According to industry surveys, from 2018 to 2020, the home intelligent vision (consumer IPC) market has grown rapidly. Since 2016, the compound annual growth rate of China's home camera sales has reached 53.5%. After the explosive growth in previous years, home camera market is now at a relatively mature. Looking at the world, global home camera shipments in 2020 will be 88.89 million units, which is about 2.2 times that of the Chinese market. The compound growth rate in the next five years is expected to be 19.3%. According to this calculation,Shipments of home cameras will exceed 200 million units all over the world in 2025
In the past few years, the home camera market was dominated by long-power-supply cameras, with low cost and large shipments. However, along with the lower technical threshold of traditional long-power-power cameras, the market competition was extremely fierce, and there was a shortage of chips starting in 2020. As well as the sharp increase in raw material prices, the profits of various enterprises have been drastically reduced, and enterprises at home and abroad have to seek new revenue and profit growth points. Under this circumstance, companies and chip manufacturers have set their sights on the low-power IPC market. Its biggest feature is ultra-low power consumption and battery-powered power, which perfectly solves the problems of external power supply and network wiring and completely solves the problem. The cable restraint, especially for countries with high labor costs such as overseas, Europe and the United States, easily solves the problem of high installation costs.
Next, several common low-power IPC solutions will be introduced:
The Hi3518EV300 chip is widely used in the field of video surveillance. Most low-power solution providers use this chip as the main component, with Hi3861Lwifi module. In order to achieve low power consumption and accelerate the device wake-up speed, this solution generally uses the LiteOS system, HiSilicon With its advantages of high integration, short development cycle, low development difficulty, low price and local services, it has grown rapidly in this market and its market share has reached 70%. Half a year after HiSilicon was sanctioned, other chip manufacturers were unable to meet market demand, making the market lack of chips more seriously. At the same time, due to the difficulty of switching low-power solutions, there was a supply gap in the middle.
Ingenic firstly set foot in low-power products is T21, and has now switched to T31 chip, adopting 22nm specifications, currently it is mainly equipped with MTK7682 or Hi3861L modules, in fact, in 2020, Ingenic's low-power solutions have many problems. With the increase of customers connecting with Ingenics solutions, the optimization and improvement speed of the original factory has also been accelerated. Ingenic’s low-power solutions have now become one of the mainstream solutions in the market. Firstly,more stable it has been, the second is that the development documentation of the Ingenic program is relatively complete and the development difficulty is relatively low.
RTL8715 integrates the main chip and wifi, which not only has advantages in cost, but also provides customers with convenience in technical support. At the same time, it adopts a small RTOS system to speed up the startup speed of the device and is also friendly to power consumption. However, due to the difficulty of RTOS system development, there are few customers who really adopt this solution, but it also has advantages. Due to the lack of market coverage, the supply has certain advantages.
Although HiSilicon has been in the technology blacklist, Hi3861L's outstanding performance in all aspects of low power consumption is still the first choice for low-power solutions. With HiSilicon’s support for other mainstream main controllers, the market’s recognition of Hi3861L is very high. High, Ofeixin also launched the 3161A-SLwifi module based on Hi3861L chip in 2020, the specific parameters are as follows:
1. Supported wireless protocol: IEEE 802.11b/g/n
2. Bandwidth and rate: support 20 MHz standard bandwidth and 5 MHz / 10 MHz narrow bandwidth, providing up to 72.2 Mbit/s physical layer rate
3. Supported modulation technology: Orthogonal Frequency Division Multiplexing (OFDM), Spread Spectrum Technology (DSSS), Complementary Code Keying Technology (CCK)
4. Rich peripheral interfaces: SPI, UART, I2C, PWM, GPIO and multi-channel ADC
5. Working temperature: -40℃～+85℃
6. Other: integrated high-performance 32-bit microprocessor