China Shenzhen Ofeixin Technology Co., Ltd Company News

I. Industry Trends: PLC Technology Ushers in a "Return to Value" In August 2026, Huawei released Lingxiao PLC 3.0 networking technology, once again bringing PLC (Power Line Carrier Communication) into the industry spotlight. Meanwhile, the revision of domestic PLC power line carrier standards began at the beginning of the year, with in-depth discussions focusing on four major scenarios: industrial lighting, outdoor streetlights, smart home systems, and hotels. In the international market, the launch of the Matter-PLC bridge enabled interconnectivity between the domestic PLC ecosystem and global Matter ecosystems such as Apple HomeKit and Samsung SmartThings. A series of signals indicate that PLC technology is undergoing a profound "value return" —from its early single application mainly in smart meters, it is rapidly penetrating into diversified scenarios such as smart homes, smart cities, and the Industrial Internet of Things. With its unique advantage of "where there is electricity, there is internet," it has become one of the core solutions for the new generation of smart connectivity. II. Technical Analysis: Why PLCs Have Become "Invisible Infrastructure" The fundamental difference between PLC-IoT and traditional wireless solutions lies in the underlying communication logic. Wireless modules (Wi-Fi, Zigbee, Bluetooth Mesh) rely on spatial electromagnetic waves to propagate signals, operating in the 2.4GHz/5GHz frequency band. When the signal passes through walls, it experiences significant attenuation due to load-bearing concrete walls and metal cabinets, and also faces co-channel interference . In contrast, PLC-IoT uses existing 220V/380V power lines in the home as the data transmission medium. The signal travels along the power lines and is unaffected by physical obstructions from walls, floors, or metal structures —as long as the circuit is powered, the communication link remains stable . The actual test data is even more convincing: the end-to-end response latency of PLC-IoT is stable within 50 milliseconds , and the communication success rate is nominally as high as 99.99% ; a single host can support 128–384 device nodes ; academic research has also confirmed that PLC-IoT has comprehensive advantages over ZigBee and KNX technologies in terms of stability, cost-effectiveness and anti-interference ability . More importantly, there is a transformation at the engineering level – PLC-IoT achieves true “no wiring required” : simply add a smart host to the distribution box, and you can achieve whole-house communication coverage through existing wiring . III. Ofeixin PLC Module Product Matrix: A "Connection Base" Covering All Scenarios As a professional enterprise deeply involved in the field of PLC technology, Shenzhen Ofeixin Technology Co., Ltd. has formed a complete technology matrix in this field, from chip-level modules to full-stack system solutions. The 3121N-H is a fully integrated power line carrier communication module developed by Ofeixin based on the Hisilicon Hi3121S chip. It operates in the 0.5-3.7MHz and 2.5-5.7MHz frequency bands, and its protocol is based on a subset of the IEEE 1901.1 standard , allowing it to interconnect with chips using the same standard subset. In terms of core performance, the physical layer peak rate is 0.507 Mbit/s and the application layer rate is 80 Kbps ; it is equipped with a 200MHz ARM Cortex-M3 processor with 256KB SRAM; a single CCO can support up to 200 STA nodes , supports dynamic routing and multi-path automatic addressing, and a typical 200-node Layer 2 network can be completed within 10 seconds . In terms of communication reliability, it adopts OFDM modulation, supports BPSK/QPSK, and has FEC forward error correction and CRC check; it also supports TDMA and CSMA/CA mechanisms, providing 4 levels of QoS guarantee ; the receiving sensitivity is better than 0.2mVpp. In terms of engineering, it measures only 23.5×30mm , integrates built-in wire drive and onboard coupling circuitry, and provides a rich set of interfaces such as UART, PWM, GPIO, I2C, and ADC; static power consumption is ≤0.15W, and dynamic operating power is ≤0.7W . The S130N-ISI is a fully integrated power line carrier communication module developed by Ofeixin based on the Lianxintong VC6330 chip. It uses an LCC package and measures only 20.6×12.6mm , making its ultra-miniaturized design suitable for space-constrained devices. In terms of core architecture, it integrates a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor , equipped with embedded Flash and 1MB of on-chip SRAM . The two cores work together, with the MCU responsible for the protocol stack and system control, and the DSP dedicated to physical layer signal modulation and demodulation, resulting in better communication performance in complex power line environments. In terms of communication protocols and modulation, it supports both China SGCC Q/GDW 11612 and IEEE 1901.1 protocols , supports multiple modulation methods such as BPSK, QPSK, and 16QAM, supports SGCC 0-12MHz bandwidth and provides multiple selectable frequency bands, which can be flexibly configured according to the scenario. In terms of interfaces and development support, it provides a rich set of interfaces including UART, PWM, GPIO, ADC, SPI, and I2C. Ofeixin also provides a full-stack solution and a development toolchain for deep collaboration with the cloud platform, integrating modules, coupling circuits, and power modules, supporting 220V direct connection testing . This one-stop support effectively reduces the development threshold and cycle time for terminal manufacturers. IV. Scenario Value: The "Connecting Foundation" from Smart Homes to Smart Cities The value of PLC technology lies in its unique advantage of "having a network wherever there is electricity" —it eliminates the need for additional communication cables, allowing the construction of a communication system directly using the existing power network, thus achieving "one power line, two uses". In smart home scenarios , the value of PLCs is being fully validated by leading companies. Huawei's HarmonyOS smart home solution uses wired PLC connections to replace many wireless solutions that rely on WiFi/Zigbee, achieving a claimed communication success rate of 99.99% . At the 2026 AWE exhibition, Haier launched a new generation of PLC smart home solutions based on Lihe Micro PLCs, adopting a PLC-Mesh architecture and possessing core advantages such as "direct device connection, ultra-fast response, local decision-making, and availability even when the network is down ." Ofeixin's 3121N-H and S130N-ISI modules are indispensable communication nodes in these whole-house smart solutions—from lighting control and smart curtains to central air conditioning, PLC modules make "no blind spots in the whole house, and controllable even when the network is down" a reality . In smart city scenarios , PLC technology demonstrates its "infrastructure-level" connectivity value. According to actual test data, under a standard urban power grid environment, PLC-IoT technology can achieve reliable communication over a distance of 500 meters , with the latest chip solutions even reaching 2400 meters . Eastsoft Carrier has launched an "AI + Road Lighting Integrated Solution," centered on an AI intelligent agent and integrating PLC and Cat.1 dual communication technologies, which has been implemented in multiple locations across the country. In scenarios such as smart streetlights, smart parking, charging piles, and photovoltaic communication , Ofeixin's 3121N-H and S130N-ISI modules achieve reliable communication between devices through existing power lines, eliminating the need to lay separate communication lines for each terminal— a single power line provides both power and communication , representing a true "new infrastructure" connectivity paradigm. In industrial and energy scenarios , the application boundaries of PLCs are expanding from the electricity meter end to the energy Internet of Things (IoT) end . With the large-scale access of new loads such as distributed energy and electric vehicle charging networks, the growth drivers of PLC chips and modules are shifting from the increase in the price of a single chip to multiple drivers such as the expansion of application nodes, the upgrade of dual-mode communication, and the spillover of energy management scenarios . V. Looking to the Future: Ofeixin and the New Paradigm of PLCs complete PLC module product matrix, full-stack system solutions, and deep cooperation with chip manufacturers , Ofeixin is occupying a key position in this PLC technology wave. Whether it's smart home lighting control and smart curtains, or smart city street lighting and charging pile communication— wherever there is electricity, there are Ofeixin's connectivity solutions . The return to value of PLC technology is essentially a rethinking of the essence of "connectivity": the most reliable connections are often hidden in the most basic power lines . Ofeixin is moving forward with this new paradigm.    

Introduction: A Technological Acceleration Triggered by AI In August 2026, the wireless communications industry made a surprising prediction— the launch of enterprise-grade Wi-Fi 8 might be brought forward to 2027 . According to the normal pace of technological iteration, Wi-Fi 7 will only begin large-scale commercial use in 2024, and Wi-Fi 6E is still in the process of becoming widespread. How could a completely new generation of Wi-Fi standards arrive so quickly? The answer lies in a seemingly unrelated industry chain— the shortage of DDR4 memory chips . And this shortage, in turn, has opened an unprecedented golden opportunity for Wi-Fi 7. I. DDR4 Shortage: A "Supply Chain Tsunami" Triggered by AI 1.1 Price Surge: From $2.90 to $24 To understand this forcing effect, we first need to see the severity of the DDR4 shortage. According to data from market research firm DRAMeXchange, in July 2026, the average fixed contract price for general-purpose PC DRAM chips (DDR4 8Gb 1Gx8) was $24 , a 14.3% increase from $21 in June . This price is the highest since price monitoring began in June 2016 , representing an increase of more than eight times compared to the initial benchmark of $2.9 . At the beginning of 2026, the average price of DDR4 8Gb was only $11.50. In just over six months, the cumulative increase reached a staggering 109% . TrendForce predicts that traditional DRAM contract prices will rise by another 13% to 18% quarter-on-quarter in the third quarter of 2026. 1.2 Root cause of the shortage: AI has "drained" traditional DRAM production capacity The root cause of this shortage is not a sudden surge in demand for DDR4 itself, but rather the siphon effect of AI infrastructure construction on storage capacity . The world's three major DRAM manufacturers—Samsung, SK Hynix, and Micron—have almost entirely devoted their new production capacity to AI-related products such as HBM (High Bandwidth Memory), server DDR5, and LPDDR5X , while the amount of chips allocated to the general DDR5, DDR4, and industrial control markets continues to decrease. Memory module manufacturer Apacer Technology has warned that, based on the original equipment manufacturer 's (OEM) supply plans, the amount of DRAM available for allocation to module manufacturers will continue to decline, and the supply-demand imbalance may persist until at least the first half of 2027. Industry insiders predict that the shortage may continue into 2028. This is not a short-term supply and demand fluctuation, but a structural redistribution of production capacity . The more prosperous the AI industry becomes, the more scarce traditional DRAM will be—and wireless access point equipment is precisely highly dependent on DDR4. II. From DDR4 to Wi-Fi 8: An Unexpected Transmission Chain 2.1 Why can't enterprise-level APs do without DDR4? Modern enterprise-grade wireless access points (APs) are heavily reliant on DDR4 memory. In Wi-Fi 6E and early Wi-Fi 7 devices, in order to handle the massive throughput data generated by multiple frequency bands such as 5GHz and 6GHz, a single high-end enterprise-grade AP is generally equipped with 2GB to 4GB of DDR4 memory chips to support complex concurrent queues and low-latency forwarding. With DDR4 chip prices soaring, the bill of materials (BOM) cost per access point (AP) faces significant growth. Several WLAN vendors have already raised their product list prices to offset the increased memory component costs driven by the AI infrastructure boom . 2.2 How does Wi-Fi 8 bypass DDR4? Wi-Fi 8 (IEEE 802.11bn) has undergone a fundamental restructuring of its underlying architecture . Unlike Wi-Fi 6E and the earlier Wi-Fi 7, which relied on a large DDR4 memory buffer pool, Wi-Fi 8 directly embeds data stream processing into a high-speed cache and a customized ASIC channel by moving chip computing power forward and reconstructing the underlying hardware acceleration engine . The effects of this architectural innovation are astonishing: DDR4 consumption per AP has plummeted by approximately 75% . Meanwhile, Wi-Fi 8 can be directly paired with DDR5—currently, DDR5's supply and availability are far superior to DDR4. The greater the cost pressure, the stronger the incentive to switch to Wi-Fi 8. Siân Morgan, senior director of Dell'Oro Group, pointed out: "The faster manufacturers adjust their access point (AP) designs to reduce their reliance on high-cost storage components, the more competitive they become on price. This constitutes a strong driving force for the transition to Wi-Fi 8." III. The "Golden Window" for Wi-Fi 7 and the "Early Entry" of Wi-Fi 8 3.1 Wi-Fi 7: Currently experiencing its peak performance It is important to emphasize that the early release of Wi-Fi 8 does not signify the decline of Wi-Fi 7. On the contrary, Wi-Fi 7 is currently at the peak of its commercial life cycle . Dell'Oro Group predicts that the Wi-Fi 7 market revenue will achieve triple-digit percentage growth in 2026. In the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of enterprise access point revenue , compared to less than 1% a year ago. Enterprise AP revenue from Wi-Fi 7 grew by 348% year-over-year in Q1 2026. In the year that enterprise-grade Wi-Fi 7 revenue peaks, its cumulative total revenue will surpass the total revenue of Wi-Fi 6E over its entire lifecycle . Dell'Oro predicts that Wi-Fi 7 revenue growth will continue for another three years . In terms of shipments, global shipments of Wi-Fi 7 devices are projected to reach 1.1 billion units in 2026. In less than eight quarters, Wi-Fi 7 jumped from a market share of less than 1% to 44.5% of enterprise AP revenue— one of the fastest standard transitions in the history of enterprise WLAN . 3.2 But the window of opportunity is being compressed. However, the DDR4 shortage is changing everything. Although Wi-Fi 8 is not yet a mainstream technology, and the market is still mainly dominated by Wi-Fi 7 devices, Dell'Oro Group believes that the adoption of Wi-Fi 8 may accelerate significantly as we move into 2027 . RF chip manufacturer Richwave has clearly stated that it has partnered with Qualcomm, MediaTek and other main chip platforms to develop Wi-Fi 8. Telecom operators have started research and evaluation for its implementation, and small-scale shipments are expected to begin in 2027 . IV. The Technological Shift in Wi-Fi 8: From "Speed Competition" to "Stability Competition" 4.1 No longer pursuing the ultimate speed Unlike previous generations of Wi-Fi that were designed primarily for peak throughput, the Wi-Fi 8 standard (IEEE 802.11bn) places greater emphasis on "ultra-high reliability" . The core goal of Wi-Fi 8 is no longer "how fast it can run", but " whether it can still operate stably in dense, interference-prone, and highly mobile environments ". According to the technical direction of the IEEE 802.11bn standard, Wi-Fi 8 can bring about a 25% increase in throughput, a 25% reduction in 95th percentile latency, and a 25% reduction in packet loss probability under the same distance and signal conditions . These figures may not seem as spectacular as the leap from Wi-Fi 6 to Wi-Fi 7, but each one directly addresses the most noticeable pain points for users in daily use. 4.2 Key Technologies: Integration of MAPC and AI One of the core technological breakthroughs of Wi-Fi 8 is the "Multi-AP Coordination" (MAPC) mechanism . Through coordinated scheduling among multiple access points (APs), Wi-Fi 8 can significantly improve overall network performance in high-density environments. Meanwhile, Wi-Fi 8 extensively utilizes AI technology to ensure smooth and stable operation of network systems and devices, comprehensively enhancing the overall user experience of wireless networks. In its Wi-Fi 8 preview released in January 2026, Qualcomm clearly stated that a major design goal is to achieve ultra-high reliability, surpassing traditional Wi-Fi performance . V. Profound Impact on the Module Industry 5.1 Accelerated technological iteration forces module manufacturers to fight on two fronts. For wireless communication module manufacturers, the shortage of DDR4 is forcing the early rollout of Wi-Fi 8, which means they must simultaneously address two technology routes . On the one hand, Wi-Fi 7 is in its peak shipping season , and module manufacturers need to ensure a stable supply and controllable costs for Wi-Fi 7 modules. However, the continued shortage and price increase of DDR4 has directly driven up the BOM cost of Wi-Fi 7 modules. On the other hand, the early arrival of Wi-Fi 8 means that the development window for the next generation of modules has been compressed . From the maturity of the chip platform and the verification of the reference design to the development, testing and certification of module products—the originally ample timeline has suddenly become tight. Whoever can find a balance between the peak shipment of Wi-Fi 7 and the research and development preparations for Wi-Fi 8 will gain the upper hand in the upcoming market competition . 5.2 Supply chain management capability becomes a core competitive advantage The DDR4 shortage exposed a deep-seated problem in the entire module industry: over-reliance on a single component and a single supplier . Storage module manufacturers such as Apacer, ADATA, and Team Group are actively building up inventory to cope with the risk of shortages. However, while this "stockpiling" strategy is feasible for large manufacturers, it poses equally significant financial pressure and inventory risks for small and medium-sized module manufacturers. Supply chain diversification and chip selection are shifting from "strategic options" to "survival necessities ." Module manufacturers that can flexibly switch between multiple chip platforms and respond quickly to different component solutions will have stronger resilience in this supply chain crisis. VI. Ofeixin Wi-Fi 7 Deployment: Positioning It in the Industry Window In the industry transformation brought about by the simultaneous arrival of the golden window of Wi-Fi 7 and the early arrival of Wi-Fi 8, the technological reserves and product development pace of module manufacturers have become particularly crucial. Ofeixin has launched a new generation of Wi-Fi 7 modules, O2072PM (M.2 interface) and O2072PB (13×15mm surface mount package), based on the Qualcomm FastConnect C7700 system (chip code QCC2072), which have now become its main flagship products . This module fully supports Wi-Fi 7 core technologies: tri-band 2.4/5/6GHz, 320MHz channel bandwidth, 4K QAM modulation, and a peak data rate of 5.8Gbps . It also supports enhanced multi-link single radio (eMLSR) , which automatically switches links when interference occurs in a certain frequency band, significantly improving connection reliability . Bluetooth has been upgraded to version 6.0 and integrates high-precision distance measurement (HADM) and channel sounding. . With the Wi-Fi 7 window potentially compressed and Wi-Fi 8 arriving ahead of schedule, O2072PM/O2072PB, through its early deployment, provides a crucial connectivity foundation for high-end scenarios such as industrial equipment, robots, and AI cameras, from chip capabilities to end products . VII. Conclusion: An "Atypical" Technological Revolution The DDR4 shortage has forced the early rollout of Wi-Fi 8, a top-down supply chain event triggered by AI. AI infrastructure development drained DDR4 production capacity → DDR4 price increases impacted enterprise-level AP costs → Equipment manufacturers accelerated their shift to the low memory-dependent Wi-Fi 8 architecture → Wi-Fi 8 arrived ahead of schedule. This chain of events reveals a profound industry principle: in a highly globalized semiconductor supply chain, structural changes in any link can trigger a chain reaction in downstream markets . The early rollout of Wi-Fi 8 was not a natural evolution driven by technology, but rather a forced acceleration driven by cost . For Wi-Fi 7, this crisis has created a unique window of opportunity for the industry— the technology is most mature, the market acceptance is highest, and the competitive landscape is still evolving . References: Dell'Oro Group's "WLAN Five-Year Forecast Report (July 2026)", DRAMeXchange, TrendForce, ABI Research  

I. Industry Transformation: The Dual Waves of Xinchuang and Industrial Control Are Reshaping the Wireless Module Landscape In 2026, China's wireless module industry stands at an unprecedented historical juncture. The Xinchuang (Information Technology Application Innovation) industry is undergoing a critical transition from “pilot demonstration” to “large-scale implementation.” According to forecasts from institutions including DYXinsheng, China's Xinchuang market size is expected to reach RMB 2.66 trillion in 2026, with a year-on-year growth rate of 26.82% —making it one of the fastest-growing sectors in the digital economy. At the policy level, the target for SOEs to complete comprehensive Xinchuang replacement by 2027 remains unchanged. Starting in 2026, core business procurement for Xinchuang in party and government agencies must account for no less than 85%, and no less than 65% for state-owned enterprises. Eight key industries—including finance, telecommunications, and energy—are required to achieve 100% domestic database replacement by 2027. Domestic replacement of office scenarios in party and government agencies nationwide has been essentially completed, and Xinchuang transformation is now rolling out across critical sectors including finance, energy, transportation, healthcare, and education. At the same time, the wave of domestic substitution in the industrial control market is equally powerful. According to industry reports from sources including China Industrial Control Network, the domestic industrial control market surpassed RMB 300 billion in 2025. The localization rate of industrial control in critical sectors—including power, rail transit, new energy, and government affairs—has exceeded 72%, and Xinchuang-compliant industrial control equipment has become the preferred choice for government and enterprise projects. However, one critical issue has long been overlooked: the “wireless connectivity” link for Xinchuang devices and industrial control equipment has consistently been the weak point in domestic substitution. After CPUs, operating systems, databases, and other core software and hardware have successively achieved domestic production, the ability to conduct high-speed, stable, and secure wireless data exchange with the outside world—this seemingly basic “connectivity” capability—has long relied on imported Wi-Fi/Bluetooth modules. This “connectivity” chip is precisely the “last piece of the puzzle” for Xinchuang device wireless connectivity. It is against this backdrop that the emergence of the Wuqi WQ9201B chip solution, combined with the module product deployment by QOGRISYS based on this chip, provides a complete solution for domestic wireless connectivity in the Xinchuang and industrial control sectors. II. The Chip Foundation: Wuqi WQ9201B’s Technological Breakthroughs and Industry Recognition 2.1 From Launch to Mass Production: The Industrialization Journey of the WQ9201B The industrialization path of the Wuqi WQ9201 is clear and well-documented. In October 2023, Wuqi officially announced the launch of its first 2×2 dual-band high-performance data-transmission Wi-Fi 6 + BT Combo chip, the WQ9201. In 2024, the WQ9201 entered the mass production stage. On November 7, 2024, the WQ9201 achieved a milestone breakthrough. At the 2024 China Microelectronics Industry Promotion Conference and the 19th “China Chip” Award Ceremony, the Wuqi high-performance Wi-Fi 6 chip WQ9201—with its stable transmission performance and industry-leading low-power consumption—stood out from 364 products submitted by 280 chip companies to win the 2024 “China Chip” Excellent Technology Innovation Product Award. The “China Chip” Excellent Product Collection campaign is guided by the Ministry of Industry and Information Technology and hosted by the China Center for Information Industry Development (CCID) , making it one of the most influential and authoritative industry events in China’s integrated circuit sector. On July 20, 2026, the WQ9201B chip solution was officially launched on mainstream component marketplaces. The iCEasy marketplace officially listed the Wuqi WQ9201B Wi-Fi 6 wireless network card chip solution, featuring 2×2 dual-band Wi-Fi 6 + Bluetooth 5.4 dual-mode design, supporting PCIe/USB dual interfaces, and having completed adaptation for two major domestic operating systems—UnionTech UOS and KylinOS. This marks the WQ9201B solution’s transition from chip launch to open market availability—completing the critical leap from “lab product” to “shelf product.” On June 29, 2026, Wuqi Microelectronics’ STAR Market IPO application was accepted. This capital-market milestone further confirms the market’s recognition of Wuqi’s technological strength and commercial prospects. 2.2 Core Technical Specifications: Benchmarking Against International Leaders The Wuqi WQ9201B is a 2×2 dual-band high-performance data-transmission Wi-Fi 6 + BT Combo chip, and its technical specifications represent the highest level of domestic Wi-Fi chips. In terms of Wi-Fi performance, the chip supports the full IEEE 802.11 a/b/g/n/ac/ax protocol suite, supports 2.4GHz + 5GHz dual-band concurrent (DBDC) , with a physical layer peak rate of up to 1.2Gbps, bandwidth support of 5/10/20/40/80MHz, and support for OFDMA, 2×2 uplink/downlink MU-MIMO, and beamforming technologies. In multi-device industrial environments, these technologies can effectively reduce network congestion and improve communication efficiency. For Bluetooth, the WQ9201B supports the Bluetooth 5.4 protocol, is compatible with BT/BLE dual-mode and BLE Audio, and supports intelligent and flexible Wi-Fi/BT coexistence strategies. In terms of interface and platform compatibility, the chip supports PCIe 2.0/USB 2.0/SDIO 3.0 three interfaces, and is compatible with X86, ARM, and domestic CPU platforms. The operating temperature range covers -20°C to 85°C, meeting industrial-grade standards. On critical RF metrics, the WQ9201B has reached the level of major international manufacturers, particularly achieving breakthroughs on technically challenging indicators such as RX EVM and Rx Sensitivity. 2.3 Three Core Technological Breakthroughs First, self-developed RISC-V architecture enables core independent control. The WQ9201 adopts Wuqi’s self-developed high-performance RISC-V multi-core CPU, featuring an innovative “2+1+1” architecture—integrating two high-performance RISC-V cores and one low-power core. All chips are designed based on the RISC-V open-source architecture, with completely independent and controllable core IP, achieving freedom from dependence on traditional closed-source architectures at the processor core level. Wuqi is one of the very few domestic communications companies with independent R&D capabilities for both Wi-Fi 6/7 STA and AP chips. Second, breakthrough low-power technology. The WQ9201 integrates Wuqi’s proprietary low-power CMOS PA technology. The self-developed PA architecture reduces power consumption by 30%–40% compared to the current industry mainstream level, with the breakthrough self-developed PA architecture further reducing consumption by 60% , saving 1W of power in typical application scenarios. Official information from Wuqi Microelectronics indicates that at 20MHz bandwidth, its power consumption is less than half that of Qualcomm’s next-generation chips. This metric directly impacts the power supply circuit design and thermal system costs of terminal devices. Third, dual-band concurrent architecture and multi-scenario adaptability. Based on Wuqi’s self-developed RF dual-band architecture, the WQ9201 supports multiple concurrent modes including STA+AP, STA+P2P GO, and STA+P2P GC. A single chip can simultaneously assume multiple network roles, significantly reducing system design complexity. III. Market Opportunity: The “Connectivity” Imperative in Xinchuang and Industrial Control 3.1 The Xinchuang Market’s “Last Piece of the Puzzle” The core logic of the Xinchuang industry is “independent and controllable, safe and reliable.” Over the past several years, domestic CPUs (Phytium, Loongson, Hygon, Zhaoxin, etc.), domestic operating systems (UnionTech UOS, KylinOS, etc.), and domestic databases (Dameng, Renda Jincang, etc.) have gradually built a complete foundational Xinchuang software and hardware system. However, the wireless connectivity capability of Xinchuang devices has long relied on imported chips—whether laptops, tablets, industrial control terminals, or various smart devices, their Wi-Fi/Bluetooth modules mostly use solutions from foreign or overseas manufacturers such as Qualcomm, Broadcom, and Realtek. This creates a significant security gap in the Xinchuang industry chain. The differentiating value of the WQ9201B lies precisely here. The chip has completed deep adaptation for two major domestic operating systems—UnionTech UOS and KylinOS. This means terminal devices based on this chip can run directly on domestic operating systems without additional driver development and compatibility debugging. This adaptation clears the last ecosystem barrier for large-scale commercial deployment of Xinchuang devices. 3.2 The Industrial Control Market’s “Wireless Upgrade” Demand for wireless communication modules in the industrial control sector is growing rapidly. Wi-Fi 6 is becoming the upgrade direction for industrial wireless—compared to traditional Wi-Fi 5, Wi-Fi 6 improves multi-device simultaneous communication capabilities through technologies such as OFDMA and MU-MIMO, effectively reducing network congestion and improving communication efficiency in device-intensive industrial environments. Industrial control scenarios impose unique and stringent requirements on wireless modules: wide-temperature operation (industrial environments have large temperature fluctuations), high reliability (no tolerance for frequent disconnections), interference resistance (factories have numerous electromagnetic interference sources), and long lifecycles (industrial equipment has long replacement cycles, requiring chip solutions with sustained supply assurance). The WQ9201B’s operating temperature range covers -20°C to 85°C, meeting industrial-grade standards. Its built-in high-efficiency power amplifier (PA/LNA) and intelligent Wi-Fi/BT coexistence strategy ensure stable transmission in complex electromagnetic environments. The PCIe interface delivers peak rates of up to 1000Mbps, meeting industrial big-data transmission requirements, while supporting 802.11k/v/r fast roaming for mobile terminal scenarios. Against the backdrop of the industrial control domestic substitution rate already exceeding 72% , the domestic substitution of wireless connectivity modules for industrial control equipment is the next inevitable direction. The WQ9201B solution’s industrial-grade specifications and fully domestic attributes make it an ideal choice for domestic industrial control wireless modules. IV. From Chip to Module: QOGRISYS’s Industrialization Deployment 4.1 The “Last Kilometer” from Chip to Module The value of a chip is ultimately realized through modules. From a chip to a mass-producible module involves a series of engineering challenges: RF design, antenna matching, power optimization, driver development, system adaptation, reliability testing, and more. This is precisely the core value proposition of professional module solution providers. QOGRISYS, as a professional module solution provider, has worked closely with Wuqi to develop a full series of Wuqi-based modules. Two core modules based on the WQ9201B chip—the O9201PB and the O9201PM—address different application scenarios, forming a complete product matrix. 4.2 O9201PB: The Compact Design “PCIe Choice” The O9201PB is a highly integrated Wi-Fi 6 + Bluetooth 5.4 2-in-1 module, with compact dimensions of just 13×15mm. The module supports the full IEEE 802.11 a/b/g/n/ac/ax protocol standard, supports 2.4GHz and 5GHz dual-band simultaneous (DBS) , with a peak rate of up to 1200Mbps. In terms of interfaces, it integrates a Wi-Fi high-speed PCIe interface and Bluetooth peripheral interfaces (UART, PCM), supports uplink/downlink MU-OFDMA and MU-MIMO, and supports multiple security protocols including WPA/WPA2/WPA3, WEP, and WAPI. The O9201PB’s core advantages include: Compact package: 13×15mm small form factor, suitable for space-constrained devices PCIe high-speed interface: Meeting high-throughput data transmission requirements Dual-band simultaneous (DBS) : 2.4GHz and 5GHz operating concurrently, enhancing concurrency capability Multi-mode support: Supporting multiple concurrent modes including STA+AP, STA+P2P GO, and STA+P2P GC Industrial-grade specifications: Meeting wide-temperature operation and high-reliability requirements 4.3 O9201PM: The High-Performance “Flagship Choice” The O9201PM is a high-performance Wi-Fi 6 module featuring M.2 2230 package with PCIe and USB dual interfaces, measuring 22×30×2.9mm. The module integrates 2×2 dual-band Wi-Fi 6 subsystem and Bluetooth 5.4 subsystem, supports PCIe 2.0 and USB 2.0 dual-interface design, and is compatible with X86, ARM, and domestic CPU platforms. The PCIe interface delivers peak rates of up to 1000Mbps, meeting big-data transmission requirements. The operating temperature range covers -20°C to 85°C, with wide-voltage power supply and industrial-grade stability, suitable for long-term stable operation in complex environments such as industrial control and outdoor applications. The O9201PM’s core advantages include: Standard M.2 package: Convenient board integration, compatible with mainstream laptops, tablets, and other devices 2×2 MIMO: Dual-antenna design improving transmission rates and signal stability Dual-band concurrent: 2.4GHz and 5GHz operating simultaneously Low-power design: Supporting excellent RF and baseband performance with extremely low power consumption Industrial-grade specifications: Meeting wide-temperature operation and high-reliability requirements Both modules support the Bluetooth 5.4 protocol and are compatible with BT/BLE dual-mode and BLE Audio. Both support security protocols including WPA/WPA2/WPA3, WEP, and WAPI, meeting the stringent data security requirements of Xinchuang and industrial control scenarios. 4.4 Real-World Application Deployment The WQ9201B solution is not停留在 paper—it has already achieved large-scale commercial deployment across multiple sectors. The Wuqi high-performance Wi-Fi 6 chip WQ9201 has been adopted in multiple China Mobile set-top box models, achieving stable mass-market supply. Additionally, products have achieved volume shipments across multiple sectors including network cameras, cloud PCs, and wireless access points, successfully gaining adoption from brands including China Mobile, Ruijie Networks, Honor, and Tianyi Vision Link (China Telecom) . QOGRISYS, as a module solution provider, plays a critical role in these deployment cases—by converting Wuqi chips into standardized, mass-producible module products, significantly reducing the development barriers and time-to-market cycles for terminal equipment manufacturers. V. Industry Significance: The Strategic Value of Completing the “Connectivity” Gap 5.1 A Complete Closed Loop from “Chip Breakthrough” to “Module Deployment” The combination of the WQ9201B chip solution and QOGRISYS module products constitutes a complete closed loop for domestic wireless connectivity in the Xinchuang and industrial control sectors: Chip layer: Wuqi provides self-developed RISC-V architecture Wi-Fi 6 chips, achieving independent and controllable core IP Module layer: QOGRISYS converts chips into standardized, mass-producible modules, lowering terminal development barriers System layer: Completed adaptation for UnionTech UOS and KylinOS, achieving seamless integration with the Xinchuang ecosystem Application layer: Achieved large-scale deployment in set-top boxes, industrial control machines, wireless access points, and other sectors The establishment of this closed loop means that Xinchuang devices no longer need to be forced to use imported Wi-Fi modules under a “domestic CPU + domestic OS” configuration. The “last piece of the puzzle” for wireless connectivity is being put in place. 5.2 Supply Chain Security and Industrial Independence Against the backdrop of ongoing fluctuations in the global semiconductor supply chain, the strategic value of fully domestic wireless modules is significantly amplified. Devices built with domestic chips not only offer excellent cost-performance and stable product quality but, more importantly, full domestic production ensures supply chain security and reduces constraints from external factors. From an industry perspective, the launch of the WQ9201 breaks the long-standing monopoly of foreign manufacturers in the high-end Wi-Fi 6 market. The chip fills multiple technical gaps in the domestic high-end Wi-Fi 6 chip field. As one of the few companies in mainland China capable of mass-producing Wi-Fi 6 AP chips, Wuqi is driving the domestic Wi-Fi chip industry from “follower” to “parallel runner.” VI. Conclusion The combination of the Wuqi WQ9201B chip solution and QOGRISYS module products is playing a critical role in “completing the last piece of the puzzle” across two high-value markets: Xinchuang and industrial control. From a timeline perspective, the industrialization path of the WQ9201 is clear and solid: October 2023—chip launch; September 2024—China Mobile product compatibility certification; November 2024—winner of the “China Chip” Excellent Technology Innovation Product Award; late 2024—adopted in China Mobile set-top boxes with volume shipments; June 2026—STAR Market IPO application accepted; July 2026—chip solution launched on the open market. This series of milestones constitutes a complete evolutionary trajectory from technological breakthrough to market validation to large-scale commercialization. From a technology and product perspective, the WQ9201B has achieved independent breakthroughs in core technologies including 2×2 dual-band concurrency, self-developed RISC-V architecture, and low-power PA, with key metrics reaching the level of major international manufacturers. The O9201PB and O9201PM modules developed by QOGRISYS based on this chip cover two major scenarios—compact devices and high-performance applications—completing the industrialization deployment from chip to module. From a market and industry perspective, this solution precisely targets two high-value tracks—Xinchuang (RMB 2.66 trillion market) and industrial control (RMB 300 billion market)—and has completed domestic operating system adaptation and key industry customer adoption. This “chip + module” combination is completing the “last piece of the puzzle” for Xinchuang device wireless connectivity, driving the domestic Wi-Fi chip industry from “follower” to “parallel runner.” In 2026—as Xinchuang substitution enters its sprint phase and industrial control domestic substitution accelerates—the domestic wireless connectivity solution represented by the Wuqi WQ9201B and QOGRISYS modules is becoming an indispensable link in China’s independent and controllable industry chain.  

I'm a product marketing staff member at Ofeixin. Our company develops wireless module solutions, working upstream with chip manufacturers like Qualcomm, Realtek, WUQI, and HiSilicon, and downstream serving end customers in fields such as smart homes, industrial IoT, and automotive electronics. Simply put, our role is to transform chips into mass-producible module products and then deliver them to customers for use in complete systems .   we enter the second half of 2026, my own work experience, as well as that of my colleagues, can be summed up in two words: unpleasant . Customers are pushing – projects can't stop, delivery dates can't be delayed, and costs can't rise. But the reality is, component prices are constantly increasing: crystal oscillators are up 10%-30%, PCBs 20%-30%, inductors 30%-70%, and upstream chip manufacturers are also adjusting prices, with ASE (ASE Technology Holding Co., Ltd.) raising prices by over 20%. As module manufacturers, we're in the middle of the supply chain; we have to accept the upstream price increases, but downstream customers are unwilling to bear them . The BOM cost of every WiFi/Bluetooth module is being passively increased, and our profit margins are being continuously squeezed.   Even more concerning is the less-than-optimistic market outlook. Consumer IoT growth has slowed significantly; WiFi 7 appears promising but its penetration rate is only 8%; and despite years of hype, AI modules still only account for single-digit percentages of shipments. Customer orders are becoming more fragmented and uncertain. Meanwhile, the US FCC is imposing component-level bans, and EU compliance requirements are becoming increasingly stringent, making export options narrower and more expensive .   These problems don't occur in isolation; they are systemic and structural. I want to organize these observations and thoughts not to predict the industry's downfall, but as a frontline practitioner, to conduct a review as objectively as possible— where the problems lie and what we can do . The following are real industry observations from the Ofeixin team in mid-2026. I、Supply chain pain points: The 2026 price hike wave will be fully upgraded. 1.1 Price Increases Across Components: From Crystal Oscillators to PCBs, No Component Was Spared In July 2026, the module industry ushered in the most intense wave of component price increases in recent years, showing a trend of cost resonance across the entire industry chain. the PCB sector, leading company Kingboard Laminates and its A-share listed counterparts both raised their prices by 10%-30% ; crystal oscillators and bases saw increases of 10%-30% ; power semiconductor Infineon and its A-share listed counterparts rose by 10%-22% ; MLCC Murata raised its prices for AI servers and automotive-grade products by 10%-40% ; inductors TDK rose by 30%-70% ; and resistors Thick Sound and its A-share listed counterparts rose by 20%-30% . The root cause lies in the out-of-control prices of upstream commodities: the annual price increases of non-ferrous metals such as gold, silver, copper, and tin have reached 30%-200% , while the price increases of components such as PCBs, memory chips, resistors, capacitors, inductors, and IGBTs have reached as high as 50%-800% , and the price of electronic cloth has nearly doubled compared to the low point in Q3 2025. When this trend extends to the module segment, a divergent pattern emerges: " high-end prices have already increased, mid-to-low-end prices are temporarily stable, and the trend is still spreading ." The BOM cost of each WiFi/Bluetooth module is passively rising. 1.2 Price Hikes Across the Entire Semiconductor Supply Chain: Pressure Reached Across the Entire Line from Substrates to Packaging and Testing Beyond components, the entire semiconductor industry chain is also experiencing a wave of price increases. Packaging and testing giant ASE officially announced price increases exceeding 20%. Indium phosphide giant Coherent announced price increases of 15%-20% for ordinary indium phosphide substrates and 30%-40% for high-end epitaxial wafers. Silicon wafer giant Shin-Etsu Chemical raised prices by 5%-8% for standard models and 18%-22% for high-end silicon wafers. Charging module manufacturers have taken the lead – starting July 1, 2026, many charging module manufacturers will raise the prices of their entire product line by 15%, directly due to the rising costs of PCBs, silicon carbide chips, resistors, capacitors, relays, and metals such as copper and silver. For WiFi/Bluetooth/PLC module manufacturers, rising costs at each level of the supply chain are eroding their already thin profit margins. 1.3 Industry gross margins remain under pressure According to industry report data, the industry's average gross profit margin in 2025 was 21.3%, a decrease of 8 percentage points compared to 2024 , mainly due to the erosion of profits by rising prices of upstream chips and components. Leading companies maintained gross profit margins above 26% thanks to economies of scale and their self-developed chip capabilities, but the profit margins of small and medium-sized module manufacturers are being continuously squeezed. Entering 2026, the price increase of electronic components far exceeded the level of 2025, and the downward pressure on gross profit margin will only increase . II. Market Pains: Growth Divergence and Value Dilemma 2.1 Slowing growth in the consumer market In 2025, global shipments of IoT modules reached 1.68 billion units, a year-on-year increase of 31%. However, the growth rate of module shipments for consumer IoT products (smart home, wearable devices) has slowed to 12% . The consumer electronics sector contributed more than 50% of the shipments, but its growth rate has slowed to below 5%. In contrast, the Internet of Things (IoT) and Industrial Internet sectors are growing at a rate as high as 22% . The market is shifting from "ubiquitous connectivity" to "scenario differentiation"—not all sectors are growing, and manufacturers that have chosen the wrong direction will face the dual pressures of shrinking demand and price wars. 2.2 WiFi 7: The "Sweet and Painful" Process of Penetration Climbing WiFi 7 is seen as the next growth engine for the industry, but its penetration rate in 2026 is still far below expectations . Industry forecasts predict that WiFi 7 penetration will increase from 5% in 2025 to 8% in 2026 , contributing as much as 18% of revenue. The initial cost of a WiFi 7 module was $12, 40% higher than that of WiFi 6E, but it is expected to fall below $9 by Q4 of 2026. The good news is that WiFi 7 modules have entered the mass production and deployment stage. In June 2026, GCI Science & Technology disclosed that its Wi-Fi 7 modules had passed the certification of several leading customers and entered the small-batch delivery stage. However, the contradiction between high costs and low penetration rate remains a hurdle that module manufacturers must overcome . 2.3 AI Modules: The Gap Between Expectations and Reality Edge AI modules are seen as a new growth driver, with global shipments of related modules expected to reach 12 million units by 2025. Shipments of edge intelligence modules (integrated AI accelerators) are projected to reach 230 million units, representing a year-on-year increase of 189%. However, the market penetration rate of AI modules is still far below the industry's early optimistic expectations . The unit price of consumer IoT product modules has increased by 19% year-on-year due to the integration of AI edge computing capabilities, but this "price increase" is more driven by cost than by perceived value. In 2026, the shipment share of module solutions equipped with integrated AI acceleration engines is expected to be close to 15%, still a considerable distance from widespread adoption. 2.4 The Industry Dilemma of "Increased Revenue but No Increased Profit" In 2025, the global average export price of modules was US$23.7 per unit, a 21% decrease compared to the same period in 2023 , mainly due to fierce competition in the low-to-mid-range module market leading to price wars. Chinese manufacturers accounted for 55% of global shipments, but their average unit price was about 30% lower than that of similar products overseas. With shipments increasing, unit prices decreasing, and costs rising—under this triple squeeze, "increased revenue but not increased profits" has become a common predicament in the industry. III. The Pain Points of Technology and Application: The Gap Between "Usable" and "Effective" 3.1 Industrial Scenarios: Reliability Challenges in Electromagnetic Environments WiFi/Bluetooth modules perform reasonably well in consumer scenarios, but when they enter industrial settings, electromagnetic interference immediately becomes the most challenging problem . In industrial settings, the strong electromagnetic interference generated by equipment such as frequency converters and motors often leads to signal attenuation, packet loss, and even frequent disconnections in ordinary wireless modules. The requirements for wireless modules in the Industrial Internet of Things (IIoT) have evolved from simply "being able to connect" to "maintaining stable connections even under strong interference ." This demands that modules meet standards far exceeding those of consumer-grade products in terms of RF design, electromagnetic compatibility, and anti-interference capabilities. 3.2 Multi-protocol coexistence: "traffic congestion" in the 2.4GHz band The 2.4GHz band is already overburdened. Multiple protocols such as WiFi, Bluetooth, Zigbee, and Thread are crowding onto the same band, and mutual interference has become a common pain point for smart homes and the Industrial Internet of Things . In environments with numerous Wi-Fi hotspots and Bluetooth devices in the same space, Zigbee packet collisions and high packet loss rates become particularly prominent. The interference problem caused by multiple protocols coexisting cannot be solved independently by a single module manufacturer ; it requires collaborative optimization across the entire industry at the protocol, hardware, and system levels. 3.3 The technical limitations and cost pressures of PLC While PLCs have the unique advantage of being able to communicate as long as they have power, their technical limitations are also obvious . Low-cost PLC chips and modules face significant cost pressures compared to WiFi and BLE communication modules, which are already widely used in local communication in smart homes . The ability to embed small-sized PLC modules into small smart home products such as 86-switch panels, light bulbs, and sensors places higher demands on the chip's peripheral interfaces (such as multi-channel PWM, multi-channel ADC, and more than 10 GPIOs). The penetration of PLCs in the consumer market still faces the dual bottlenecks of cost and technology. IV.Geopolitical Pain: The "Compliance Storm" Escalates in 2026 4.1 FCC New Rules Take Effect: From "Whole Machine Ban" to "Component Blockade" By 2026, geopolitical factors had evolved from "potential risks" to "real costs . " In July 2026, the U.S. Federal Communications Commission (FCC) formally voted to completely ban the sale of equipment in the United States containing key hardware components from Chinese companies deemed to pose a "national security risk ." The FCC chairman explicitly stated that this move aims to "completely close the loopholes in components." The restrictions are no longer limited to specific brand-name end products, but extend to the bottom layer of the entire electronics supply chain . All electronics manufacturers selling products in the U.S. market must undergo in-depth supply chain traceability and compliance audits. 4.2 Certification barriers have been comprehensively upgraded. The FCC certifies approximately 40,000 electronic devices annually, with about 75% of the testing still relying on Chinese laboratories . On April 30, 2026, the FCC unanimously passed a new rule by a 5-0 vote, prohibiting laboratories in China from providing FCC testing and certification for electronic devices exported to the United States. The accreditation of already recognized laboratories in China will gradually expire within two years. Furthermore, the FCC is planning to expand restrictions on Chinese communication modules, potentially banning Chinese-made mobile communication modules from the U.S. market . Once a module is included on the FCC's "Control List," it will be considered a potential national security risk, unable to obtain FCC certification, and thus subject to a complete ban on its entry into the U.S. market. 4.3 Profound Impact on Chinese Module Manufacturers Chinese module manufacturers account for 55% of global shipments , making them highly dependent on exports. In 2025, China's wireless module exports reached $18.5 billion, primarily destined for Southeast Asia and Europe. If the restrictions imposed by the United States are fully implemented, they will directly impact billions of dollars in exports. Analysts believe that if mobile communication modules are ultimately included in the restricted list, global manufacturers will be forced to redesign product architectures, change suppliers, and rebuild certification processes . For connected vehicle, industrial automation, and smart city systems that heavily rely on Chinese modules, this could lead to increased costs and supply delays in the short term. V. As a module solution provider, what is our perspective? Having addressed these four major pain points, let's return to the initial question: As a module solution provider in the middle of the industry chain, what can we do? Frankly, we can't control supply chain price increases, we can't change geopolitics, and we can't control the evolution of technological standards. But our value lies precisely in making "connectivity" simpler and more reliable for our customers in the most complex environments . Component price increases are a fact, but we can help clients keep their BOM costs within a reasonable range through more precise solution selection and more flexible inventory strategies . Low WiFi 7 penetration is also a fact, but our work involves helping clients complete solution verification and mass production preparation while the technology maturity curve is still climbing—so that their products are ready when the market takes off. FCC compliance is becoming more difficult, but we can help clients plan their compliance path in advance , avoiding missing market opportunities due to certification delays. The industry environment in 2026 is indeed more complex than ever before. But the more complex the market, the more it needs professional intermediaries to reduce transaction costs and technical barriers. This is why Ofeixin has chosen to focus on module solutions . For module solution providers, the ability to maintain delivery capabilities under cost pressure, help customers reduce selection risks amidst technical challenges, and make compliance predictions amidst geopolitical changes will determine who survives this round of industry reshuffling. The key to navigating economic cycles lies not in the size of the business, but in the depth of understanding of the industry chain and the speed of response. (Data sources for this article: IIM Information Global IoT Module Market In-Depth Development Research Report (2026), Global Wireless Module Technology Development and Market Prospect Analysis Report (2026), Global IoT Module Industry Development and Outlook Report (2026), Shanghai Securities News, Securities Star, International Electronic Business Information, and other public information)  

For the past decade, most IoT devices have followed a "collect, upload, wait" model—data is transmitted from edge sensors to the cloud for processing. This model is feasible for simple monitoring, but it faces bottlenecks in terms of realtime performance, bandwidth consumption, and privacy protection. Today, WiFi 7 is redefining wireless connectivity with ultralow latency and ultrahigh throughput, while edge AI is bringing computing power down to the device level. The convergence of these two technologies is ushering in a new era of intelligent IoT.   I. The market votes with real money. The Wi Fi 7 market is expanding rapidly. According to Research and Markets data, the global WiFi 7 market size will grow from $2.76 billion in 2025 to $4.56 billion in 2026, with a CAGR of 65.4%, and is expected to reach $33.96 billion in 2030. ABI Research predicts that by 2029, 81% of consumergrade and 92% of enterprisegrade access points will be equipped with WiFi 7 or a newer standard. The edge AI market is even larger. Grand View Research shows that the global edge AI market will be worth approximately $24.9 billion in 2025, and is projected to reach $30 billion in 2026, growing at an annual rate of 20%, and is expected to exceed $118.7 billion by 2033. The convergence of these two multibillion dollar markets means that integration is no longer a vision, but a reality that is already underway. II. Wi Fi 7: A highway paved for edge AI Edge AI demands low latency, high throughput, and high reliability, which are precisely the core advantages of WiFi 7. The 320MHz channel and 4K QAM double the maximum bandwidth from 160MHz, increasing peak throughput by 2.4 times compared to WiFi 6; MultiLink Operation (MLO) allows devices to transmit simultaneously in the 2.4GHz, 5GHz, and 6GHz bands, achieving wirelevel reliability and seamless switching; and the open 6GHz spectrum provides a clean, highspeed channel. III. Edge AI: An Inevitable Shift from the Cloud to the Device AI must move to the edge for three reasons: cloudbased inference suffers from network latency, and in scenarios like industrial control and autonomous driving, tens of milliseconds can determine safety; massive amounts of raw data transmission consume bandwidth, while local processing only triggers communication for meaningful events, enabling architectural restructuring; and local processing of sensitive data naturally reduces the risk of privacy leaks. Currently, industrial visual quality inspection, intelligent security, edge gateways, and robotics and embodied intelligence are recognized as the four directions where edge AI is most likely to become mainstream solutions. Factory automation is the earliest area of implementation, while robotics is closest to the core of physical AI. 四、Core application scenario: The world that is being changed Smart manufacturing and industrial automation : the most urgent need is for integration with industrial scenarios. Industrialgrade WiFi 7 modules support temperatures from 40°C to 85°C, with actual throughput exceeding 4Gbps and latency of approximately 1ms. In SMT workshops, Wi Fi 7 solves signal blind spots, while edge AI performs visual inspection and predictive maintenance; the combination of the two is the only technological option.   Autonomous mobile robots and drones : Robots need to process visual data and make decisions locally in real time, while transmitting critical information back via lowlatency WiFi 7. The global cloudedgedevice collaboration market reached $48.7 billion in 2025 and is projected to exceed $180 billion by 2030, with a CAGR of 22.3%.   Smart Cities and Infrastructure : Under the conditions of wide outdoor temperature range and global compliance requirements, the WiFi 7 module covers a temperature range of 40°C to 85°C, and the edge AI completes image recognition locally. WiFi 7 provides highspeed backhaul, forming a complete closed loop.   Smart Home and Consumer IoT : Homes are shifting from "passive response" to "proactive service." Synaptics released the world's first Wi Fi 7 AInative MCU, integrating Wi Fi 7, Bluetooth LE 6.0, and Thread/Zigbee, enabling end devices to have local sensing and decisionmaking capabilities. The WiFi 7 gateway market is valued at $7.4 billion in 2025 and is projected to reach $20.9 billion in 2032, with home computing power considered the most likely area for explosive growth in 2026 and 2027. V. Ofeixin Wi Fi 7+ Edge AI Product Solution Based on the Qualcomm QCC2072 chip, O2072PM and O2072PB are two WiFi 7 + Bluetooth 6.0 combo modules, fully supporting 4K QAM, 320MHz channels, and MLO, with a peak rate of 5.8Gbps and eMLSR enhanced multilink switching. The O2072PM uses an M.2 Key E interface (22×30mm), suitable for highend robots and industrial equipment; the O2072PB is a compact surfacemount package (13×15×2.3mm), designed specifically for spaceconstrained devices such as AI cameras, smart cockpits, and industrial vision systems. Both support Bluetooth 6.0 channel detection for highprecision ranging. O2072PM also provides deep customization of the entire hardware platform (Qualcomm, Realtek, Woogi, HiSilicon, etc.), including size and interface trimming, native driver adaptation, and scenariobased RF optimization, becoming a key bridge connecting chips and terminal applications. VI. The Deep Logic of Technological Convergence: Integration of Connectivity, Computing, and Security In the past, wireless connectivity and edge computing were two separate paths, but this piecemeal architecture is becoming obsolete. ABI Research points out that edge AIoT platforms must be designed with connectivity, computing, and security as a unified strategy. Integrating Wi Fi 7 and AI acceleration into a single chip (such as the SYN765x) reduces space requirements, simplifies design, and saves costs. The significance of this integration lies in the fact that it is no longer a physical superposition of "WiFi chip + AI chip," but rather treats AI acceleration and wireless connectivity as a holistic system from the ground up, eliminating the need for devices to make painful tradeoffs between local inference and highspeed communication. VII. Industry Trends and Outlook Trend 1 : Wi Fi 7 penetration is accelerating, with a projected CAGR of approximately 65% from 2026 to 2030. AI workloads are driving companies to upgrade their networks ahead of schedule. Trend 2 : Edge AI is going from "optional" to "standard". 2026 is seen as the starting year for the explosion of Edge AI and Physical AI, and industrial computer manufacturers are transforming into AI Box solution providers. Trend 3 : The architecture is shifting from "cloudpipedevice" to "deviceedgecloud" collaboration, and the low latency of WiFi 7 is naturally suitable for distributed AI. Trend 4 : Multiprotocol convergence (Wi Fi 7 + Bluetooth LE + 802.15.4) is becoming a necessity. Singlechip solutions simplify development, reduce costs, and better support crossplatform standards such as Matter.  

Introduction: An Ongoing Shift in Industrial Focus The global wireless communication module industry is undergoing profound structural changes. The Industrial Internet of Things (IIoT) has surpassed consumer electronics to become the fastest-growing and largest core application market for wireless modules . This shift is not accidental—it is the result of the combined effects of four forces: market expansion, technological maturity, policy support, and industry demand. According to the "Global Wireless Module Industry In-Depth Analysis Report (2026)" released by IIM Information, the global wireless module industry market size is expected to reach approximately US$18.73 billion in 2026 , a 14.2% increase compared to 2025, with shipments exceeding 1.25 billion units . On the application demand side, Industrial Internet of Things (IIoT) and smart manufacturing already account for 21.3% of IoT module shipments , with demand for industrial sensors and edge gateway modules growing by 18% annually. Industrial Internet modules achieved a 37% year-on-year growth in 2025 , becoming the second largest segment after consumer electronics. I. Why has the Industrial Internet of Things become the main battleground for wireless modules? 1.1 Market Level: A Trillion-Yuan Demand Pool $277.35 billion in 2025 to $537.4 billion in 2030 , representing a CAGR of 14.3% . Each IIoT terminal requires at least one wireless module, and the size of the downstream market directly determines the total demand for upstream modules . 1.2 Technical Aspect: Wireless solutions are systematically replacing wired connections. Industrial scenarios have historically been dominated by wired protocols such as RS-485 and Modbus, but three major pain points are driving wireless alternatives: high cabling costs , with expensive cabling and construction fees for wired deployments, while wireless modules offer a low-cost "plug-and-play" solution; urgent need to upgrade existing equipment , with the "Implementation Opinions" issued by eight departments including the Ministry of Industry and Information Technology in July 2026 explicitly encouraging enterprises to deploy converged industrial equipment with embedded advanced communication modules; and the inherent need for wireless in industrial scenarios , such as electromagnetic interference environments, wide-coverage mining areas, mobile AGVs, and robots, where wired connections are unsuitable and naturally rely on wireless solutions. 1.3 Industry Level: The Maturity of New Technologies Transforms "Usable" into "Easy to Use" The cost of 5G modules has decreased by approximately 40% within two years, with industrial 5G module prices dropping to around 200 yuan, a 90% decrease compared to the initial commercial launch period . Shipments of 5G RedCap modules are projected to reach 8 million units in 2025 and exceed 30 million units in 2026. The high throughput and low latency of Wi-Fi 6/7 meet the needs of industrial video surveillance and other applications; Wi-Fi HaLow provides communication coverage of up to 1 kilometer in the Sub-1GHz band ; and the integration of Bluetooth 6.0 and edge AI enables modules to perform local data preprocessing. This increased technological maturity directly lowers the barriers and risks for industrial users adopting wireless solutions. 1.4 Demand Level: Edge AI Drives Module Upgrades Towards Intelligence Edge AI computing power is increasingly being deployed at the module level . Factory production lines operate with hundreds of sensors and robotic arms, requiring decisions to be made within milliseconds, leaving no room for cloud-based processing. Modules integrating AI acceleration capabilities can perform intelligent processing at the data source. According to IIM data, shipments of edge intelligent modules (integrated AI accelerators) reached 230 million units in 2025, a year-on-year increase of 189% . Industrial applications are driving the upgrade of modules from communication devices to key nodes integrating communication, computing, and intelligence . 1.5 Policy Level: Global Collaboration to Promote Industrial Internet of Things In July 2026, eight departments, including China's Ministry of Industry and Information Technology, issued the "Implementation Opinions on Promoting the High-Quality Development of the Industrial Internet," which explicitly proposed to comprehensively improve the connectivity rate of industrial equipment . The "Action Plan for Promoting the High-Quality Development of Industrial Internet Platforms (2026-2028)" proposed that the number of connected industrial devices should exceed 120 million units by 2028. The EU's RED Directive amendment (effective in 2026) imposed stricter limits on the energy efficiency of wireless modules; and the North American FCC promoted the 6GHz band dynamic spectrum sharing standard. The core logic of these policies is that the connectivity rate of industrial equipment is a key indicator of a country's manufacturing competitiveness . II . Special Requirements of Wireless Modules in Industrial Scenarios Industrial-grade modules must achieve breakthroughs in the following dimensions : Wide temperature range operation capability. Stable operation within a wide temperature range of -40°C to 85°C. High reliability and interference resistance. Excellent interference resistance design, stable connection maintenance, and millisecond-level low latency response. Long lifecycle and guaranteed supply. Industrial equipment has an upgrade cycle of years or even decades, requiring long-term stable supply and technical support. Small size and high integration. Industrial equipment has limited internal space, so it needs to integrate more functions within the smallest possible size. III . Industry Practice: Ofeixin Industrial Internet of Things Deployment Founded in 2014, Shenzhen Oufexin Technology Co., Ltd., headquartered in Guangming District, Shenzhen, has been recognized as a National High-tech Enterprise . Its product line covers Wi-Fi modules, Wi-Fi HaLow, Bluetooth modules, PLC modules, embedded IoT/AIoT modules, and more, with multiple product lines catering to the core needs of industrial scenarios. 3.1 Wi-Fi 7 Module: Designed for High-Bandwidth Industrial Scenarios O2Flytek has launched the O2072PM Wi-Fi 7 module based on the Qualcomm QCC2072 chip . Featuring an M.2 Key E interface, a 2T2R dual-antenna design, and support for Wi-Fi/BT coexistence, its 320MHz bandwidth, 4096-QAM modulation, and MLO multi-link aggregation technology give it significant advantages in industrial video surveillance, high-definition image transmission, VR/AR, and other scenarios. 3.2 Wi-Fi HaLow Module: A Powerful Industrial Tool for Long-Range, Low-Power Operation The 4108E-S module launched by Oufexin is based on the Morse Micro MM6108 chip, operates in the Sub-1GHz band, supports data rates up to 32Mbps , and is suitable for scenarios such as industrial automation, warehouse management, transportation and logistics, smart agriculture, and smart grids . 3.3 PLC Module: An Industrial Solution That Enables Communication with Power Power line communication (PLC) utilizes existing power lines to transmit data, eliminating the need for additional wiring . Oufexin PLC modules have been applied in new energy industrial scenarios such as charging piles, photovoltaic inverters, and energy storage systems , featuring low cost, stable communication, strong real-time performance, and strong anti-interference capabilities. 3.4 Industrial-grade Wi-Fi/Bluetooth module Ofeixin product line is clearly divided into three levels: consumer electronics grade, industrial grade, and automotive grade . The industrial grade module has excellent industrial temperature range performance and millisecond-level low latency , with an operating temperature range of -40 °C to 85°C, a transmit power of 19dBm, and a receive sensitivity of -82dBm. IV . Market Prospects and Industry Opportunities In terms of market size , the global wireless module market is projected to reach US$14.44 billion by 2030. The Chinese WLAN module market is expected to generate US$3.5-4.5 billion in annual revenue by 2026, with total shipments exceeding 600-700 million units. From a technological perspective , industrial module shipments are projected to reach 110 million units in 2026. The 5G industrial IoT market is expected to grow from $17.3 billion in 2025 to $22.56 billion in 2026. In terms of the competitive landscape , Chinese suppliers have already occupied 67% of the global module market share, but they also face the dual pressure of rising material prices and trade barriers. V .Conclusion: Four forces working together to drive the shift in industrial focus The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules, a result of the combined effects of market forces, technology, demand, and policy . Market level : The trillion-dollar and rapidly growing IIoT market provides a huge demand pool for modules; From a technical perspective : the maturity and cost reduction of technologies such as 5G, Wi-Fi 6/7, Wi-Fi HaLow, and Bluetooth 6.0 have transformed wireless solutions from "usable" to "easy to use". On the demand side : The extreme requirements for real-time performance and reliability in industrial scenarios are forcing modules to evolve towards edge intelligence; Policy level : Major global economies have elevated the connectivity of industrial equipment to a national strategy, creating institutionalized incremental demand. These four forces reinforce each other : technological progress lowers the barriers to entry, policy promotion accelerates transformation, market demand amplifies the scale effect, and the scale effect further reduces costs, forming a positive cycle. The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules. This is not a prediction, but a fact that has already occurred and is accelerating. Whoever can deeply understand the special needs of industrial scenarios—wide temperature range, high reliability, long life cycle, and strong anti-interference—and continuously invest in areas such as multi-mode fusion and edge intelligence will gain the upper hand in the next stage.  

I. Trend Background: Why is "combination" becoming the new normal? IoT devices are becoming increasingly "all-rounders." A smart home control unit needs to connect to the cloud via Wi-Fi and also enable near-field network pairing with mobile phones via Bluetooth; an industrial gateway needs to connect to the local area network via Wi-Fi and also needs Bluetooth for on-site device debugging. This demand for "both...and..." is driving IoT communication modules from "single-protocol dedicated" to "multi-protocol convergence". A multi-protocol module (combo module) refers to a single wireless SoC that supports multiple protocol stacks, providing multiple wireless communication capabilities simultaneously on the same module. The most common combination is Wi-Fi + Bluetooth , with other combinations such as ZigBee + BLE and Wi-Fi + ZigBee . A single-protocol module , on the other hand , focuses on a single communication standard, concentrating all hardware and software resources to serve only one protocol. Both have their advantages and disadvantages, and the selection decision directly affects the device's cost, power consumption, size, and development cycle. 二、Five Advantages of Multi-Protocol Combination Modules 1. Size and PCB Layout: From "Two RF Systems" to "One System Coexisting" Using two independent single-protocol modules means requiring at least two sets of RF traces and two antennas. Multi-protocol modules consolidate the RF front-end, coexistence design, and interfaces onto a single SoC solution, significantly simplifying PCB layout. In the space-constrained environments of IoT devices, replacing two independent modules with a single module can reduce PCB area by more than 40% . 2. BOM Cost and Supply Chain Management: One less module, one less level of complexity The multi-protocol module simplifies procurement and version management into a single part number, significantly reducing the complexity of supply chain management. Compared to three separate modules, the three-in-one module can reduce BOM costs by more than 30% . 3. Power Management: Unified scheduling is better than decentralized management. The power state machine of the combined module makes it easier to implement a unified sleep/wake-up strategy at the driver layer, avoiding leakage current spikes caused by two independent chips operating independently. In contrast, the power management strategies of two independent modules are often difficult to coordinate precisely. 4. Certification and Compliance: Design Once, Test in a Coordinated Manner The combined module narrows down the transmit power level, spectrum template, and coexistence scenarios to a more predictable range, allowing for comprehensive planning of the certification path early in the project. Compared to certifying two modules separately, the combined module can save more than 30% of certification time and cost . 5. User Experience: A Natural Match for the "Distribution Network-Connectivity" Interaction Model In screenless IoT devices, the standard path has become "the mobile phone transmits the Wi-Fi SSID and password via Bluetooth → the device connects to the network via Wi-Fi". The combined module is naturally matched to this interaction model in terms of hardware , without the need for additional cross-chip communication overhead. III. Four major limitations of multi-protocol combination modules 1. Performance compromises: the cost of shared resources Wi-Fi, Bluetooth, ZigBee, and other mainstream wireless technologies coexist in the 2.4GHz ISM band. When they run simultaneously on a single chip, the multiple protocols need to share bandwidth, which may lead to potential increased latency and packet loss . Single-protocol modules concentrate all hardware resources to serve a single protocol, and generally perform better in terms of peak throughput and latency stability . 2. Limited flexibility: A change in one part affects the whole. Combination modules "bundle" multiple protocols onto the same hardware platform. If a product needs to be upgraded to one of the protocols in the future, the entire module often needs to be replaced . Single-protocol modules , on the other hand, can upgrade only one protocol , making product iteration more flexible. 3. Integration complexity: Not "plug and play" When different protocol stacks run on the same chip, a sophisticated time-division/frequency-division scheduling strategy is required to avoid self-interference. Developers need to handle complex issues such as priority management between protocols and coexistence strategy configuration. For inexperienced teams, this may actually prolong the development cycle. 4. The "hidden cost" of power consumption In scenarios where multiple protocols operate simultaneously or alternately, the overall power consumption of combined modules is typically higher than that of single-protocol BLE-only designs . For devices powered entirely by batteries with minimal data transmission , single-protocol BLE modules are more competitive in terms of power consumption. IV. Market Data and Industry Dynamics Market data confirms the upward trend in combo modules. The global wireless module market is expanding at a CAGR of 12.9% , projected to grow from $7.92 billion in 2025 to $8.94 billion in 2026. In the combo chip segment, the global Wi-Fi/Bluetooth Combo chip market reached $18.76 billion in 2025 , a year-on-year increase of 14.2% . Smart home, industrial IoT, and automotive electronics are the three core drivers, with the automotive OEM market expected to reach an annual demand of 980 million units in 2027 . 27.4% year-on-year in 2025. It is predicted that the number of connected IoT devices globally will exceed 30 billion by 2026 , with a significant increase in the proportion of devices using multi-protocol connections. Single-protocol modules will not disappear, but the market share of combined modules is expanding rapidly. V. Ofeixin Technology: In-depth layout of multi-protocol combination modules With multi-protocol combination modules rapidly becoming the industry mainstream, Ofeixin has built a complete product matrix covering multi-protocol combination modules such as Wi-Fi, Bluetooth, PLC, and IoT/AIoT , thanks to its years of experience in the field of wireless communication. In the field of Wi-Fi + Bluetooth combo modules , Ofeixin has achieved full-speed, full-scenario coverage from Wi-Fi 4 to Wi-Fi 7. Its Wi-Fi + Bluetooth combo module product line possesses the following core advantages: First, the speed coverage is comprehensive. From entry-level Wi-Fi 4/BLE combinations to flagship Wi-Fi 7/BLE 5.4 combinations, Ofeixin can provide precisely matched solutions for projects with different cost and performance requirements. The flagship combination module supports a 320MHz ultra-wide bandwidth , achieving high-speed wireless transmission at 5.8Gbps , while integrating the latest generation of Bluetooth Low Energy protocol; the mainstream Wi-Fi 6 series combination module supports 2x2 dual-band concurrent operation , with a stable speed of over 1200Mbps , balancing performance and cost-effectiveness. Secondly, it boasts outstanding interface compatibility. Ofeixin's Wi-Fi + Bluetooth combo module comprehensively covers various mainstream host interfaces such as PCIe, USB, and SDIO , enabling flexible adaptation to main control chips on different platforms and greatly reducing customers' hardware porting and adaptation costs. Third, it has mature multi-protocol concurrency capabilities. Through a sophisticated radio frequency coexistence scheduling algorithm, the combined modules of Ofeixin can achieve low-interference and low-latency collaborative work between Wi-Fi data transmission and Bluetooth scanning/connection , perfectly matching the classic interaction mode of "Bluetooth network configuration + Wi-Fi communication" for IoT devices, as well as multi-task scenarios such as concurrent Bluetooth audio, Bluetooth data transmission and Wi-Fi big data. In terms of multi-technology integration and vertical scenarios , Ofeixin has further integrated Wi-Fi, Bluetooth, and PLC-IoT power line carrier technology. Its PLC-IoT module, based on the IEEE 1901.1 standard, supports a single CCO to connect 200 STA nodes and features dynamic routing and multi-path automatic addressing capabilities, achieving dual "wired + wireless" connectivity in smart home, smart lighting, and other scenarios. In addition, the company also provides Wi-Fi HaLow (based on IEEE 802.11ah, targeting low power consumption and wide coverage), Nearlink , and other multi-protocol modules, widely covering application scenarios such as smart homes, smart cities, industrial IoT, and connected vehicles. From a technological perspective, Ofeixin's product portfolio precisely aligns with the industry's evolution from "single-protocol modules" to "multi-protocol combination modules." The company has obtained numerous core technology patents , and all its products have passed international certifications such as FCC, CE, and SRRC, as well as RoHS and REACH environmental directives. Today, with multi-protocol combination modules becoming the industry mainstream, Ofeixin is providing global IoT devices with a "one-stop" multi-protocol connectivity solution through its product system that covers all protocols, is compatible with multiple interfaces, and is adaptable to all scenarios . VI. Selection Recommendations and Conclusion The difference between multi-protocol combination modules and single-protocol modules is not a simple matter of superiority or inferiority, but rather a matter of different choices for different scenarios . Scenarios where a combination module is preferred include: devices needing to work collaboratively between Wi-Fi and Bluetooth (such as smart home control); limited PCB area; high requirements for BOM cost and supply chain efficiency; and screenless devices requiring Bluetooth to assist Wi-Fi network pairing. Scenarios where a single-protocol module is preferred include: extreme requirements for peak performance of a single protocol; requiring only one communication method; purely battery-powered devices with extremely sensitive power consumption; and scenarios requiring flexible upgrades to a specific protocol without replacing the entire module. The future is not about "combined modules replacing single-protocol modules," but rather "combined and single-protocol modules each finding their proper place." Combined modules, with their smaller size, lower BOM cost, and simplified supply chain, are becoming the mainstream choice for space- and cost-sensitive scenarios; single-protocol modules, on the other hand, remain irreplaceable in industrial control, professional communications, and other scenarios due to their superior peak performance and more flexible upgrade paths . For module manufacturers, having a complete matrix of both types of products is essential to meeting the diverse needs of different customers. The rise of multi-protocol combined modules is not a technological revolution, but an inevitable consequence of demand. 2

Signal attenuation, data loss, and frequent device offline issues in WiFi modules under strong electromagnetic interference are no longer isolated incidents. With the number of connected industrial IoT devices exceeding 10 billion, this problem is evolving from an "occasional inconvenience" to a "systemic risk." According to IDC statistics, the number of connected IoT devices worldwide will exceed 75 billion by 2025. This massive influx of access leads to channel congestion and increased interference, with throughput in some scenarios reaching only 40% to 60% of the rated capacity. As the number of connections surges, each unstable connection could become the trigger for a system-wide disaster. What exactly is going on? And how can this situation be resolved? I. Where does the interference come from? — The physical root cause of WiFi "disconnection" WiFi communication relies on radio waves to transmit data, and the physical characteristics of electromagnetic waves determine their susceptibility to interference . Strong electromagnetic interference is mainly divided into two categories: radiated interference and conducted interference. Radiated interference directly "impacts" the antennas or circuits of WiFi modules in the form of electromagnetic waves. High-power industrial equipment such as frequency converters, servo motors, and high-frequency welding machines are the main culprits. Frequency converters generate harmonics of 10kHz to 100MHz during switching, and the electromagnetic field strength can reach 50V/m at a distance of 1 meter , far exceeding the interference immunity standards of ordinary routers. In addition, mutual interference from devices on the same frequency (other WiFi networks, Bluetooth, microwave ovens) in congested frequency bands such as 2.4GHz, as well as the self-interference generated by high-speed interfaces such as DDR memory, HDMI, and USB on the circuit board, all constitute sources of radiated interference. Research by Murata Manufacturing Co., Ltd. indicates that electromagnetic noise generated by industrial robots and control equipment can interfere with wireless signals such as WiFi, LTE and 5G, potentially causing serious operational problems such as malfunctions in production equipment and production line shutdowns due to communication errors . II. How does interference trigger "symptoms"? — A chain reaction from packet loss to disconnection When interference signals enter the module, they trigger a series of chain reactions. Before sending data, the WiFi device "listens" to see if the channel is empty. If a strong interference signal is detected, it will suspend transmission until the interference disappears—this causes the initial delay. If interference is encountered during transmission, the data packets will be corrupted. The receiving end will discard the packets after detecting the error through verification—this is data packet loss . To compensate for packet loss, WiFi will initiate a retransmission mechanism, but retransmission may fail again in an interference environment, causing a sharp drop in effective throughput. When the interference is so severe that the module cannot complete any successful "handshake" or data exchange, the device will determine that the connection has failed—leading to frequent offline occurrences . These technical problems have had a serious, quantifiable impact in reality: A real-world test of a logistics AGV project showed that the packet loss rate in the 5GHz band surged from 3% to 28% under strong interference ; in an automotive welding workshop, electromagnetic interference from AGVs resulted in a packet loss rate as high as 37% in the 2.4GHz band , causing robot trajectory deviations; a wind farm monitoring system experienced a data packet loss rate of 37% due to inverter interference; an automotive parts factory suffered direct losses exceeding one million yuan due to delayed robotic arm control commands caused by electromagnetic interference, resulting in batch product size deviations; and a cement plant's distributed control system experienced 17 shutdowns per month due to router jitter triggering safety interlocks , with each shutdown resulting in losses exceeding 200,000 yuan . A packet loss rate soaring from single digits to over 30% means that an industrial automation system is only a hair's breadth away from sliding from "controllable" to "out of control". III. Which scenarios are most severely affected? — Pain points in typical application scenarios Automotive welding workshops are notorious for WiFi interference. The simultaneous operation of numerous AGVs and welding robots, with their switching frequencies overlapping with WiFi bands (inverters and servo motors), creates a continuous electromagnetic noise surge. The packet loss rate in the 2.4GHz band reaches as high as 37%, directly causing robot trajectory deviations and product scrap. High temperatures, dust, steel structure obstructions, and strong electromagnetic interference in metallurgical and heavy industrial environments often lead to communication delays and packet loss. A five-axis machining center worth 3 million yuan suffered from servo motor vibration due to network latency, causing the machining error to spike from 0.01mm to 0.15mm, directly scrapping 120,000 yuan worth of aircraft blade blanks. Medical electronic equipment has extremely high requirements for WiFi connection stability. Devices such as electrocardiographs need to transmit vital sign data in real-time without packet loss, requiring WiFi connection stability of over 98% in industrial EMC environments. In smart logistics scenarios, AGVs frequently traverse metal shelving areas while moving through warehouses. The combined effects of signal attenuation and electromagnetic interference can lead to vehicle disconnection, path errors, and even collisions. IV. How can technology fight back? — The evolution from Wi-Fi 6 to Wi-Fi 7 Faced with this challenge, the direction of technological evolution has shifted from simply pursuing speed to pursuing "ultra-high reliability" . Wi-Fi 6/6E: Laying a Solid Foundation Wi-Fi 6 improves spectrum utilization and interference immunity through OFDMA and MU-MIMO technologies. The newly added 6GHz band provides a wider, less interference-prone "highway." In industrial IIoT environments, optimized IEEE 802.11ax networks can reduce the maximum packet loss rate from 32.5% to 23% . Wi-Fi 7: Taking the Initiative Multilink operation (MLO) is the core anti-interference technology of Wi-Fi 7. It allows devices to establish connections simultaneously on multiple frequency bands such as 2.4GHz, 5GHz, and 6GHz. Critical commands can be redundantly transmitted through multiple links —if one link is interrupted by interference, other links can still maintain communication, achieving a stable "link-level" connection. Tests conducted by the Wireless Broadband Alliance (WBA) in a real-world enterprise environment, in conjunction with AT&T, Ruckus Networks, and Intel, have confirmed that under interference conditions, MLO can increase Wi-Fi 7 uplink throughput by up to 116% and reduce uplink latency for real-time services by up to 66% ; under co-channel interference, it can increase downlink throughput by 75% and reduce downlink one-way latency for real-time services by up to 44% . Wi-Fi 8: The Cure for "Instability" Wi-Fi 8 (IEEE 802.11bn) , expected to be released in 2027 , has clearly defined its core goal as "ultra-high reliability ," rather than continuing to increase peak speeds. Multi-AP collaboration technology will allow multiple routers/APs to work together as a "whole system," reducing interference at its source. V. Ofeixin Breakthrough Strategy: From "Standardization" to "Deep Customization" The evolution of technical standards has pointed the way for the industry, but to truly implement the technology into specific products and solve interference problems in real-world scenarios, module manufacturers need to have deeper capabilities. Founded in 2014, Shenzhen Oufexin Technology Co., Ltd. focuses on the communication connectivity industry, possessing complete capabilities from broadband short-range wireless connectivity to deeply vertically integrated industry-leading resources . The company has served over 260 clients , with an annual production capacity of 5200 KPCS , and its products are exported to 7 countries and regions . Ofeixin product line covers a full range of communication products , from Wi-Fi 7/6E/6/5/4 series modules, Wi-Fi HaLow modules, Bluetooth modules, and PLC modules . Modules can be categorized into consumer electronics grade and industrial grade . In industrial applications, its WiFi modules support multiple interfaces such as USB, SDIO, PCIe, and PCIe M.2 , employing WPA/WPA2/WPA3 multi-layer security encryption. Market standard coverage includes WiFi 6, WiFi 6E, and WiFi 7. In long-distance, high-reliability scenarios such as industrial drones, it also supports Mesh networking mode , further enhancing anti-interference and high-stability transmission capabilities. Ofeixin practices reveal an industry trend: standardized modules solve the problem of "usability," while the second half of the IoT era aims to address the issues of "ease of use, reliability, and deep integration with my products ." Many solution providers choose standard modules in the early stages of projects, only to encounter three incalculable costs on the eve of mass production: the compromise cost of structural customization —standard modules have fixed dimensions and antenna interfaces; once the product ID is finalized, dimensional deviations are discovered, requiring either structural modifications (costing hundreds of thousands in mold opening fees) or the addition of adapter cables (sacrificing RF performance); the sunk cost of cross-platform adaptation —when switching a module that works on platform A to a main controller on platform B, driver crashes and a sharp drop in throughput may occur; and the hidden loss of performance bottlenecks —the rate parameters of standard modules are measured in an ideal environment in a shielded room, while in real-world scenarios, performance is determined by latency jitter suppression capabilities, OFDMA resource scheduling strategies, and fast frequency hopping mechanisms. Ofeixin approach is to keep risks out of the customer's R&D stage —based on the PCB stacking and antenna environment of the customer's product, while ensuring RF performance (such as EVM, sensitivity, and spurious compliance), the module size is reduced, the onboard antenna is integrated, and the connector position is changed ; at the same time, with the help of the underlying development experience of the full range of main control platforms such as Qualcomm, Realtek, Woogi, and HiSilicon , the company delivers "native-level drivers" that have been time-aligned, low-power adapted, and anomaly-handling hardened for the main control platform selected by the customer . This "deep customization" capability is the most pragmatic solution to deal with complex industrial scenarios such as strong electromagnetic interference —it's not about forcing customers to "fit" a standard module, but about creating modules for customers' real-world application scenarios. VI. Market Verification: Why "Interference Resistance" is Crucial Market data also confirms the urgency of the "reliability" requirement. The global WiFi & 802.11 module component market size is approximately US$8.279 billion in 2025 and is projected to reach US$11.37 billion by 2032 . The rapid growth of the market highlights the scarcity of "interference resistance and high reliability" capabilities —as the number of connections explodes and application scenarios shift from consumer to industrial, every unstable connection could become the trigger for a system-wide disaster. Meanwhile, WiFi 7 is accelerating its commercial deployment . Currently, there are approximately 11,500 WiFi 7-related patents and 3,000 patent families worldwide. European telecom operator EE has already begun deploying WiFi 7, and Deutsche Telekom has partnered with Airties to advance the first commercial deployments of WiFi 7. Conclusion The instability of WiFi modules in environments with strong electromagnetic interference is the result of a combination of external interference, internal design flaws, and the complexity of the application environment. From the 50V/m electromagnetic field near the frequency converter to the 37% packet loss rate in the automotive welding workshop, and the 17 safety shutdowns per month with each loss exceeding 200,000 yuan —behind these figures lies the urgent need for "highly reliable connectivity" in countless industrial scenarios. The path of technological evolution is clear: from OFDMA in Wi-Fi 6 to MLO in Wi-Fi 7, from standardized modules to deeply customized services, the entire industry is moving from "connectivity" to "highly reliable connectivity ." In this process, module manufacturers that can implement the latest Wi-Fi standards into reliable products while providing deeply customized services will become the key force driving the Industrial Internet of Things (IIoT) from "usable" to "easy to use."  

I. The Tide of the Times: Why the Inevitable Emergence of Body-Possessing Robots Artificial intelligence is undergoing a fundamental paradigm shift. From large language models to multimodal models, the "brain" of AI has acquired the ability to understand, reason, and generate, but a key question remains unresolved: how can AI truly "touch" the physical world? Embodied AI is the answer to this problem. It combines large-scale AI models with physical entities, achieving a leap from "computational intelligence" to "physical intelligence ." If we compare the large model to the "brain" of a robot, then the communication network is its "nervous system"—this "brain" must process massive amounts of heterogeneous data from dozens of sensors distributed throughout the body in milliseconds and issue synchronous instructions to actuators in microseconds . embodied robots is not accidental, but an inevitable result of AI moving from the digital world to the physical world. II. Market Boom: The Trillion-Dollar Track Accelerates According to the "China Embossed Intelligence Industry Development Report (2026)," China has become one of the fastest-growing embossed intelligence markets in the world, with the market size growing from approximately RMB 213.3 billion in 2018 to an estimated RMB 1.09 trillion in 2026 , representing an average annual compound growth rate of 22% to 23% . In July 2026, the Ministry of Industry and Information Technology stated at the 2026 World Artificial Intelligence Conference that China's annual production of humanoid robots is expected to exceed 100,000 units in 2026. Morgan Stanley significantly raised its 2026 forecast for domestic humanoid robot shipments from 28,000 units to 50,000 units , and expects it to reach 446,000 units by 2030 . III. Everyday Life: Embodied Intelligence is Rapidly Becoming a Reality Embodied intelligence is rapidly entering the public eye through high-profile events such as marathons and the Spring Festival Gala. Marathon: Outrunning Humans in One Year. In April 2025, the world's first humanoid robot half marathon took place in Yizhuang, Beijing, with the winner finishing in 2 hours and 40 minutes. In April 2026, the number of participating teams expanded from 20 to over 100, with the Glory "Lightning" winning in 50 minutes and 26 seconds, surpassing the human men's half marathon world record of 57 minutes and 20 seconds . 38% of the participating teams achieved fully autonomous navigation , and the course accumulated a 100-meter elevation gain. Spring Festival Gala: From Yangko Dance to "Cyber Kung Fu". In the 2025 Year of the Snake Spring Festival Gala, 16 H1 robots from Unitree Robotics completed "Yangko BOT" with a synchronization error of 0.1 seconds. In the 2026 Year of the Horse Spring Festival Gala, Unitree Robotics, Galaxy General, Songyan Power , and Magic Atom will collectively appear, with Unitree presenting the world's first fully autonomous robot swarm martial arts performance, "Martial Arts BOT"—more than 20 robots rapidly changing formation in a swarm, requiring no external positioning, and autonomously coordinating with onboard sensors throughout the entire process. From "active" to "usable" , robots are accelerating their transformation into "active" and "usable". IV. Bottleneck Emerges: An Underestimated Key Issue As computing platforms and AI capabilities mature, connectivity is becoming one of the key factors determining whether a robot is "truly usable" . Whether it's humanoid robots or autonomous mobile robots (AMRs), actual deployment places unprecedentedly stringent demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency . ResearchInChina points out that the internal and external communication architecture of robots is facing an unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits . The market size for communication systems specifically designed for intelligent robots is projected to expand rapidly from $42 million in 2026 to approximately $300 million in 2030. The value of communication links is undergoing a structural reorganization from "general-purpose industrial parts" to "dedicated core components . " V、Ofeixin 's dual flagship strategy It is against this industrial backdrop that QOGRISYS launched its Wi-Fi 7 module product line for high-end robots and industrial equipment , precisely covering the market demands at different levels. O2072PM / O2072PB: Second-generation flagship module, currently the main product being promoted. Based on the Qualcomm FastConnect C7700 (chip code name QCC2072), this is a Wi-Fi 7 + Bluetooth 6.0 tri -band 2×2 MIMO module, and is also O2Flytek's current flagship product for intelligent and high-end industrial equipment . Core specifications: Supports 2.4/5/6 GHz tri-band, with a maximum bandwidth of 320 MHz across all bands ; peak data rate up to 5.8 Gbps ; supports 4096-QAM modulation; supports multi-link operation (MLO) ; Bluetooth supports BLE 6.0 and LE Audio; supports 2×2 MU-MIMO; compliant with IEEE 802.11a/b/g/n/ ac /ax/be standards. The O2072PM/O2072PB design includes all the functions of the QCC2072 , with comprehensive optimizations in RF performance, system stability, and power consumption control compared to the previous generation, fully meeting the stringent requirements of multi-sensor fusion, high-definition video backhaul, and low-latency control. The O2072PM uses a standard M.2 interface, allowing for easy integration into embedded systems, gateways, industrial PCs, and various robotic devices. With its full performance potential and large-scale deployment , O2072PM has established a clear product iteration path, and its solutions are already compatible with the RK3588 and NVIDIA AGX ORIN platform among smart device manufacturers .   VI. Why has Wi-Fi 7 become a standard feature in robots? The design goal of Wi-Fi 7 (IEEE 802.11be) is clearly defined as "extremely high throughput", but its value goes far beyond the speed increase - Wi-Fi 7 is not just a speed upgrade, but a connection base tailored for the era of "physical AI" . 320 MHz ultra-wide bandwidth. Double that of Wi-Fi 6's 160 MHz. A humanoid robot equipped with more than 10 cameras and various sensors needs this kind of ultra-wide bandwidth. Multi-link operation (MLO). One of the most revolutionary features of Wi-Fi 7 is that it allows devices to transmit data simultaneously on three frequency bands: 2.4GHz, 5GHz, and 6GHz. The value of MLO lies in reducing connection interruptions and latency spikes , providing link redundancy and rapid switching capabilities in real-time robot control scenarios. 4096-QAM high-order modulation and CMU-MIMO. Compared to Wi-Fi 6's 1024-QAM, the data capacity per symbol is increased from 10 bits to 12 bits, with a theoretical peak rate of 5.8Gbps. CMU-MIMO enables multiple access points to work collaboratively, allowing dozens of robots in a workshop to maintain stable connections simultaneously without interfering with each other —which is precisely the core requirement for collaborative scheduling of robot swarms. VII. Core Applications in Embodied Intelligence Scenarios Multi-sensor fusion and high-definition video backhaul. The O2072PM / O2072P B offers a peak rate of 5.8 Gbps and an ultra-wide bandwidth of 320 MHz, which is sufficient to support the concurrent backhaul of multiple 4K video streams and high-frequency point cloud data . Low-latency real-time control. Robot motion control is extremely sensitive to latency. Wi-Fi 7's MLO multi-link mechanism provides link redundancy and fast switching capabilities, which can significantly reduce the probability of connection loss in high-density equipment environments such as factory machines and handling robots . Robot swarm collaborative scheduling. Wi-Fi 7's CMU-MIMO and multi-AP collaborative scheduling technology enable multiple access points to work together, effectively reducing interference and improving air interface resource utilization efficiency. Cloud-edge-device collaboration. The ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form the invisible infrastructure for cloud-edge-device collaboration—the robot uploads sensor data to the edge server in real time for VLA model inference, receives decision instructions, and executes them immediately. 8. Industry Recognition and Mass Production Capability Oufexin is one of the pioneers in the Chinese market for Wi-Fi 7 modules . Currently, there are very few module manufacturers that truly possess complete Wi-Fi 7 engineering capabilities, mass production capabilities, and application implementation experience, while Oufexin has taken the lead in completing the leap from solutions to modules , and from laboratories to application scenarios . IX. From Connectivity to Intelligence: An Underestimated Key Link The core of the next-generation robot architecture is no longer the stacking of single computing power , but rather high-performance, low-power, and strongly connected system-level collaboration . The key leap from "single-point intelligence" to "system-level intelligence" requires the seamless integration of the entire chain of computing, perception, decision-making, communication, and collaboration. Ofeixin's Wi-Fi 7 module provides an indispensable "connection base" in this chain —carrying massive amounts of data with a 320MHz ultra-wide bandwidth, ensuring low latency control with MLO multi-link, and supporting stable operation in complex environments with industrial-grade reliability. Communication modules are transitioning from "general-purpose industrial components" to "dedicated core components ." In this transformation, Oufexin has secured a key position thanks to its product portfolio of dual flagship Wi-Fi 7 modules and its early mass production capabilities. Data sources for this article include: "China Embossed Intelligent Industry Development Report (2026)", ResearchInChina "2026 Next-Generation Embossed Intelligent Robot Communication Network Topology and Chip Industry Research Report", the official release of the 2026 World Artificial Intelligence Conference by the Ministry of Industry and Information Technology, Morgan Stanley industry research reports, and official product information from Ofeixin Technology.  

Just as we were celebrating the world's first Bluetooth 6.2 module certification, another bombshell dropped: the Bluetooth Special Interest Group (SIG) has made its biggest overhaul of the BQB certification rules in nearly a decade. Bluetooth 5.4 is now mandatory, LE Audio testing is required, and RN numbers now have expiration dates . What should I do about my module selection? The days of simply "getting a module certification and relabeling it to ship" are basically over. 一、What exactly are the three changes in the new regulations? The first step: a forced upgrade of the technical benchmark. After January 1, 2026, all new BQB certification applications must comply with the Bluetooth 5.4 core specification . The SIG no longer accepts new certification applications for Bluetooth 5.3 and older versions. If the core hardware has been modified, the Bluetooth main control chip replaced, or the RF circuitry adjusted, recertification according to 5.4 is required. Even more alarming is the standard for determining "major changes." One customer simply switched antenna suppliers with the same parameters, but the SIG audit deemed it a "radio frequency circuit adjustment," requiring a complete recertification process . This means that for products that have chosen the wrong module solution, every subsequent hardware tweak could trigger costly recertification. The second blow: LE Audio has gone from being a "bonus" to a "must-have". Previously, LE Audio was an optional "bonus feature". Starting in 2026, as long as a product uses a chip with Bluetooth 5.2 or higher and the hardware supports LE Audio, regardless of whether the firmware enables the feature, all three core protocols —BAP (Broadcast Audio Profile), CAP (Audio Control Profile), and LC3 (Low Complexity Communication Codec) —must be tested. The SIG's official TCRL pkg103 clearly defines this. The LC3 codec can provide higher audio quality at a lower bit rate and reduce power consumption by about 50% compared to traditional Bluetooth audio, but on the condition that it passes the full set of LE Audio tests; missing even one test result will disqualify it . The third measure: tightening certification fees and pathways across the board. Full Bluetooth certification (non-listing method) has a single certification administration fee of up to $12,000 . If the product has multiple derivative models and the hardware/firmware (affecting the Bluetooth part) is different, an additional listing fee of $8,000 is required for each model. The core logic of the new regulations is that using certified modules through the QDL (Qualified Design List) route can significantly save certification costs and time. The QDL route allows end products to directly reference the QDID (Bluetooth Qualification ID) already obtained by the module, exempting them from numerous repetitive tests. Conversely, if the module itself has not completed 5.4+LE Audio certification, end customers will have to bear the full certification cost starting at $12,000 . II. Data Tells You: Why the New Regulations Have Such a Wide-Reaching Impact The sheer volume of Bluetooth device shipments determines the scope of the new regulations. The Bluetooth Special Interest Group (SIG) predicts that global Bluetooth device shipments will approach 6 billion units in 2026 and exceed 8 billion units in 2030. From 2025 to 2050, the average annual growth rate is projected to be approximately 8.4% . Under the new regulations, every product line—from TWS earphones and smart speakers to in-vehicle Bluetooth devices—must pass LE Audio testing if it involves Bluetooth audio functionality . Failure to pass will prevent the promotion of high-definition audio features . Furthermore, the mandatory implementation of the Bluetooth 5.4 core specification necessitates that all new products select Bluetooth modules that are compatible from the outset. 二、Ofeixin has completed the full deployment of Bluetooth 5.4+LE Audio. Shenzhen Aufexin Technology Co., Ltd. has taken the lead in completing the product layout of modules that meet the core specifications of Bluetooth 5.4 and LE Audio . The following products fully support the core technical requirements of the new BQB certification regulations in 2026: Wuqi Chip Solution - Bluetooth 5.4 + LE Audio Layout O9201PM – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, PCIe interface The O9201PM is a dual-mode chip solution supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features Low Energy Audio (LE Audio) capabilities. It is fully compatible with the Bluetooth 5.4 protocol, supports BT/BLE dual-mode and BLE audio, and supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. Typical application scenarios include smart speakers, Bluetooth audio devices, smart home gateways, and AIoT terminals—products with dual requirements for audio quality and wireless connectivity. O9201SB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9201SB is a highly integrated module supporting 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with a maximum speed of 1200Mbps . Measuring only 13×15mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs and a rich set of peripheral interfaces (UART, SPI, I2S, I2C, and GPIO, etc.). The Bluetooth module supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. It is widely used in set-top boxes, industrial control computers, and wireless access points , and has already achieved mass production shipments in multiple China Mobile set-top boxes. O9201UB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, USB interface The O9201UB is also a dual-mode chip solution, supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features low-power audio capabilities. It boasts an ultra-compact 13×15mm size and a USB interface design. It is suitable for scenarios with specific size and interface requirements, such as set-top boxes, smart projectors, USB Wi-Fi adapters, and industrial handheld terminals. O9101SA – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9101SA is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and supports dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with 5G speeds up to 886Mbps . Measuring only 12×12mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs. It supports BT/BLE dual-mode operation and uplink/downlink MU-OFDMA and MU-MIMO. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. O9101UE – Wi-Fi 6 + Bluetooth 5.4 module, ultra-compact size The O9101UE is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 . Measuring only 13×12.2mm , it supports both BT and BLE dual-mode operation. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. III. Three Musts for Module Selection Under the New Regulations In response to the new BQB certification regulations, the selection of Bluetooth modules must follow three principles: Bluetooth version 5.4 or higher is required. All new applications submitted from 2026 onwards must comply with the Bluetooth 5.4 specification. Choosing a module with Bluetooth version 5.3 or lower means the product will face a "no certification" dilemma from the outset. LE Audio support must be confirmed. As long as the hardware supports LE Audio, regardless of whether the feature is enabled in the firmware, the full suite of BAP, CAP, and LC3 tests will be required. When selecting a module, ensure that the module solution has completed LE Audio protocol stack adaptation and RF verification. The QDL certification path is mandatory. The full certification fee of $12,000 is a significant sum for any product team. Choosing a module solution that is already Bluetooth 5.4+LE Audio certified and referencing the module's QDID via the QDL path can significantly reduce certification costs and time . In conclusion The 2026 Bluetooth BQB certification regulations will introduce a three-pronged approach: mandatory Bluetooth 5.4 benchmark, mandatory LE Audio, and high certification fees . This is not a gradual adjustment, but a structural reshaping. For engineers and product managers developing Bluetooth products, module selection is no longer just a trade-off between "performance, power consumption, and cost," but must now include a fourth dimension—certification and compliance . Choosing the wrong module can, at best, delay the time-to-market, and at worst, trigger recertification fees of up to $12,000. Shenzhen Oufengxin Technology Co., Ltd. , with its full range of Bluetooth 5.4+LE Audio products including O9201PM, O9201SB, O9201UB, O9101SA, and O9101UE , as well as full-process technical support from module selection to certification path planning, is committed to helping customers overcome the threshold of the new BQB certification regulations in 2026 with the lowest compliance cost.