China Shenzhen Ofeixin Technology Co., Ltd Company News

For the past decade, most IoT devices have followed a "collect, upload, wait" model—data is transmitted from edge sensors to the cloud for processing. This model is feasible for simple monitoring, but it faces bottlenecks in terms of realtime performance, bandwidth consumption, and privacy protection. Today, WiFi 7 is redefining wireless connectivity with ultralow latency and ultrahigh throughput, while edge AI is bringing computing power down to the device level. The convergence of these two technologies is ushering in a new era of intelligent IoT.   I. The market votes with real money. The Wi Fi 7 market is expanding rapidly. According to Research and Markets data, the global WiFi 7 market size will grow from $2.76 billion in 2025 to $4.56 billion in 2026, with a CAGR of 65.4%, and is expected to reach $33.96 billion in 2030. ABI Research predicts that by 2029, 81% of consumergrade and 92% of enterprisegrade access points will be equipped with WiFi 7 or a newer standard. The edge AI market is even larger. Grand View Research shows that the global edge AI market will be worth approximately $24.9 billion in 2025, and is projected to reach $30 billion in 2026, growing at an annual rate of 20%, and is expected to exceed $118.7 billion by 2033. The convergence of these two multibillion dollar markets means that integration is no longer a vision, but a reality that is already underway. II. Wi Fi 7: A highway paved for edge AI Edge AI demands low latency, high throughput, and high reliability, which are precisely the core advantages of WiFi 7. The 320MHz channel and 4K QAM double the maximum bandwidth from 160MHz, increasing peak throughput by 2.4 times compared to WiFi 6; MultiLink Operation (MLO) allows devices to transmit simultaneously in the 2.4GHz, 5GHz, and 6GHz bands, achieving wirelevel reliability and seamless switching; and the open 6GHz spectrum provides a clean, highspeed channel. III. Edge AI: An Inevitable Shift from the Cloud to the Device AI must move to the edge for three reasons: cloudbased inference suffers from network latency, and in scenarios like industrial control and autonomous driving, tens of milliseconds can determine safety; massive amounts of raw data transmission consume bandwidth, while local processing only triggers communication for meaningful events, enabling architectural restructuring; and local processing of sensitive data naturally reduces the risk of privacy leaks. Currently, industrial visual quality inspection, intelligent security, edge gateways, and robotics and embodied intelligence are recognized as the four directions where edge AI is most likely to become mainstream solutions. Factory automation is the earliest area of implementation, while robotics is closest to the core of physical AI. 四、Core application scenario: The world that is being changed Smart manufacturing and industrial automation : the most urgent need is for integration with industrial scenarios. Industrialgrade WiFi 7 modules support temperatures from 40°C to 85°C, with actual throughput exceeding 4Gbps and latency of approximately 1ms. In SMT workshops, Wi Fi 7 solves signal blind spots, while edge AI performs visual inspection and predictive maintenance; the combination of the two is the only technological option.   Autonomous mobile robots and drones : Robots need to process visual data and make decisions locally in real time, while transmitting critical information back via lowlatency WiFi 7. The global cloudedgedevice collaboration market reached $48.7 billion in 2025 and is projected to exceed $180 billion by 2030, with a CAGR of 22.3%.   Smart Cities and Infrastructure : Under the conditions of wide outdoor temperature range and global compliance requirements, the WiFi 7 module covers a temperature range of 40°C to 85°C, and the edge AI completes image recognition locally. WiFi 7 provides highspeed backhaul, forming a complete closed loop.   Smart Home and Consumer IoT : Homes are shifting from "passive response" to "proactive service." Synaptics released the world's first Wi Fi 7 AInative MCU, integrating Wi Fi 7, Bluetooth LE 6.0, and Thread/Zigbee, enabling end devices to have local sensing and decisionmaking capabilities. The WiFi 7 gateway market is valued at $7.4 billion in 2025 and is projected to reach $20.9 billion in 2032, with home computing power considered the most likely area for explosive growth in 2026 and 2027. V. Ofeixin Wi Fi 7+ Edge AI Product Solution Based on the Qualcomm QCC2072 chip, O2072PM and O2072PB are two WiFi 7 + Bluetooth 6.0 combo modules, fully supporting 4K QAM, 320MHz channels, and MLO, with a peak rate of 5.8Gbps and eMLSR enhanced multilink switching. The O2072PM uses an M.2 Key E interface (22×30mm), suitable for highend robots and industrial equipment; the O2072PB is a compact surfacemount package (13×15×2.3mm), designed specifically for spaceconstrained devices such as AI cameras, smart cockpits, and industrial vision systems. Both support Bluetooth 6.0 channel detection for highprecision ranging. O2072PM also provides deep customization of the entire hardware platform (Qualcomm, Realtek, Woogi, HiSilicon, etc.), including size and interface trimming, native driver adaptation, and scenariobased RF optimization, becoming a key bridge connecting chips and terminal applications. VI. The Deep Logic of Technological Convergence: Integration of Connectivity, Computing, and Security In the past, wireless connectivity and edge computing were two separate paths, but this piecemeal architecture is becoming obsolete. ABI Research points out that edge AIoT platforms must be designed with connectivity, computing, and security as a unified strategy. Integrating Wi Fi 7 and AI acceleration into a single chip (such as the SYN765x) reduces space requirements, simplifies design, and saves costs. The significance of this integration lies in the fact that it is no longer a physical superposition of "WiFi chip + AI chip," but rather treats AI acceleration and wireless connectivity as a holistic system from the ground up, eliminating the need for devices to make painful tradeoffs between local inference and highspeed communication. VII. Industry Trends and Outlook Trend 1 : Wi Fi 7 penetration is accelerating, with a projected CAGR of approximately 65% from 2026 to 2030. AI workloads are driving companies to upgrade their networks ahead of schedule. Trend 2 : Edge AI is going from "optional" to "standard". 2026 is seen as the starting year for the explosion of Edge AI and Physical AI, and industrial computer manufacturers are transforming into AI Box solution providers. Trend 3 : The architecture is shifting from "cloudpipedevice" to "deviceedgecloud" collaboration, and the low latency of WiFi 7 is naturally suitable for distributed AI. Trend 4 : Multiprotocol convergence (Wi Fi 7 + Bluetooth LE + 802.15.4) is becoming a necessity. Singlechip solutions simplify development, reduce costs, and better support crossplatform standards such as Matter.  

Introduction: An Ongoing Shift in Industrial Focus The global wireless communication module industry is undergoing profound structural changes. The Industrial Internet of Things (IIoT) has surpassed consumer electronics to become the fastest-growing and largest core application market for wireless modules . This shift is not accidental—it is the result of the combined effects of four forces: market expansion, technological maturity, policy support, and industry demand. According to the "Global Wireless Module Industry In-Depth Analysis Report (2026)" released by IIM Information, the global wireless module industry market size is expected to reach approximately US$18.73 billion in 2026 , a 14.2% increase compared to 2025, with shipments exceeding 1.25 billion units . On the application demand side, Industrial Internet of Things (IIoT) and smart manufacturing already account for 21.3% of IoT module shipments , with demand for industrial sensors and edge gateway modules growing by 18% annually. Industrial Internet modules achieved a 37% year-on-year growth in 2025 , becoming the second largest segment after consumer electronics. I. Why has the Industrial Internet of Things become the main battleground for wireless modules? 1.1 Market Level: A Trillion-Yuan Demand Pool $277.35 billion in 2025 to $537.4 billion in 2030 , representing a CAGR of 14.3% . Each IIoT terminal requires at least one wireless module, and the size of the downstream market directly determines the total demand for upstream modules . 1.2 Technical Aspect: Wireless solutions are systematically replacing wired connections. Industrial scenarios have historically been dominated by wired protocols such as RS-485 and Modbus, but three major pain points are driving wireless alternatives: high cabling costs , with expensive cabling and construction fees for wired deployments, while wireless modules offer a low-cost "plug-and-play" solution; urgent need to upgrade existing equipment , with the "Implementation Opinions" issued by eight departments including the Ministry of Industry and Information Technology in July 2026 explicitly encouraging enterprises to deploy converged industrial equipment with embedded advanced communication modules; and the inherent need for wireless in industrial scenarios , such as electromagnetic interference environments, wide-coverage mining areas, mobile AGVs, and robots, where wired connections are unsuitable and naturally rely on wireless solutions. 1.3 Industry Level: The Maturity of New Technologies Transforms "Usable" into "Easy to Use" The cost of 5G modules has decreased by approximately 40% within two years, with industrial 5G module prices dropping to around 200 yuan, a 90% decrease compared to the initial commercial launch period . Shipments of 5G RedCap modules are projected to reach 8 million units in 2025 and exceed 30 million units in 2026. The high throughput and low latency of Wi-Fi 6/7 meet the needs of industrial video surveillance and other applications; Wi-Fi HaLow provides communication coverage of up to 1 kilometer in the Sub-1GHz band ; and the integration of Bluetooth 6.0 and edge AI enables modules to perform local data preprocessing. This increased technological maturity directly lowers the barriers and risks for industrial users adopting wireless solutions. 1.4 Demand Level: Edge AI Drives Module Upgrades Towards Intelligence Edge AI computing power is increasingly being deployed at the module level . Factory production lines operate with hundreds of sensors and robotic arms, requiring decisions to be made within milliseconds, leaving no room for cloud-based processing. Modules integrating AI acceleration capabilities can perform intelligent processing at the data source. According to IIM data, shipments of edge intelligent modules (integrated AI accelerators) reached 230 million units in 2025, a year-on-year increase of 189% . Industrial applications are driving the upgrade of modules from communication devices to key nodes integrating communication, computing, and intelligence . 1.5 Policy Level: Global Collaboration to Promote Industrial Internet of Things In July 2026, eight departments, including China's Ministry of Industry and Information Technology, issued the "Implementation Opinions on Promoting the High-Quality Development of the Industrial Internet," which explicitly proposed to comprehensively improve the connectivity rate of industrial equipment . The "Action Plan for Promoting the High-Quality Development of Industrial Internet Platforms (2026-2028)" proposed that the number of connected industrial devices should exceed 120 million units by 2028. The EU's RED Directive amendment (effective in 2026) imposed stricter limits on the energy efficiency of wireless modules; and the North American FCC promoted the 6GHz band dynamic spectrum sharing standard. The core logic of these policies is that the connectivity rate of industrial equipment is a key indicator of a country's manufacturing competitiveness . II . Special Requirements of Wireless Modules in Industrial Scenarios Industrial-grade modules must achieve breakthroughs in the following dimensions : Wide temperature range operation capability. Stable operation within a wide temperature range of -40°C to 85°C. High reliability and interference resistance. Excellent interference resistance design, stable connection maintenance, and millisecond-level low latency response. Long lifecycle and guaranteed supply. Industrial equipment has an upgrade cycle of years or even decades, requiring long-term stable supply and technical support. Small size and high integration. Industrial equipment has limited internal space, so it needs to integrate more functions within the smallest possible size. III . Industry Practice: Ofeixin Industrial Internet of Things Deployment Founded in 2014, Shenzhen Oufexin Technology Co., Ltd., headquartered in Guangming District, Shenzhen, has been recognized as a National High-tech Enterprise . Its product line covers Wi-Fi modules, Wi-Fi HaLow, Bluetooth modules, PLC modules, embedded IoT/AIoT modules, and more, with multiple product lines catering to the core needs of industrial scenarios. 3.1 Wi-Fi 7 Module: Designed for High-Bandwidth Industrial Scenarios O2Flytek has launched the O2072PM Wi-Fi 7 module based on the Qualcomm QCC2072 chip . Featuring an M.2 Key E interface, a 2T2R dual-antenna design, and support for Wi-Fi/BT coexistence, its 320MHz bandwidth, 4096-QAM modulation, and MLO multi-link aggregation technology give it significant advantages in industrial video surveillance, high-definition image transmission, VR/AR, and other scenarios. 3.2 Wi-Fi HaLow Module: A Powerful Industrial Tool for Long-Range, Low-Power Operation The 4108E-S module launched by Oufexin is based on the Morse Micro MM6108 chip, operates in the Sub-1GHz band, supports data rates up to 32Mbps , and is suitable for scenarios such as industrial automation, warehouse management, transportation and logistics, smart agriculture, and smart grids . 3.3 PLC Module: An Industrial Solution That Enables Communication with Power Power line communication (PLC) utilizes existing power lines to transmit data, eliminating the need for additional wiring . Oufexin PLC modules have been applied in new energy industrial scenarios such as charging piles, photovoltaic inverters, and energy storage systems , featuring low cost, stable communication, strong real-time performance, and strong anti-interference capabilities. 3.4 Industrial-grade Wi-Fi/Bluetooth module Ofeixin product line is clearly divided into three levels: consumer electronics grade, industrial grade, and automotive grade . The industrial grade module has excellent industrial temperature range performance and millisecond-level low latency , with an operating temperature range of -40 °C to 85°C, a transmit power of 19dBm, and a receive sensitivity of -82dBm. IV . Market Prospects and Industry Opportunities In terms of market size , the global wireless module market is projected to reach US$14.44 billion by 2030. The Chinese WLAN module market is expected to generate US$3.5-4.5 billion in annual revenue by 2026, with total shipments exceeding 600-700 million units. From a technological perspective , industrial module shipments are projected to reach 110 million units in 2026. The 5G industrial IoT market is expected to grow from $17.3 billion in 2025 to $22.56 billion in 2026. In terms of the competitive landscape , Chinese suppliers have already occupied 67% of the global module market share, but they also face the dual pressure of rising material prices and trade barriers. V .Conclusion: Four forces working together to drive the shift in industrial focus The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules, a result of the combined effects of market forces, technology, demand, and policy . Market level : The trillion-dollar and rapidly growing IIoT market provides a huge demand pool for modules; From a technical perspective : the maturity and cost reduction of technologies such as 5G, Wi-Fi 6/7, Wi-Fi HaLow, and Bluetooth 6.0 have transformed wireless solutions from "usable" to "easy to use". On the demand side : The extreme requirements for real-time performance and reliability in industrial scenarios are forcing modules to evolve towards edge intelligence; Policy level : Major global economies have elevated the connectivity of industrial equipment to a national strategy, creating institutionalized incremental demand. These four forces reinforce each other : technological progress lowers the barriers to entry, policy promotion accelerates transformation, market demand amplifies the scale effect, and the scale effect further reduces costs, forming a positive cycle. The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules. This is not a prediction, but a fact that has already occurred and is accelerating. Whoever can deeply understand the special needs of industrial scenarios—wide temperature range, high reliability, long life cycle, and strong anti-interference—and continuously invest in areas such as multi-mode fusion and edge intelligence will gain the upper hand in the next stage.  

I. Trend Background: Why is "combination" becoming the new normal? IoT devices are becoming increasingly "all-rounders." A smart home control unit needs to connect to the cloud via Wi-Fi and also enable near-field network pairing with mobile phones via Bluetooth; an industrial gateway needs to connect to the local area network via Wi-Fi and also needs Bluetooth for on-site device debugging. This demand for "both...and..." is driving IoT communication modules from "single-protocol dedicated" to "multi-protocol convergence". A multi-protocol module (combo module) refers to a single wireless SoC that supports multiple protocol stacks, providing multiple wireless communication capabilities simultaneously on the same module. The most common combination is Wi-Fi + Bluetooth , with other combinations such as ZigBee + BLE and Wi-Fi + ZigBee . A single-protocol module , on the other hand , focuses on a single communication standard, concentrating all hardware and software resources to serve only one protocol. Both have their advantages and disadvantages, and the selection decision directly affects the device's cost, power consumption, size, and development cycle. 二、Five Advantages of Multi-Protocol Combination Modules 1. Size and PCB Layout: From "Two RF Systems" to "One System Coexisting" Using two independent single-protocol modules means requiring at least two sets of RF traces and two antennas. Multi-protocol modules consolidate the RF front-end, coexistence design, and interfaces onto a single SoC solution, significantly simplifying PCB layout. In the space-constrained environments of IoT devices, replacing two independent modules with a single module can reduce PCB area by more than 40% . 2. BOM Cost and Supply Chain Management: One less module, one less level of complexity The multi-protocol module simplifies procurement and version management into a single part number, significantly reducing the complexity of supply chain management. Compared to three separate modules, the three-in-one module can reduce BOM costs by more than 30% . 3. Power Management: Unified scheduling is better than decentralized management. The power state machine of the combined module makes it easier to implement a unified sleep/wake-up strategy at the driver layer, avoiding leakage current spikes caused by two independent chips operating independently. In contrast, the power management strategies of two independent modules are often difficult to coordinate precisely. 4. Certification and Compliance: Design Once, Test in a Coordinated Manner The combined module narrows down the transmit power level, spectrum template, and coexistence scenarios to a more predictable range, allowing for comprehensive planning of the certification path early in the project. Compared to certifying two modules separately, the combined module can save more than 30% of certification time and cost . 5. User Experience: A Natural Match for the "Distribution Network-Connectivity" Interaction Model In screenless IoT devices, the standard path has become "the mobile phone transmits the Wi-Fi SSID and password via Bluetooth → the device connects to the network via Wi-Fi". The combined module is naturally matched to this interaction model in terms of hardware , without the need for additional cross-chip communication overhead. III. Four major limitations of multi-protocol combination modules 1. Performance compromises: the cost of shared resources Wi-Fi, Bluetooth, ZigBee, and other mainstream wireless technologies coexist in the 2.4GHz ISM band. When they run simultaneously on a single chip, the multiple protocols need to share bandwidth, which may lead to potential increased latency and packet loss . Single-protocol modules concentrate all hardware resources to serve a single protocol, and generally perform better in terms of peak throughput and latency stability . 2. Limited flexibility: A change in one part affects the whole. Combination modules "bundle" multiple protocols onto the same hardware platform. If a product needs to be upgraded to one of the protocols in the future, the entire module often needs to be replaced . Single-protocol modules , on the other hand, can upgrade only one protocol , making product iteration more flexible. 3. Integration complexity: Not "plug and play" When different protocol stacks run on the same chip, a sophisticated time-division/frequency-division scheduling strategy is required to avoid self-interference. Developers need to handle complex issues such as priority management between protocols and coexistence strategy configuration. For inexperienced teams, this may actually prolong the development cycle. 4. The "hidden cost" of power consumption In scenarios where multiple protocols operate simultaneously or alternately, the overall power consumption of combined modules is typically higher than that of single-protocol BLE-only designs . For devices powered entirely by batteries with minimal data transmission , single-protocol BLE modules are more competitive in terms of power consumption. IV. Market Data and Industry Dynamics Market data confirms the upward trend in combo modules. The global wireless module market is expanding at a CAGR of 12.9% , projected to grow from $7.92 billion in 2025 to $8.94 billion in 2026. In the combo chip segment, the global Wi-Fi/Bluetooth Combo chip market reached $18.76 billion in 2025 , a year-on-year increase of 14.2% . Smart home, industrial IoT, and automotive electronics are the three core drivers, with the automotive OEM market expected to reach an annual demand of 980 million units in 2027 . 27.4% year-on-year in 2025. It is predicted that the number of connected IoT devices globally will exceed 30 billion by 2026 , with a significant increase in the proportion of devices using multi-protocol connections. Single-protocol modules will not disappear, but the market share of combined modules is expanding rapidly. V. Ofeixin Technology: In-depth layout of multi-protocol combination modules With multi-protocol combination modules rapidly becoming the industry mainstream, Ofeixin has built a complete product matrix covering multi-protocol combination modules such as Wi-Fi, Bluetooth, PLC, and IoT/AIoT , thanks to its years of experience in the field of wireless communication. In the field of Wi-Fi + Bluetooth combo modules , Ofeixin has achieved full-speed, full-scenario coverage from Wi-Fi 4 to Wi-Fi 7. Its Wi-Fi + Bluetooth combo module product line possesses the following core advantages: First, the speed coverage is comprehensive. From entry-level Wi-Fi 4/BLE combinations to flagship Wi-Fi 7/BLE 5.4 combinations, Ofeixin can provide precisely matched solutions for projects with different cost and performance requirements. The flagship combination module supports a 320MHz ultra-wide bandwidth , achieving high-speed wireless transmission at 5.8Gbps , while integrating the latest generation of Bluetooth Low Energy protocol; the mainstream Wi-Fi 6 series combination module supports 2x2 dual-band concurrent operation , with a stable speed of over 1200Mbps , balancing performance and cost-effectiveness. Secondly, it boasts outstanding interface compatibility. Ofeixin's Wi-Fi + Bluetooth combo module comprehensively covers various mainstream host interfaces such as PCIe, USB, and SDIO , enabling flexible adaptation to main control chips on different platforms and greatly reducing customers' hardware porting and adaptation costs. Third, it has mature multi-protocol concurrency capabilities. Through a sophisticated radio frequency coexistence scheduling algorithm, the combined modules of Ofeixin can achieve low-interference and low-latency collaborative work between Wi-Fi data transmission and Bluetooth scanning/connection , perfectly matching the classic interaction mode of "Bluetooth network configuration + Wi-Fi communication" for IoT devices, as well as multi-task scenarios such as concurrent Bluetooth audio, Bluetooth data transmission and Wi-Fi big data. In terms of multi-technology integration and vertical scenarios , Ofeixin has further integrated Wi-Fi, Bluetooth, and PLC-IoT power line carrier technology. Its PLC-IoT module, based on the IEEE 1901.1 standard, supports a single CCO to connect 200 STA nodes and features dynamic routing and multi-path automatic addressing capabilities, achieving dual "wired + wireless" connectivity in smart home, smart lighting, and other scenarios. In addition, the company also provides Wi-Fi HaLow (based on IEEE 802.11ah, targeting low power consumption and wide coverage), Nearlink , and other multi-protocol modules, widely covering application scenarios such as smart homes, smart cities, industrial IoT, and connected vehicles. From a technological perspective, Ofeixin's product portfolio precisely aligns with the industry's evolution from "single-protocol modules" to "multi-protocol combination modules." The company has obtained numerous core technology patents , and all its products have passed international certifications such as FCC, CE, and SRRC, as well as RoHS and REACH environmental directives. Today, with multi-protocol combination modules becoming the industry mainstream, Ofeixin is providing global IoT devices with a "one-stop" multi-protocol connectivity solution through its product system that covers all protocols, is compatible with multiple interfaces, and is adaptable to all scenarios . VI. Selection Recommendations and Conclusion The difference between multi-protocol combination modules and single-protocol modules is not a simple matter of superiority or inferiority, but rather a matter of different choices for different scenarios . Scenarios where a combination module is preferred include: devices needing to work collaboratively between Wi-Fi and Bluetooth (such as smart home control); limited PCB area; high requirements for BOM cost and supply chain efficiency; and screenless devices requiring Bluetooth to assist Wi-Fi network pairing. Scenarios where a single-protocol module is preferred include: extreme requirements for peak performance of a single protocol; requiring only one communication method; purely battery-powered devices with extremely sensitive power consumption; and scenarios requiring flexible upgrades to a specific protocol without replacing the entire module. The future is not about "combined modules replacing single-protocol modules," but rather "combined and single-protocol modules each finding their proper place." Combined modules, with their smaller size, lower BOM cost, and simplified supply chain, are becoming the mainstream choice for space- and cost-sensitive scenarios; single-protocol modules, on the other hand, remain irreplaceable in industrial control, professional communications, and other scenarios due to their superior peak performance and more flexible upgrade paths . For module manufacturers, having a complete matrix of both types of products is essential to meeting the diverse needs of different customers. The rise of multi-protocol combined modules is not a technological revolution, but an inevitable consequence of demand. 2

Signal attenuation, data loss, and frequent device offline issues in WiFi modules under strong electromagnetic interference are no longer isolated incidents. With the number of connected industrial IoT devices exceeding 10 billion, this problem is evolving from an "occasional inconvenience" to a "systemic risk." According to IDC statistics, the number of connected IoT devices worldwide will exceed 75 billion by 2025. This massive influx of access leads to channel congestion and increased interference, with throughput in some scenarios reaching only 40% to 60% of the rated capacity. As the number of connections surges, each unstable connection could become the trigger for a system-wide disaster. What exactly is going on? And how can this situation be resolved? I. Where does the interference come from? — The physical root cause of WiFi "disconnection" WiFi communication relies on radio waves to transmit data, and the physical characteristics of electromagnetic waves determine their susceptibility to interference . Strong electromagnetic interference is mainly divided into two categories: radiated interference and conducted interference. Radiated interference directly "impacts" the antennas or circuits of WiFi modules in the form of electromagnetic waves. High-power industrial equipment such as frequency converters, servo motors, and high-frequency welding machines are the main culprits. Frequency converters generate harmonics of 10kHz to 100MHz during switching, and the electromagnetic field strength can reach 50V/m at a distance of 1 meter , far exceeding the interference immunity standards of ordinary routers. In addition, mutual interference from devices on the same frequency (other WiFi networks, Bluetooth, microwave ovens) in congested frequency bands such as 2.4GHz, as well as the self-interference generated by high-speed interfaces such as DDR memory, HDMI, and USB on the circuit board, all constitute sources of radiated interference. Research by Murata Manufacturing Co., Ltd. indicates that electromagnetic noise generated by industrial robots and control equipment can interfere with wireless signals such as WiFi, LTE and 5G, potentially causing serious operational problems such as malfunctions in production equipment and production line shutdowns due to communication errors . II. How does interference trigger "symptoms"? — A chain reaction from packet loss to disconnection When interference signals enter the module, they trigger a series of chain reactions. Before sending data, the WiFi device "listens" to see if the channel is empty. If a strong interference signal is detected, it will suspend transmission until the interference disappears—this causes the initial delay. If interference is encountered during transmission, the data packets will be corrupted. The receiving end will discard the packets after detecting the error through verification—this is data packet loss . To compensate for packet loss, WiFi will initiate a retransmission mechanism, but retransmission may fail again in an interference environment, causing a sharp drop in effective throughput. When the interference is so severe that the module cannot complete any successful "handshake" or data exchange, the device will determine that the connection has failed—leading to frequent offline occurrences . These technical problems have had a serious, quantifiable impact in reality: A real-world test of a logistics AGV project showed that the packet loss rate in the 5GHz band surged from 3% to 28% under strong interference ; in an automotive welding workshop, electromagnetic interference from AGVs resulted in a packet loss rate as high as 37% in the 2.4GHz band , causing robot trajectory deviations; a wind farm monitoring system experienced a data packet loss rate of 37% due to inverter interference; an automotive parts factory suffered direct losses exceeding one million yuan due to delayed robotic arm control commands caused by electromagnetic interference, resulting in batch product size deviations; and a cement plant's distributed control system experienced 17 shutdowns per month due to router jitter triggering safety interlocks , with each shutdown resulting in losses exceeding 200,000 yuan . A packet loss rate soaring from single digits to over 30% means that an industrial automation system is only a hair's breadth away from sliding from "controllable" to "out of control". III. Which scenarios are most severely affected? — Pain points in typical application scenarios Automotive welding workshops are notorious for WiFi interference. The simultaneous operation of numerous AGVs and welding robots, with their switching frequencies overlapping with WiFi bands (inverters and servo motors), creates a continuous electromagnetic noise surge. The packet loss rate in the 2.4GHz band reaches as high as 37%, directly causing robot trajectory deviations and product scrap. High temperatures, dust, steel structure obstructions, and strong electromagnetic interference in metallurgical and heavy industrial environments often lead to communication delays and packet loss. A five-axis machining center worth 3 million yuan suffered from servo motor vibration due to network latency, causing the machining error to spike from 0.01mm to 0.15mm, directly scrapping 120,000 yuan worth of aircraft blade blanks. Medical electronic equipment has extremely high requirements for WiFi connection stability. Devices such as electrocardiographs need to transmit vital sign data in real-time without packet loss, requiring WiFi connection stability of over 98% in industrial EMC environments. In smart logistics scenarios, AGVs frequently traverse metal shelving areas while moving through warehouses. The combined effects of signal attenuation and electromagnetic interference can lead to vehicle disconnection, path errors, and even collisions. IV. How can technology fight back? — The evolution from Wi-Fi 6 to Wi-Fi 7 Faced with this challenge, the direction of technological evolution has shifted from simply pursuing speed to pursuing "ultra-high reliability" . Wi-Fi 6/6E: Laying a Solid Foundation Wi-Fi 6 improves spectrum utilization and interference immunity through OFDMA and MU-MIMO technologies. The newly added 6GHz band provides a wider, less interference-prone "highway." In industrial IIoT environments, optimized IEEE 802.11ax networks can reduce the maximum packet loss rate from 32.5% to 23% . Wi-Fi 7: Taking the Initiative Multilink operation (MLO) is the core anti-interference technology of Wi-Fi 7. It allows devices to establish connections simultaneously on multiple frequency bands such as 2.4GHz, 5GHz, and 6GHz. Critical commands can be redundantly transmitted through multiple links —if one link is interrupted by interference, other links can still maintain communication, achieving a stable "link-level" connection. Tests conducted by the Wireless Broadband Alliance (WBA) in a real-world enterprise environment, in conjunction with AT&T, Ruckus Networks, and Intel, have confirmed that under interference conditions, MLO can increase Wi-Fi 7 uplink throughput by up to 116% and reduce uplink latency for real-time services by up to 66% ; under co-channel interference, it can increase downlink throughput by 75% and reduce downlink one-way latency for real-time services by up to 44% . Wi-Fi 8: The Cure for "Instability" Wi-Fi 8 (IEEE 802.11bn) , expected to be released in 2027 , has clearly defined its core goal as "ultra-high reliability ," rather than continuing to increase peak speeds. Multi-AP collaboration technology will allow multiple routers/APs to work together as a "whole system," reducing interference at its source. V. Ofeixin Breakthrough Strategy: From "Standardization" to "Deep Customization" The evolution of technical standards has pointed the way for the industry, but to truly implement the technology into specific products and solve interference problems in real-world scenarios, module manufacturers need to have deeper capabilities. Founded in 2014, Shenzhen Oufexin Technology Co., Ltd. focuses on the communication connectivity industry, possessing complete capabilities from broadband short-range wireless connectivity to deeply vertically integrated industry-leading resources . The company has served over 260 clients , with an annual production capacity of 5200 KPCS , and its products are exported to 7 countries and regions . Ofeixin product line covers a full range of communication products , from Wi-Fi 7/6E/6/5/4 series modules, Wi-Fi HaLow modules, Bluetooth modules, and PLC modules . Modules can be categorized into consumer electronics grade and industrial grade . In industrial applications, its WiFi modules support multiple interfaces such as USB, SDIO, PCIe, and PCIe M.2 , employing WPA/WPA2/WPA3 multi-layer security encryption. Market standard coverage includes WiFi 6, WiFi 6E, and WiFi 7. In long-distance, high-reliability scenarios such as industrial drones, it also supports Mesh networking mode , further enhancing anti-interference and high-stability transmission capabilities. Ofeixin practices reveal an industry trend: standardized modules solve the problem of "usability," while the second half of the IoT era aims to address the issues of "ease of use, reliability, and deep integration with my products ." Many solution providers choose standard modules in the early stages of projects, only to encounter three incalculable costs on the eve of mass production: the compromise cost of structural customization —standard modules have fixed dimensions and antenna interfaces; once the product ID is finalized, dimensional deviations are discovered, requiring either structural modifications (costing hundreds of thousands in mold opening fees) or the addition of adapter cables (sacrificing RF performance); the sunk cost of cross-platform adaptation —when switching a module that works on platform A to a main controller on platform B, driver crashes and a sharp drop in throughput may occur; and the hidden loss of performance bottlenecks —the rate parameters of standard modules are measured in an ideal environment in a shielded room, while in real-world scenarios, performance is determined by latency jitter suppression capabilities, OFDMA resource scheduling strategies, and fast frequency hopping mechanisms. Ofeixin approach is to keep risks out of the customer's R&D stage —based on the PCB stacking and antenna environment of the customer's product, while ensuring RF performance (such as EVM, sensitivity, and spurious compliance), the module size is reduced, the onboard antenna is integrated, and the connector position is changed ; at the same time, with the help of the underlying development experience of the full range of main control platforms such as Qualcomm, Realtek, Woogi, and HiSilicon , the company delivers "native-level drivers" that have been time-aligned, low-power adapted, and anomaly-handling hardened for the main control platform selected by the customer . This "deep customization" capability is the most pragmatic solution to deal with complex industrial scenarios such as strong electromagnetic interference —it's not about forcing customers to "fit" a standard module, but about creating modules for customers' real-world application scenarios. VI. Market Verification: Why "Interference Resistance" is Crucial Market data also confirms the urgency of the "reliability" requirement. The global WiFi & 802.11 module component market size is approximately US$8.279 billion in 2025 and is projected to reach US$11.37 billion by 2032 . The rapid growth of the market highlights the scarcity of "interference resistance and high reliability" capabilities —as the number of connections explodes and application scenarios shift from consumer to industrial, every unstable connection could become the trigger for a system-wide disaster. Meanwhile, WiFi 7 is accelerating its commercial deployment . Currently, there are approximately 11,500 WiFi 7-related patents and 3,000 patent families worldwide. European telecom operator EE has already begun deploying WiFi 7, and Deutsche Telekom has partnered with Airties to advance the first commercial deployments of WiFi 7. Conclusion The instability of WiFi modules in environments with strong electromagnetic interference is the result of a combination of external interference, internal design flaws, and the complexity of the application environment. From the 50V/m electromagnetic field near the frequency converter to the 37% packet loss rate in the automotive welding workshop, and the 17 safety shutdowns per month with each loss exceeding 200,000 yuan —behind these figures lies the urgent need for "highly reliable connectivity" in countless industrial scenarios. The path of technological evolution is clear: from OFDMA in Wi-Fi 6 to MLO in Wi-Fi 7, from standardized modules to deeply customized services, the entire industry is moving from "connectivity" to "highly reliable connectivity ." In this process, module manufacturers that can implement the latest Wi-Fi standards into reliable products while providing deeply customized services will become the key force driving the Industrial Internet of Things (IIoT) from "usable" to "easy to use."  

I. The Tide of the Times: Why the Inevitable Emergence of Body-Possessing Robots Artificial intelligence is undergoing a fundamental paradigm shift. From large language models to multimodal models, the "brain" of AI has acquired the ability to understand, reason, and generate, but a key question remains unresolved: how can AI truly "touch" the physical world? Embodied AI is the answer to this problem. It combines large-scale AI models with physical entities, achieving a leap from "computational intelligence" to "physical intelligence ." If we compare the large model to the "brain" of a robot, then the communication network is its "nervous system"—this "brain" must process massive amounts of heterogeneous data from dozens of sensors distributed throughout the body in milliseconds and issue synchronous instructions to actuators in microseconds . embodied robots is not accidental, but an inevitable result of AI moving from the digital world to the physical world. II. Market Boom: The Trillion-Dollar Track Accelerates According to the "China Embossed Intelligence Industry Development Report (2026)," China has become one of the fastest-growing embossed intelligence markets in the world, with the market size growing from approximately RMB 213.3 billion in 2018 to an estimated RMB 1.09 trillion in 2026 , representing an average annual compound growth rate of 22% to 23% . In July 2026, the Ministry of Industry and Information Technology stated at the 2026 World Artificial Intelligence Conference that China's annual production of humanoid robots is expected to exceed 100,000 units in 2026. Morgan Stanley significantly raised its 2026 forecast for domestic humanoid robot shipments from 28,000 units to 50,000 units , and expects it to reach 446,000 units by 2030 . III. Everyday Life: Embodied Intelligence is Rapidly Becoming a Reality Embodied intelligence is rapidly entering the public eye through high-profile events such as marathons and the Spring Festival Gala. Marathon: Outrunning Humans in One Year. In April 2025, the world's first humanoid robot half marathon took place in Yizhuang, Beijing, with the winner finishing in 2 hours and 40 minutes. In April 2026, the number of participating teams expanded from 20 to over 100, with the Glory "Lightning" winning in 50 minutes and 26 seconds, surpassing the human men's half marathon world record of 57 minutes and 20 seconds . 38% of the participating teams achieved fully autonomous navigation , and the course accumulated a 100-meter elevation gain. Spring Festival Gala: From Yangko Dance to "Cyber Kung Fu". In the 2025 Year of the Snake Spring Festival Gala, 16 H1 robots from Unitree Robotics completed "Yangko BOT" with a synchronization error of 0.1 seconds. In the 2026 Year of the Horse Spring Festival Gala, Unitree Robotics, Galaxy General, Songyan Power , and Magic Atom will collectively appear, with Unitree presenting the world's first fully autonomous robot swarm martial arts performance, "Martial Arts BOT"—more than 20 robots rapidly changing formation in a swarm, requiring no external positioning, and autonomously coordinating with onboard sensors throughout the entire process. From "active" to "usable" , robots are accelerating their transformation into "active" and "usable". IV. Bottleneck Emerges: An Underestimated Key Issue As computing platforms and AI capabilities mature, connectivity is becoming one of the key factors determining whether a robot is "truly usable" . Whether it's humanoid robots or autonomous mobile robots (AMRs), actual deployment places unprecedentedly stringent demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency . ResearchInChina points out that the internal and external communication architecture of robots is facing an unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits . The market size for communication systems specifically designed for intelligent robots is projected to expand rapidly from $42 million in 2026 to approximately $300 million in 2030. The value of communication links is undergoing a structural reorganization from "general-purpose industrial parts" to "dedicated core components . " V、Ofeixin 's dual flagship strategy It is against this industrial backdrop that QOGRISYS launched its Wi-Fi 7 module product line for high-end robots and industrial equipment , precisely covering the market demands at different levels. O2072PM / O2072PB: Second-generation flagship module, currently the main product being promoted. Based on the Qualcomm FastConnect C7700 (chip code name QCC2072), this is a Wi-Fi 7 + Bluetooth 6.0 tri -band 2×2 MIMO module, and is also O2Flytek's current flagship product for intelligent and high-end industrial equipment . Core specifications: Supports 2.4/5/6 GHz tri-band, with a maximum bandwidth of 320 MHz across all bands ; peak data rate up to 5.8 Gbps ; supports 4096-QAM modulation; supports multi-link operation (MLO) ; Bluetooth supports BLE 6.0 and LE Audio; supports 2×2 MU-MIMO; compliant with IEEE 802.11a/b/g/n/ ac /ax/be standards. The O2072PM/O2072PB design includes all the functions of the QCC2072 , with comprehensive optimizations in RF performance, system stability, and power consumption control compared to the previous generation, fully meeting the stringent requirements of multi-sensor fusion, high-definition video backhaul, and low-latency control. The O2072PM uses a standard M.2 interface, allowing for easy integration into embedded systems, gateways, industrial PCs, and various robotic devices. With its full performance potential and large-scale deployment , O2072PM has established a clear product iteration path, and its solutions are already compatible with the RK3588 and NVIDIA AGX ORIN platform among smart device manufacturers .   VI. Why has Wi-Fi 7 become a standard feature in robots? The design goal of Wi-Fi 7 (IEEE 802.11be) is clearly defined as "extremely high throughput", but its value goes far beyond the speed increase - Wi-Fi 7 is not just a speed upgrade, but a connection base tailored for the era of "physical AI" . 320 MHz ultra-wide bandwidth. Double that of Wi-Fi 6's 160 MHz. A humanoid robot equipped with more than 10 cameras and various sensors needs this kind of ultra-wide bandwidth. Multi-link operation (MLO). One of the most revolutionary features of Wi-Fi 7 is that it allows devices to transmit data simultaneously on three frequency bands: 2.4GHz, 5GHz, and 6GHz. The value of MLO lies in reducing connection interruptions and latency spikes , providing link redundancy and rapid switching capabilities in real-time robot control scenarios. 4096-QAM high-order modulation and CMU-MIMO. Compared to Wi-Fi 6's 1024-QAM, the data capacity per symbol is increased from 10 bits to 12 bits, with a theoretical peak rate of 5.8Gbps. CMU-MIMO enables multiple access points to work collaboratively, allowing dozens of robots in a workshop to maintain stable connections simultaneously without interfering with each other —which is precisely the core requirement for collaborative scheduling of robot swarms. VII. Core Applications in Embodied Intelligence Scenarios Multi-sensor fusion and high-definition video backhaul. The O2072PM / O2072P B offers a peak rate of 5.8 Gbps and an ultra-wide bandwidth of 320 MHz, which is sufficient to support the concurrent backhaul of multiple 4K video streams and high-frequency point cloud data . Low-latency real-time control. Robot motion control is extremely sensitive to latency. Wi-Fi 7's MLO multi-link mechanism provides link redundancy and fast switching capabilities, which can significantly reduce the probability of connection loss in high-density equipment environments such as factory machines and handling robots . Robot swarm collaborative scheduling. Wi-Fi 7's CMU-MIMO and multi-AP collaborative scheduling technology enable multiple access points to work together, effectively reducing interference and improving air interface resource utilization efficiency. Cloud-edge-device collaboration. The ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form the invisible infrastructure for cloud-edge-device collaboration—the robot uploads sensor data to the edge server in real time for VLA model inference, receives decision instructions, and executes them immediately. 8. Industry Recognition and Mass Production Capability Oufexin is one of the pioneers in the Chinese market for Wi-Fi 7 modules . Currently, there are very few module manufacturers that truly possess complete Wi-Fi 7 engineering capabilities, mass production capabilities, and application implementation experience, while Oufexin has taken the lead in completing the leap from solutions to modules , and from laboratories to application scenarios . IX. From Connectivity to Intelligence: An Underestimated Key Link The core of the next-generation robot architecture is no longer the stacking of single computing power , but rather high-performance, low-power, and strongly connected system-level collaboration . The key leap from "single-point intelligence" to "system-level intelligence" requires the seamless integration of the entire chain of computing, perception, decision-making, communication, and collaboration. Ofeixin's Wi-Fi 7 module provides an indispensable "connection base" in this chain —carrying massive amounts of data with a 320MHz ultra-wide bandwidth, ensuring low latency control with MLO multi-link, and supporting stable operation in complex environments with industrial-grade reliability. Communication modules are transitioning from "general-purpose industrial components" to "dedicated core components ." In this transformation, Oufexin has secured a key position thanks to its product portfolio of dual flagship Wi-Fi 7 modules and its early mass production capabilities. Data sources for this article include: "China Embossed Intelligent Industry Development Report (2026)", ResearchInChina "2026 Next-Generation Embossed Intelligent Robot Communication Network Topology and Chip Industry Research Report", the official release of the 2026 World Artificial Intelligence Conference by the Ministry of Industry and Information Technology, Morgan Stanley industry research reports, and official product information from Ofeixin Technology.  

Just as we were celebrating the world's first Bluetooth 6.2 module certification, another bombshell dropped: the Bluetooth Special Interest Group (SIG) has made its biggest overhaul of the BQB certification rules in nearly a decade. Bluetooth 5.4 is now mandatory, LE Audio testing is required, and RN numbers now have expiration dates . What should I do about my module selection? The days of simply "getting a module certification and relabeling it to ship" are basically over. 一、What exactly are the three changes in the new regulations? The first step: a forced upgrade of the technical benchmark. After January 1, 2026, all new BQB certification applications must comply with the Bluetooth 5.4 core specification . The SIG no longer accepts new certification applications for Bluetooth 5.3 and older versions. If the core hardware has been modified, the Bluetooth main control chip replaced, or the RF circuitry adjusted, recertification according to 5.4 is required. Even more alarming is the standard for determining "major changes." One customer simply switched antenna suppliers with the same parameters, but the SIG audit deemed it a "radio frequency circuit adjustment," requiring a complete recertification process . This means that for products that have chosen the wrong module solution, every subsequent hardware tweak could trigger costly recertification. The second blow: LE Audio has gone from being a "bonus" to a "must-have". Previously, LE Audio was an optional "bonus feature". Starting in 2026, as long as a product uses a chip with Bluetooth 5.2 or higher and the hardware supports LE Audio, regardless of whether the firmware enables the feature, all three core protocols —BAP (Broadcast Audio Profile), CAP (Audio Control Profile), and LC3 (Low Complexity Communication Codec) —must be tested. The SIG's official TCRL pkg103 clearly defines this. The LC3 codec can provide higher audio quality at a lower bit rate and reduce power consumption by about 50% compared to traditional Bluetooth audio, but on the condition that it passes the full set of LE Audio tests; missing even one test result will disqualify it . The third measure: tightening certification fees and pathways across the board. Full Bluetooth certification (non-listing method) has a single certification administration fee of up to $12,000 . If the product has multiple derivative models and the hardware/firmware (affecting the Bluetooth part) is different, an additional listing fee of $8,000 is required for each model. The core logic of the new regulations is that using certified modules through the QDL (Qualified Design List) route can significantly save certification costs and time. The QDL route allows end products to directly reference the QDID (Bluetooth Qualification ID) already obtained by the module, exempting them from numerous repetitive tests. Conversely, if the module itself has not completed 5.4+LE Audio certification, end customers will have to bear the full certification cost starting at $12,000 . II. Data Tells You: Why the New Regulations Have Such a Wide-Reaching Impact The sheer volume of Bluetooth device shipments determines the scope of the new regulations. The Bluetooth Special Interest Group (SIG) predicts that global Bluetooth device shipments will approach 6 billion units in 2026 and exceed 8 billion units in 2030. From 2025 to 2050, the average annual growth rate is projected to be approximately 8.4% . Under the new regulations, every product line—from TWS earphones and smart speakers to in-vehicle Bluetooth devices—must pass LE Audio testing if it involves Bluetooth audio functionality . Failure to pass will prevent the promotion of high-definition audio features . Furthermore, the mandatory implementation of the Bluetooth 5.4 core specification necessitates that all new products select Bluetooth modules that are compatible from the outset. 二、Ofeixin has completed the full deployment of Bluetooth 5.4+LE Audio. Shenzhen Aufexin Technology Co., Ltd. has taken the lead in completing the product layout of modules that meet the core specifications of Bluetooth 5.4 and LE Audio . The following products fully support the core technical requirements of the new BQB certification regulations in 2026: Wuqi Chip Solution - Bluetooth 5.4 + LE Audio Layout O9201PM – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, PCIe interface The O9201PM is a dual-mode chip solution supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features Low Energy Audio (LE Audio) capabilities. It is fully compatible with the Bluetooth 5.4 protocol, supports BT/BLE dual-mode and BLE audio, and supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. Typical application scenarios include smart speakers, Bluetooth audio devices, smart home gateways, and AIoT terminals—products with dual requirements for audio quality and wireless connectivity. O9201SB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9201SB is a highly integrated module supporting 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with a maximum speed of 1200Mbps . Measuring only 13×15mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs and a rich set of peripheral interfaces (UART, SPI, I2S, I2C, and GPIO, etc.). The Bluetooth module supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. It is widely used in set-top boxes, industrial control computers, and wireless access points , and has already achieved mass production shipments in multiple China Mobile set-top boxes. O9201UB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, USB interface The O9201UB is also a dual-mode chip solution, supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features low-power audio capabilities. It boasts an ultra-compact 13×15mm size and a USB interface design. It is suitable for scenarios with specific size and interface requirements, such as set-top boxes, smart projectors, USB Wi-Fi adapters, and industrial handheld terminals. O9101SA – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9101SA is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and supports dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with 5G speeds up to 886Mbps . Measuring only 12×12mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs. It supports BT/BLE dual-mode operation and uplink/downlink MU-OFDMA and MU-MIMO. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. O9101UE – Wi-Fi 6 + Bluetooth 5.4 module, ultra-compact size The O9101UE is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 . Measuring only 13×12.2mm , it supports both BT and BLE dual-mode operation. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. III. Three Musts for Module Selection Under the New Regulations In response to the new BQB certification regulations, the selection of Bluetooth modules must follow three principles: Bluetooth version 5.4 or higher is required. All new applications submitted from 2026 onwards must comply with the Bluetooth 5.4 specification. Choosing a module with Bluetooth version 5.3 or lower means the product will face a "no certification" dilemma from the outset. LE Audio support must be confirmed. As long as the hardware supports LE Audio, regardless of whether the feature is enabled in the firmware, the full suite of BAP, CAP, and LC3 tests will be required. When selecting a module, ensure that the module solution has completed LE Audio protocol stack adaptation and RF verification. The QDL certification path is mandatory. The full certification fee of $12,000 is a significant sum for any product team. Choosing a module solution that is already Bluetooth 5.4+LE Audio certified and referencing the module's QDID via the QDL path can significantly reduce certification costs and time . In conclusion The 2026 Bluetooth BQB certification regulations will introduce a three-pronged approach: mandatory Bluetooth 5.4 benchmark, mandatory LE Audio, and high certification fees . This is not a gradual adjustment, but a structural reshaping. For engineers and product managers developing Bluetooth products, module selection is no longer just a trade-off between "performance, power consumption, and cost," but must now include a fourth dimension—certification and compliance . Choosing the wrong module can, at best, delay the time-to-market, and at worst, trigger recertification fees of up to $12,000. Shenzhen Oufengxin Technology Co., Ltd. , with its full range of Bluetooth 5.4+LE Audio products including O9201PM, O9201SB, O9201UB, O9101SA, and O9101UE , as well as full-process technical support from module selection to certification path planning, is committed to helping customers overcome the threshold of the new BQB certification regulations in 2026 with the lowest compliance cost.  

On July 4, 2026, Huihan Technology announced that its self-developed Bluetooth protocol stack, FlairBlue, had officially passed the Bluetooth SIG 6.2 core specification certification, becoming the world's first module manufacturer to pass Bluetooth 6.2 certification . Behind this certification lies years of evolution and accumulation in Bluetooth technology. As Bluetooth 6.2 compresses the connection interval from 7.5 milliseconds to 375 microseconds, and as channel detection moves from "meter-level" to "centimeter-level," a real question arises: should Bluetooth modules use 6.0 or 6.2?   For module manufacturers, another more fundamental question arises: should they chase the latest standard version, or strive for excellence in already mature technologies? I. Bluetooth's "old problems": Why do we always have to put up with latency, dropped connections and inaccurate measurements? Prior to Bluetooth 6.2, Bluetooth technology had three core pain points that had long plagued the industry: Pain Point 1: The latency ceiling is too low. The minimum connection interval for Bluetooth Low Energy is fixed at 7.5 milliseconds . For daily office work or leisure, 7.5ms may be acceptable. However, in the competitive world where milliseconds matter—Bluetooth mice deter esports players, and Bluetooth keyboards can never keep up with wired devices in terms of response speed—this is not a problem that software can solve, but a physical bottleneck at the protocol level. Pain Point Two: Inaccurate Positioning. Traditional Bluetooth positioning relies on Received Signal Strength Indicator (RSSI). However, RSSI signals are highly susceptible to environmental interference—human obstruction, wall reflections, and multipath effects can all cause drastic signal fluctuations. Typical errors are between 3 and 5 meters . Digital car keys "standing still," asset tracking "inaccurate"—these scenarios all stem from the same problem: Bluetooth doesn't know "how far away the device is." Pain Point 3: Vulnerabilities in Secure Distance Measurement. RSSI cannot defend against relay attacks. Attackers can forge distance information with just a signal amplifier. With the rapid popularization of digital keys and keyless entry systems, distance measurement security has gone from being a "nice-to-have" to a "life-or-death" issue. These pain points combined have created an awkward reality: Bluetooth connectivity is ubiquitous, but high-end application scenarios—such as e-sports peripherals, digital keys, and industrial positioning—have been hesitant to adopt Bluetooth as their "primary solution." II. Bluetooth 6.0 vs 6.2: Two "trump cards," two different positioning methods To answer the question of "choosing 6.0 or 6.2", we first need to clarify the capability boundaries of the two generations of standards. Bluetooth 6.0 (released in September 2024): Channel detection is the biggest highlight. The most significant upgrade in Bluetooth 6.0 is its Channel Sounding feature. This technology combines Phase Scale (PBR) and Round Trip Time (RTT) for distance calculation, improving Bluetooth positioning accuracy from meter-level error (RSSI) to centimeter-level . In 2025, shipments of Bluetooth Channel Sounding modules reached 32 million units . The global BLE 6.0 Channel Sounding module market is projected to grow from $21 million in 2024 to $210 million in 2031 , representing a CAGR of 25.0% . Bluetooth 6.2 (to be released in November 2025): SCI is a decisive upgrade. Bluetooth 6.2, building upon 6.0, introduces Shorter Connection Interval (SCI) technology. SCI reduces the minimum connection interval for Bluetooth Low Energy from 7.5 milliseconds to 375 microseconds, resulting in a 20-fold increase in response speed . It can achieve a reporting rate exceeding 2 kHz under secure connections . Resolution is refined to 125 microseconds . Meanwhile, Bluetooth 6.2 includes security enhancements for channel probing—a new attack detection mechanism based on signal amplitude effectively detects and defends against sophisticated relay and spoofing attacks. This enhancement is crucial for automotive, smart home, and industrial applications. One picture to show the difference: Key findings: Bluetooth 6.0 solved the "where" problem (centimeter-level positioning), while Bluetooth 6.2 solved the "how fast" problem (ultra-low latency of 375 microseconds) and the "how secure" problem (attack-resistant ranging). They are not substitutes for each other, but rather optimal solutions for different scenarios. III. Ofeixin's Choice: Deepening its expertise in Bluetooth 6.0 and becoming a professional player in the "precise positioning" field. Faced with the industrialization wave of Bluetooth 6.2, Oufexin's strategic choice is pragmatic—focusing on mature versions of Bluetooth 6.0 and below, and maximizing the centimeter-level positioning capability of channel detection. This choice is based on rational judgment on three levels: Judgment 1: Bluetooth 6.0's channel detection capability is sufficient to cover more than 95% of current commercial scenarios. Digital keys, asset tracking, indoor navigation, access control systems—the core requirement for these scenarios is "knowing where the device is," not "how fast the response is." For the vast majority of IoT applications, Bluetooth 6.0's positioning capabilities are already "sufficient," and it is also lower in cost and has a more mature ecosystem. Judgment 2 : The industrialization of Bluetooth 6.2 still needs time. The standard was released in November 2025, and the first module certification was issued in July 2026—less than eight months indeed demonstrates the industry's rapid response. However, there is still a considerable distance between "the first certification" and "large-scale commercial use ." The penetration of terminal devices, the maturity of the software environment, and the completion of interoperability verification all require time. Rather than waiting for a standard that is not yet fully mature, it is better to perfect the technology that is already mature. Key takeaway: Oufexin's decision to focus on Bluetooth 6.0 is not because it "can't keep up," but rather based on a precise assessment of market demand—in the scenario of "precise positioning," the greatest common denominator, Bluetooth 6.0 is already powerful enough, and it is also cheaper, faster to deliver, and has a more mature ecosystem. IV. Ofeixin Technology: Professional Strength in Bluetooth 6.0 Modules Qogrisys, a professional wireless communication module supplier, has a deep understanding of the evolution trends of Bluetooth technology in terms of positioning, power consumption and connection stability, and has built a complete module product matrix covering Bluetooth 5.0 to Bluetooth 6.0. The O2072PM /O2072PB module, based on the Qualcomm QCC2072 chip, supports Bluetooth 6.0 and integrates channel sounding for high-precision distance measurement. The module uses an M.2 Key E standard interface, a 2T2R dual-antenna design, and supports both Wi-Fi and Bluetooth. Peak data rates reach up to 5.8Gbps , supporting 320MHz bandwidth and 4K QAM. It is suitable for scenarios requiring high positioning accuracy, such as digital keys, asset tracking, and smart locks. O9101SA / O9101UB — A domestically produced dual-mode module for Wi-Fi 6 and Bluetooth 5.4/5.3, supporting simultaneous operation of 2.4GHz and 5GHz dual bands (DBS). Its ultra-small 12×12mm size makes it suitable for IoT devices with limited space. O2066PM — an industrial-grade Wi-Fi 6 and Bluetooth 5.2 module that supports a wide operating temperature range of -40°C to +85°C , suitable for harsh environments such as industrial automation and smart grids. 6162C-IC / 6161B-R — Low-cost, low-power Bluetooth 5.0 modules. The 6162C-IC supports Mesh functionality, while the 6161B-R supports UART and PCM interfaces. At the product planning level, Oufexin is closely following the latest evolution of Bluetooth technology . Its Bluetooth module solutions, based on mainstream chip platforms such as Qualcomm and Realtek, possess the technological foundation to evolve to higher versions of the Bluetooth standard. From Bluetooth 5.0 to Bluetooth 6.0, Oufexin's Bluetooth module product line covers all scenarios from classic Bluetooth to Bluetooth Low Energy, from single-mode to dual-mode, and from consumer-grade to industrial-grade applications . Key takeaway: Aufexin's Bluetooth module matrix covers the entire range from Bluetooth 5.0 to Bluetooth 6.0—whether you need centimeter-level positioning for digital keys, wide-temperature reliability for industrial equipment, or high cost-effectiveness for consumer electronics, Aufexin can provide a matching module solution. In terms of technical capabilities, Oufexin provides customers with full-process technical support, from module selection, power consumption optimization, antenna design to certification testing . Bluetooth module development involves multiple stages, including RF tuning, protocol stack adaptation, and power management—Oufexin's engineering team has accumulated extensive experience in these areas, enabling them to help customers complete Bluetooth module selection, integration, and certification in the shortest possible time. V. How to play the two "trump cards"? The scenario determines the choice. Bluetooth 6.0 and 6.2 each have their own strengths, and the choice depends on the priority of latency, positioning, and security in the application scenario. Scenarios for choosing Bluetooth 6.0: Positioning is a basic requirement, and latency is not a major concern. " knowing where the device is." Bluetooth 6.0's channel detection provides centimeter-level positioning accuracy, and related modules shipped reached 32 million units in 2025. If your product requires "location" rather than "speed," Bluetooth 6.0 is currently the most cost-effective choice. Scenarios where Bluetooth 6.2 is chosen: latency-sensitive, user experience is paramount. Gaming peripherals (mice, keyboards, gamepads) – a connection interval of 375 microseconds means that 2K+ wireless polling rates are a reality. For the first time, wireless peripherals have truly caught up with the "zero-perceptible" experience of wired connections. VR/AR headsets – sub-millisecond communication cycles support smoother immersive interaction. Industrial real-time control – In high-density equipment environments, SCI’s ultra-low latency can significantly improve system response speed. Human-Computer Interface (HMI) – In scenarios such as smart car cockpits and medical device control panels, every touch a user makes can receive instant feedback . Key takeaways: If your product prioritizes an "ultimate experience"—e-sports, VR/AR, real-time control—Bluetooth 6.2 is the only correct choice. If your product prioritizes "precise positioning"—digital keys, asset tracking—Bluetooth 6.0 is sufficient, and it's also lower in cost and has a more mature ecosystem. Qogrisys offers a complete product matrix covering Bluetooth 5.0 to Bluetooth 6.0, along with end-to-end technical support from module selection to system integration. Qogrisys is committed to helping customers quickly upgrade their products and achieve commercialization during the Bluetooth 6.0 era.  

In June 2026, Chongqing Wuqi Microelectronics Co., Ltd.'s IPO application on the Science and Technology Innovation Board was accepted, with a planned fundraising of 1.619 billion yuan. This chip design company, which was one of the earliest in China to fully adopt the RISC-V architecture and achieve commercial mass production, officially stepped onto the stage of the capital market.   For Shenzhen Oufexin Technology, Wuqi Micro is not only a chip supplier, but also a deeply collaborative ecosystem partner. As a professional IoT wireless module solution provider, Oufexin is a key link in transforming Wuqi's chip technology into large-scale commercial solutions. I. Oufexin: A professional module solution provider focusing on the communication connectivity industry Shenzhen QOGRISYS Technology Co., Ltd. was founded in the communications connectivity industry. After years of experience in the industry market and customer service, it has grown into a professional solution provider with high-quality supporting resources ranging from broadband short-range wireless connections and wide area network cellular communications to deep vertical integration of the industry . The company has an annual production capacity of 4,900 KPCS, has served 245 customers, and exports its products to 7 countries . Its service capabilities cover the entire chain from solution design and module R&D to mass production and delivery. Oufexix's role is to enable chip technology to move from "laboratory verification" to "large-scale commercial use," and from "usable" to "easy to use." II. Deep Collaboration with Wuqi Micro: Development of the Full Range of Modules With its stable transmission performance and internationally leading low power consumption, the WQ9201 high-performance Wi-Fi 6 chip from Wuqi stood out from 364 products from 280 chip companies and won the 2024 "China Chip" Excellent Technological Innovation Product Award . Image source: China Chip   As a professional module solution provider, QOGRISYS collaborates closely with QOGRISYS to develop QOGRISYS's full range of modules . Currently released module products include: O9101U E , O9101UD, O9101S A – A series of 1×1 Wi-Fi 6 modules based on the WQ9101 chip from Wuqi. O9201SB, O9201UB , O9201PB , O9201PM , O9201UD , O9201UDH — A series of 2×2 Wi-Fi 6 modules based on the WQ9201 chip . Based on the technology of the Wuqi chip, Oufexin has transformed the high performance of the chip into standardized modules that can be directly integrated and quickly launched through modular design , which greatly reduces the threshold for terminal manufacturers to adopt domestic high-end Wi-Fi solutions. III. Detailed Explanation of Core Product Solutions 3.1 O9201SB: Wi-Fi 6 Module for Set-Top Boxes and Home Audio-Visual Systems a 1200Mbps SDIO 2T2R Wi-Fi 6 + BT 5.4 module developed by Oufexin based on the WQ9201 chip , with a size of only 13×15mm . This module supports all IEEE 802.11 a/b/g/n/ac/ax protocols, dual-band 2.4GHz/5GHz, and DBAC 2×2 MU-MIMO and DBDC 1×1 dual-band concurrent operation . 2.4GHz and 5GHz can operate simultaneously, supporting complete security protocols such as WPA/WPA2/WPA3, WEP, and WAPI, as well as multiple operating modes including P2P GO/GC and STA+AP . The O9201SB has been widely used in set-top boxes, industrial control computers, wireless access points, and other fields . The WQ9201 chip from Wuqi has been adopted in multiple China Mobile set-top boxes, achieving stable mass market supply . Based on this chip, the O9201SB module is quietly sparking an "experience revolution" in the set-top box industry — completely eliminating frustrating experiences such as video stuttering and soaring game latency . 3.2 O9201PM: Wi-Fi 6 Module for Industrial and Embedded Platforms The O9201PM is a 1200Mbps M.2 PCIe 2T2R Wi-Fi 6 + BT 5.4 module , measuring 22×30mm. It uses an M.2 interface and PCIe communication protocol and is mainly targeted at industrial embedded platforms, the Linux/Android open source ecosystem, and domestic SoC solutions . This module is developed based on the Wuqi WQ9201 chip, which integrates multiple high-performance RISC-V CPUs, supports a 2.4GHz/5GHz dual-band architecture and dual-band concurrency, and has achieved several breakthroughs in wireless performance: High-speed dual-band concurrency : Supports 2×2 MIMO and 80MHz bandwidth, with a theoretical speed of up to 1.2Gbps in the 5GHz band, meeting the high bandwidth requirements of industrial data acquisition, high-definition video streaming, and other applications. Superior wall penetration capability : The high-gain iPA design improves signal strength by 30% , making it suitable for complex industrial environments with multiple obstructions, such as factory workshops and warehouses. Low-power architecture : Wi-Fi and Bluetooth work together, reducing power consumption by 40%; deep sleep mode power consumption as low as μA; wake-up response time less than 10ms, suitable for battery-powered portable industrial terminals. Bluetooth 5.4 Full-Power Upgrade : 2Mbps High-Speed Transmission, Latency as Low as 30ms, Supports Bluetooth Low Energy Audio and Mesh Networking The O9201PM has completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip. It can be widely used in industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, digital signage and other scenarios, providing high-performance and high-reliability Wi-Fi 6 connectivity solutions for embedded systems. In industrial manufacturing and IoT scenarios, devices constantly face challenges in wireless environments characterized by multiple obstructions, high interference, and high concurrency . Traditional Wi-Fi solutions often suffer from unstable connections and fluctuating speeds. The O9201PM is a systematic solution addressing these industrial pain points. 3.3 O9201UD/O9201UDH: Long-range Standard/Narrowband Video Transmission Module The O9201 UD/ O9201UD H is a high-power proprietary image transmission module developed by Oufexin based on the WQ9201S / WQ9201HS chip . It supports the 802.11ax Wi-Fi + BLE 5.4 protocol and has a maximum speed of 1200Mbps . This module supports the 5GHz band, with channel bandwidth covering 20MHz/40MHz/80MHz. It supports uplink MU-OFDMA TX and downlink MU-OFDMA RX, and is fully compatible with the Bluetooth 5.4 protocol . Oufexin has been committed to creating high-performance, long-range, low-latency Wi-Fi modules , primarily for applications in high-definition image transmission, drones, multi-connectivity, multi-reliability, and VR/AR scenarios . With advancements in wireless technology, image transmission solutions have evolved from Wi-Fi 5 to Wi-Fi 6. Private image transmission solutions, due to their superior anti-interference and transmission performance, are widely used in drones and are gradually being adopted by terrestrial image transmission solutions such as HDMI/IPC . O9201UD / O9201 UDH module is a prime example of this technological trend, making it an ideal choice for various smart devices and drone image transmission applications. IV. Application Scenarios: From Smart Homes to Industrial Internet of Things Oufexin's module solutions have been widely used in multiple industries: Smart Home : The module fully considers the compatibility of different smart devices, supports multiple communication protocols, and ensures the interconnection of smart home devices. Products such as water purifiers, smart projectors, and smart home appliances can achieve remote monitoring, smart reminders, and data analysis through the Oufexin Wi-Fi module. Digital consumer electronics : The modules provide cost-effective solutions suitable for various consumer electronics products, helping companies control costs and enhance market competitiveness. Smart Cities and Industrial IoT : The module adopts an advanced low-power design, maintaining low energy consumption during long-term operation and extending device battery life. Drones and HD image transmission : The O9201UD /UDH image transmission module provides long-distance, low-latency wireless connectivity for drones, VR/AR and other scenarios . V. Looking to the Future: Wi-Fi 7 and a Broader Connectivity Ecosystem Wuqi Micro plans to raise 1.619 billion yuan in its IPO, which will be mainly invested in the research and development of next-generation Wi-Fi 7 AP chips, edge smart chips, and cutting-edge technology pre-research. Wuqi's technological iteration signifies the continuous upgrading of Oufexin's module solutions. Oufexin has taken the lead in the Wi-Fi 7 arena, launching the O2072PM Wi-Fi 7 module based on the Qualcomm QCC2072. From Wi-Fi 4, Wi-Fi 5, Wi-Fi 6 to Wi-Fi 7, Oufexin has consistently been committed to leading technological trends and providing users with an exceptional wireless experience . With the rapid development of edge AI and edge computing, the requirements for bandwidth, latency, and stability of wireless connections are constantly increasing. Oufexin will continue to serve as a solution and product partner for Wuqi Chip Technology, providing more advanced wireless connectivity module solutions for smart homes, machine vision, industrial IoT, and other scenarios, from Wi-Fi 6 to Wi-Fi 7, and from traditional connections to edge AI. Conclusion The IPO of Wuqi Microelectronics is a landmark event marking the transition of domestically produced high-end Wi-Fi chips from technological breakthroughs to industrialization. Oufexix Technology, as a deep ecosystem partner of Wuqi Microelectronics, is a key force in transforming chip technology into large-scale commercial solutions. From the O9201SB revolutionizing the set-top box industry experience, to the O9201PM redefining wireless connectivity for laptops, and the O9201UD driving the upgrade of drone image transmission technology— behind each module solution lies Ophixin's commitment to its mission of "making good chips into good solutions." The RISC-V architecture has provided a historic opportunity for China's chip industry to leapfrog ahead, while Wi-Fi 7 and edge AI have opened up new market spaces. With deep synergy between chip-level innovation and module-level solution capabilities, the path to independent and controllable domestic wireless connectivity is becoming increasingly broad.  

From June 24th to 26th, 2026, the 2026 Global Internet of Things Conference & Shenzhen International Internet of Things Industry Ecosystem Expo (GIoT) was held as scheduled at the Shenzhen Convention and Exhibition Center (Futian). With an exhibition area of 40,000 square meters , 400 exhibitors, and over 60,000 professional visitors , the event attracted attendees from across China, as well as more than ten countries and regions including the United States, Germany, the United Kingdom, Japan, South Korea, France, the Netherlands, and Australia . The exhibition showcased a complete industry chain, from underlying chips, computing power, and data to upper-level application scenarios . A single core theme ran throughout the entire exhibition: AIoT is moving from proof-of-concept to large-scale deployment, and communication modules, as the core link connecting the physical and digital worlds, are taking center stage in the distribution of industry value. I. Full industry chain coverage: Communication modules occupy a core hub position in the "network layer". GIoT's exhibits are clearly divided into five major sections: underlying sensing technology, communication and network technology, smart terminal hardware, platforms and solutions, and industry collaboration ecosystem . Among these, the communication and network technology section is listed as an independent core section, with exhibits explicitly including 5G/6G communication modules, LPWAN (LoRa/NB-IoT), and edge computing gateways . From a vertical industry chain perspective, GIoT divides its exhibition area into the sensing layer, network layer, platform layer, and application layer —communication modules, located at the network layer, connect upwards to the platform layer for data aggregation and analysis, and downwards to the sensing layer for data acquisition and terminal execution, making them a crucial link in the entire industry chain. What does this mean? For communication module manufacturers, GIoT is not a general exhibition they "casually attend," but rather an industry hub that precisely brings together downstream buyers and application solution providers . The target audience includes system integrators, IT service providers, software developers, and end-user buyers in fields such as smart cities, intelligent transportation, smart grids, smart manufacturing, and smart homes . For communication module suppliers, these are precisely their core target customer groups. II. AIoT Becomes the Main Theme: The Value Leap from "Connectivity" to "Intelligent Connectivity" The most noteworthy trend at this year's exhibition is that the deep integration of AI and IoT has permeated every corner of the event. The exhibition will highlight complete IoT technology solutions across ten application areas , including smart cities, smart security, smart parks/communities, and smart homes . Meanwhile, new AI+ consumer electronics products such as AI glasses, AI PCs, and AI toys, as well as cutting-edge fields like humanoid robots and large-scale model applications, will also be showcased . The concurrent forums further confirmed this trend. During the exhibition, a series of hot topics were discussed, including "Analysis of industry market dynamics and development directions by leaders of well-known IoT companies; Explanation of core IoT technologies by industry experts; Release of new IoT products and technologies; and How to apply 5G technology to the IoT field . " Several professional forums were held concurrently , including the Global IoT Summit, the 5G+AIoT Development Forum, the Artificial Intelligence Technology and Application Summit Forum, and the Industrial IoT Application Summit Forum . As AI moves from the cloud to the edge and from concept to deployment, communication modules are no longer just "data transmission pipes," but key nodes that support edge AI inference and enable local intelligent decision-making. This is the core logic behind the value leap of communication modules. The inclusion of "AI + Ecosystem (chips, computing power, data, edge computing, vision)" as a separate section in the exhibits indicates that the industry consensus has reached on the downward shift of AI capabilities from chips to modules and then to edge computing. III. Market Data Support: The Cellular IoT Module Market is Undergoing Structural Restructuring The exhibition's popularity and the number of exhibitors did not come out of thin air. According to Counterpoint Research's latest Global Cellular IoT Module and Chip Tracker report, global cellular IoT module shipments grew by 4% year-on-year in the first quarter of 2026 . However, the drivers of growth are undergoing structural differentiation. 5G is the fastest-growing cellular technology with a year-on-year growth rate of 39% , mainly benefiting from increased demand for routers/CPEs, connected PCs, and automotive applications. Meanwhile, shipments of 4G Cat 1 bis modules increased by 12% year-on-year , primarily driven by demand for smart meters, POS terminals, asset tracking, and connected vehicle applications in developing markets such as India, the Middle East and Africa, and Latin America. 6% of total cellular IoT module shipments in the first quarter of 2026. Although this proportion is not high, the trend of AI capabilities being pushed down to the module level has been established—from the independent setting of the "AI + Ecosystem" section at exhibitions to the large number of AI consumer electronics products on display, all of these confirm this direction. More noteworthy are the changes on the cost side. Counterpoint predicts that the average selling price of cellular IoT modules will rebound in the second half of 2026 due to rising storage costs, as suppliers will raise module prices to maintain profitability. This upward price trend is expected to gradually extend to entry-level product segments, including Cat 1 and LTE-M. The rebound in ASP signifies that value competition in the module industry is shifting from "price wars" to "value wars" —high-value-added modules that can provide high reliability, multi-protocol integration, and edge AI capabilities will gain the upper hand in the new round of market competition. The full industry chain showcase at GIoT, from communication modules to edge computing gateways, and from AI chips to AIoT platforms, is a concentrated manifestation of this trend. IV. Three Strategic Opportunities for Communication Module Manufacturers from the Perspective of GIoT The signals released by GIoT 2026 are clear enough. For communication module manufacturers, three major strategic opportunities are taking shape: Opportunity 1: Multi-protocol integration capabilities are becoming standard. Single communication protocols can no longer meet the needs of complex scenarios. At the exhibition, a full spectrum of connectivity capabilities was showcased, ranging from the underlying sensing layer (RFID, sensors, positioning technologies (UWB/BeiDou)) to the communication and network layer (5G/6G modules, LPWAN (LoRa/NB-IoT), and edge computing gateways), covering short-range to wide-area applications and from licensed to unlicensed frequency bands . Vendors capable of supporting multiple communication protocols simultaneously on a single module will gain broader application coverage and higher customer loyalty. Opportunity Two: AI Capabilities Descending to Module Levels. As AI glasses, AIPCs, humanoid robots, and large-scale model applications become the focus of the exhibition , communication modules need to handle not only data transmission but also computational tasks such as edge AI inference and local decision-making . The "AI + Ecosystem" section of the exhibits covers the entire chain from chips, computing power, and data to edge computing and vision . The integration of modules and AI is changing from an "optional" to a "must-have." Opportunity Three: Vertical Industry Know-How Becomes Key to Differentiated Competition. The exhibition showcased comprehensive IoT solutions in smart cities, smart security, smart homes, and industrial internet . Suppliers who deeply understand the needs of vertical industries and provide customized module solutions will gain higher customer loyalty and premium pricing power. The target audience included end-user buyers from over 20 sub-sectors, such as smart cities, smart transportation, smart grids, smart manufacturing, smart healthcare, smart parking, smart meters, and smart homes —each sub-sector representing differentiated module needs. In conclusion The 2026 Global Internet of Things Conference and Shenzhen International Internet of Things Industry Ecosystem Expo has concluded, but the industry trends it revealed are only just beginning to take hold. 400 exhibitors, 60,000 professional visitors, and a complete industry chain covering the perception layer to the application layer —behind these figures lies an IoT industry landscape that is rapidly being restructured. As 5G leads the growth of cellular IoT modules with a 39% growth rate, as the AI+ ecosystem rises from a peripheral section of the exhibition to an independent exhibition area, and as communication modules expand from a single link in the "network layer" to a core link connecting the four layers of perception, network, platform, and application—communication modules are moving from a "supporting role in the industry chain" to a "value center . " For those working in the communication module industry, the question they need to answer now is no longer "Will AIoT come?", but rather "When AIoT is deployed on a large scale, are your module solutions ready? "  

From June 9th to 12th, 2026, the 23rd Guangzhou International Building Electrical Technology Exhibition (GEBT) was held in Guangzhou. At the exhibition, KingPAC showcased for the first time its comprehensive solution for the Internet of Things (IoT) across all scenarios, based on its independently controllable PLC-IoT technology. Its core concept directly addresses industry pain points: no new wiring or complex debugging is required; simply plug it in to have a stable, secure, and intelligent IoT system .   This demonstration sends a clear signal to the industry: PLC-IoT is evolving from an "alternative communication solution" into an "invisible infrastructure" for large-scale commercial deployment of smart homes . I. Underlying Communication Logic: Wires vs. Air Interface To understand why PLC-IoT has become a focal point, we first need to understand its fundamental differences from wireless solutions. Wireless modules (Wi-Fi, Zigbee, Bluetooth Mesh) rely on electromagnetic waves to propagate signals and operate in the 2.4GHz/5GHz frequency band. When the signal passes through walls, it is significantly attenuated when encountering load-bearing concrete walls and metal cabinets; in the unlicensed 2.4GHz band, microwave ovens, neighboring routers, etc., cause serious co-channel interference. PLC-IoT is entirely different. It uses the existing 220V/380V power lines in the home as the data transmission medium , superimposing communication signals in the 0.7–12MHz frequency band . The signal is conducted along the power lines and is not affected by physical obstructions from walls, floors, or metal structures . As long as the circuit is powered, the communication link exists stably . Key conclusion: Wireless modules are limited by signal attenuation and frequency congestion in physical space, while PLC-IoT relies on the physical closed loop of power lines, naturally possessing the fundamental advantage of penetrating walls and being unobstructed. This is the most fundamental and insurmountable structural difference between the two. II. Measured Data: Quantitative Difference in Stability The aforementioned underlying differences are directly reflected in the measured performance. Regarding latency , the PLC-IoT end-to-end response latency is consistently below 50 milliseconds . In a typical three-bedroom apartment, Huawei's solution maintains a response latency consistently below 50ms, with a signal strength standard deviation only one-third that of Wi-Fi solutions . Wireless solutions exhibit greater latency fluctuations, with typical values for Wi-Fi/Zigbee ranging from 100 to 400 milliseconds . In terms of communication success rate , PLC-IoT has a nominal communication success rate of up to 99.99% . In terms of device connectivity , a single PLC-IoT host supports 128–384 device nodes . KingPAC's solution can stably connect over 1000 device nodes per network , supporting more than 15 levels of relays . Wi-Fi typically only supports 30–50 devices . Key findings: In the three core dimensions of latency, success rate, and device capacity, PLC-IoT demonstrates a quantifiable systemic advantage over wireless modules. This is not a "slightly better" advantage, but rather a difference of orders of magnitude. III. Independent Verification of Academic Research The academic research "Research on Smart IoT Application Architecture under the Advantages of PLC-IoT Technology", published in Hebei Industrial Science and Technology in 2024, systematically compared the three technologies . The research results show that home systems using PLC-IoT technology achieve stable long-distance communication, which is impossible with ZigBee technology, reducing costs by approximately 30% compared to KNX technology, and improving the overall system's anti-interference capabilities . The study clearly concludes that PLC-IoT technology is more suitable than ZigBee and KNX technologies for realizing smart homes, building automation, and other intelligent IoT applications . Key findings: Academic research, from an independent third-party perspective, has verified the comprehensive advantages of PLC-IoT over wireless and traditional wired solutions in terms of stability, cost-effectiveness, and anti-interference capabilities. IV. Engineering Advantages: "Network-with-Power" System Eliminates the Need for Wiring Although wireless modules do not require wiring, they face multiple hidden costs in actual projects : large houses require the deployment of multiple Mesh nodes to ensure signal coverage; and the walls of old houses cause severe attenuation of 2.4GHz/5GHz signals. The engineering advantage of PLC-IoT lies in its "no wiring required"—simply install a smart host in the distribution box to achieve whole-house communication coverage through existing wiring . This solves the problem of wireless communication being greatly affected by the surrounding environment, and the elimination of wiring eliminates issues such as the need for separate wiring for industrial fieldbuses, resulting in messy wiring, aging lines, and difficult maintenance. KingPAC's data presented at GEBT 2026 is even more convincing: typical hotel rooms or offices can complete intelligent upgrades in just 2 hours without breaking walls or shutting down operations, reducing the renovation period by 90% . Their solution can directly reuse existing old power lines within the building, without distinguishing between copper or aluminum cores or requiring any rewiring . Key findings: The "no wiring required" feature of wireless modules is often offset by signal coverage issues in practical engineering; the "no wiring required" feature of PLC-IoT is truly "plug and play"—this advantage has decisive commercial value in the existing housing renovation market. V. Network Outage Availability: The Reliability Advantages of Local Deployment The PLC-IoT system is deployed and operates entirely locally—all control logic, scene linkage, and data storage are executed on the local gateway, ensuring full functionality even during network outages . Both Huawei's whole-house smart home system and Haier's smart home system emphasize "uninterrupted connectivity during network outages . " If a purely wireless solution relies on the cloud to execute commands, the devices will lose their ability to operate in the event of a broadband outage . Even though Zigbee 3.0 itself supports local networking, if the manufacturer has not performed offline optimization, it may still be affected by the gateway's network status. Key findings: Local deployment of PLC-IoT enables it to maintain core functions even in network outage scenarios; while cloud-based wireless solutions may be completely paralyzed when the network is out of service. VI. Market Validation: From Industry Consensus to Large-Scale Deployment There is a growing consensus in the industry that as smart homes move from "single-product intelligence" to "whole-house intelligence," and from the "pre-installed market" to "upgrades of existing systems," PLC-IoT, with its underlying advantage of "network access wherever there is electricity," is becoming a key bridge connecting these two markets . Huawei's HarmonyOS Smart Home adopts a triple architecture of "PLC-IoT + StarFlash + Wi-Fi 7," with the PLC utilizing existing wiring to transmit data. Haier Smart Home leads the way with its PLC-based wall-mounted solution, boasting self-produced products across all categories, 3,300 stores, and a decade of dedicated concierge services. Brands like Midea Smart Home have also launched PLC-based post-installation whole-house smart solutions. $11.7 billion in 2025 and is projected to reach $20.9 billion by 2032 , representing a compound annual growth rate of 8.6% . VII. Oufexin Technology: Full-Stack PLC Solutions Empower Industry Implementation As a professional company deeply involved in the field of PLC technology, Shenzhen Qogrisys Technology Co., Ltd. has formed a complete technology matrix in this field, from chip-level modules to full-stack system solutions. S130N-ISI Series – Fully Integrated PLC Module Based on Lianxintong VC6330 The S130N-ISI is a fully integrated power line communication module, internally integrating a 32-bit ARM Cortex-M3 MCU, a 32-bit DSP, embedded Flash, and 1MB SRAM . The module uses an LCC package, featuring an ultra-miniaturized size and compact structure; it integrates an on-chip wire driver, resulting in low power consumption and strong noise immunity . It can be widely used in various PLC real-time communication applications such as smart streetlights, smart homes , central air conditioning, and ubiquitous power IoT terminal devices . 3121N-H Series – Wideband PLC Module Based on HiSilicon Hi3121S The 3121N-H is developed based on the HiSilicon Hi3121S, operating in the 0.5-3.7MHz and 2.5-5.7MHz frequency bands, and its protocol is based on a subset of the IEEE 1901.1 standard. One CCO can connect 200 STAs and supports dynamic routing and automatic multi-path addressing for rapid network setup. Oufexin's PLC module products can be widely used in various PLC instant communication application scenarios such as smart street lights, smart homes , smart parking, central air conditioning, photovoltaic communication, and ubiquitous power Internet of Things terminal equipment. Based on the Hisilicon and Lianxintong dual-chip platforms, the company has formed a complete PLC module product matrix ranging from narrowband to broadband and from hundreds to thousands of nodes. In conclusion The rise of PLC-IoT is not a replacement for wireless solutions, but a structural supplement to the communication infrastructure of smart homes . Behind walls where wireless signals cannot penetrate, in commercial spaces requiring large-scale stable networking, and in existing buildings where rewiring is not feasible, PLCs are becoming that "invisible but indispensable" connection base. For every participant in the smart home and IoT module industry, the question that needs to be answered now is not "Will PLC become mainstream?", but "When PLC-IoT becomes the default communication method for smart homes, is your product ready? " Shenzhen Qogrisys Technology Co., Ltd. specializes in PLC technology. Based on mainstream chip platforms such as HiSilicon Hi3121S and Leadcore VC6330/VC6322TF, it has launched a complete series of PLC module products, including the 3121N-H and S130N-ISI. Learn more about PLC modules and solutions.