China Shenzhen Ofeixin Technology Co., Ltd Company News

I. The "Impossible Triangle" of IoT Terminals With the rapid iteration of IoT terminals, more and more devices are moving towards miniaturization and battery power, while products are facing design challenges such as limited PCB space, insufficient battery life, and unstable wireless connectivity . This is not an isolated phenomenon in a particular sub-sector, but rather a systemic challenge facing the entire Internet of Things (IoT) industry. In 2026, global shipments of wireless modules reached 870 million units, with a market size exceeding US$41.2 billion. By 2030, global shipments are projected to climb to 1.52 billion units, with a CAGR of 11.8%, and the market size is expected to reach US$79.8 billion. During the same period, the number of connected IoT devices worldwide is expected to exceed 39 billion. This explosive growth in device numbers is amplifying the challenges of every design dimension into key factors determining product success or failure. Small size, low power consumption, and high stability—these three requirements are forming the "impossible triangle" in IoT terminal design. In traditional solutions, these three often constrain each other: pursuing small size limits antenna performance, pursuing low power consumption sacrifices transmission rate, and pursuing stability increases power consumption and size. Finding a balance among these three has become a core issue for module solution providers. II. Challenge 1: Extremely tight PCB space Industrial driving force of space compression From smart rings and TWS earphones to micro sensors and smart locks, the physical space of terminal devices is being continuously compressed. The micro battery market is projected to grow from $1.59 billion in 2025 to $1.81 billion in 2026, representing a CAGR of 13.5%. This rapid growth in the micro battery market is a direct reflection of the trend towards device miniaturization —the smaller the device, the higher the requirements for battery volume and energy density. One of the most challenging problems faced by hardware engineers is achieving high-density, high-stability electrical connections between the daughterboard and the motherboard under extremely limited overall device thickness and PCB space. As an indispensable radio frequency component in the device, the footprint of the wireless module directly determines the feasibility of the overall device layout. Solution path for miniaturized modules The industry is addressing the spatial challenges from multiple perspectives. The O9101SA module from Qogrisys has compressed its size to 12×12mm , while supporting dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps . This size is among the industry-leading levels for Wi-Fi 6 + Bluetooth Combo modules. This extreme size reduction not only allows for more space to be packed in, but also frees up valuable PCB space for other components such as the battery, sensors, and main control chip – the smaller module footprint allows for more storage . Multi-protocol single-chip integration is another key path. Two independent modules, plus their respective peripheral circuits and antenna clearance, occupy a much larger PCB area than a single multi-protocol integrated module. In small-sized products such as smart bulbs and panel switches, this area is the biggest limiting factor. The Wi-Fi/Bluetooth Combo solution fundamentally reduces PCB footprint by integrating the two protocols into a single chip. The area occupied by antennas is also significant. Traditional antenna implementations consume 15%-25% of the total PCB area in mobile devices and IoT applications. The emergence of antenna-in-package (AiP) technology integrates the antenna into the module package, achieving space savings of 40%-60% . Challenge 2: Severely Inadequate Battery Life The Economics of Range Anxiety For battery-powered IoT devices, battery life is not a "nice-to-have" but a "life-or-death" issue. The global IoT battery market was valued at $15.9 billion in 2024 and is projected to grow to $36.88 billion by 2033, representing a CAGR of 9.8%. This continued expansion reflects the rigid demand from end devices for longer battery life. The operational lifespan of battery-powered nodes directly impacts maintenance costs and deployment scalability . The industrial value of low power consumption technology The low-power Wi-Fi module market is projected to reach $4.142 billion in 2025 and $11.79 billion in 2032, representing a CAGR of 16.4%. The BLE module market is expected to grow to $68.27 billion in 2032, with a CAGR of 13.80%. The robust growth of these two segments confirms that low power consumption has become one of the most crucial competitive dimensions in the module industry. IV. Challenge 3: Unstable wireless connection Crowded 2.4GHz and limited antennas The root cause of unstable wireless connections lies in two structural contradictions. The first problem is frequency congestion. The 2.4GHz ISM band is shared by multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, resulting in severe co-channel interference. In high-density deployment scenarios such as smart homes and offices, signal conflicts and data rate degradation are commonplace. The second contradiction is the limitation of antenna performance. Device miniaturization means that the available space for the antenna is compressed, and the antenna efficiency and bandwidth decrease accordingly. There is an inherent physical constraint between radio frequency performance and device size —the smaller the antenna size, the lower the radiation efficiency, and the worse the communication distance and stability. V. Qogrisys Systemic Solutions To address the aforementioned triple design challenges, QOGRISYS offers a comprehensive product portfolio, providing end-to-end solutions from chips to modules and from hardware to software. Extremely Miniaturized Product Matrix Qogrisys has achieved complete coverage in the field of small-sized modules, from Wi-Fi 6 to Wi-Fi 5, and from Combo to single Wi-Fi. The O9101SA boasts a compact size of 12×12mm , supports dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps, and utilizes an SDIO 3.0 interface . It supports a 2.4GHz/5GHz dual-band simultaneous (DBS) architecture , uplink/downlink MU-OFDMA and MU-MIMO, and BT/BLE dual-mode operation . The O9101SA, along with the O9101UE and O9101UD, belongs to the Oufixin 1×1 Wi-Fi 6 module series developed based on the WQ9101 chip . The O9101UE measures 13×12.2mm and uses a USB 2.0 interface; the O9201SB measures only 13×15mm, is also based on the WQ9201 chip, and offers speeds up to 1200Mbps. The O9201UB shares the same platform as the O9201SB and uses a USB 2.0 interface. The O8852PB measures 13×15mm, is based on the Realtek RTL8852BE chip, supports Wi-Fi 6 and Bluetooth 5.2 with a speed of 1200Mbps, and uses a PCIe interface. For scenarios with stricter space constraints, the small size of these modules is particularly advantageous. The smaller module footprint frees up valuable PCB space for other components such as the battery, sensors, and main control chip. Low-power design: Co-optimization from chip to system Qogrisys's low-power capability stems primarily from the selection and deep collaboration with upstream chips. The Wuqi WQ9201 chip, with its stable transmission performance and internationally leading low-power consumption , stood out from 364 products from 280 chip companies, winning the 2024 "China Chip" Excellent Technological Innovation Product Award. Interference Resistance and Stable Connection: Breakthrough Technologies in Dual-Band and Multi-Protocol Integration O9201SB, O9101UE , and O8852PB all support 2.4GHz/5GHz dual-band Wi-Fi 6. The core value of the dual-band architecture lies in "selectivity"—when the 2.4GHz band becomes congested due to the coexistence of protocols such as Bluetooth and Zigbee, the device can switch to the 5GHz band to ensure transmission speed and connection stability. Dual-band Wi-Fi 6 also brings core technologies such as OFDMA and MU-MIMO, improving spectrum utilization efficiency in scenarios with multiple concurrent devices. In high-density deployment environments such as smart homes and offices, these technologies directly translate into improved user experience—lower latency, fewer dropped connections, and more stable connections. Multi-protocol integration is another approach. A single module can simultaneously support multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, and can intelligently select the best connection method according to the environment, flexibly switching between different scenarios. VI. Industry Outlook: From "Usable" to "Effective" Looking ahead to 2026-2032, the design trend for small-size, low-power modules will continue to evolve along the following directions: First, the limits of size will continue to be broken . The competition for module size is far from over, and the approach of physical limits is forcing continuous innovation in packaging technology. Secondly, low power consumption will shift from a "feature" to a "standard feature." QYResearch data shows that the low-power Wi-Fi module market will continue to expand at a compound annual growth rate of 16.4%. Low power consumption will no longer be a differentiating selling point for high-end modules, but rather a basic requirement for all module products. Third, multi-protocol integration, miniaturization, and low power consumption will be deeply intertwined. Integrating multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread onto a single chip is a fundamental solution to the space and power consumption issues. The widespread adoption of the Matter protocol will further strengthen this trend— future modules will no longer require users to "select" protocols, but will automatically adapt to the optimal connectivity solution based on the environment and application. Fourth, module selection is evolving from "component procurement" to "strategic decision-making." Under the dual constraints of miniaturization and low power consumption, module selection is no longer merely a comparison of technical parameters, but a strategic choice concerning product definition, development cycle, and time-to-market. A suitable module solution can compress the development cycle from months to weeks and simplify a four-layer PCB to a two-layer PCB .  

By 2026, edge AI will no longer be a concept that needs to be "defined," but a reality that is being "quantified"—and the speed and scale of this quantification far exceed the expectations of most analysts a year ago. Edge AI is moving from "proof of concept" to "large-scale deployment." I. Qualcomm's Strategic Move: Dragonwing Dual-Processor Chip Released to Boost Edge AI On the eve of the 2026 IFA Berlin, Qualcomm officially launched two processors , the Dragonwing Q-2390 and IQ-2390. The Q-2390 highly integrates edge AI inference, cellular connectivity, positioning, and display support into a single chip, aiming to lower the development threshold for edge AI devices. The IQ-2390 focuses on enhancing machine vision acceleration, TSN (Time-Sensitive Networking) support, and has a wide operating temperature range of -30°C to +115°C , designed for demanding scenarios such as industrial automation, machine vision, and energy management. Qualcomm's core intention in this announcement is to reduce the complexity of implementing edge AI in industrial scenarios through chip-level integration and industrial hardening. II . Edge AI Market: A Trillion-Dollar Track Accelerating The market size of edge AI is expanding at an astonishing rate. According to a recent report by Global Market Insights, the global edge AI market is valued at approximately $25.2 billion in 2025, projected to reach $30.9 billion in 2026, and is expected to grow to $225.5 billion by 2035, representing a compound annual growth rate (CAGR) of 24.7% from 2026 to 2035. Data from Mordor Intelligence also corroborates this trend: the edge AI hardware market is projected to grow from $25.08 billion in 2025 to $30.74 billion in 2026, reaching $68.73 billion in 2031 . The global edge AI market (hardware + software + services) is approaching $47-50 billion in size by 2026, with a year-on-year growth rate exceeding 28% . IDC predicts that the overall edge computing market will reach $450 billion by 2029, with AI being the primary growth engine . From a regional perspective, the Asia-Pacific region is the fastest-growing edge AI market globally . China, as a core growth engine, leads the world in shipments of edge devices equipped with domestically produced computing chips. Bulk procurement in areas such as smart security, smart cities, and factory automation continues to drive demand, with the domestic market growing at an annual rate exceeding 34% . III . The AI-driven transformation of the module industry: From "connectivity" to "computing + connectivity" The explosive growth of the edge AI market is profoundly reshaping the competitive logic of the module industry. Traditional module manufacturers heavily rely on the number of connections and shipment growth, but this model is encountering bottlenecks. In the first quarter of 2026, shipments of AI embedded cellular IoT modules declined by 17% year-on-year, marking the first decline after 12 consecutive quarters of growth in the market. The penetration rate of AI modules in global cellular IoT modules is currently only about 6%—meaning that edge AI modules are still on the verge of explosive growth, rather than a red ocean market . Meanwhile, leading companies in the industry are accelerating their transformation towards "connectivity + intelligence." Quectel Wireless Solutions' revenue in the first half of 2026 reached RMB 15.259 billion, a year-on-year increase of 32.16%, with automotive, intelligent, and solutions businesses accounting for 46.76% of revenue. Furthermore, the gross profit margin of this segment (21.42%) is significantly higher than that of traditional communication module businesses (16.28%) . Andrew Zignani, Senior Research Director at ABI Research, pointed out that wireless connectivity is no longer just about connecting devices; it's also about enabling scalable edge AI in consumer, enterprise, and industrial markets . IV . Trends in Module Products Driven by Edge AI The large-scale deployment of edge AI is reshaping the definition of module products from three dimensions. Trend 1: From "Communication Modules" to "Computing Modules" . The integration of AI edge computing chips has become the core differentiator for modules in 2026. Shipments of modules supporting edge inference exceeded 80 million units in 2025, and this proportion is expected to rise to 35% of total module shipments by 2030. The compound annual growth rate of high-performance computing modules is projected to reach 60% over seven years, and the proportion of intelligent and AI modules in cellular IoT modules will continue to increase. Trend Two: Industrial-grade wide operating temperature range becomes the "entry ticket ." Wide operating temperature capability reflects the stringent reliability requirements of modules in industrial edge AI scenarios. Industrial-grade modules typically require an operating temperature range of -40℃ to +85℃. In scenarios such as oil and gas, power, and outdoor infrastructure, wide operating temperature capability directly determines whether the equipment can operate stably in real-world environments. Trend 3: Multi-technology integration becomes standard . Edge AI scenarios often require simultaneous support for multiple connectivity methods—industrial automation needs Wi-Fi/Bluetooth for inter-device communication, energy management needs PLCs to solve the problems of transmission through walls and over long distances, and industrial gateways need cellular networks to upload data to the cloud. Modules with single communication methods are being replaced by integrated solutions that combine multiple modes . V. Qogrisys's Product Strategy: AI Capabilities Connected to the Base Amid the industry wave of module manufacturers moving towards AI, QOGRISYS's strategic path clearly demonstrates the industry logic of integrating "connectivity + computing". Qogrisys's strategic path can be summarized as follows: using high-speed connectivity as the foundation and edge AI as the incremental factor, to build an intelligent module product matrix covering multiple scenarios. Wi-Fi 7 Module: Full Product Lineup In the Wi-Fi 7 field, O2072PM and O2072PB, two Wi-Fi 7 + Bluetooth 6.0 combo modules based on the Qualcomm QCC2072 chip, fully support 4K QAM, 320MHz channels, MLO (Multi-Link Operation), with a peak rate of 5.8Gbps and eMLSR enhanced multi-link switching. The O2072PM uses an M.2 Key E interface (22×30mm), making it suitable for high-end robots and industrial equipment. From an industry trend perspective, Wi-Fi 7 is rapidly entering a large-scale deployment phase. IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN-dependent AP revenue. The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next stage . Multi-platform and multi-scenario coverage Qogrisys's core R&D team has long been deeply involved in mainstream global wireless chip platforms such as Qualcomm, Realtek, and MediaTek, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing . This multi-platform, full-stack technical capability enables Qogrisys to provide compatible connectivity solutions across different customers' main control solution ecosystems. In terms of application scenarios, Qogrisys's product matrix has extended to multiple core areas of edge AI: industry and intelligent manufacturing , modules such as O9201PM have completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in scenarios such as industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, and digital signage. robotics and embodied intelligence , the ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form an invisible infrastructure for cloud-edge-device collaboration—robots upload sensor data to edge servers in real time for VLA model inference, receive decision commands, and execute them instantly. Qogrisys's Wi-Fi 7 module product line already covers the needs of high-end robots and industrial equipment. VI. Trend Analysis: Three Certain Directions for Edge AI Modules Based on Qualcomm's chip release trends, three definite trends can be identified in the field of edge AI modules: First, AI capabilities will become a standard feature rather than an optional feature for modules. As the report "Edge Intelligence 2026: The First Year of Large-Scale Deployment" points out, 2026 has become a crucial turning point for edge intelligence, moving from proof-of-concept to large-scale deployment. The market space for pure connectivity modules lacking AI acceleration capabilities will continue to shrink. The seven-year compound annual growth rate of intelligent modules and AI modules reached 60% and 28% respectively , and this difference in growth rate is the strongest evidence of this. Second, industrial scenarios represent the most certain high-value market for edge AI modules. The industrial AI accelerator chip market is expanding at an average annual growth rate of 40%. Industrial visual inspection is migrating from traditional algorithms to deep learning, and predictive maintenance is generating explosive demand for edge inference computing power. Third, the convergence of "connectivity + computing" modules will become the infrastructure of the AIoT era. Wi-Fi 7 provides a connection base with ultra-low latency and ultra-high throughput, while edge AI provides localized intelligent decision-making capabilities. When the coverage density of Wi-Fi 7 and the computing power density of edge AI converge at the device end, the module will be upgraded from a "communication component" to an "intelligent computing node".    

On August 31, 2026, a report by CCTV Finance shook the entire semiconductor industry. According to industry research data, the demand for domestically produced AI chips in 2026 was approximately 4 million units, while actual deliveries were only around 3 million units, leaving a capacity gap of millions . Some high-end computing power companies already had orders booked three years into the future .   What is the connection between this "computing power famine" in the cloud computing field and the Wi-Fi, Bluetooth, and PLC modules shipped every day? The answer lies hidden in three transmission paths. I. Three transmission paths of computing power shortage Path 1: Structural shortage of memory chips The insane demand for high-bandwidth memory (HBM) from AI servers is reshaping the global DRAM supply landscape. Memory manufacturers are prioritizing capacity for the more profitable AI-grade HBM while cutting production of traditional memory chips such as LPDDR4 . According to TrendForce data, traditional DRAM contract prices rose by 90% to 95% quarter-on-quarter in the first quarter of 2026. Entering the second quarter, general DRAM contract prices continued to rise by 58% to 63% quarter-on-quarter, while NAND Flash contract prices rose by 70% to 75% . Changxin Memory Technologies, a leading memory chip company, reported revenue of 150.3 billion yuan in the first half of the year, a staggering 873.64% year-on-year increase. For Wi-Fi and Bluetooth modules that require the integration of DRAM and Flash, this means that the BOM cost is systematically increased . Path Two: Cost Resonance Across the Entire Industry Chain The surge in demand for AI chips has not only driven up storage prices but has also triggered a chain reaction of price increases across the entire industry chain. On July 1, 2026, ASE Technology Holding Co., Ltd., the world's leading semiconductor packaging and testing supplier, announced another round of price increases for its packaging products, with the highest increase exceeding 20% , primarily targeting advanced packaging categories such as CoWoS and FoCoS . There is still approximately a 10% supply-demand gap in advanced packaging technologies . From components such as crystal oscillators, PCBs, MLCCs, and inductors, to semiconductor stages such as chip packaging and testing, substrates, and silicon wafers, rising costs are passed down through each stage to the module stage. The BOM cost of each Wi-Fi/Bluetooth module is passively increasing . Path Three: The "Siphoning Effect" of Production Capacity AI chips are not only consuming advanced process capacity, but also taking up a large amount of mature 8-inch wafer capacity. Wafer fabs and packaging and testing plants are prioritizing capacity for high-profit AI computing power orders, squeezing the capacity of IoT chips. Yole projects the 2.5D/3D advanced packaging market to reach nearly $35 billion by 2030. Industry experts generally anticipate that the tight supply and demand situation for advanced packaging will continue . Counterpoint predicts that the average selling price of cellular IoT modules will face upward pressure in the second half of 2026 , primarily due to the continuously rising cost of memory . This means that the production capacity of IoT chips such as Wi-Fi and Bluetooth may face long-term pressure, with tight supply and extended delivery times becoming the norm. II. A Tale of Two Extremes: Industry Differentiation Amidst Computing Power Shortages The "Ice" Side: Short-Term Pain The most direct impact of the AI chip shortage on the module industry has already begun to appear in the data. According to a report released by Counterpoint Research, shipments of embedded AI cellular IoT modules declined by nearly 17% year-over-year in the first quarter of 2026 , marking the first decline after 12 consecutive quarters of growth . In 2025, this category maintained a year-over-year growth of 19% . As memory costs rise, the average selling price of embedded AI cellular modules has increased by double digits , forcing module manufacturers to raise prices. Ultimately, the increase in hardware costs has affected demand across various application areas . Meanwhile, global shipments of cellular IoT modules grew by only 4% year-on-year in the first quarter of 2026 , marking the first time they had fallen to single digits after seven consecutive quarters of double-digit growth . Shipments in the Chinese market declined by 2% year-on-year in the same quarter . The "Fire" Side: Long-Term Opportunities However, short-term cost pressures have not changed the industry's long-term direction. A report by Shanxi Securities points out that IoT modules are evolving from basic communication functions towards high computing power and intelligence. Counterpoint Research predicts that by 2030, the penetration rate of artificial intelligence in cellular modules will reach 25% . "Artificial intelligence will no longer be limited to a few niche applications, but will become a standard feature." In the Wi-Fi sector, the global Wi-Fi module market size is projected to reach $16.82 billion in 2026, representing a year-on-year growth of 17.9% . The market share of Wi-Fi 7 modules will rapidly climb to 17.2%, with an estimated 234 million units shipped throughout the year . IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN AP revenue, a significant increase compared to 11.8% in the first quarter of 2025. The Wi-Fi Alliance predicts that global Wi-Fi 7 device shipments will reach approximately 1.1 billion units in 2026 . III. The Response Logic of Module Manufacturers: From "Passive Pressure" to "Proactive Breakthrough" Faced with the cost impact across the entire industry chain caused by the shortage of cloud AI chips, Shenzhen Qogrisys has transformed external pressure into an upgrade impetus through its contingency strategies: On the supply chain side , we have established deep ecological collaborations with chip manufacturers such as Qualcomm, Realtek, Wuqi, and HiSilicon, upgrading the procurement relationship to a "joint development + capacity lock-in" model, so as to ensure supply stability during periods of tight capacity through large-scale operations and long-term cooperation. On the product side , the company aims to mitigate risks through full-scenario coverage. The Wi-Fi 7 module (O2072PM/ O2072PB ) is positioned to capitalize on the next-generation high-speed connectivity window, the PLC module (3121N-H/S130N-ISI) serves as a cost "ballast" with low storage dependence, and the domestic innovation module (O9201SB/O9201PM) enters the 2.66 trillion yuan domestic substitution market. At the same time, the company is also developing cutting-edge technologies such as Wi-Fi HaLow and AIoT modules. On the service side , the company is shifting from "selling standard products" to "selling deeply customized solutions," enhancing customer loyalty with a complete hardware platform foundation and full-chain technical services. On the compliance side , products have obtained certifications from multiple countries, including FCC, CE, and SRRC, circumventing trade barriers. This cost shock caused by the shortage of AI computing power is accelerating the weeding out of weaker players in the module industry, while deep ecosystem collaboration, a full-scenario product matrix, and customized service capabilities are becoming the core barriers for module solution providers to weather the cycle. IV. The "Safe Haven" Effect of PLCs In this round of AI chip shortages, PLC (Power Line Carrier) modules are relatively less affected . PLC modules have a lower reliance on high-bandwidth memory, unlike high-end Wi-Fi/Bluetooth modules which require the integration of large-capacity DRAM and Flash. PLC main control chips mostly use mature manufacturing processes, and although they also face some capacity constraints, the extent is far less than that of AI-related chips. In major PLC application scenarios such as smart lighting and smart homes, the requirements for real-time performance and stability are higher than computing power, and the impact of the AI chip price surge is relatively indirect. When Wi-Fi/Bluetooth modules face a comprehensive cost increase, PLC modules become a relatively cost-effective and stable connection solution. V. From “Selling Connectivity” to “Selling Connectivity + Computing”: A Paradigm Shift in the Module Industry This computing power shortage reveals a deeper industry trend: the module industry is moving from "single connectivity" to comprehensive competition involving "connectivity + computing + ecosystem". According to data from IoT Analytics, the number of connected IoT devices worldwide reached approximately 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030. This increase in the number of devices is only the first layer of change; more importantly, an increasing number of IoT devices are beginning to possess AI algorithms, NPUs, local inference, voice interaction, and edge computing capabilities . This means that the amount of data generated and processed by terminal devices is constantly increasing, which places higher demands on wireless modules— not only to "transmit faster", but also to "calculate closer and connect more stably" . VI. Conclusion While everyone is chasing the "brain" of computing power, even the most powerful brain needs a sensitive "neural network" to perceive the world and transmit instructions. Wireless modules are an indispensable neural network in this AI era. As CCTV Finance reported, the underlying reason for this round of growth is not just passive price increases due to "shortage," but also proactive choices driven by "ease of use." Domestically produced chips have crossed a critical point in terms of performance and stability, moving from "usable" to "easily usable." The same logic is unfolding in the wireless module industry— modules are moving from "connectivity" to "good connectivity," and from "connectivity" to "connectivity + intelligence . "  

From August 26th to 28th, 2026, the 25th IOTE International Internet of Things Exhibition was grandly held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall) . With a massive exhibition area of 80,000 square meters, this year's exhibition brought together over 1,000 high-quality exhibitors from around the world, attracting 48,109 industry professionals and over 3,000 overseas visitors on the first day . The exhibition, themed "Edge Intelligence, Scenario Deepening, and Green Sustainability," was a major collaboration between AGIC 2026 Shenzhen International General Artificial Intelligence Industry Expo and GERX Global Embossed Intelligent Robot Industry Expo, achieving deep integration of IoT technology with general AI and robot intelligence .   The strongest signal released by this exhibition is that edge AI and wireless connectivity are moving from "evolving independently" to "deeply coupled". Hall 12 showcases top achievements such as AI chips, edge computing, and embodied intelligent robots , while Hall 10 focuses on industrial IoT and communication modules . The coordinated layout of the two halls itself constitutes a spatial interpretation of the "AI + connectivity" industrial logic. I. Industry Logic: Why "Connectivity" Must Embrace "Computing" The integration of edge AI and wireless modules is essentially a technological evolution driven by industry demands. The centralized model, which relies solely on cloud computing power, is encountering multiple bottlenecks: industrial control scenarios require millisecond-level response times, which cloud round-trip latency cannot meet; medical and security scenarios are highly sensitive to data privacy, and uploading data to the cloud poses compliance risks; and the continuous uploading of data by massive IoT devices is driving up bandwidth and cloud computing costs. The standard architecture for AI implementation is becoming one where the terminal handles perception, the edge handles inference, and the cloud handles training and coordination—each with its own specific role. This trend is clearly supported by data. According to a report released by IIM Information, the global wireless module market is expected to reach $48.62 billion in 2026, a 17.8% increase from $41.27 billion in 2025. Among these developments, the integration rate of AI-dedicated acceleration chips in modules continues to climb , and shipments of emerging AI edge inference modules (integrated NPU) exceeded 12 million units in the second quarter of 2026 , marking a shift in modules from simple transmission units to computing power nodes. Meanwhile, Wi-Fi 7 modules support 320MHz bandwidth and 4096-QAM modulation, and are expected to see significant adoption in routers, VR/AR devices, and other applications in 2026 . Wireless modules are evolving from "data transmission pipelines" to "intelligent connectivity bases" with local intelligent processing capabilities. The competitive logic of next-generation wireless communication modules is undergoing profound changes: from single Wi-Fi connectivity to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence . II. IOTE 2026 Exhibition Confirms: Integration Has Become an Industry Consensus At IOTE 2026, leading global wireless connectivity companies clearly outlined the industry landscape of this trend through their respective product portfolios. From chip manufacturers to module solution providers, the core positions of their booths were generally occupied by edge AI-related solutions—whether it was a wireless SoC integrating AI/ML hardware accelerators or a main control platform for embodied intelligence and generative AI terminals, the strategic focus of leading players in the industry has clearly shifted towards dual-core capabilities of "communication + computing". Among the numerous innovative product awards presented concurrently with the exhibition, edge AI computing modules and high-performance AI chips occupied prominent positions. Several exhibitors showcased edge AI demonstration solutions supporting features such as local keyword wake-up and real-time face and gesture recognition. Meanwhile, the exhibition of supporting technologies such as high-precision wireless sensing and multi-protocol fusion further enriched the capabilities of wireless connectivity in AI scenarios. The exhibition clearly demonstrates that competition in the wireless connectivity field has evolved from a simple contest of "communication performance" to a comprehensive competition of "communication + computing" capabilities . Simply providing high-speed, stable data transmission channels is no longer sufficient to create a differentiated advantage. The ability to provide computing power support and intelligent collaboration for edge AI applications on top of connectivity capabilities is becoming a new benchmark for measuring the technological strength of module manufacturers. III. Application Scenarios: Where to Deploy Edge AI + Wireless Modules The integration of edge AI and wireless modules is being rapidly implemented in multiple vertical scenarios.   Industrial manufacturing is one of the most mature scenarios for the integration of edge AI and wireless modules. Hall 10 of the exhibition focuses specifically on industrial IoT and embedded solutions, connecting three major technology tracks: intelligent sensing, IoT communication, and precise positioning . In intelligent manufacturing scenarios, AGV/AMR autonomous transport vehicles, industrial sensors, and monitoring systems have rigid requirements for low-latency wireless connectivity and local AI inference capabilities. Wireless modules need to provide stable connectivity in high-interference industrial environments, while providing a communication foundation for AI applications such as visual inspection and predictive maintenance on the equipment side. Smart homes and smart buildings are another important scenario. In the smart home scenario, local AI processing means that voice commands can be responded to without being uploaded to the cloud, which reduces latency and protects user privacy—this is the core value of edge AI. Smart retail and smart cities also benefit from this trend. The exhibition comprehensively covered more than 20 core application scenarios, including smart logistics and smart consumption . In the smart retail scenario, AI POS terminals, smart vending machines, and other devices need to complete inference tasks such as image recognition and behavior analysis locally, while relying on wireless modules to achieve data synchronization and remote management with the cloud. Drones and robots represent emerging high-growth sectors. Drone solutions integrate Wi-Fi modules, 5G communication, and edge AI computing capabilities, supporting applications such as long-distance image transmission, remote control, real-time image recognition, and intelligent monitoring. With the rapid development of embodied intelligent robots, the demand for high-bandwidth, low-latency wireless connectivity and local AI inference capabilities will continue to surge. IV. Qogrisys's Solution Layout: A "Smart Connection Dock" with Wi-Fi 7 + Bluetooth 6.0 In light of this industry trend, the layout of QOGRISYS Technology Co., Ltd., headquartered in Shenzhen, is highly representative. Founded in 2014, Qogrisys Technology focuses on the communication connectivity industry, committed to providing customers with comprehensive IoT connectivity solutions. The company partners upstream with chip manufacturers such as Qualcomm, Realtek, Woogi, and HiSilicon, and downstream with end customers in smart home, industrial IoT, and automotive electronics sectors. Its main products cover 2.4G/5.8G Wi-Fi modules, BLE modules, PLC modules , RF antenna components, and smart hardware solutions. Core Product: O2072PM Wi-Fi 7 + Bluetooth 6.0 Combination Module Qogrisys has launched two Wi-Fi 7 + Bluetooth 6.0 combo modules, the O2072PM and O2072PB , based on the Qualcomm FastConnect C7700 (chip code QCC2072) chip . The QCC2072 is designed to provide ultra-high-speed connectivity, with peak speeds up to 5.8Gbps, and features a 320MHz channel, 4K QAM, and Multi-Link Operation (MLO) capabilities . The O2072PM uses an M.2 Key E standard interface (22×30mm) , fully supporting 4K QAM, 320MHz channels, and MLO (Multi-Link Operation), with a peak rate of 5.8Gbps . The Wi-Fi portion complies with IEEE 802.11a/b/g/n/ ac /ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with each band supporting up to 4096 QAM modulation . The Bluetooth portion is compatible with Bluetooth 6.0, supporting dual-mode Bluetooth, Tx beamforming, MRC, LE Audio, and 2 Mbps Bluetooth Low Energy (BLE) . Of particular note is that the O2072PM also supports high-precision distance measurement (HADM/channel detection) , providing new technological possibilities for scenarios such as indoor positioning and asset tracking. The O2072PM is clearly designed to meet the "connectivity foundation" requirement in edge AI scenarios—providing stable, high-bandwidth, and low-latency wireless connectivity for high-performance edge platforms. With the continuous improvement of edge AI computing power, the low latency and high reliability of Wi-Fi 7 are becoming the core communication foundation for edge computing. The higher speed and lower latency offered by Wi-Fi 7 enable the module to achieve a better product experience across a wider range of devices . Domestic platform adaptation capabilities Qogrisys's foray into the Wi-Fi 6 field is also noteworthy. Its O9201 SB/ O9 1 01 SA/ O9201PM series modules have completed driver adaptation and verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in industrial tablets, edge computing gateways, industrial control equipment, and other scenarios. This demonstrates Qogrisys's deep technical accumulation in adapting to domestic platforms and wireless connectivity. In terms of product portfolio, Qogrisys is building a complete wireless connectivity solution covering Wi-Fi 4/5/6/7 and BLE, following the path of "using a full hardware platform as the foundation and vertical scenarios as the direction" . V. Outlook: The Era of "Intelligent Connectivity" in the Module Industry Looking ahead to 2026-2030, the industry will enter the era of "intelligent connectivity." Edge AI modules have become a new growth engine for the wireless module industry. According to an IIM report, the global wireless module market is projected to exceed $90 billion by 2030, with edge AI and satellite direct connection modules expected to grow at a compound annual growth rate of over 30%. The deep integration of edge AI and wireless modules is not an optional "icing on the cake," but an inevitable path for industry development . For wireless module manufacturers, their ability to synergize with edge AI platforms beyond mere connectivity, and to provide a highly reliable communication foundation for edge AI applications, will determine their position in the next stage of competition. The IOTE 2026 exhibition showcases a true picture of this ongoing transformation—from "connecting everything" to "intelligently connecting everything." Qogrisys Technology, with Shenzhen as its origin, Wi-Fi 7 + Bluetooth 6.0 as its connectivity platform, and full-scenario coverage as its goal, is contributing its strength to this transformation.  

Smart connected vehicles are emerging as one of the most确定性 growth trajectories in the global technology industry.   China's intelligent connected vehicle production is projected to reach 14.064 million units in 2026, with market penetration expanding to 38.40%. From 4.6915 million units in 2021 to 14.064 million units in 2026, this figure has nearly tripled in just five years, representing a compound annual growth rate of 24.8%. Revenue from in-vehicle intelligent connected solutions is expected to reach 236.5 billion yuan. iiMedia Research data shows that China's intelligent connected vehicle application service market has already reached 222.3 billion yuan in 2025. On a global scale, the growth trajectory is equally steep. Research and Markets data indicates that the global connected vehicle technology market will grow from $45.99 billion in 2025 to $51.86 billion in 2026, reaching $84.54 billion by 2030 at a CAGR of 13%**. The broader connected cars market is forecast to expand from $105.67 billion in 2025 to $121.23 billion in 2026, and further to **$214.42 billion by 2030 at a CAGR of 15.3%. According to TechNavio, the global connected car market is forecast to grow by $161.69 billion during 2025-2030, accelerating at a CAGR of 17.2%. Communication and navigation terminals are transitioning from vehicle "options" to "standard equipment" —this is not incremental improvement but a structural reconfiguration of the industry's underlying logic. The connectivity demands of intelligent connected vehicles are extending in two directions: inside the vehicle, intelligent cockpits require high-bandwidth, low-latency wireless connectivity; outside the vehicle, charging infrastructure demands intelligent communication via power line carrier technology. Ofeixin Technology delivers a full-stack connectivity solution covering both the "vehicle side" and the "energy side" of intelligent connected vehicles, with Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions and PLC charging pile communication solutions. I. The Bandwidth Revolution in Intelligent Cockpits: Wi-Fi 7 Ushers in a New Era of In-Vehicle Connectivity Wi-Fi 7, as the next-generation standard following Wi-Fi 6, is becoming the core infrastructure for wireless connectivity in intelligent cockpits. In January 2026, the Wi-Fi Alliance officially opened Wi-Fi 7 certification. From certification opening to module mass production delivery, the pace of commercialization for this technological iteration has far exceeded market expectations. Automotive-grade Wi-Fi 7 modules completed AEC-Q104 qualification and entered small-batch trial production in Q4 2025, with theoretical peak data rates 4.8 times higher than Wi-Fi 6, significantly supporting high-bandwidth scenarios such as high-definition map streaming updates and in-vehicle AR navigation. Industry players have already demonstrated clear commercialization signals—LG Innotek has secured orders from a leading European automotive parts supplier to begin shipping automotive-grade Wi-Fi 7 and Bluetooth wireless communication modules in 2027, with the order valued at approximately $68 million. The global automotive Wi-Fi/Bluetooth module market is projected to reach $4.28 billion in 2026, surpassing $6.83 billion by 2030. Wi-Fi modules have become a core procurement category in the intelligent cockpit domain, accounting for 76% of Wi-Fi module procurement demand. Single-chip solution shipments accounted for 42.5% of total volume in 2025 and are expected to exceed 50% in 2026. Chinese domestic OEM procurement demand for dual-band concurrent modules grew 23% year-over-year in 2025, making China the fastest-growing single market globally. In the Wi-Fi 7 automotive module space, Ofeixin Technology has completed a flagship product lineup. The O2072PM (PCIe M.2 interface) and O2072PB (SMD version) are automotive-grade Wi-Fi 7 modules designed based on Qualcomm's QCC2072 (FastConnect C7700) chipset. Both modules comply with IEEE 802.11a/b/g/n/ac/ax/be standards, support tri-band 2.4 GHz/5 GHz/6 GHz concurrent operation, with 6 GHz band channel bandwidth up to 320 MHz, and peak data rates reaching 5.8 Gbps. Both modules support Enhanced Multi-Link Single Radio (eMLSR) and 2×2 Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling flexible frequency resource scheduling in scenarios with multiple in-vehicle concurrent connections and complex signal interference. The O2072PM and O2072PB are among the few module products on the market that simultaneously support Wi-Fi 7 and Bluetooth 6.0, with the Bluetooth section directly supporting Bluetooth 6.0 and Channel Sounding functionality—providing a complete technology foundation for high-precision positioning scenarios such as digital car keys. II. From "Connectivity" to "Perception": Bluetooth 6.0 Redefines Human-Vehicle Interaction Bluetooth technology is undergoing an upgrade from a "connectivity tool" to a "perception infrastructure." Bluetooth 6.0's introduction of Channel Sounding technology brings centimeter-level high-precision distance measurement capability to Bluetooth. Channel Sounding combines RTT (Round-Trip Time) and phase-based ranging to achieve high-precision distance measurement, representing a qualitative leap from the meter-level error of traditional BLE solutions that relied on RSSI (Received Signal Strength Indicator). Bluetooth Channel Sounding technology achieves accuracy within 0.5 meters with relay attack protection, and will be the first to be deployed in automotive digital car keys in 2026. Industry solutions have already matured. Quectel released its next-generation automotive digital key solution in April 2026, featuring BLE 6.0 + UWB + NFC tri-mode fusion technology. Yuanfeng Technology also announced it will be the industry's first to launch a multi-node Bluetooth 6.0 Channel Sounding technology solution in the second half of 2026. Industry data shows that over 13.2 million vehicles were equipped with digital key functionality as standard in 2025. Bluetooth device annual shipments are projected to reach 5.9 billion units in 2026, with the 2030 annual shipment forecast reaching 8.1 billion units. The Bluetooth 6.0 market was valued at $5.42 billion in 2025 and is expected to grow to $17.47 billion by 2035. According to DIGITIMES, Bluetooth Channel Sounding, leveraging its established ecosystem advantages, is penetrating the precision ranging market, with large-scale adoption by application vendors expected to commence from the second half of 2026 through 2027. The O2072PM and O2072PB modules from Ofeixin Technology, with their integrated Bluetooth 6.0 functionality, offer distinct advantages in digital car keys, in-vehicle personnel positioning, and other scenarios. Both modules support High Accuracy Distance Measurement (HADM), LE Audio, 2 Mbps Bluetooth Low Energy, and other complete Bluetooth features. Bluetooth shares an antenna with 2.4 GHz WLAN while operating concurrently with 5 GHz/6 GHz WLAN, providing flexible configuration options for in-vehicle multi-protocol concurrency. Wi-Fi/Bluetooth combo module shipments reached 71% in 2026 and are expected to exceed 85% by 2030. Ofeixin's O2072PM/O2072PB solution is a representative example of this trend—delivering high-speed Wi-Fi connectivity and precise Bluetooth perception simultaneously on a single module, providing intelligent cockpits with an integrated "one network, multiple capabilities" solution. III. The "Invisible Communication Network" of Charging Infrastructure: PLC's Mandatory Upgrade Window In the industrial landscape of intelligent connected vehicles, charging infrastructure is an indispensable component. And PLC (Power Line Communication) technology is emerging as the core solution for electric vehicle charging pile communication. EU regulations are mandating a comprehensive upgrade of charging pile communication methods. Under EU Delegated Regulation (EU) 2025/656, which sets a mandatory compliance deadline of 2027, developing next-generation smart AC charging piles that comply with EN ISO 15118-20:2022 has become the only path for products to enter the European market. This means the traditional PWM communication method will be phased out, with a complete transition to high-layer communication based on GreenPHY Power Line Communication (PLC), with mandatory integration of Plug & Charge (PnC) and Vehicle-to-Grid (V2G) capabilities. The global Power Line Communication (PLC) market is projected to grow from $12.74 billion in 2025 to $14.29 billion in 2026 at a CAGR of 12.1%. By 2030, the market is expected to reach $22.66 billion. Among the key growth drivers are the expansion of electric vehicle charging networks. As electrification, distributed energy resources, electric vehicle charging, and smart city programs expand, PLC is becoming an important layer in the broader industrial IoT and smart grid communications ecosystem. PLC communication requires no additional communication wiring—it transmits data while transmitting power. This "two-in-one" characteristic gives PLC a natural advantage in charging pile scenarios: no need for rewiring, directly utilizing existing power lines to complete two-way data exchange between vehicle and charging pile, and between charging pile and the cloud. Effective from January 8, 2026, all newly installed or significantly upgraded publicly accessible AC charging piles must support EN ISO 15118-2:2016. This means PLC communication capability is transitioning from a "nice-to-have" to a "must-have." Ofeixin Technology offers a complete PLC module product portfolio. The S130N-ISI is a fully integrated Power Line Communication module, designed based on the LianXinTong VC6330 chip, integrating a 32-bit ARM Cortex M3 MCU, 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module adopts LCC packaging with ultra-compact dimensions, integrating line drivers on-chip with low power consumption and strong anti-noise capability. In charging piles, photovoltaic communications, and other scenarios, Ofeixin's S130N-ISI module enables reliable device communication through existing power lines—one power line, simultaneously delivering power and data. With the mandatory implementation of EU regulations and the continued expansion of global electric vehicle charging infrastructure, market demand for PLC modules in charging pile scenarios is poised for explosive growth. IV. From Cockpit to Infrastructure: The Connectivity Foundation of Intelligent Connected Vehicles Intelligent connected vehicles and the Internet of Vehicles are racing ahead at a compound annual growth rate exceeding 30%. In this process, in-vehicle wireless communication modules have transitioned from "behind-the-scenes配角" to "core hub." On the intelligent cockpit side, they are the transmission channels for multi-screen interaction, the positioning foundation for digital car keys enabling keyless entry, and the connectivity safeguard for OTA upgrades ensuring continuous vehicle evolution. On the charging infrastructure side, they are the communication cornerstone enabling intelligent functions such as Plug & Charge and V2G bidirectional charging. Ofeixin Technology's in-vehicle connectivity solutions present a clear "dual-track" architecture: On the intelligent cockpit and digital key front, the O2072PM and O2072PB deliver Wi-Fi 7 + Bluetooth 6.0 combination, covering differentiated requirements from high-end intelligent cockpits to next-generation digital car keys. The 5.8 Gbps peak data rate supports the high-bandwidth demands of multi-screen HD video streaming and in-vehicle AR navigation; Bluetooth 6.0 Channel Sounding provides centimeter-level precise positioning foundation for digital car keys. The interface format differences between the two modules—PCIe M.2 versus SMD package—offer flexible selection options for different in-vehicle hardware architectures. On the charging infrastructure front, the S130N-ISI and other PLC module products are addressing the mandatory upgrade requirements brought by new EU regulations, providing GreenPHY PLC communication capability compliant with ISO 15118-20 standards for charging piles. With upstream partnerships with Qualcomm and other leading chip original equipment manufacturers, Ofeixin Technology rapidly transforms the latest chip platforms into mass-producible module products. From Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions to charging pile PLC communication solutions, the full-stack coverage enables Ofeixin to deliver complete wireless module solutions for intelligent connected vehicles—from in-vehicle connectivity to infrastructure communication. This represents both the completeness of the product portfolio and the flexibility to address different scenarios and requirements. Looking ahead to 2027-2030, composite communication modules integrating 5G cellular are gradually penetrating mid-to-low-end vehicle segments, while software-defined vehicle architectures demand higher programmability and security isolation capabilities from modules. The rigid demand of intelligent cockpits and autonomous driving for high-speed, reliable data links, combined with the mandatory upgrade window created by EU charging pile regulations, will together ensure the long-term positive fundamentals of both the in-vehicle wireless communication and charging infrastructure communication module markets.  

On August 19, 2026, the 11th World Robot Conference (WRC) officially opened at the Beiren Yichuang International Convention Center in Beijing’s E-Town, running through August 23 under the theme “Human-Robot Symbiosis, Production-Demand Convergence.” The scale set new records: more than 300 exhibitors (up 36% year-over-year) presented over 2,000 exhibits, with more than 150 products making their global debut. More than 17,800 contestants from 26 countries are competing across the conference‘s robotics contests. If previous WRC editions were “technology showcases,” WRC 2026 is an “industrial acceptance test.” The most significant shift is structural, not cosmetic. The conference introduced four themed days — Launch Day (Aug 19), a first-ever Procurement Day (Aug 20), Developer Day (Aug 21), and Public Days (Aug 22–23). A dedicated pavilion gathered 49 centrally administered state-owned enterprises presenting 12 real-world application scenarios — one of the strongest procurement signals the Chinese robot industry has ever staged. As one observer put it: last year‘s WRC answered whether robots can work; this year the industry answers how well they work, how much they cost, who buys them, and whether they can be deployed at scale. I. WRC 2026 Signals: The “Acceptance Test” of Physical AI The signals from this year’s conference are clear and strong: the robotics industry is moving from “single-technology demonstrations” to a new phase of “technological innovation + industry-demand alignment + global collaborative governance.” Trend One: From “Muscle” to “Brain.” Goldman Sachs’ July 2026 research report explicitly noted that the industry’s center of gravity is shifting from “physical capabilities” to “intelligent decision-making.” On the WRC floor, the Beijing Humanoid Robot Innovation Center unveiled the Pelican-Unify 1.0 unified embodied model and the Tiangong Omni — a lightweight humanoid robot open platform designed for the embodied AI ecosystem. Xinghaitu demonstrated the application results of the world’s first end-to-end full-body control model. The industry consensus is forming: the ultimate competition in embodied intelligence is not in motors and joints, but in foundational models and the data flywheel accumulated through continuous interaction with the real physical world. Trend Two: From “Showing Off” to “Real Work.” On the exhibition floor, robots are doing real work rather than performing. The firefighting humanoid robot Linglong L2.0 can easily climb over rubble and stairs. Fourier’s GR-3 humanoid robot acts as an “intelligent butler assistant” in simulated home scenarios. Keenon Robotics’ XMAN series autonomously completes the entire coffee extraction process. As Li Tong, founder and CEO of Keenon Robotics, stated: “Whether robots can actually do real work is the essence of humanoid robot commercialization.” Trend Three: Accelerated Industry Chain Closure. IDC’s latest MarketGlance: China Embodied AI Robotics, 3Q26 report divides the current industry into six market segments: computing infrastructure, model algorithms, data engines, robot bodies, core components and infrastructure, and industry application agents. The four exhibition halls of WRC 2026 — Innovation, Exchange, Manufacturing, and Fun — precisely cover the complete chain from underlying technology and core components to finished robot applications. Guangdong sent 34 companies spanning the full robot supply chain, from upstream EVE Energy batteries and ORBBEC 3D vision sensors, through midstream CVTE control boards and Neoway 5G communication modules, to downstream UBTECH, Dobot, and LimX Dynamics full machines. II. Communication Modules: The Underestimated “Nervous System” When industry attention focuses on the “brain” (AI models) and the “body” (joints and actuators), a critical question emerges: connectivity is becoming a key factor in determining whether robots are truly deployable. If large models are the robot’s “brain,” then the communication network is its “nervous system” — this “brain” must process massive heterogeneous data from dozens of sensors distributed across the body within milliseconds, and issue synchronized instructions to actuators within microseconds. Whether humanoid robots or autonomous mobile robots (AMRs), actual deployment imposes unprecedented demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency. Industry research indicates that the internal and external communication architectures of robots are facing unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits. The market size for embodied AI robot-dedicated communication is expected to expand rapidly from $42 million in 2026 to approximately $300 million by 2030. More宏观 data confirms this trajectory. QYResearch shows that the global robot communication module market was approximately $8.12 billion in 2025 and is projected to reach $21.61 billion by 2032, with a compound annual growth rate of 15.1% from 2026 to 2032. Research institutions further point out that driven by market prosperity and chip specialization, communication modules will witness nearly RMB 10 billion in incremental growth. The value of the communication link is undergoing a structural reorganization — from “general industrial component” to “dedicated core component.” III. The Communication Module Ecosystem at WRC 2026 WRC 2026 clearly displays the complete ecosystem of robot communication modules. In wireless communication, Neoway Technology showcased its 5G communication modules for the midstream industry, demonstrating a rich portfolio of products and solutions for robot collaborative communication scenarios. Realtek Semiconductor exhibited its communication transmission chip integration solutions for humanoid and industrial robots, featuring Wi-Fi 8 2×2 and 5GHz 3T3R high-end wireless modules to ensure real-time protocol and high-speed data exchange between robots. The 34 Guangdong companies formed a complete closed loop from upstream power batteries and 3D vision sensors, through midstream control motherboards and 5G communication modules, to downstream finished robots. In control and communication integration, GigaDevice demonstrated joint module solutions based on GD32 series MCUs, compatible with CANopenNode protocol and equipped with CANFD and RS485 dual industrial buses. JWIPC and CVTE provided control motherboards and edge computing platforms. These highly integrated control solutions represent the typical application of PLC (Power Line Communication) technology in robot motion control — achieving precise, real-time joint control through industrial buses, which is the key neural pathway through which the robot’s “brain” commands its “body.” In perception and safety, ORBBEC demonstrated robot-dedicated 3D depth camera modules, while Lingsi Intelligent and Saigan Technology provided perception and safety modules. These modules constitute the robot’s “sensory system,” forming the foundation for environmental perception and safe interaction. IV. Qogrisys Business Portfolio: A Full-Stack Connectivity Foundation from Wi-Fi 7 to PLC In the industry landscape revealed by WRC 2026, the role of communication module suppliers is upgrading from “standard component providers” to “builders of robot nervous systems.” Qogrisys business portfolio precisely covers multiple critical dimensions of this transformation. Wi-Fi 7 Modules: High-Speed Neural Pathways for Embodied Intelligence. Qogrisys has launched Wi-Fi 7 module product lines for high-end robots and industrial equipment. Among them, the O2072PM, based on Qualcomm’s QCC2072 chip, is a Wi-Fi 7 + Bluetooth 6.0 tri-band 2×2 MIMO module supporting 2.4/5/6 GHz bands, with up to 320 MHz bandwidth across all bands, peak speeds of up to 5.8 Gbps, 4096-QAM modulation, and Multi-Link Operation (MLO) capabilities. Bluetooth supports BLE 6.0 and LE Audio. In addition, These performance metrics directly address the rigid demand for ultra-low latency and ultra-high bandwidth wireless connectivity in embodied AI robots. Bluetooth and Multi-Protocol Modules: The Foundation of Diverse Connectivity. Qogrisys‘ product portfolio covers 2.4G/5.8G/6G series Wi-Fi modules, Wi-Fi HaLow, Nearlink, and Bluetooth (BLE) modules. Its Bluetooth modules support the latest standards including BLE 6.0 and LE Audio. In robot scenarios, different communication protocols serve different connectivity needs — Wi-Fi carries high-bandwidth data backhaul, Bluetooth handles low-power device interconnection, and Wi-Fi HaLow is suitable for long-distance low-power scenarios. Multi-protocol parallelism has become a standard capability of robot communication modules. PLC Modules: The “Invisible Infrastructure” of Power Line Communication. In August 2026, Qogrisys has formed a complete technology matrix in the PLC domain. Its 3121N-H module, based on the HiSilicon Hi3121S chip, achieves a physical layer peak rate of 0.507 Mbit/s, with a single CCO supporting up to 200 STA nodes. The S130N-ISI module features an ultra-compact design measuring just 20.6 × 12.6 mm, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor. The 3121N-L module is a fully integrated power line carrier communication module equipped with an external LD amplifier and transmitter function. The unique value of PLC technology lies in “where there is power, there is network” — using existing power lines in homes or industrial settings as the data transmission medium, walls, floors, or metal structures blocking the signal. Measured data shows that PLC-IoT end-to-end response latency is stable within 50 milliseconds, with communication success rates as high as 99.99%. In industrial and service scenarios where robots need to be deployed across floors and rooms, PLC provides a stable connectivity guarantee that wireless solutions cannot. Deep Customization Capability: From Modules to Solutions. Qogrisys‘ core R&D team has long the world’s leading wireless chip platforms including Qualcomm, Realtek, WUQI, and HiSilicon, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing. In the trend of the module industry moving from standardization to deep customization, this capability enables the company to provide customized connectivity solutions for different robot form factors and application scenarios. V. Challenges and Opportunities: The Module Industry‘s “Acceptance Test” The industry trends revealed by WRC 2026 bring structural opportunities to the module industry — but challenges are equally. Supply chain pressure continues to intensify. In July 2026, the module industry experienced the most severe component price surge in recent years. PCB prices rose 10%-30%, crystal oscillators 10%-30%, inductors 30%-70%, and MLCCs 10%-70%. Packaging giant ASE officially announced price increases of up to over 20%. Passing down to the module segment, the BOM cost of every Wi-Fi/Bluetooth module is being passively pushed up. Industry report data shows that the industry‘s average gross margin in 2025 fell by 8 percentage points compared to 2024. The market side also faces divergence. Consumer IoT growth has significantly slowed, Wi-Fi 7 penetration is only 8%, and AI module shipments still account for single-digit percentages. Meanwhile, the U.S. FCC is推行 component-level bans, and EU compliance thresholds continue to rise. However, the explosive growth of the robotics industry is opening a high-value growth curve for the module industry. As IDC points out, the robotics industry is transitioning from technology demonstrations and point breakthroughs to product delivery, scenario deployment, and industrial collaboration. IDC‘s 2026 Global CEO Survey shows that 35.2% of CEOs rank Physical AI as a key new technology investment area to focus on over the next 12-24 months. At the opening ceremony, Vice Minister of Industry and Information Technology Xin Guobin stated that Chinese robotics enterprises’ revenue topped RMB 300 billion ($44.45 billion) in 2025, with average annual growth exceeding 20% over the past five years. In the first half of 2026, revenue reached RMB 165.5 billion, up 24.5% year-on-year. Ministry of Industry and Information Technology data shows that China‘s annual humanoid robot production is expected to exceed 100,000 units in 2026. Morgan Stanley has raised its 2026 domestic humanoid robot shipment forecast from 28,000 to 50,000 units, projecting 446,000 units by 2030. Every robot requires communication modules as its “nervous system” — this is not only growth in volume but also a leap in the value of communication modules per robot.     Conclusion WRC 2026 clearly declares to the world: the robotics industry has crossed the stage of “can we build it” and officially entered a new era of “can we use it well and sell it.” In this new era, communication and connectivity technology is no longer an “optional accessory” for robots, but a “core organ.” From the high-speed wireless neural pathways of Wi-Fi 7, to the invisible backbone of PLC over power lines, from the low-power interconnection of Bluetooth, to the wide-area coordination of 5G — the module industry is moving from behind the scenes to center stage, becoming a key force in defining the performance boundaries of robots. For module manufacturers, this is not just a market opportunity to supply components, but a strategic opportunity to deeply participate in and define the future form of robots by providing smarter, more integrated, and more reliable connectivity solutions. As robots move from “showing off” to “delivery,” the module industry is likewise welcoming its own “acceptance test.”  

As Wi-Fi evolved from Wi-Fi 6 and Wi-Fi 6E to Wi-Fi 7, the industry's focus shifted to high-speed connectivity capabilities such as 320MHz, 4096-QAM, and MLO. However, entering 2026, a more noteworthy change is taking place: the value of Wi-Fi 7 is shifting from "faster wireless networks" to "a smarter, more reliable, and more convergent terminal connectivity platform."   At the same time, as technologies such as Bluetooth 6.0, Matter, Thread, Wi-Fi Sensing, and edge AI continue to mature, AI PCs, robots, smart homes, industrial IoT, smart healthcare, and new energy equipment are placing more complex demands on wireless connectivity. This means that the competitive logic for next-generation wireless communication modules is changing: From a single Wi-Fi connection to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence. For wireless communication module manufacturers, the real opportunity is no longer just "bringing Wi-Fi 7 into devices", but helping terminal manufacturers build more complete smart connectivity capabilities. I. Wi-Fi 7 is entering a true stage of large-scale deployment, but "high speed" is just the beginning. The most representative technologies of Wi-Fi 7 include 320MHz channels, 4096-QAM, and Multi-Link Operation (MLO). These technologies can significantly improve throughput, reduce latency, and enhance connectivity in complex network environments. However, if we only understand Wi-Fi 7 as "faster Wi-Fi", we are actually underestimating its future value in the IoT market. According to IDC data, in the first quarter of 2026, Wi-Fi 7 accounted for 44.5% of global enterprise WLAN-dependent access point (AP) revenue , a significant increase from 11.8% in the first quarter of 2025. IDC believes that Wi-Fi 7 has become a major driver of growth in enterprise wireless networks. In terms of terminal scale, the Wi-Fi Alliance predicts that global shipments of Wi-Fi 7 devices will reach approximately 1.1 billion units in 2026. Among them, IoT devices will account for approximately 196.1 million units . These two data points deserve special attention. Because it illustrates: The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next phase. For the module industry, this means that Wi-Fi 7 is expanding from "high-performance network equipment solutions" to "terminal connectivity solutions".   II. The Real Change: Wi-Fi 7 is Entering the IoT, and the IoT's Need for "Speed" is Not as High as Imagined Traditional Wi-Fi 7 emphasizes: 320MHz 4096-QAM Multi-link operation High throughput Multi-user concurrency However, many IoT devices do not require peak speeds of several Gbps at all. For example: Devices such as smart door locks, environmental sensors, smart lighting, HVAC controllers, and industrial sensors may not generate a large amount of data, but they are more concerned with: Connection stability, low power consumption, low latency, reliability under network congestion, and long-term operating capability. Therefore, a very important industry assessment is: The next wave of growth for Wi-Fi 7 may not come from "faster devices," but rather from "more devices starting to use Wi-Fi 7." This is also a structural change that the wireless module industry should pay attention to.   III. AIoT is redefining wireless modules: connectivity is only the first layer of capability. AI is changing how data is processed in IoT devices. Traditional IoT is more about: Sensor → Data Acquisition → Cloud → Command Return And AIoT is gradually becoming: Sensors/cameras/microphones → Local AI inference → Real-time decision-making → Cloud collaboration → Multi-device联动 (Multi-device linkage) This means that the amount of data generated and processed by terminal devices is constantly increasing, while requiring more stable inter-device communication. 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030 . The increase in the number of devices is only the first layer of change. More importantly, an increasing number of IoT devices are beginning to possess: AI algorithms NPU Local reasoning Voice interaction Visual recognition Multi-sensor fusion Edge computing capabilities Counterpoint Research also identified Edge AI as a key technology direction in its CES 2026 analysis, covering multiple fields such as AI vision, intelligent sensing, edge computing, and AIoT devices. Therefore, wireless modules in the AIoT era are no longer just "networked devices," but are increasingly becoming the connectivity infrastructure in terminal intelligent systems.   IV. From AI Robots to Smart Terminals: Why is Wi-Fi 7 Becoming More and More Important? Robots are a very typical example of observing this trend. A robot with vision, voice, and edge AI capabilities may simultaneously need: **Wi-Fi:** Connect to the cloud, transmit images, perform OTA upgrades, and access AI services; **Bluetooth:** Connects to mobile phones, headphones, gamepads, and other peripheral devices; **UWB/Positioning Technology:** Enables spatial positioning and device interaction; **Thread/Matter:** Connecting the smart home ecosystem; **Edge AI:** Completes local vision, speech, and behavior judgments. Therefore, future robots will not simply be "equipped with a Wi-Fi module". It's more like a: AI computing platform + multi-sensor platform + multi-wireless communication platform. The Wi-Fi Alliance's assessment of Wi-Fi trends for 2026 also explicitly mentions that AI, robotics, automotive, and predictive maintenance are driving Wi-Fi into more industrial IoT applications; in the consumer IoT field, the Matter ecosystem is also further promoting Wi-Fi applications. This means: Robots, AI terminals, smart gateways, and other new devices are likely to become important application scenarios for Wi-Fi 7 modules in the future. V. Bluetooth 6.0 is changing the definition of "Bluetooth module" If Wi-Fi 7 is solving the problem of "high-speed, reliable connectivity", then Bluetooth 6.0 is enabling Bluetooth to evolve from a traditional "short-range connectivity technology" to positioning, ranging, and spatial awareness . The Channel Sounding introduced in Bluetooth Core 6.0 enables more accurate distance measurement through methods such as Phase-Based Ranging (PBR) and Round-Trip Timing (RTT). The Bluetooth SIG believes that this technology will provide new application possibilities for scenarios such as digital keys, asset tracking, smart homes, and industrial equipment. The Bluetooth SIG predicts that global annual shipments of Bluetooth devices will reach approximately 5.9 billion units by 2026 . This means that the application scope of Bluetooth is expanding. past: Bluetooth = connection to headphones, keyboard, mouse, and mobile phone future: Bluetooth = Connectivity + Location + Ranging + Device Discovery + Low Power Awareness Therefore, Wi-Fi 7 and Bluetooth 6.0 are not two independent technological paths. In an increasing number of terminal devices, both will coexist: Wi-Fi is responsible for high-speed IP connectivity, while Bluetooth is responsible for low-power device connectivity, network configuration, peripheral devices, and spatial awareness. This is why next-generation wireless modules are increasingly emphasizing the integration of Wi-Fi and Bluetooth.   VI. From Wi-Fi + Bluetooth to Wi-Fi + Bluetooth + Thread: Multi-protocol convergence is becoming a trend Smart home is the most typical application scenario for the integration of multiple protocols. A complete smart home system may exist simultaneously: Wi-Fi camera Bluetooth door lock Thread sensor Matter Smart Light Wi-Fi gateway Bluetooth remote control Different devices have completely different requirements for power consumption, bandwidth, coverage, and network topology. Therefore, the future of smart homes is not about one protocol "eliminating" another, but about different protocols taking on different roles. More notably, solutions have emerged in the market that integrate Wi-Fi 7, Bluetooth LE, and Thread/802.15.4 onto the same chip platform. This shows that: Multi-protocol integration has moved from the "concept" stage to the productization stage of chips and modules. VII. The real competition in wireless modules is shifting from "chip performance" to "system integration capabilities". The chip is the core of the wireless module, but the chip itself cannot directly determine the connection experience of the final product. From chip to end product, there are still many engineering steps in between: Chip → RF Design → PA/LNA → Filtering and Matching → Antenna → PCB → Driver → Operating System → Protocol Stack → Authentication → Mass Production The issue of radio frequency coexistence will become even more important as Wi-Fi and Bluetooth are increasingly integrated into the same module. 8. From Chips to Modules: The Industry Chain is Entering a "Platformization" Stage From the current perspective of the industrial chain, this change is already quite evident. Qualcomm is continuing to advance Wi-Fi 7, Bluetooth, and next-generation wireless connectivity platforms for AI experiences. Its official product roadmap has expanded from Wi-Fi 7 to Wi-Fi 8, which emphasizes reliable and intelligent connectivity. Chip manufacturers such as Realtek are also continuously promoting the integration of wireless connectivity capabilities such as Wi-Fi 6E, Wi-Fi 7, and Bluetooth. Meanwhile, domestic manufacturers are accelerating their entry into the high-performance Wi-Fi market. QOGRISYS has already developed Wi-Fi 7 and Wi-Fi 6 modules based on Qualcomm and Wuqi chips , supporting applications such as 2T2R, dual-band, and SDIO. The underlying industry logic is very clear: Chip manufacturers provide the connectivity platform, while module manufacturers are responsible for truly transforming chip capabilities into end-user, mass-producible, and certifiable products. Future module platforms may simultaneously possess: Wi-Fi + Bluetooth + Thread/802.15.4 + AI computing + Sensing Wireless modules are evolving from "a communication device" to "a smart connectivity platform". 9. QOGRISYS: Extending from Wi-Fi modules to multi-scenario wireless connectivity capabilities For terminal equipment manufacturers, standard upgrades are only the first step. Real product development also needs to consider: Performance, size, power consumption, interface, antenna, radio frequency, operating system, certification, and mass production cost. This is also the key value of QOGRISYS's long-term strategic layout in wireless communication modules. In terms of product portfolio, QOGRISYS has formed a product layout that includes Wi-Fi modules, Bluetooth modules, Wi-Fi HaLow, NearLink, PLC modules, and IoT/AIoT modules , covering application areas such as artificial intelligence, smart home, industrial internet, consumer digital products, telemedicine, and new energy. Regarding Wi-Fi 7 products, O2072PB, O2072PM, and other products are currently listed on the O2072PB/O2072PM product page. Among them, O2072PB/O2072PM are labeled as 802.11be + Bluetooth 6.0, 2T2R, and 5.8Gbps . This means that there is a relatively direct correspondence between QOGRISYS's product roadmap and industry trends: Wi-Fi 7 → High-performance wireless connectivity Bluetooth 6.0 → Low-Power Connectivity and Spatial Awareness AIoT → Local Intelligence and Edge Computing PLC → Energy and Industrial IoT Communication Multi-protocol → Converged connectivity for complex terminal scenarios Therefore, a more complete connectivity technology chain is being formed, from chips to modules, and then from modules to end applications. 10. The true value of Wi-Fi 7 lies in making the connection between smart devices more reliable. If you look at the development of the entire industry together, you'll find that the significance of Wi-Fi 7 is changing. Wi-Fi 4 era: Solve the problem of "Is there a wireless network?". The Wi-Fi 5 era: Solve the problem of "Is the wireless network fast enough?" Wi-Fi 6 era: How to solve the problem of "many devices connecting to the network at the same time". Wi-Fi 7 era: The task began by addressing how to maintain reliable connections in high-performance, multi-device, low-latency, and complex network environments. The AIoT era has raised new questions: The device not only needs to be connected to the network, but also needs to sense, compute, coordinate, and make autonomous decisions. Therefore, Wi-Fi 7 is just the starting point of this change. The real next stage is: Wi-Fi + Bluetooth + Thread/Matter + AI + Sensing + Edge Computing Together, they form the connection base for the next generation of smart terminals.    

I. Industrial Transformation: A Decade of Leap from "Visible" to "Comprehensible" Over the past decade, the security monitoring industry has undergone a profound transformation, evolving from analog to digital, from wired to wireless, and from passive recording to proactive sensing. IPCs (IP Cameras) have evolved from simple video acquisition devices into distributed intelligent sensing nodes that integrate optical imaging, edge computing, intelligent analysis, and wireless connectivity. The global market size for smart IP cameras (IPCs) reached approximately US$17.389 billion in 2025, and is projected to grow to US$18.418 billion in 2026, and potentially reach US$26.092 billion by 2032, with a projected compound annual growth rate (CAGR) of 6.0% from 2026 to 2032. From a broader perspective, the global video surveillance market size was US$87.24 billion in 2025, and is projected to reach US$242.17 billion by 2034, with a CAGR of 12.01% . The core drivers of this round of growth come from three levels: the explosive growth in demand for AI video analytics from enterprises to governments, the implementation of mandatory video surveillance regulations in various regions, and the replacement of traditional on-premises deployment models by cloud-managed video platforms . II、Core technology trends: AI, wireless technology, and low power consumption are redefining product features. 2.1 AI is moving from the cloud to the edge, and its penetration rate continues to rise. Artificial intelligence is permeating every aspect of security monitoring at an unprecedented pace. The value of IPC's products has expanded from basic indicators such as image clarity, night vision capabilities, and structural protection to intelligent functions such as human detection, human and vehicle classification, facial recognition, license plate recognition, perimeter intrusion detection, voice recognition, passenger flow statistics, and event retrieval . As security systems shift from passive recording to proactive early warning, the computational burden on cameras continues to increase. Demand for edge AI inference chips is surging, with penetration expected to reach 65% by 2025, a 28 percentage point increase from 2023 . The focus of future competition will not only be on hardware parameters, but also on algorithm accuracy, false alarm control, platform openness, remote operation and maintenance efficiency, data security, and multi-scenario adaptability . 2.2 Wirelessization: From "Optional" to "Required" Wireless connectivity technology is profoundly changing the way IP devices are deployed and their application boundaries. Industry demand is expanding across multiple paths, including home consumption, commercial stores, industrial parks, urban governance, traffic management, and industrial sites. Wireless solutions can save 30% to 50% on cabling and maintenance costs , with particularly significant advantages in distributed monitoring scenarios. In terms of product structure, global shipments of consumer IPCs are projected to exceed 192 million units in 2025 , representing a year-on-year increase of approximately 11.6%. Among these, low-power IPCs account for 48 million units, and 4G IPCs account for 40.32 million units . These two product categories are driving the upgrade of IPCs from "passive monitoring" to "proactive sensing." In terms of connectivity technology, the mainstream solutions in the industry have evolved from a single Wi-Fi solution to a pattern where multiple wireless technologies coexist. 2.3 Low power consumption: Opening up new scenarios of "no power and no network". Breaking free from dependence on fixed power supplies and stable broadband networks has become an irreversible industry trend. The low-power IPC market grew by approximately 30% in 2024. It is projected to reach 25 billion yuan by 2026 . The maturity of AOV (Always on Video) technology represents a significant breakthrough in the field of low power consumption—based on ultra-low power memory and fast startup/standby technology, it enables 24/7 uninterrupted recording capability . This technology allows IPCs to record in a low frame rate power-saving mode when there are no events, significantly extending the battery life of battery-powered devices. III、Application Scenarios Panorama: From Home Security to Full-Scenario Intelligence 3.1 Home and Micro-enterprise Scenarios: The Explosion of the Consumer Market The product form in the consumer market is rapidly evolving. In the domestic market, multi-lens cameras account for 75% , becoming the absolute mainstream. Low-power products account for 25%, and 4G IPCs account for 21% . 3-megapixel to 5-megapixel cameras have become the mainstream configuration. The core needs of the home environment have evolved from "visible" to "understandable" —features such as low cost, easy installation, mobile experience, cloud storage, voice interaction, privacy protection, and pet or baby recognition have become the focus of competition . In home settings, Wi-Fi modules play a crucial role. They enable monitoring devices to connect wirelessly to the internet or a local area network, facilitating data transmission and remote monitoring . 3.2 Commercial and Industrial Park Scenarios: Core Tools for Intelligent Management In commercial buildings and industrial parks, the value of IPCs has expanded from simple security monitoring to an operational management tool. This scenario focuses on continuous monitoring, access control linkage, passenger flow analysis, personnel management, and cross-location retrieval, driving deep integration of cameras with NVRs, VMSs, cloud platforms, and security management systems . In 2025, the digital transformation of commercial buildings and industrial parks will drive steady growth in the procurement of security equipment . The deployment of computer vision for customer flow analysis and behavior prediction in the retail sector will continue to increase. 3.3 Urban Governance and Transportation Scenarios: The Main Battlefield for Large-Scale Deployment Government public safety and smart city projects remain the largest downstream scenario, continuing to contribute about 35% of the demand . In the field of intelligent transportation, integrated security systems based on roadside sensing units cover key road sections in more than 1,200 cities worldwide. The demand for security upgrades in transportation scenarios (airports, railways, ports) continues to grow . Urban governance, transportation, and industrial scenarios require stronger environmental adaptability, longer recognition distances, higher structured recognition accuracy, and greater reliability, driving the growth of high-pixel, PTZ, multi-lens, thermal imaging, 4G or 5G access, explosion-proof and corrosion-resistant, and industry-specific models . IV. Ofeixin Dedicated Wireless Module Product System for IPCs Wireless connectivity technology plays an increasingly crucial role in the entire IPC industry value chain. As a professional IoT wireless module solution provider, Ofeixin currently focuses on promoting three dedicated Wi-Fi modules for the consumer market in the IPC network camera field: O9101UD, 6188E-UF, and F89FTSM13-W7 , each positioned for different technology generations, interface solutions, and application scenarios. 4.1 O9201SB and O9101SA: Wi-Fi 6 Dual-Band High-Speed Modules Both the O9201SB and O9101SA are based on the Wuqi Wi-Fi 6 chip solution, supporting the 802.11ax + BLE 5.3 protocol. They adopt a 2.4GHz/5GHz dual-band synchronous (DBS) architecture, achieving speeds up to 886Mbps, and support core Wi-Fi 6 technologies such as MU-OFDMA and MU-MIMO. Both modules use a USB 2.0 interface and support the full range of WPA/WPA2/WPA3 protocols for security.   In IPC scenarios, dual-band concurrency effectively avoids stuttering and disconnections caused by single-band congestion. The high bandwidth is sufficient to support real-time transmission of 4K ultra-high-definition video streams, making them suitable for mid-to-high-end home IPCs and commercial surveillance cameras. 4.2 6188E-UF: High-performance USB Wi-Fi module The 6188E-UF is based on the Realtek RTL8188FTV solution, supporting IEEE 802.11 b/g/n, 2.4GHz band, 150Mbps speed, USB 2.0 interface, and measuring only 12.2×13mm . The module highly integrates all functions such as MAC, BB, and PA, requiring only a few external components on the PCB, significantly reducing the overall design complexity. For security, it supports WPA/WPA2/WPA3 enterprise-level certification and has obtained CMIIT ID approval. In IPC scenarios, the core advantage of the 6188E-UF is its mature and reliable solution that brings a highly competitive cost structure. The plug-and-play USB interface greatly reduces the difficulty of adaptation and has been widely verified in fields such as IPC/NVR, set-top boxes, and dashcams . 4.3 F89FTSM13-W7: Compact Wi-Fi Module with SDIO Interface The F89FTSM13-W7 is based on the Realtek RTL8189FTV solution, supports IEEE 802.11 b/g/n, 2.4GHz band, 150Mbps speed, SDIO 2.0 interface, and is the smallest of the three products, measuring only 12×12mm. This module is a single-chip 1×1 SISO WLAN SDIO controller, fully compliant with the 802.11n specification, and supports WPA/WPA2 enterprise-level security authentication and AES encryption. In IPC scenarios, the core advantage of the F89FTSM13-W7 lies in the superior data transfer efficiency and CPU usage of the SDIO interface compared to USB, while its ultra-small size provides greater flexibility for compact PCB design . This module has been widely used in tablets, smart TVs, IPTV/OTT, IPCs, AI speakers, and other fields, and is especially suitable for products with strict space constraints, such as mini cameras and embedded monitoring modules. V. Industry Challenges and Future Outlook 5.1 Safety compliance has become a hard threshold. The global regulatory framework is expanding from traditional product security standards to mandatory cybersecurity protocols and data localization requirements. Smart cameras involve public safety, personal privacy, cybersecurity, and cross-border data flows, leading governments and critical infrastructure procurement to increasingly prioritize equipment origin, vulnerability response, data compliance, and supply chain trustworthiness . In 2025, Europe will officially implement a new version of its cybersecurity directive, requiring all networked security devices to pass baseline security certification before they can be sold. China will also release detailed implementation rules for the "Regulations on the Administration of Public Security Video Image Information Systems" in 2025, strengthening data privacy and restrictions on cross-border transmission. 5.2 The competitive landscape is shifting from hardware to comprehensive capabilities. The supply landscape exhibits a coexistence of globalized manufacturing and regionalized market access . Mainland Chinese manufacturers possess advantages in product portfolio completeness, large-scale manufacturing, cost control, and industry project coverage. The industry is expected to continue growing, but competition will shift from simple hardware price to a comprehensive competition encompassing hardware, algorithms, cloud platforms, compliance certifications, and service capabilities . The top five companies in the global IP camera market (Hikvision, Dahua, Axis Communications, Hanwha Vision, and Motorola Solutions) collectively held 84.2% of the market share in 2025 , indicating a continued increase in industry concentration. 5.3 The value of software and services continues to rise. The industry's profit structure is undergoing profound changes. The proportion of cloud platform deployments is expected to surpass 30% for the first time in 2025. Software is capturing a larger share of market value , and customers are shifting from purchasing equipment to purchasing outcome-driven solutions. The widespread adoption of Video Surveillance as a Service (VSaaS) is driving a continued rise in software penetration. 5.4 Future Directions: From "Video Acquisition" to "Intelligent Sensing and Decision-Making" The industry is transforming from "video capture" to "intelligent perception and decision-making," and cameras are becoming one of the most important AI sensors in the physical world . Key dimensions of future competition will include: algorithm accuracy and false alarm control, platform openness and remote operation and maintenance efficiency, data security and multi-scenario adaptability, compliance certification and supply chain credibility.  

I. Industry Trends: PLC Technology Ushers in a "Return to Value" In August 2026, Huawei released Lingxiao PLC 3.0 networking technology, once again bringing PLC (Power Line Carrier Communication) into the industry spotlight. Meanwhile, the revision of domestic PLC power line carrier standards began at the beginning of the year, with in-depth discussions focusing on four major scenarios: industrial lighting, outdoor streetlights, smart home systems, and hotels. In the international market, the launch of the Matter-PLC bridge enabled interconnectivity between the domestic PLC ecosystem and global Matter ecosystems such as Apple HomeKit and Samsung SmartThings. A series of signals indicate that PLC technology is undergoing a profound "value return" —from its early single application mainly in smart meters, it is rapidly penetrating into diversified scenarios such as smart homes, smart cities, and the Industrial Internet of Things. With its unique advantage of "where there is electricity, there is internet," it has become one of the core solutions for the new generation of smart connectivity. II. Technical Analysis: Why PLCs Have Become "Invisible Infrastructure" The fundamental difference between PLC-IoT and traditional wireless solutions lies in the underlying communication logic. Wireless modules (Wi-Fi, Zigbee, Bluetooth Mesh) rely on spatial electromagnetic waves to propagate signals, operating in the 2.4GHz/5GHz frequency band. When the signal passes through walls, it experiences significant attenuation due to load-bearing concrete walls and metal cabinets, and also faces co-channel interference . In contrast, PLC-IoT uses existing 220V/380V power lines in the home as the data transmission medium. The signal travels along the power lines and is unaffected by physical obstructions from walls, floors, or metal structures —as long as the circuit is powered, the communication link remains stable . The actual test data is even more convincing: the end-to-end response latency of PLC-IoT is stable within 50 milliseconds , and the communication success rate is nominally as high as 99.99% ; a single host can support 128–384 device nodes ; academic research has also confirmed that PLC-IoT has comprehensive advantages over ZigBee and KNX technologies in terms of stability, cost-effectiveness and anti-interference ability . More importantly, there is a transformation at the engineering level – PLC-IoT achieves true “no wiring required” : simply add a smart host to the distribution box, and you can achieve whole-house communication coverage through existing wiring . III. Ofeixin PLC Module Product Matrix: A "Connection Base" Covering All Scenarios As a professional enterprise deeply involved in the field of PLC technology, Shenzhen Ofeixin Technology Co., Ltd. has formed a complete technology matrix in this field, from chip-level modules to full-stack system solutions. The 3121N-H is a fully integrated power line carrier communication module developed by Ofeixin based on the Hisilicon Hi3121S chip. It operates in the 0.5-3.7MHz and 2.5-5.7MHz frequency bands, and its protocol is based on a subset of the IEEE 1901.1 standard , allowing it to interconnect with chips using the same standard subset. In terms of core performance, the physical layer peak rate is 0.507 Mbit/s and the application layer rate is 80 Kbps ; it is equipped with a 200MHz ARM Cortex-M3 processor with 256KB SRAM; a single CCO can support up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be completed within 10 seconds . In terms of communication reliability, it adopts OFDM modulation, supports BPSK/QPSK, and has FEC forward error correction and CRC check; it also supports TDMA and CSMA/CA mechanisms, providing 4 levels of QoS guarantee ; the receiving sensitivity is better than 0.2mVpp. In terms of engineering, it measures only 23.5×30mm , integrates built-in wire drive and onboard coupling circuitry, and provides a rich set of interfaces such as UART, PWM, GPIO, I2C, and ADC; static power consumption is ≤0.15W, and dynamic operating power is ≤0.7W . The S130N-ISI is a fully integrated power line carrier communication module developed by Ofeixin based on the Lianxintong VC6330 chip. It uses an LCC package and measures only 20.6×12.6mm , making its ultra-miniaturized design suitable for space-constrained devices. In terms of core architecture, it integrates a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor , equipped with embedded Flash and 1MB of on-chip SRAM . The two cores work together, with the MCU responsible for the protocol stack and system control, and the DSP dedicated to physical layer signal modulation and demodulation, resulting in better communication performance in complex power line environments. In terms of communication protocols and modulation, it supports both China SGCC Q/GDW 11612 and IEEE 1901.1 protocols , supports multiple modulation methods such as BPSK, QPSK, and 16QAM, supports SGCC 0-12MHz bandwidth and provides multiple selectable frequency bands, which can be flexibly configured according to the scenario. In terms of interfaces and development support, it provides a rich set of interfaces including UART, PWM, GPIO, ADC, SPI, and I2C. Ofeixin also provides a full-stack solution and a development toolchain for deep collaboration with the cloud platform, integrating modules, coupling circuits, and power modules, supporting 220V direct connection testing . This one-stop support effectively reduces the development threshold and cycle time for terminal manufacturers. IV. Scenario Value: The "Connecting Foundation" from Smart Homes to Smart Cities The value of PLC technology lies in its unique advantage of "having a network wherever there is electricity" —it eliminates the need for additional communication cables, allowing the construction of a communication system directly using the existing power network, thus achieving "one power line, two uses". In smart home scenarios , the value of PLCs is being fully validated by leading companies. Huawei's HarmonyOS smart home solution uses wired PLC connections to replace many wireless solutions that rely on WiFi/Zigbee, achieving a claimed communication success rate of 99.99% . At the 2026 AWE exhibition, Haier launched a new generation of PLC smart home solutions based on Lihe Micro PLCs, adopting a PLC-Mesh architecture and possessing core advantages such as "direct device connection, ultra-fast response, local decision-making, and availability even when the network is down ." Ofeixin's 3121N-H and S130N-ISI modules are indispensable communication nodes in these whole-house smart solutions—from lighting control and smart curtains to central air conditioning, PLC modules make "no blind spots in the whole house, and controllable even when the network is down" a reality . In smart city scenarios , PLC technology demonstrates its "infrastructure-level" connectivity value. According to actual test data, under a standard urban power grid environment, PLC-IoT technology can achieve reliable communication over a distance of 500 meters , with the latest chip solutions even reaching 2400 meters . Eastsoft Carrier has launched an "AI + Road Lighting Integrated Solution," centered on an AI intelligent agent and integrating PLC and Cat.1 dual communication technologies, which has been implemented in multiple locations across the country. In scenarios such as smart streetlights, smart parking, charging piles, and photovoltaic communication , Ofeixin's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal— a single power line provides both power and communication , representing a true "new infrastructure" connectivity paradigm. In industrial and energy scenarios , the application boundaries of PLCs are expanding from the electricity meter end to the energy Internet of Things (IoT) end . With the large-scale access of new loads such as distributed energy and electric vehicle charging networks, the growth drivers of PLC chips and modules are shifting from the increase in the price of a single chip to multiple drivers such as the expansion of application nodes, the upgrade of dual-mode communication, and the spillover of energy management scenarios . V. Looking to the Future: Ofeixin and the New Paradigm of PLCs complete PLC module product matrix, full-stack system solutions, and deep cooperation with chip manufacturers , Ofeixin is occupying a key position in this PLC technology wave. Whether it's smart home lighting control and smart curtains, or smart city street lighting and charging pile communication— wherever there is electricity, there are Ofeixin's connectivity solutions . The return to value of PLC technology is essentially a rethinking of the essence of "connectivity": the most reliable connections are often hidden in the most basic power lines . Ofeixin is moving forward with this new paradigm.    

Introduction: A Technological Acceleration Triggered by AI In August 2026, the wireless communications industry made a surprising prediction— the launch of enterprise-grade Wi-Fi 8 might be brought forward to 2027 . According to the normal pace of technological iteration, Wi-Fi 7 will only begin large-scale commercial use in 2024, and Wi-Fi 6E is still in the process of becoming widespread. How could a completely new generation of Wi-Fi standards arrive so quickly? The answer lies in a seemingly unrelated industry chain— the shortage of DDR4 memory chips . And this shortage, in turn, has opened an unprecedented golden opportunity for Wi-Fi 7. I. DDR4 Shortage: A "Supply Chain Tsunami" Triggered by AI 1.1 Price Surge: From $2.90 to $24 To understand this forcing effect, we first need to see the severity of the DDR4 shortage. According to data from market research firm DRAMeXchange, in July 2026, the average fixed contract price for general-purpose PC DRAM chips (DDR4 8Gb 1Gx8) was $24 , a 14.3% increase from $21 in June . This price is the highest since price monitoring began in June 2016 , representing an increase of more than eight times compared to the initial benchmark of $2.9 . At the beginning of 2026, the average price of DDR4 8Gb was only $11.50. In just over six months, the cumulative increase reached a staggering 109% . TrendForce predicts that traditional DRAM contract prices will rise by another 13% to 18% quarter-on-quarter in the third quarter of 2026. 1.2 Root cause of the shortage: AI has "drained" traditional DRAM production capacity The root cause of this shortage is not a sudden surge in demand for DDR4 itself, but rather the siphon effect of AI infrastructure construction on storage capacity . The world's three major DRAM manufacturers—Samsung, SK Hynix, and Micron—have almost entirely devoted their new production capacity to AI-related products such as HBM (High Bandwidth Memory), server DDR5, and LPDDR5X , while the amount of chips allocated to the general DDR5, DDR4, and industrial control markets continues to decrease. Memory module manufacturer Apacer Technology has warned that, based on the original equipment manufacturer 's (OEM) supply plans, the amount of DRAM available for allocation to module manufacturers will continue to decline, and the supply-demand imbalance may persist until at least the first half of 2027. Industry insiders predict that the shortage may continue into 2028. This is not a short-term supply and demand fluctuation, but a structural redistribution of production capacity . The more prosperous the AI industry becomes, the more scarce traditional DRAM will be—and wireless access point equipment is precisely highly dependent on DDR4. II. From DDR4 to Wi-Fi 8: An Unexpected Transmission Chain 2.1 Why can't enterprise-level APs do without DDR4? Modern enterprise-grade wireless access points (APs) are heavily reliant on DDR4 memory. In Wi-Fi 6E and early Wi-Fi 7 devices, in order to handle the massive throughput data generated by multiple frequency bands such as 5GHz and 6GHz, a single high-end enterprise-grade AP is generally equipped with 2GB to 4GB of DDR4 memory chips to support complex concurrent queues and low-latency forwarding. With DDR4 chip prices soaring, the bill of materials (BOM) cost per access point (AP) faces significant growth. Several WLAN vendors have already raised their product list prices to offset the increased memory component costs driven by the AI infrastructure boom . 2.2 How does Wi-Fi 8 bypass DDR4? Wi-Fi 8 (IEEE 802.11bn) has undergone a fundamental restructuring of its underlying architecture . Unlike Wi-Fi 6E and the earlier Wi-Fi 7, which relied on a large DDR4 memory buffer pool, Wi-Fi 8 directly embeds data stream processing into a high-speed cache and a customized ASIC channel by moving chip computing power forward and reconstructing the underlying hardware acceleration engine . The effects of this architectural innovation are astonishing: DDR4 consumption per AP has plummeted by approximately 75% . Meanwhile, Wi-Fi 8 can be directly paired with DDR5—currently, DDR5's supply and availability are far superior to DDR4. The greater the cost pressure, the stronger the incentive to switch to Wi-Fi 8. Siân Morgan, senior director of Dell'Oro Group, pointed out: "The faster manufacturers adjust their access point (AP) designs to reduce their reliance on high-cost storage components, the more competitive they become on price. This constitutes a strong driving force for the transition to Wi-Fi 8." III. The "Golden Window" for Wi-Fi 7 and the "Early Entry" of Wi-Fi 8 3.1 Wi-Fi 7: Currently experiencing its peak performance It is important to emphasize that the early release of Wi-Fi 8 does not signify the decline of Wi-Fi 7. On the contrary, Wi-Fi 7 is currently at the peak of its commercial life cycle . Dell'Oro Group predicts that the Wi-Fi 7 market revenue will achieve triple-digit percentage growth in 2026. In the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of enterprise access point revenue , compared to less than 1% a year ago. Enterprise AP revenue from Wi-Fi 7 grew by 348% year-over-year in Q1 2026. In the year that enterprise-grade Wi-Fi 7 revenue peaks, its cumulative total revenue will surpass the total revenue of Wi-Fi 6E over its entire lifecycle . Dell'Oro predicts that Wi-Fi 7 revenue growth will continue for another three years . In terms of shipments, global shipments of Wi-Fi 7 devices are projected to reach 1.1 billion units in 2026. In less than eight quarters, Wi-Fi 7 jumped from a market share of less than 1% to 44.5% of enterprise AP revenue— one of the fastest standard transitions in the history of enterprise WLAN . 3.2 But the window of opportunity is being compressed. However, the DDR4 shortage is changing everything. Although Wi-Fi 8 is not yet a mainstream technology, and the market is still mainly dominated by Wi-Fi 7 devices, Dell'Oro Group believes that the adoption of Wi-Fi 8 may accelerate significantly as we move into 2027 . RF chip manufacturer Richwave has clearly stated that it has partnered with Qualcomm, MediaTek and other main chip platforms to develop Wi-Fi 8. Telecom operators have started research and evaluation for its implementation, and small-scale shipments are expected to begin in 2027 . IV. The Technological Shift in Wi-Fi 8: From "Speed Competition" to "Stability Competition" 4.1 No longer pursuing the ultimate speed Unlike previous generations of Wi-Fi that were designed primarily for peak throughput, the Wi-Fi 8 standard (IEEE 802.11bn) places greater emphasis on "ultra-high reliability" . The core goal of Wi-Fi 8 is no longer "how fast it can run", but " whether it can still operate stably in dense, interference-prone, and highly mobile environments ". According to the technical direction of the IEEE 802.11bn standard, Wi-Fi 8 can bring about a 25% increase in throughput, a 25% reduction in 95th percentile latency, and a 25% reduction in packet loss probability under the same distance and signal conditions . These figures may not seem as spectacular as the leap from Wi-Fi 6 to Wi-Fi 7, but each one directly addresses the most noticeable pain points for users in daily use. 4.2 Key Technologies: Integration of MAPC and AI One of the core technological breakthroughs of Wi-Fi 8 is the "Multi-AP Coordination" (MAPC) mechanism . Through coordinated scheduling among multiple access points (APs), Wi-Fi 8 can significantly improve overall network performance in high-density environments. Meanwhile, Wi-Fi 8 extensively utilizes AI technology to ensure smooth and stable operation of network systems and devices, comprehensively enhancing the overall user experience of wireless networks. In its Wi-Fi 8 preview released in January 2026, Qualcomm clearly stated that a major design goal is to achieve ultra-high reliability, surpassing traditional Wi-Fi performance . V. Profound Impact on the Module Industry 5.1 Accelerated technological iteration forces module manufacturers to fight on two fronts. For wireless communication module manufacturers, the shortage of DDR4 is forcing the early rollout of Wi-Fi 8, which means they must simultaneously address two technology routes . On the one hand, Wi-Fi 7 is in its peak shipping season , and module manufacturers need to ensure a stable supply and controllable costs for Wi-Fi 7 modules. However, the continued shortage and price increase of DDR4 has directly driven up the BOM cost of Wi-Fi 7 modules. On the other hand, the early arrival of Wi-Fi 8 means that the development window for the next generation of modules has been compressed . From the maturity of the chip platform and the verification of the reference design to the development, testing and certification of module products—the originally ample timeline has suddenly become tight. Whoever can find a balance between the peak shipment of Wi-Fi 7 and the research and development preparations for Wi-Fi 8 will gain the upper hand in the upcoming market competition . 5.2 Supply chain management capability becomes a core competitive advantage The DDR4 shortage exposed a deep-seated problem in the entire module industry: over-reliance on a single component and a single supplier . Storage module manufacturers such as Apacer, ADATA, and Team Group are actively building up inventory to cope with the risk of shortages. However, while this "stockpiling" strategy is feasible for large manufacturers, it poses equally significant financial pressure and inventory risks for small and medium-sized module manufacturers. Supply chain diversification and chip selection are shifting from "strategic options" to "survival necessities ." Module manufacturers that can flexibly switch between multiple chip platforms and respond quickly to different component solutions will have stronger resilience in this supply chain crisis. VI. Ofeixin Wi-Fi 7 Deployment: Positioning It in the Industry Window In the industry transformation brought about by the simultaneous arrival of the golden window of Wi-Fi 7 and the early arrival of Wi-Fi 8, the technological reserves and product development pace of module manufacturers have become particularly crucial. Ofeixin has launched a new generation of Wi-Fi 7 modules, O2072PM (M.2 interface) and O2072PB (13×15mm surface mount package), based on the Qualcomm FastConnect C7700 system (chip code QCC2072), which have now become its main flagship products . This module fully supports Wi-Fi 7 core technologies: tri-band 2.4/5/6GHz, 320MHz channel bandwidth, 4K QAM modulation, and a peak data rate of 5.8Gbps . It also supports enhanced multi-link single radio (eMLSR) , which automatically switches links when interference occurs in a certain frequency band, significantly improving connection reliability . Bluetooth has been upgraded to version 6.0 and integrates high-precision distance measurement (HADM) and channel sounding. . With the Wi-Fi 7 window potentially compressed and Wi-Fi 8 arriving ahead of schedule, O2072PM/O2072PB, through its early deployment, provides a crucial connectivity foundation for high-end scenarios such as industrial equipment, robots, and AI cameras, from chip capabilities to end products . VII. Conclusion: An "Atypical" Technological Revolution The DDR4 shortage has forced the early rollout of Wi-Fi 8, a top-down supply chain event triggered by AI. AI infrastructure development drained DDR4 production capacity → DDR4 price increases impacted enterprise-level AP costs → Equipment manufacturers accelerated their shift to the low memory-dependent Wi-Fi 8 architecture → Wi-Fi 8 arrived ahead of schedule. This chain of events reveals a profound industry principle: in a highly globalized semiconductor supply chain, structural changes in any link can trigger a chain reaction in downstream markets . The early rollout of Wi-Fi 8 was not a natural evolution driven by technology, but rather a forced acceleration driven by cost . For Wi-Fi 7, this crisis has created a unique window of opportunity for the industry— the technology is most mature, the market acceptance is highest, and the competitive landscape is still evolving . References: Dell'Oro Group's "WLAN Five-Year Forecast Report (July 2026)", DRAMeXchange, TrendForce, ABI Research