcomm QCC2072 chip, fully support 4K QAM, 320MHz channels, MLO (Multi-Link Operation), with a peak rate of 5.8Gbps and eMLSR enhanced multi-link switching. The O2072PM uses an M.2 Key E interface (22×30mm), making it suitable for high-end robots and industrial equipment. From an industry trend perspective, Wi-Fi 7 is rapidly entering a large-scale deployment phase. IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN-dependent AP revenue. The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next stage . Multi-platform and multi-scenario coverage Qogrisys's core R&D team has long been deeply involved in mainstream global wireless chip platforms such as Qualcomm, Realtek, and MediaTek, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing . This multi-platform, full-stack technical capability enables Qogrisys to provide compatible connectivity solutions across different customers' main control solution ecosystems. In terms of application scenarios, Qogrisys's product matrix has extended to multiple core areas of edge AI: industry and intelligent manufacturing , modules such as O9201PM have completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in scenarios such as industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, and digital signage. robotics and embodied intelligence , the ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form an invisible infrastructure for cloud-edge-device collaboration—robots upload sensor data to edge servers in real time for VLA model inference, receive decision commands, and execute them instantly. Qogrisys's Wi-Fi 7 module product line already covers the needs of high-end robots and industrial equipment. VI. Trend Analysis: Three Certain Directions for Edge AI Modules Based on Qualcomm's chip release trends, three definite trends can be identified in the field of edge AI modules: First, AI capabilities will become a standard feature rather than an optional feature for modules. As the report "Edge Intelligence 2026: The First Year of Large-Scale Deployment" points out, 2026 has become a crucial turning point for edge intelligence, moving from proof-of-concept to large-scale deployment. The market space for pure connectivity modules lacking AI acceleration capabilities will continue to shrink. The seven-year compound annual growth rate of intelligent modules and AI modules reached 60% and 28% respectively , and this difference in growth rate is the strongest evidence of this. Second, industrial scenarios represent the most certain high-value market for edge AI modules. The industrial AI accelerator chip market is expanding at an average annual growth rate of 40%. Industrial visual inspection is migrating from traditional algorithms to deep learning, and predictive maintenance is generating explosive demand for edge inference computing power. Third, the convergence of "connectivity + computing" modules will become the infrastructure of the AIoT era. Wi-Fi 7 provides a connection base with ultra-low latency and ultra-high throughput, while edge AI provides localized intelligent decision-making capabilities. When the coverage density of Wi-Fi 7 and the computing power density of edge AI converge at the device end, the module will be upgraded from a "communication component" to an "intelligent computing node".    

On August 31, 2026, a report by CCTV Finance shook the entire semiconductor industry. According to industry research data, the demand for domestically produced AI chips in 2026 was approximately 4 million units, while actual deliveries were only around 3 million units, leaving a capacity gap of millions . Some high-end computing power companies already had orders booked three years into the future .   What is the connection between this "computing power famine" in the cloud computing field and the Wi-Fi, Bluetooth, and PLC modules shipped every day? The answer lies hidden in three transmission paths. I. Three transmission paths of computing power shortage Path 1: Structural shortage of memory chips The insane demand for high-bandwidth memory (HBM) from AI servers is reshaping the global DRAM supply landscape. Memory manufacturers are prioritizing capacity for the more profitable AI-grade HBM while cutting production of traditional memory chips such as LPDDR4 . According to TrendForce data, traditional DRAM contract prices rose by 90% to 95% quarter-on-quarter in the first quarter of 2026. Entering the second quarter, general DRAM contract prices continued to rise by 58% to 63% quarter-on-quarter, while NAND Flash contract prices rose by 70% to 75% . Changxin Memory Technologies, a leading memory chip company, reported revenue of 150.3 billion yuan in the first half of the year, a staggering 873.64% year-on-year increase. For Wi-Fi and Bluetooth modules that require the integration of DRAM and Flash, this means that the BOM cost is systematically increased . Path Two: Cost Resonance Across the Entire Industry Chain The surge in demand for AI chips has not only driven up storage prices but has also triggered a chain reaction of price increases across the entire industry chain. On July 1, 2026, ASE Technology Holding Co., Ltd., the world's leading semiconductor packaging and testing supplier, announced another round of price increases for its packaging products, with the highest increase exceeding 20% , primarily targeting advanced packaging categories such as CoWoS and FoCoS . There is still approximately a 10% supply-demand gap in advanced packaging technologies . From components such as crystal oscillators, PCBs, MLCCs, and inductors, to semiconductor stages such as chip packaging and testing, substrates, and silicon wafers, rising costs are passed down through each stage to the module stage. The BOM cost of each Wi-Fi/Bluetooth module is passively increasing . Path Three: The "Siphoning Effect" of Production Capacity AI chips are not only consuming advanced process capacity, but also taking up a large amount of mature 8-inch wafer capacity. Wafer fabs and packaging and testing plants are prioritizing capacity for high-profit AI computing power orders, squeezing the capacity of IoT chips. Yole projects the 2.5D/3D advanced packaging market to reach nearly $35 billion by 2030. Industry experts generally anticipate that the tight supply and demand situation for advanced packaging will continue . Counterpoint predicts that the average selling price of cellular IoT modules will face upward pressure in the second half of 2026 , primarily due to the continuously rising cost of memory . This means that the production capacity of IoT chips such as Wi-Fi and Bluetooth may face long-term pressure, with tight supply and extended delivery times becoming the norm. II. A Tale of Two Extremes: Industry Differentiation Amidst Computing Power Shortages The "Ice" Side: Short-Term Pain The most direct impact of the AI chip shortage on the module industry has already begun to appear in the data. According to a report released by Counterpoint Research, shipments of embedded AI cellular IoT modules declined by nearly 17% year-over-year in the first quarter of 2026 , marking the first decline after 12 consecutive quarters of growth . In 2025, this category maintained a year-over-year growth of 19% . As memory costs rise, the average selling price of embedded AI cellular modules has increased by double digits , forcing module manufacturers to raise prices. Ultimately, the increase in hardware costs has affected demand across various application areas . Meanwhile, global shipments of cellular IoT modules grew by only 4% year-on-year in the first quarter of 2026 , marking the first time they had fallen to single digits after seven consecutive quarters of double-digit growth . Shipments in the Chinese market declined by 2% year-on-year in the same quarter . The "Fire" Side: Long-Term Opportunities However, short-term cost pressures have not changed the industry's long-term direction. A report by Shanxi Securities points out that IoT modules are evolving from basic communication functions towards high computing power and intelligence. Counterpoint Research predicts that by 2030, the penetration rate of artificial intelligence in cellular modules will reach 25% . "Artificial intelligence will no longer be limited to a few niche applications, but will become a standard feature." In the Wi-Fi sector, the global Wi-Fi module market size is projected to reach $16.82 billion in 2026, representing a year-on-year growth of 17.9% . The market share of Wi-Fi 7 modules will rapidly climb to 17.2%, with an estimated 234 million units shipped throughout the year . IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN AP revenue, a significant increase compared to 11.8% in the first quarter of 2025. The Wi-Fi Alliance predicts that global Wi-Fi 7 device shipments will reach approximately 1.1 billion units in 2026 . III. The Response Logic of Module Manufacturers: From "Passive Pressure" to "Proactive Breakthrough" Faced with the cost impact across the entire industry chain caused by the shortage of cloud AI chips, Shenzhen Qogrisys has transformed external pressure into an upgrade impetus through its contingency strategies: On the supply chain side , we have established deep ecological collaborations with chip manufacturers such as Qualcomm, Realtek, Wuqi, and HiSilicon, upgrading the procurement relationship to a "joint development + capacity lock-in" model, so as to ensure supply stability during periods of tight capacity through large-scale operations and long-term cooperation. On the product side , the company aims to mitigate risks through full-scenario coverage. The Wi-Fi 7 module (O2072PM/ O2072PB ) is positioned to capitalize on the next-generation high-speed connectivity window, the PLC module (3121N-H/S130N-ISI) serves as a cost "ballast" with low storage dependence, and the domestic innovation module (O9201SB/O9201PM) enters the 2.66 trillion yuan domestic substitution market. At the same time, the company is also developing cutting-edge technologies such as Wi-Fi HaLow and AIoT modules. On the service side , the company is shifting from "selling standard products" to "selling deeply customized solutions," enhancing customer loyalty with a complete hardware platform foundation and full-chain technical services. On the compliance side , products have obtained certifications from multiple countries, including FCC, CE, and SRRC, circumventing trade barriers. This cost shock caused by the shortage of AI computing power is accelerating the weeding out of weaker players in the module industry, while deep ecosystem collaboration, a full-scenario product matrix, and customized service capabilities are becoming the core barriers for module solution providers to weather the cycle. IV. The "Safe Haven" Effect of PLCs In this round of AI chip shortages, PLC (Power Line Carrier) modules are relatively less affected . PLC modules have a lower reliance on high-bandwidth memory, unlike high-end Wi-Fi/Bluetooth modules which require the integration of large-capacity DRAM and Flash. PLC main control chips mostly use mature manufacturing processes, and although they also face some capacity constraints, the extent is far less than that of AI-related chips. In major PLC application scenarios such as smart lighting and smart homes, the requirements for real-time performance and stability are higher than computing power, and the impact of the AI chip price surge is relatively indirect. When Wi-Fi/Bluetooth modules face a comprehensive cost increase, PLC modules become a relatively cost-effective and stable connection solution. V. From “Selling Connectivity” to “Selling Connectivity + Computing”: A Paradigm Shift in the Module Industry This computing power shortage reveals a deeper industry trend: the module industry is moving from "single connectivity" to comprehensive competition involving "connectivity + computing + ecosystem". According to data from IoT Analytics, the number of connected IoT devices worldwide reached approximately 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030. This increase in the number of devices is only the first layer of change; more importantly, an increasing number of IoT devices are beginning to possess AI algorithms, NPUs, local inference, voice interaction, and edge computing capabilities . This means that the amount of data generated and processed by terminal devices is constantly increasing, which places higher demands on wireless modules— not only to "transmit faster", but also to "calculate closer and connect more stably" . VI. Conclusion While everyone is chasing the "brain" of computing power, even the most powerful brain needs a sensitive "neural network" to perceive the world and transmit instructions. Wireless modules are an indispensable neural network in this AI era. As CCTV Finance reported, the underlying reason for this round of growth is not just passive price increases due to "shortage," but also proactive choices driven by "ease of use." Domestically produced chips have crossed a critical point in terms of performance and stability, moving from "usable" to "easily usable." The same logic is unfolding in the wireless module industry— modules are moving from "connectivity" to "good connectivity," and from "connectivity" to "connectivity + intelligence . "  

From August 26th to 28th, 2026, the 25th IOTE International Internet of Things Exhibition was grandly held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall) . With a massive exhibition area of 80,000 square meters, this year's exhibition brought together over 1,000 high-quality exhibitors from around the world, attracting 48,109 industry professionals and over 3,000 overseas visitors on the first day . The exhibition, themed "Edge Intelligence, Scenario Deepening, and Green Sustainability," was a major collaboration between AGIC 2026 Shenzhen International General Artificial Intelligence Industry Expo and GERX Global Embossed Intelligent Robot Industry Expo, achieving deep integration of IoT technology with general AI and robot intelligence .   The strongest signal released by this exhibition is that edge AI and wireless connectivity are moving from "evolving independently" to "deeply coupled". Hall 12 showcases top achievements such as AI chips, edge computing, and embodied intelligent robots , while Hall 10 focuses on industrial IoT and communication modules . The coordinated layout of the two halls itself constitutes a spatial interpretation of the "AI + connectivity" industrial logic. I. Industry Logic: Why "Connectivity" Must Embrace "Computing" The integration of edge AI and wireless modules is essentially a technological evolution driven by industry demands. The centralized model, which relies solely on cloud computing power, is encountering multiple bottlenecks: industrial control scenarios require millisecond-level response times, which cloud round-trip latency cannot meet; medical and security scenarios are highly sensitive to data privacy, and uploading data to the cloud poses compliance risks; and the continuous uploading of data by massive IoT devices is driving up bandwidth and cloud computing costs. The standard architecture for AI implementation is becoming one where the terminal handles perception, the edge handles inference, and the cloud handles training and coordination—each with its own specific role. This trend is clearly supported by data. According to a report released by IIM Information, the global wireless module market is expected to reach $48.62 billion in 2026, a 17.8% increase from $41.27 billion in 2025. Among these developments, the integration rate of AI-dedicated acceleration chips in modules continues to climb , and shipments of emerging AI edge inference modules (integrated NPU) exceeded 12 million units in the second quarter of 2026 , marking a shift in modules from simple transmission units to computing power nodes. Meanwhile, Wi-Fi 7 modules support 320MHz bandwidth and 4096-QAM modulation, and are expected to see significant adoption in routers, VR/AR devices, and other applications in 2026 . Wireless modules are evolving from "data transmission pipelines" to "intelligent connectivity bases" with local intelligent processing capabilities. The competitive logic of next-generation wireless communication modules is undergoing profound changes: from single Wi-Fi connectivity to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence . II. IOTE 2026 Exhibition Confirms: Integration Has Become an Industry Consensus At IOTE 2026, leading global wireless connectivity companies clearly outlined the industry landscape of this trend through their respective product portfolios. From chip manufacturers to module solution providers, the core positions of their booths were generally occupied by edge AI-related solutions—whether it was a wireless SoC integrating AI/ML hardware accelerators or a main control platform for embodied intelligence and generative AI terminals, the strategic focus of leading players in the industry has clearly shifted towards dual-core capabilities of "communication + computing". Among the numerous innovative product awards presented concurrently with the exhibition, edge AI computing modules and high-performance AI chips occupied prominent positions. Several exhibitors showcased edge AI demonstration solutions supporting features such as local keyword wake-up and real-time face and gesture recognition. Meanwhile, the exhibition of supporting technologies such as high-precision wireless sensing and multi-protocol fusion further enriched the capabilities of wireless connectivity in AI scenarios. The exhibition clearly demonstrates that competition in the wireless connectivity field has evolved from a simple contest of "communication performance" to a comprehensive competition of "communication + computing" capabilities . Simply providing high-speed, stable data transmission channels is no longer sufficient to create a differentiated advantage. The ability to provide computing power support and intelligent collaboration for edge AI applications on top of connectivity capabilities is becoming a new benchmark for measuring the technological strength of module manufacturers. III. Application Scenarios: Where to Deploy Edge AI + Wireless Modules The integration of edge AI and wireless modules is being rapidly implemented in multiple vertical scenarios.   Industrial manufacturing is one of the most mature scenarios for the integration of edge AI and wireless modules. Hall 10 of the exhibition focuses specifically on industrial IoT and embedded solutions, connecting three major technology tracks: intelligent sensing, IoT communication, and precise positioning . In intelligent manufacturing scenarios, AGV/AMR autonomous transport vehicles, industrial sensors, and monitoring systems have rigid requirements for low-latency wireless connectivity and local AI inference capabilities. Wireless modules need to provide stable connectivity in high-interference industrial environments, while providing a communication foundation for AI applications such as visual inspection and predictive maintenance on the equipment side. Smart homes and smart buildings are another important scenario. In the smart home scenario, local AI processing means that voice commands can be responded to without being uploaded to the cloud, which reduces latency and protects user privacy—this is the core value of edge AI. Smart retail and smart cities also benefit from this trend. The exhibition comprehensively covered more than 20 core application scenarios, including smart logistics and smart consumption . In the smart retail scenario, AI POS terminals, smart vending machines, and other devices need to complete inference tasks such as image recognition and behavior analysis locally, while relying on wireless modules to achieve data synchronization and remote management with the cloud. Drones and robots represent emerging high-growth sectors. Drone solutions integrate Wi-Fi modules, 5G communication, and edge AI computing capabilities, supporting applications such as long-distance image transmission, remote control, real-time image recognition, and intelligent monitoring. With the rapid development of embodied intelligent robots, the demand for high-bandwidth, low-latency wireless connectivity and local AI inference capabilities will continue to surge. IV. Qogrisys's Solution Layout: A "Smart Connection Dock" with Wi-Fi 7 + Bluetooth 6.0 In light of this industry trend, the layout of QOGRISYS Technology Co., Ltd., headquartered in Shenzhen, is highly representative. Founded in 2014, Qogrisys Technology focuses on the communication connectivity industry, committed to providing customers with comprehensive IoT connectivity solutions. The company partners upstream with chip manufacturers such as Qualcomm, Realtek, Woogi, and HiSilicon, and downstream with end customers in smart home, industrial IoT, and automotive electronics sectors. Its main products cover 2.4G/5.8G Wi-Fi modules, BLE modules, PLC modules , RF antenna components, and smart hardware solutions. Core Product: O2072PM Wi-Fi 7 + Bluetooth 6.0 Combination Module Qogrisys has launched two Wi-Fi 7 + Bluetooth 6.0 combo modules, the O2072PM and O2072PB , based on the Qualcomm FastConnect C7700 (chip code QCC2072) chip . The QCC2072 is designed to provide ultra-high-speed connectivity, with peak speeds up to 5.8Gbps, and features a 320MHz channel, 4K QAM, and Multi-Link Operation (MLO) capabilities . The O2072PM uses an M.2 Key E standard interface (22×30mm) , fully supporting 4K QAM, 320MHz channels, and MLO (Multi-Link Operation), with a peak rate of 5.8Gbps . The Wi-Fi portion complies with IEEE 802.11a/b/g/n/ ac /ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with each band supporting up to 4096 QAM modulation . The Bluetooth portion is compatible with Bluetooth 6.0, supporting dual-mode Bluetooth, Tx beamforming, MRC, LE Audio, and 2 Mbps Bluetooth Low Energy (BLE) . Of particular note is that the O2072PM also supports high-precision distance measurement (HADM/channel detection) , providing new technological possibilities for scenarios such as indoor positioning and asset tracking. The O2072PM is clearly designed to meet the "connectivity foundation" requirement in edge AI scenarios—providing stable, high-bandwidth, and low-latency wireless connectivity for high-performance edge platforms. With the continuous improvement of edge AI computing power, the low latency and high reliability of Wi-Fi 7 are becoming the core communication foundation for edge computing. The higher speed and lower latency offered by Wi-Fi 7 enable the module to achieve a better product experience across a wider range of devices . Domestic platform adaptation capabilities Qogrisys's foray into the Wi-Fi 6 field is also noteworthy. Its O9201 SB/ O9 1 01 SA/ O9201PM series modules have completed driver adaptation and verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in industrial tablets, edge computing gateways, industrial control equipment, and other scenarios. This demonstrates Qogrisys's deep technical accumulation in adapting to domestic platforms and wireless connectivity. In terms of product portfolio, Qogrisys is building a complete wireless connectivity solution covering Wi-Fi 4/5/6/7 and BLE, following the path of "using a full hardware platform as the foundation and vertical scenarios as the direction" . V. Outlook: The Era of "Intelligent Connectivity" in the Module Industry Looking ahead to 2026-2030, the industry will enter the era of "intelligent connectivity." Edge AI modules have become a new growth engine for the wireless module industry. According to an IIM report, the global wireless module market is projected to exceed $90 billion by 2030, with edge AI and satellite direct connection modules expected to grow at a compound annual growth rate of over 30%. The deep integration of edge AI and wireless modules is not an optional "icing on the cake," but an inevitable path for industry development . For wireless module manufacturers, their ability to synergize with edge AI platforms beyond mere connectivity, and to provide a highly reliable communication foundation for edge AI applications, will determine their position in the next stage of competition. The IOTE 2026 exhibition showcases a true picture of this ongoing transformation—from "connecting everything" to "intelligently connecting everything." Qogrisys Technology, with Shenzhen as its origin, Wi-Fi 7 + Bluetooth 6.0 as its connectivity platform, and full-scenario coverage as its goal, is contributing its strength to this transformation.  

Smart connected vehicles are emerging as one of the most确定性 growth trajectories in the global technology industry.   China's intelligent connected vehicle production is projected to reach 14.064 million units in 2026, with market penetration expanding to 38.40%. From 4.6915 million units in 2021 to 14.064 million units in 2026, this figure has nearly tripled in just five years, representing a compound annual growth rate of 24.8%. Revenue from in-vehicle intelligent connected solutions is expected to reach 236.5 billion yuan. iiMedia Research data shows that China's intelligent connected vehicle application service market has already reached 222.3 billion yuan in 2025. On a global scale, the growth trajectory is equally steep. Research and Markets data indicates that the global connected vehicle technology market will grow from $45.99 billion in 2025 to $51.86 billion in 2026, reaching $84.54 billion by 2030 at a CAGR of 13%**. The broader connected cars market is forecast to expand from $105.67 billion in 2025 to $121.23 billion in 2026, and further to **$214.42 billion by 2030 at a CAGR of 15.3%. According to TechNavio, the global connected car market is forecast to grow by $161.69 billion during 2025-2030, accelerating at a CAGR of 17.2%. Communication and navigation terminals are transitioning from vehicle "options" to "standard equipment" —this is not incremental improvement but a structural reconfiguration of the industry's underlying logic. The connectivity demands of intelligent connected vehicles are extending in two directions: inside the vehicle, intelligent cockpits require high-bandwidth, low-latency wireless connectivity; outside the vehicle, charging infrastructure demands intelligent communication via power line carrier technology. Ofeixin Technology delivers a full-stack connectivity solution covering both the "vehicle side" and the "energy side" of intelligent connected vehicles, with Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions and PLC charging pile communication solutions. I. The Bandwidth Revolution in Intelligent Cockpits: Wi-Fi 7 Ushers in a New Era of In-Vehicle Connectivity Wi-Fi 7, as the next-generation standard following Wi-Fi 6, is becoming the core infrastructure for wireless connectivity in intelligent cockpits. In January 2026, the Wi-Fi Alliance officially opened Wi-Fi 7 certification. From certification opening to module mass production delivery, the pace of commercialization for this technological iteration has far exceeded market expectations. Automotive-grade Wi-Fi 7 modules completed AEC-Q104 qualification and entered small-batch trial production in Q4 2025, with theoretical peak data rates 4.8 times higher than Wi-Fi 6, significantly supporting high-bandwidth scenarios such as high-definition map streaming updates and in-vehicle AR navigation. Industry players have already demonstrated clear commercialization signals—LG Innotek has secured orders from a leading European automotive parts supplier to begin shipping automotive-grade Wi-Fi 7 and Bluetooth wireless communication modules in 2027, with the order valued at approximately $68 million. The global automotive Wi-Fi/Bluetooth module market is projected to reach $4.28 billion in 2026, surpassing $6.83 billion by 2030. Wi-Fi modules have become a core procurement category in the intelligent cockpit domain, accounting for 76% of Wi-Fi module procurement demand. Single-chip solution shipments accounted for 42.5% of total volume in 2025 and are expected to exceed 50% in 2026. Chinese domestic OEM procurement demand for dual-band concurrent modules grew 23% year-over-year in 2025, making China the fastest-growing single market globally. In the Wi-Fi 7 automotive module space, Ofeixin Technology has completed a flagship product lineup. The O2072PM (PCIe M.2 interface) and O2072PB (SMD version) are automotive-grade Wi-Fi 7 modules designed based on Qualcomm's QCC2072 (FastConnect C7700) chipset. Both modules comply with IEEE 802.11a/b/g/n/ac/ax/be standards, support tri-band 2.4 GHz/5 GHz/6 GHz concurrent operation, with 6 GHz band channel bandwidth up to 320 MHz, and peak data rates reaching 5.8 Gbps. Both modules support Enhanced Multi-Link Single Radio (eMLSR) and 2×2 Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling flexible frequency resource scheduling in scenarios with multiple in-vehicle concurrent connections and complex signal interference. The O2072PM and O2072PB are among the few module products on the market that simultaneously support Wi-Fi 7 and Bluetooth 6.0, with the Bluetooth section directly supporting Bluetooth 6.0 and Channel Sounding functionality—providing a complete technology foundation for high-precision positioning scenarios such as digital car keys. II. From "Connectivity" to "Perception": Bluetooth 6.0 Redefines Human-Vehicle Interaction Bluetooth technology is undergoing an upgrade from a "connectivity tool" to a "perception infrastructure." Bluetooth 6.0's introduction of Channel Sounding technology brings centimeter-level high-precision distance measurement capability to Bluetooth. Channel Sounding combines RTT (Round-Trip Time) and phase-based ranging to achieve high-precision distance measurement, representing a qualitative leap from the meter-level error of traditional BLE solutions that relied on RSSI (Received Signal Strength Indicator). Bluetooth Channel Sounding technology achieves accuracy within 0.5 meters with relay attack protection, and will be the first to be deployed in automotive digital car keys in 2026. Industry solutions have already matured. Quectel released its next-generation automotive digital key solution in April 2026, featuring BLE 6.0 + UWB + NFC tri-mode fusion technology. Yuanfeng Technology also announced it will be the industry's first to launch a multi-node Bluetooth 6.0 Channel Sounding technology solution in the second half of 2026. Industry data shows that over 13.2 million vehicles were equipped with digital key functionality as standard in 2025. Bluetooth device annual shipments are projected to reach 5.9 billion units in 2026, with the 2030 annual shipment forecast reaching 8.1 billion units. The Bluetooth 6.0 market was valued at $5.42 billion in 2025 and is expected to grow to $17.47 billion by 2035. According to DIGITIMES, Bluetooth Channel Sounding, leveraging its established ecosystem advantages, is penetrating the precision ranging market, with large-scale adoption by application vendors expected to commence from the second half of 2026 through 2027. The O2072PM and O2072PB modules from Ofeixin Technology, with their integrated Bluetooth 6.0 functionality, offer distinct advantages in digital car keys, in-vehicle personnel positioning, and other scenarios. Both modules support High Accuracy Distance Measurement (HADM), LE Audio, 2 Mbps Bluetooth Low Energy, and other complete Bluetooth features. Bluetooth shares an antenna with 2.4 GHz WLAN while operating concurrently with 5 GHz/6 GHz WLAN, providing flexible configuration options for in-vehicle multi-protocol concurrency. Wi-Fi/Bluetooth combo module shipments reached 71% in 2026 and are expected to exceed 85% by 2030. Ofeixin's O2072PM/O2072PB solution is a representative example of this trend—delivering high-speed Wi-Fi connectivity and precise Bluetooth perception simultaneously on a single module, providing intelligent cockpits with an integrated "one network, multiple capabilities" solution. III. The "Invisible Communication Network" of Charging Infrastructure: PLC's Mandatory Upgrade Window In the industrial landscape of intelligent connected vehicles, charging infrastructure is an indispensable component. And PLC (Power Line Communication) technology is emerging as the core solution for electric vehicle charging pile communication. EU regulations are mandating a comprehensive upgrade of charging pile communication methods. Under EU Delegated Regulation (EU) 2025/656, which sets a mandatory compliance deadline of 2027, developing next-generation smart AC charging piles that comply with EN ISO 15118-20:2022 has become the only path for products to enter the European market. This means the traditional PWM communication method will be phased out, with a complete transition to high-layer communication based on GreenPHY Power Line Communication (PLC), with mandatory integration of Plug & Charge (PnC) and Vehicle-to-Grid (V2G) capabilities. The global Power Line Communication (PLC) market is projected to grow from $12.74 billion in 2025 to $14.29 billion in 2026 at a CAGR of 12.1%. By 2030, the market is expected to reach $22.66 billion. Among the key growth drivers are the expansion of electric vehicle charging networks. As electrification, distributed energy resources, electric vehicle charging, and smart city programs expand, PLC is becoming an important layer in the broader industrial IoT and smart grid communications ecosystem. PLC communication requires no additional communication wiring—it transmits data while transmitting power. This "two-in-one" characteristic gives PLC a natural advantage in charging pile scenarios: no need for rewiring, directly utilizing existing power lines to complete two-way data exchange between vehicle and charging pile, and between charging pile and the cloud. Effective from January 8, 2026, all newly installed or significantly upgraded publicly accessible AC charging piles must support EN ISO 15118-2:2016. This means PLC communication capability is transitioning from a "nice-to-have" to a "must-have." Ofeixin Technology offers a complete PLC module product portfolio. The S130N-ISI is a fully integrated Power Line Communication module, designed based on the LianXinTong VC6330 chip, integrating a 32-bit ARM Cortex M3 MCU, 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module adopts LCC packaging with ultra-compact dimensions, integrating line drivers on-chip with low power consumption and strong anti-noise capability. In charging piles, photovoltaic communications, and other scenarios, Ofeixin's S130N-ISI module enables reliable device communication through existing power lines—one power line, simultaneously delivering power and data. With the mandatory implementation of EU regulations and the continued expansion of global electric vehicle charging infrastructure, market demand for PLC modules in charging pile scenarios is poised for explosive growth. IV. From Cockpit to Infrastructure: The Connectivity Foundation of Intelligent Connected Vehicles Intelligent connected vehicles and the Internet of Vehicles are racing ahead at a compound annual growth rate exceeding 30%. In this process, in-vehicle wireless communication modules have transitioned from "behind-the-scenes配角" to "core hub." On the intelligent cockpit side, they are the transmission channels for multi-screen interaction, the positioning foundation for digital car keys enabling keyless entry, and the connectivity safeguard for OTA upgrades ensuring continuous vehicle evolution. On the charging infrastructure side, they are the communication cornerstone enabling intelligent functions such as Plug & Charge and V2G bidirectional charging. Ofeixin Technology's in-vehicle connectivity solutions present a clear "dual-track" architecture: On the intelligent cockpit and digital key front, the O2072PM and O2072PB deliver Wi-Fi 7 + Bluetooth 6.0 combination, covering differentiated requirements from high-end intelligent cockpits to next-generation digital car keys. The 5.8 Gbps peak data rate supports the high-bandwidth demands of multi-screen HD video streaming and in-vehicle AR navigation; Bluetooth 6.0 Channel Sounding provides centimeter-level precise positioning foundation for digital car keys. The interface format differences between the two modules—PCIe M.2 versus SMD package—offer flexible selection options for different in-vehicle hardware architectures. On the charging infrastructure front, the S130N-ISI and other PLC module products are addressing the mandatory upgrade requirements brought by new EU regulations, providing GreenPHY PLC communication capability compliant with ISO 15118-20 standards for charging piles. With upstream partnerships with Qualcomm and other leading chip original equipment manufacturers, Ofeixin Technology rapidly transforms the latest chip platforms into mass-producible module products. From Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions to charging pile PLC communication solutions, the full-stack coverage enables Ofeixin to deliver complete wireless module solutions for intelligent connected vehicles—from in-vehicle connectivity to infrastructure communication. This represents both the completeness of the product portfolio and the flexibility to address different scenarios and requirements. Looking ahead to 2027-2030, composite communication modules integrating 5G cellular are gradually penetrating mid-to-low-end vehicle segments, while software-defined vehicle architectures demand higher programmability and security isolation capabilities from modules. The rigid demand of intelligent cockpits and autonomous driving for high-speed, reliable data links, combined with the mandatory upgrade window created by EU charging pile regulations, will together ensure the long-term positive fundamentals of both the in-vehicle wireless communication and charging infrastructure communication module markets.  

On August 19, 2026, the 11th World Robot Conference (WRC) officially opened at the Beiren Yichuang International Convention Center in Beijing’s E-Town, running through August 23 under the theme “Human-Robot Symbiosis, Production-Demand Convergence.” The scale set new records: more than 300 exhibitors (up 36% year-over-year) presented over 2,000 exhibits, with more than 150 products making their global debut. More than 17,800 contestants from 26 countries are competing across the conference‘s robotics contests. If previous WRC editions were “technology showcases,” WRC 2026 is an “industrial acceptance test.” The most significant shift is structural, not cosmetic. The conference introduced four themed days — Launch Day (Aug 19), a first-ever Procurement Day (Aug 20), Developer Day (Aug 21), and Public Days (Aug 22–23). A dedicated pavilion gathered 49 centrally administered state-owned enterprises presenting 12 real-world application scenarios — one of the strongest procurement signals the Chinese robot industry has ever staged. As one observer put it: last year‘s WRC answered whether robots can work; this year the industry answers how well they work, how much they cost, who buys them, and whether they can be deployed at scale. I. WRC 2026 Signals: The “Acceptance Test” of Physical AI The signals from this year’s conference are clear and strong: the robotics industry is moving from “single-technology demonstrations” to a new phase of “technological innovation + industry-demand alignment + global collaborative governance.” Trend One: From “Muscle” to “Brain.” Goldman Sachs’ July 2026 research report explicitly noted that the industry’s center of gravity is shifting from “physical capabilities” to “intelligent decision-making.” On the WRC floor, the Beijing Humanoid Robot Innovation Center unveiled the Pelican-Unify 1.0 unified embodied model and the Tiangong Omni — a lightweight humanoid robot open platform designed for the embodied AI ecosystem. Xinghaitu demonstrated the application results of the world’s first end-to-end full-body control model. The industry consensus is forming: the ultimate competition in embodied intelligence is not in motors and joints, but in foundational models and the data flywheel accumulated through continuous interaction with the real physical world. Trend Two: From “Showing Off” to “Real Work.” On the exhibition floor, robots are doing real work rather than performing. The firefighting humanoid robot Linglong L2.0 can easily climb over rubble and stairs. Fourier’s GR-3 humanoid robot acts as an “intelligent butler assistant” in simulated home scenarios. Keenon Robotics’ XMAN series autonomously completes the entire coffee extraction process. As Li Tong, founder and CEO of Keenon Robotics, stated: “Whether robots can actually do real work is the essence of humanoid robot commercialization.” Trend Three: Accelerated Industry Chain Closure. IDC’s latest MarketGlance: China Embodied AI Robotics, 3Q26 report divides the current industry into six market segments: computing infrastructure, model algorithms, data engines, robot bodies, core components and infrastructure, and industry application agents. The four exhibition halls of WRC 2026 — Innovation, Exchange, Manufacturing, and Fun — precisely cover the complete chain from underlying technology and core components to finished robot applications. Guangdong sent 34 companies spanning the full robot supply chain, from upstream EVE Energy batteries and ORBBEC 3D vision sensors, through midstream CVTE control boards and Neoway 5G communication modules, to downstream UBTECH, Dobot, and LimX Dynamics full machines. II. Communication Modules: The Underestimated “Nervous System” When industry attention focuses on the “brain” (AI models) and the “body” (joints and actuators), a critical question emerges: connectivity is becoming a key factor in determining whether robots are truly deployable. If large models are the robot’s “brain,” then the communication network is its “nervous system” — this “brain” must process massive heterogeneous data from dozens of sensors distributed across the body within milliseconds, and issue synchronized instructions to actuators within microseconds. Whether humanoid robots or autonomous mobile robots (AMRs), actual deployment imposes unprecedented demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency. Industry research indicates that the internal and external communication architectures of robots are facing unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits. The market size for embodied AI robot-dedicated communication is expected to expand rapidly from $42 million in 2026 to approximately $300 million by 2030. More宏观 data confirms this trajectory. QYResearch shows that the global robot communication module market was approximately $8.12 billion in 2025 and is projected to reach $21.61 billion by 2032, with a compound annual growth rate of 15.1% from 2026 to 2032. Research institutions further point out that driven by market prosperity and chip specialization, communication modules will witness nearly RMB 10 billion in incremental growth. The value of the communication link is undergoing a structural reorganization — from “general industrial component” to “dedicated core component.” III. The Communication Module Ecosystem at WRC 2026 WRC 2026 clearly displays the complete ecosystem of robot communication modules. In wireless communication, Neoway Technology showcased its 5G communication modules for the midstream industry, demonstrating a rich portfolio of products and solutions for robot collaborative communication scenarios. Realtek Semiconductor exhibited its communication transmission chip integration solutions for humanoid and industrial robots, featuring Wi-Fi 8 2×2 and 5GHz 3T3R high-end wireless modules to ensure real-time protocol and high-speed data exchange between robots. The 34 Guangdong companies formed a complete closed loop from upstream power batteries and 3D vision sensors, through midstream control motherboards and 5G communication modules, to downstream finished robots. In control and communication integration, GigaDevice demonstrated joint module solutions based on GD32 series MCUs, compatible with CANopenNode protocol and equipped with CANFD and RS485 dual industrial buses. JWIPC and CVTE provided control motherboards and edge computing platforms. These highly integrated control solutions represent the typical application of PLC (Power Line Communication) technology in robot motion control — achieving precise, real-time joint control through industrial buses, which is the key neural pathway through which the robot’s “brain” commands its “body.” In perception and safety, ORBBEC demonstrated robot-dedicated 3D depth camera modules, while Lingsi Intelligent and Saigan Technology provided perception and safety modules. These modules constitute the robot’s “sensory system,” forming the foundation for environmental perception and safe interaction. IV. Qogrisys Business Portfolio: A Full-Stack Connectivity Foundation from Wi-Fi 7 to PLC In the industry landscape revealed by WRC 2026, the role of communication module suppliers is upgrading from “standard component providers” to “builders of robot nervous systems.” Qogrisys business portfolio precisely covers multiple critical dimensions of this transformation. Wi-Fi 7 Modules: High-Speed Neural Pathways for Embodied Intelligence. Qogrisys has launched Wi-Fi 7 module product lines for high-end robots and industrial equipment. Among them, the O2072PM, based on Qualcomm’s QCC2072 chip, is a Wi-Fi 7 + Bluetooth 6.0 tri-band 2×2 MIMO module supporting 2.4/5/6 GHz bands, with up to 320 MHz bandwidth across all bands, peak speeds of up to 5.8 Gbps, 4096-QAM modulation, and Multi-Link Operation (MLO) capabilities. Bluetooth supports BLE 6.0 and LE Audio. In addition, These performance metrics directly address the rigid demand for ultra-low latency and ultra-high bandwidth wireless connectivity in embodied AI robots. Bluetooth and Multi-Protocol Modules: The Foundation of Diverse Connectivity. Qogrisys‘ product portfolio covers 2.4G/5.8G/6G series Wi-Fi modules, Wi-Fi HaLow, Nearlink, and Bluetooth (BLE) modules. Its Bluetooth modules support the latest standards including BLE 6.0 and LE Audio. In robot scenarios, different communication protocols serve different connectivity needs — Wi-Fi carries high-bandwidth data backhaul, Bluetooth handles low-power device interconnection, and Wi-Fi HaLow is suitable for long-distance low-power scenarios. Multi-protocol parallelism has become a standard capability of robot communication modules. PLC Modules: The “Invisible Infrastructure” of Power Line Communication. In August 2026, Qogrisys has formed a complete technology matrix in the PLC domain. Its 3121N-H module, based on the HiSilicon Hi3121S chip, achieves a physical layer peak rate of 0.507 Mbit/s, with a single CCO supporting up to 200 STA nodes. The S130N-ISI module features an ultra-compact design measuring just 20.6 × 12.6 mm, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor. The 3121N-L module is a fully integrated power line carrier communication module equipped with an external LD amplifier and transmitter function. The unique value of PLC technology lies in “where there is power, there is network” — using existing power lines in homes or industrial settings as the data transmission medium, walls, floors, or metal structures blocking the signal. Measured data shows that PLC-IoT end-to-end response latency is stable within 50 milliseconds, with communication success rates as high as 99.99%. In industrial and service scenarios where robots need to be deployed across floors and rooms, PLC provides a stable connectivity guarantee that wireless solutions cannot. Deep Customization Capability: From Modules to Solutions. Qogrisys‘ core R&D team has long the world’s leading wireless chip platforms including Qualcomm, Realtek, WUQI, and HiSilicon, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing. In the trend of the module industry moving from standardization to deep customization, this capability enables the company to provide customized connectivity solutions for different robot form factors and application scenarios. V. Challenges and Opportunities: The Module Industry‘s “Acceptance Test” The industry trends revealed by WRC 2026 bring structural opportunities to the module industry — but challenges are equally. Supply chain pressure continues to intensify. In July 2026, the module industry experienced the most severe component price surge in recent years. PCB prices rose 10%-30%, crystal oscillators 10%-30%, inductors 30%-70%, and MLCCs 10%-70%. Packaging giant ASE officially announced price increases of up to over 20%. Passing down to the module segment, the BOM cost of every Wi-Fi/Bluetooth module is being passively pushed up. Industry report data shows that the industry‘s average gross margin in 2025 fell by 8 percentage points compared to 2024. The market side also faces divergence. Consumer IoT growth has significantly slowed, Wi-Fi 7 penetration is only 8%, and AI module shipments still account for single-digit percentages. Meanwhile, the U.S. FCC is推行 component-level bans, and EU compliance thresholds continue to rise. However, the explosive growth of the robotics industry is opening a high-value growth curve for the module industry. As IDC points out, the robotics industry is transitioning from technology demonstrations and point breakthroughs to product delivery, scenario deployment, and industrial collaboration. IDC‘s 2026 Global CEO Survey shows that 35.2% of CEOs rank Physical AI as a key new technology investment area to focus on over the next 12-24 months. At the opening ceremony, Vice Minister of Industry and Information Technology Xin Guobin stated that Chinese robotics enterprises’ revenue topped RMB 300 billion ($44.45 billion) in 2025, with average annual growth exceeding 20% over the past five years. In the first half of 2026, revenue reached RMB 165.5 billion, up 24.5% year-on-year. Ministry of Industry and Information Technology data shows that China‘s annual humanoid robot production is expected to exceed 100,000 units in 2026. Morgan Stanley has raised its 2026 domestic humanoid robot shipment forecast from 28,000 to 50,000 units, projecting 446,000 units by 2030. Every robot requires communication modules as its “nervous system” — this is not only growth in volume but also a leap in the value of communication modules per robot.     Conclusion WRC 2026 clearly declares to the world: the robotics industry has crossed the stage of “can we build it” and officially entered a new era of “can we use it well and sell it.” In this new era, communication and connectivity technology is no longer an “optional accessory” for robots, but a “core organ.” From the high-speed wireless neural pathways of Wi-Fi 7, to the invisible backbone of PLC over power lines, from the low-power interconnection of Bluetooth, to the wide-area coordination of 5G — the module industry is moving from behind the scenes to center stage, becoming a key force in defining the performance boundaries of robots. For module manufacturers, this is not just a market opportunity to supply components, but a strategic opportunity to deeply participate in and define the future form of robots by providing smarter, more integrated, and more reliable connectivity solutions. As robots move from “showing off” to “delivery,” the module industry is likewise welcoming its own “acceptance test.”