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Introduction: A Technological Acceleration Triggered by AI In August 2026, the wireless communications industry made a surprising prediction— the launch of enterprise-grade Wi-Fi 8 might be brought forward to 2027 . According to the normal pace of technological iteration, Wi-Fi 7 will only begin large-scale commercial use in 2024, and Wi-Fi 6E is still in the process of becoming widespread. How could a completely new generation of Wi-Fi standards arrive so quickly? The answer lies in a seemingly unrelated industry chain— the shortage of DDR4 memory chips . And this shortage, in turn, has opened an unprecedented golden opportunity for Wi-Fi 7. I. DDR4 Shortage: A "Supply Chain Tsunami" Triggered by AI 1.1 Price Surge: From $2.90 to $24 To understand this forcing effect, we first need to see the severity of the DDR4 shortage. According to data from market research firm DRAMeXchange, in July 2026, the average fixed contract price for general-purpose PC DRAM chips (DDR4 8Gb 1Gx8) was $24 , a 14.3% increase from $21 in June . This price is the highest since price monitoring began in June 2016 , representing an increase of more than eight times compared to the initial benchmark of $2.9 . At the beginning of 2026, the average price of DDR4 8Gb was only $11.50. In just over six months, the cumulative increase reached a staggering 109% . TrendForce predicts that traditional DRAM contract prices will rise by another 13% to 18% quarter-on-quarter in the third quarter of 2026. 1.2 Root cause of the shortage: AI has "drained" traditional DRAM production capacity The root cause of this shortage is not a sudden surge in demand for DDR4 itself, but rather the siphon effect of AI infrastructure construction on storage capacity . The world's three major DRAM manufacturers—Samsung, SK Hynix, and Micron—have almost entirely devoted their new production capacity to AI-related products such as HBM (High Bandwidth Memory), server DDR5, and LPDDR5X , while the amount of chips allocated to the general DDR5, DDR4, and industrial control markets continues to decrease. Memory module manufacturer Apacer Technology has warned that, based on the original equipment manufacturer 's (OEM) supply plans, the amount of DRAM available for allocation to module manufacturers will continue to decline, and the supply-demand imbalance may persist until at least the first half of 2027. Industry insiders predict that the shortage may continue into 2028. This is not a short-term supply and demand fluctuation, but a structural redistribution of production capacity . The more prosperous the AI industry becomes, the more scarce traditional DRAM will be—and wireless access point equipment is precisely highly dependent on DDR4. II. From DDR4 to Wi-Fi 8: An Unexpected Transmission Chain 2.1 Why can't enterprise-level APs do without DDR4? Modern enterprise-grade wireless access points (APs) are heavily reliant on DDR4 memory. In Wi-Fi 6E and early Wi-Fi 7 devices, in order to handle the massive throughput data generated by multiple frequency bands such as 5GHz and 6GHz, a single high-end enterprise-grade AP is generally equipped with 2GB to 4GB of DDR4 memory chips to support complex concurrent queues and low-latency forwarding. With DDR4 chip prices soaring, the bill of materials (BOM) cost per access point (AP) faces significant growth. Several WLAN vendors have already raised their product list prices to offset the increased memory component costs driven by the AI infrastructure boom . 2.2 How does Wi-Fi 8 bypass DDR4? Wi-Fi 8 (IEEE 802.11bn) has undergone a fundamental restructuring of its underlying architecture . Unlike Wi-Fi 6E and the earlier Wi-Fi 7, which relied on a large DDR4 memory buffer pool, Wi-Fi 8 directly embeds data stream processing into a high-speed cache and a customized ASIC channel by moving chip computing power forward and reconstructing the underlying hardware acceleration engine . The effects of this architectural innovation are astonishing: DDR4 consumption per AP has plummeted by approximately 75% . Meanwhile, Wi-Fi 8 can be directly paired with DDR5—currently, DDR5's supply and availability are far superior to DDR4. The greater the cost pressure, the stronger the incentive to switch to Wi-Fi 8. Siân Morgan, senior director of Dell'Oro Group, pointed out: "The faster manufacturers adjust their access point (AP) designs to reduce their reliance on high-cost storage components, the more competitive they become on price. This constitutes a strong driving force for the transition to Wi-Fi 8." III. The "Golden Window" for Wi-Fi 7 and the "Early Entry" of Wi-Fi 8 3.1 Wi-Fi 7: Currently experiencing its peak performance It is important to emphasize that the early release of Wi-Fi 8 does not signify the decline of Wi-Fi 7. On the contrary, Wi-Fi 7 is currently at the peak of its commercial life cycle . Dell'Oro Group predicts that the Wi-Fi 7 market revenue will achieve triple-digit percentage growth in 2026. In the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of enterprise access point revenue , compared to less than 1% a year ago. Enterprise AP revenue from Wi-Fi 7 grew by 348% year-over-year in Q1 2026. In the year that enterprise-grade Wi-Fi 7 revenue peaks, its cumulative total revenue will surpass the total revenue of Wi-Fi 6E over its entire lifecycle . Dell'Oro predicts that Wi-Fi 7 revenue growth will continue for another three years . In terms of shipments, global shipments of Wi-Fi 7 devices are projected to reach 1.1 billion units in 2026. In less than eight quarters, Wi-Fi 7 jumped from a market share of less than 1% to 44.5% of enterprise AP revenue— one of the fastest standard transitions in the history of enterprise WLAN . 3.2 But the window of opportunity is being compressed. However, the DDR4 shortage is changing everything. Although Wi-Fi 8 is not yet a mainstream technology, and the market is still mainly dominated by Wi-Fi 7 devices, Dell'Oro Group believes that the adoption of Wi-Fi 8 may accelerate significantly as we move into 2027 . RF chip manufacturer Richwave has clearly stated that it has partnered with Qualcomm, MediaTek and other main chip platforms to develop Wi-Fi 8. Telecom operators have started research and evaluation for its implementation, and small-scale shipments are expected to begin in 2027 . IV. The Technological Shift in Wi-Fi 8: From "Speed Competition" to "Stability Competition" 4.1 No longer pursuing the ultimate speed Unlike previous generations of Wi-Fi that were designed primarily for peak throughput, the Wi-Fi 8 standard (IEEE 802.11bn) places greater emphasis on "ultra-high reliability" . The core goal of Wi-Fi 8 is no longer "how fast it can run", but " whether it can still operate stably in dense, interference-prone, and highly mobile environments ". According to the technical direction of the IEEE 802.11bn standard, Wi-Fi 8 can bring about a 25% increase in throughput, a 25% reduction in 95th percentile latency, and a 25% reduction in packet loss probability under the same distance and signal conditions . These figures may not seem as spectacular as the leap from Wi-Fi 6 to Wi-Fi 7, but each one directly addresses the most noticeable pain points for users in daily use. 4.2 Key Technologies: Integration of MAPC and AI One of the core technological breakthroughs of Wi-Fi 8 is the "Multi-AP Coordination" (MAPC) mechanism . Through coordinated scheduling among multiple access points (APs), Wi-Fi 8 can significantly improve overall network performance in high-density environments. Meanwhile, Wi-Fi 8 extensively utilizes AI technology to ensure smooth and stable operation of network systems and devices, comprehensively enhancing the overall user experience of wireless networks. In its Wi-Fi 8 preview released in January 2026, Qualcomm clearly stated that a major design goal is to achieve ultra-high reliability, surpassing traditional Wi-Fi performance . V. Profound Impact on the Module Industry 5.1 Accelerated technological iteration forces module manufacturers to fight on two fronts. For wireless communication module manufacturers, the shortage of DDR4 is forcing the early rollout of Wi-Fi 8, which means they must simultaneously address two technology routes . On the one hand, Wi-Fi 7 is in its peak shipping season , and module manufacturers need to ensure a stable supply and controllable costs for Wi-Fi 7 modules. However, the continued shortage and price increase of DDR4 has directly driven up the BOM cost of Wi-Fi 7 modules. On the other hand, the early arrival of Wi-Fi 8 means that the development window for the next generation of modules has been compressed . From the maturity of the chip platform and the verification of the reference design to the development, testing and certification of module products—the originally ample timeline has suddenly become tight. Whoever can find a balance between the peak shipment of Wi-Fi 7 and the research and development preparations for Wi-Fi 8 will gain the upper hand in the upcoming market competition . 5.2 Supply chain management capability becomes a core competitive advantage The DDR4 shortage exposed a deep-seated problem in the entire module industry: over-reliance on a single component and a single supplier . Storage module manufacturers such as Apacer, ADATA, and Team Group are actively building up inventory to cope with the risk of shortages. However, while this "stockpiling" strategy is feasible for large manufacturers, it poses equally significant financial pressure and inventory risks for small and medium-sized module manufacturers. Supply chain diversification and chip selection are shifting from "strategic options" to "survival necessities ." Module manufacturers that can flexibly switch between multiple chip platforms and respond quickly to different component solutions will have stronger resilience in this supply chain crisis. VI. Ofeixin Wi-Fi 7 Deployment: Positioning It in the Industry Window In the industry transformation brought about by the simultaneous arrival of the golden window of Wi-Fi 7 and the early arrival of Wi-Fi 8, the technological reserves and product development pace of module manufacturers have become particularly crucial. Ofeixin has launched a new generation of Wi-Fi 7 modules, O2072PM (M.2 interface) and O2072PB (13×15mm surface mount package), based on the Qualcomm FastConnect C7700 system (chip code QCC2072), which have now become its main flagship products . This module fully supports Wi-Fi 7 core technologies: tri-band 2.4/5/6GHz, 320MHz channel bandwidth, 4K QAM modulation, and a peak data rate of 5.8Gbps . It also supports enhanced multi-link single radio (eMLSR) , which automatically switches links when interference occurs in a certain frequency band, significantly improving connection reliability . Bluetooth has been upgraded to version 6.0 and integrates high-precision distance measurement (HADM) and channel sounding. . With the Wi-Fi 7 window potentially compressed and Wi-Fi 8 arriving ahead of schedule, O2072PM/O2072PB, through its early deployment, provides a crucial connectivity foundation for high-end scenarios such as industrial equipment, robots, and AI cameras, from chip capabilities to end products . VII. Conclusion: An "Atypical" Technological Revolution The DDR4 shortage has forced the early rollout of Wi-Fi 8, a top-down supply chain event triggered by AI. AI infrastructure development drained DDR4 production capacity → DDR4 price increases impacted enterprise-level AP costs → Equipment manufacturers accelerated their shift to the low memory-dependent Wi-Fi 8 architecture → Wi-Fi 8 arrived ahead of schedule. This chain of events reveals a profound industry principle: in a highly globalized semiconductor supply chain, structural changes in any link can trigger a chain reaction in downstream markets . The early rollout of Wi-Fi 8 was not a natural evolution driven by technology, but rather a forced acceleration driven by cost . For Wi-Fi 7, this crisis has created a unique window of opportunity for the industry— the technology is most mature, the market acceptance is highest, and the competitive landscape is still evolving . References: Dell'Oro Group's "WLAN Five-Year Forecast Report (July 2026)", DRAMeXchange, TrendForce, ABI Research  

I. Industry Transformation: The Dual Waves of Xinchuang and Industrial Control Are Reshaping the Wireless Module Landscape In 2026, China's wireless module industry stands at an unprecedented historical juncture. The Xinchuang (Information Technology Application Innovation) industry is undergoing a critical transition from “pilot demonstration” to “large-scale implementation.” According to forecasts from institutions including DYXinsheng, China's Xinchuang market size is expected to reach RMB 2.66 trillion in 2026, with a year-on-year growth rate of 26.82% —making it one of the fastest-growing sectors in the digital economy. At the policy level, the target for SOEs to complete comprehensive Xinchuang replacement by 2027 remains unchanged. Starting in 2026, core business procurement for Xinchuang in party and government agencies must account for no less than 85%, and no less than 65% for state-owned enterprises. Eight key industries—including finance, telecommunications, and energy—are required to achieve 100% domestic database replacement by 2027. Domestic replacement of office scenarios in party and government agencies nationwide has been essentially completed, and Xinchuang transformation is now rolling out across critical sectors including finance, energy, transportation, healthcare, and education. At the same time, the wave of domestic substitution in the industrial control market is equally powerful. According to industry reports from sources including China Industrial Control Network, the domestic industrial control market surpassed RMB 300 billion in 2025. The localization rate of industrial control in critical sectors—including power, rail transit, new energy, and government affairs—has exceeded 72%, and Xinchuang-compliant industrial control equipment has become the preferred choice for government and enterprise projects. However, one critical issue has long been overlooked: the “wireless connectivity” link for Xinchuang devices and industrial control equipment has consistently been the weak point in domestic substitution. After CPUs, operating systems, databases, and other core software and hardware have successively achieved domestic production, the ability to conduct high-speed, stable, and secure wireless data exchange with the outside world—this seemingly basic “connectivity” capability—has long relied on imported Wi-Fi/Bluetooth modules. This “connectivity” chip is precisely the “last piece of the puzzle” for Xinchuang device wireless connectivity. It is against this backdrop that the emergence of the Wuqi WQ9201B chip solution, combined with the module product deployment by QOGRISYS based on this chip, provides a complete solution for domestic wireless connectivity in the Xinchuang and industrial control sectors. II. The Chip Foundation: Wuqi WQ9201B’s Technological Breakthroughs and Industry Recognition 2.1 From Launch to Mass Production: The Industrialization Journey of the WQ9201B The industrialization path of the Wuqi WQ9201 is clear and well-documented. In October 2023, Wuqi officially announced the launch of its first 2×2 dual-band high-performance data-transmission Wi-Fi 6 + BT Combo chip, the WQ9201. In 2024, the WQ9201 entered the mass production stage. On November 7, 2024, the WQ9201 achieved a milestone breakthrough. At the 2024 China Microelectronics Industry Promotion Conference and the 19th “China Chip” Award Ceremony, the Wuqi high-performance Wi-Fi 6 chip WQ9201—with its stable transmission performance and industry-leading low-power consumption—stood out from 364 products submitted by 280 chip companies to win the 2024 “China Chip” Excellent Technology Innovation Product Award. The “China Chip” Excellent Product Collection campaign is guided by the Ministry of Industry and Information Technology and hosted by the China Center for Information Industry Development (CCID) , making it one of the most influential and authoritative industry events in China’s integrated circuit sector. On July 20, 2026, the WQ9201B chip solution was officially launched on mainstream component marketplaces. The iCEasy marketplace officially listed the Wuqi WQ9201B Wi-Fi 6 wireless network card chip solution, featuring 2×2 dual-band Wi-Fi 6 + Bluetooth 5.4 dual-mode design, supporting PCIe/USB dual interfaces, and having completed adaptation for two major domestic operating systems—UnionTech UOS and KylinOS. This marks the WQ9201B solution’s transition from chip launch to open market availability—completing the critical leap from “lab product” to “shelf product.” On June 29, 2026, Wuqi Microelectronics’ STAR Market IPO application was accepted. This capital-market milestone further confirms the market’s recognition of Wuqi’s technological strength and commercial prospects. 2.2 Core Technical Specifications: Benchmarking Against International Leaders The Wuqi WQ9201B is a 2×2 dual-band high-performance data-transmission Wi-Fi 6 + BT Combo chip, and its technical specifications represent the highest level of domestic Wi-Fi chips. In terms of Wi-Fi performance, the chip supports the full IEEE 802.11 a/b/g/n/ac/ax protocol suite, supports 2.4GHz + 5GHz dual-band concurrent (DBDC) , with a physical layer peak rate of up to 1.2Gbps, bandwidth support of 5/10/20/40/80MHz, and support for OFDMA, 2×2 uplink/downlink MU-MIMO, and beamforming technologies. In multi-device industrial environments, these technologies can effectively reduce network congestion and improve communication efficiency. For Bluetooth, the WQ9201B supports the Bluetooth 5.4 protocol, is compatible with BT/BLE dual-mode and BLE Audio, and supports intelligent and flexible Wi-Fi/BT coexistence strategies. In terms of interface and platform compatibility, the chip supports PCIe 2.0/USB 2.0/SDIO 3.0 three interfaces, and is compatible with X86, ARM, and domestic CPU platforms. The operating temperature range covers -20°C to 85°C, meeting industrial-grade standards. On critical RF metrics, the WQ9201B has reached the level of major international manufacturers, particularly achieving breakthroughs on technically challenging indicators such as RX EVM and Rx Sensitivity. 2.3 Three Core Technological Breakthroughs First, self-developed RISC-V architecture enables core independent control. The WQ9201 adopts Wuqi’s self-developed high-performance RISC-V multi-core CPU, featuring an innovative “2+1+1” architecture—integrating two high-performance RISC-V cores and one low-power core. All chips are designed based on the RISC-V open-source architecture, with completely independent and controllable core IP, achieving freedom from dependence on traditional closed-source architectures at the processor core level. Wuqi is one of the very few domestic communications companies with independent R&D capabilities for both Wi-Fi 6/7 STA and AP chips. Second, breakthrough low-power technology. The WQ9201 integrates Wuqi’s proprietary low-power CMOS PA technology. The self-developed PA architecture reduces power consumption by 30%–40% compared to the current industry mainstream level, with the breakthrough self-developed PA architecture further reducing consumption by 60% , saving 1W of power in typical application scenarios. Official information from Wuqi Microelectronics indicates that at 20MHz bandwidth, its power consumption is less than half that of Qualcomm’s next-generation chips. This metric directly impacts the power supply circuit design and thermal system costs of terminal devices. Third, dual-band concurrent architecture and multi-scenario adaptability. Based on Wuqi’s self-developed RF dual-band architecture, the WQ9201 supports multiple concurrent modes including STA+AP, STA+P2P GO, and STA+P2P GC. A single chip can simultaneously assume multiple network roles, significantly reducing system design complexity. III. Market Opportunity: The “Connectivity” Imperative in Xinchuang and Industrial Control 3.1 The Xinchuang Market’s “Last Piece of the Puzzle” The core logic of the Xinchuang industry is “independent and controllable, safe and reliable.” Over the past several years, domestic CPUs (Phytium, Loongson, Hygon, Zhaoxin, etc.), domestic operating systems (UnionTech UOS, KylinOS, etc.), and domestic databases (Dameng, Renda Jincang, etc.) have gradually built a complete foundational Xinchuang software and hardware system. However, the wireless connectivity capability of Xinchuang devices has long relied on imported chips—whether laptops, tablets, industrial control terminals, or various smart devices, their Wi-Fi/Bluetooth modules mostly use solutions from foreign or overseas manufacturers such as Qualcomm, Broadcom, and Realtek. This creates a significant security gap in the Xinchuang industry chain. The differentiating value of the WQ9201B lies precisely here. The chip has completed deep adaptation for two major domestic operating systems—UnionTech UOS and KylinOS. This means terminal devices based on this chip can run directly on domestic operating systems without additional driver development and compatibility debugging. This adaptation clears the last ecosystem barrier for large-scale commercial deployment of Xinchuang devices. 3.2 The Industrial Control Market’s “Wireless Upgrade” Demand for wireless communication modules in the industrial control sector is growing rapidly. Wi-Fi 6 is becoming the upgrade direction for industrial wireless—compared to traditional Wi-Fi 5, Wi-Fi 6 improves multi-device simultaneous communication capabilities through technologies such as OFDMA and MU-MIMO, effectively reducing network congestion and improving communication efficiency in device-intensive industrial environments. Industrial control scenarios impose unique and stringent requirements on wireless modules: wide-temperature operation (industrial environments have large temperature fluctuations), high reliability (no tolerance for frequent disconnections), interference resistance (factories have numerous electromagnetic interference sources), and long lifecycles (industrial equipment has long replacement cycles, requiring chip solutions with sustained supply assurance). The WQ9201B’s operating temperature range covers -20°C to 85°C, meeting industrial-grade standards. Its built-in high-efficiency power amplifier (PA/LNA) and intelligent Wi-Fi/BT coexistence strategy ensure stable transmission in complex electromagnetic environments. The PCIe interface delivers peak rates of up to 1000Mbps, meeting industrial big-data transmission requirements, while supporting 802.11k/v/r fast roaming for mobile terminal scenarios. Against the backdrop of the industrial control domestic substitution rate already exceeding 72% , the domestic substitution of wireless connectivity modules for industrial control equipment is the next inevitable direction. The WQ9201B solution’s industrial-grade specifications and fully domestic attributes make it an ideal choice for domestic industrial control wireless modules. IV. From Chip to Module: QOGRISYS’s Industrialization Deployment 4.1 The “Last Kilometer” from Chip to Module The value of a chip is ultimately realized through modules. From a chip to a mass-producible module involves a series of engineering challenges: RF design, antenna matching, power optimization, driver development, system adaptation, reliability testing, and more. This is precisely the core value proposition of professional module solution providers. QOGRISYS, as a professional module solution provider, has worked closely with Wuqi to develop a full series of Wuqi-based modules. Two core modules based on the WQ9201B chip—the O9201PB and the O9201PM—address different application scenarios, forming a complete product matrix. 4.2 O9201PB: The Compact Design “PCIe Choice” The O9201PB is a highly integrated Wi-Fi 6 + Bluetooth 5.4 2-in-1 module, with compact dimensions of just 13×15mm. The module supports the full IEEE 802.11 a/b/g/n/ac/ax protocol standard, supports 2.4GHz and 5GHz dual-band simultaneous (DBS) , with a peak rate of up to 1200Mbps. In terms of interfaces, it integrates a Wi-Fi high-speed PCIe interface and Bluetooth peripheral interfaces (UART, PCM), supports uplink/downlink MU-OFDMA and MU-MIMO, and supports multiple security protocols including WPA/WPA2/WPA3, WEP, and WAPI. The O9201PB’s core advantages include: Compact package: 13×15mm small form factor, suitable for space-constrained devices PCIe high-speed interface: Meeting high-throughput data transmission requirements Dual-band simultaneous (DBS) : 2.4GHz and 5GHz operating concurrently, enhancing concurrency capability Multi-mode support: Supporting multiple concurrent modes including STA+AP, STA+P2P GO, and STA+P2P GC Industrial-grade specifications: Meeting wide-temperature operation and high-reliability requirements 4.3 O9201PM: The High-Performance “Flagship Choice” The O9201PM is a high-performance Wi-Fi 6 module featuring M.2 2230 package with PCIe and USB dual interfaces, measuring 22×30×2.9mm. The module integrates 2×2 dual-band Wi-Fi 6 subsystem and Bluetooth 5.4 subsystem, supports PCIe 2.0 and USB 2.0 dual-interface design, and is compatible with X86, ARM, and domestic CPU platforms. The PCIe interface delivers peak rates of up to 1000Mbps, meeting big-data transmission requirements. The operating temperature range covers -20°C to 85°C, with wide-voltage power supply and industrial-grade stability, suitable for long-term stable operation in complex environments such as industrial control and outdoor applications. The O9201PM’s core advantages include: Standard M.2 package: Convenient board integration, compatible with mainstream laptops, tablets, and other devices 2×2 MIMO: Dual-antenna design improving transmission rates and signal stability Dual-band concurrent: 2.4GHz and 5GHz operating simultaneously Low-power design: Supporting excellent RF and baseband performance with extremely low power consumption Industrial-grade specifications: Meeting wide-temperature operation and high-reliability requirements Both modules support the Bluetooth 5.4 protocol and are compatible with BT/BLE dual-mode and BLE Audio. Both support security protocols including WPA/WPA2/WPA3, WEP, and WAPI, meeting the stringent data security requirements of Xinchuang and industrial control scenarios. 4.4 Real-World Application Deployment The WQ9201B solution is not停留在 paper—it has already achieved large-scale commercial deployment across multiple sectors. The Wuqi high-performance Wi-Fi 6 chip WQ9201 has been adopted in multiple China Mobile set-top box models, achieving stable mass-market supply. Additionally, products have achieved volume shipments across multiple sectors including network cameras, cloud PCs, and wireless access points, successfully gaining adoption from brands including China Mobile, Ruijie Networks, Honor, and Tianyi Vision Link (China Telecom) . QOGRISYS, as a module solution provider, plays a critical role in these deployment cases—by converting Wuqi chips into standardized, mass-producible module products, significantly reducing the development barriers and time-to-market cycles for terminal equipment manufacturers. V. Industry Significance: The Strategic Value of Completing the “Connectivity” Gap 5.1 A Complete Closed Loop from “Chip Breakthrough” to “Module Deployment” The combination of the WQ9201B chip solution and QOGRISYS module products constitutes a complete closed loop for domestic wireless connectivity in the Xinchuang and industrial control sectors: Chip layer: Wuqi provides self-developed RISC-V architecture Wi-Fi 6 chips, achieving independent and controllable core IP Module layer: QOGRISYS converts chips into standardized, mass-producible modules, lowering terminal development barriers System layer: Completed adaptation for UnionTech UOS and KylinOS, achieving seamless integration with the Xinchuang ecosystem Application layer: Achieved large-scale deployment in set-top boxes, industrial control machines, wireless access points, and other sectors The establishment of this closed loop means that Xinchuang devices no longer need to be forced to use imported Wi-Fi modules under a “domestic CPU + domestic OS” configuration. The “last piece of the puzzle” for wireless connectivity is being put in place. 5.2 Supply Chain Security and Industrial Independence Against the backdrop of ongoing fluctuations in the global semiconductor supply chain, the strategic value of fully domestic wireless modules is significantly amplified. Devices built with domestic chips not only offer excellent cost-performance and stable product quality but, more importantly, full domestic production ensures supply chain security and reduces constraints from external factors. From an industry perspective, the launch of the WQ9201 breaks the long-standing monopoly of foreign manufacturers in the high-end Wi-Fi 6 market. The chip fills multiple technical gaps in the domestic high-end Wi-Fi 6 chip field. As one of the few companies in mainland China capable of mass-producing Wi-Fi 6 AP chips, Wuqi is driving the domestic Wi-Fi chip industry from “follower” to “parallel runner.” VI. Conclusion The combination of the Wuqi WQ9201B chip solution and QOGRISYS module products is playing a critical role in “completing the last piece of the puzzle” across two high-value markets: Xinchuang and industrial control. From a timeline perspective, the industrialization path of the WQ9201 is clear and solid: October 2023—chip launch; September 2024—China Mobile product compatibility certification; November 2024—winner of the “China Chip” Excellent Technology Innovation Product Award; late 2024—adopted in China Mobile set-top boxes with volume shipments; June 2026—STAR Market IPO application accepted; July 2026—chip solution launched on the open market. This series of milestones constitutes a complete evolutionary trajectory from technological breakthrough to market validation to large-scale commercialization. From a technology and product perspective, the WQ9201B has achieved independent breakthroughs in core technologies including 2×2 dual-band concurrency, self-developed RISC-V architecture, and low-power PA, with key metrics reaching the level of major international manufacturers. The O9201PB and O9201PM modules developed by QOGRISYS based on this chip cover two major scenarios—compact devices and high-performance applications—completing the industrialization deployment from chip to module. From a market and industry perspective, this solution precisely targets two high-value tracks—Xinchuang (RMB 2.66 trillion market) and industrial control (RMB 300 billion market)—and has completed domestic operating system adaptation and key industry customer adoption. This “chip + module” combination is completing the “last piece of the puzzle” for Xinchuang device wireless connectivity, driving the domestic Wi-Fi chip industry from “follower” to “parallel runner.” In 2026—as Xinchuang substitution enters its sprint phase and industrial control domestic substitution accelerates—the domestic wireless connectivity solution represented by the Wuqi WQ9201B and QOGRISYS modules is becoming an indispensable link in China’s independent and controllable industry chain.  

I'm a product marketing staff member at Ofeixin. Our company develops wireless module solutions, working upstream with chip manufacturers like Qualcomm, Realtek, WUQI, and HiSilicon, and downstream serving end customers in fields such as smart homes, industrial IoT, and automotive electronics. Simply put, our role is to transform chips into mass-producible module products and then deliver them to customers for use in complete systems .   we enter the second half of 2026, my own work experience, as well as that of my colleagues, can be summed up in two words: unpleasant . Customers are pushing – projects can't stop, delivery dates can't be delayed, and costs can't rise. But the reality is, component prices are constantly increasing: crystal oscillators are up 10%-30%, PCBs 20%-30%, inductors 30%-70%, and upstream chip manufacturers are also adjusting prices, with ASE (ASE Technology Holding Co., Ltd.) raising prices by over 20%. As module manufacturers, we're in the middle of the supply chain; we have to accept the upstream price increases, but downstream customers are unwilling to bear them . The BOM cost of every WiFi/Bluetooth module is being passively increased, and our profit margins are being continuously squeezed.   Even more concerning is the less-than-optimistic market outlook. Consumer IoT growth has slowed significantly; WiFi 7 appears promising but its penetration rate is only 8%; and despite years of hype, AI modules still only account for single-digit percentages of shipments. Customer orders are becoming more fragmented and uncertain. Meanwhile, the US FCC is imposing component-level bans, and EU compliance requirements are becoming increasingly stringent, making export options narrower and more expensive .   These problems don't occur in isolation; they are systemic and structural. I want to organize these observations and thoughts not to predict the industry's downfall, but as a frontline practitioner, to conduct a review as objectively as possible— where the problems lie and what we can do . The following are real industry observations from the Ofeixin team in mid-2026. I、Supply chain pain points: The 2026 price hike wave will be fully upgraded. 1.1 Price Increases Across Components: From Crystal Oscillators to PCBs, No Component Was Spared In July 2026, the module industry ushered in the most intense wave of component price increases in recent years, showing a trend of cost resonance across the entire industry chain. the PCB sector, leading company Kingboard Laminates and its A-share listed counterparts both raised their prices by 10%-30% ; crystal oscillators and bases saw increases of 10%-30% ; power semiconductor Infineon and its A-share listed counterparts rose by 10%-22% ; MLCC Murata raised its prices for AI servers and automotive-grade products by 10%-40% ; inductors TDK rose by 30%-70% ; and resistors Thick Sound and its A-share listed counterparts rose by 20%-30% . The root cause lies in the out-of-control prices of upstream commodities: the annual price increases of non-ferrous metals such as gold, silver, copper, and tin have reached 30%-200% , while the price increases of components such as PCBs, memory chips, resistors, capacitors, inductors, and IGBTs have reached as high as 50%-800% , and the price of electronic cloth has nearly doubled compared to the low point in Q3 2025. When this trend extends to the module segment, a divergent pattern emerges: " high-end prices have already increased, mid-to-low-end prices are temporarily stable, and the trend is still spreading ." The BOM cost of each WiFi/Bluetooth module is passively rising. 1.2 Price Hikes Across the Entire Semiconductor Supply Chain: Pressure Reached Across the Entire Line from Substrates to Packaging and Testing Beyond components, the entire semiconductor industry chain is also experiencing a wave of price increases. Packaging and testing giant ASE officially announced price increases exceeding 20%. Indium phosphide giant Coherent announced price increases of 15%-20% for ordinary indium phosphide substrates and 30%-40% for high-end epitaxial wafers. Silicon wafer giant Shin-Etsu Chemical raised prices by 5%-8% for standard models and 18%-22% for high-end silicon wafers. Charging module manufacturers have taken the lead – starting July 1, 2026, many charging module manufacturers will raise the prices of their entire product line by 15%, directly due to the rising costs of PCBs, silicon carbide chips, resistors, capacitors, relays, and metals such as copper and silver. For WiFi/Bluetooth/PLC module manufacturers, rising costs at each level of the supply chain are eroding their already thin profit margins. 1.3 Industry gross margins remain under pressure According to industry report data, the industry's average gross profit margin in 2025 was 21.3%, a decrease of 8 percentage points compared to 2024 , mainly due to the erosion of profits by rising prices of upstream chips and components. Leading companies maintained gross profit margins above 26% thanks to economies of scale and their self-developed chip capabilities, but the profit margins of small and medium-sized module manufacturers are being continuously squeezed. Entering 2026, the price increase of electronic components far exceeded the level of 2025, and the downward pressure on gross profit margin will only increase . II. Market Pains: Growth Divergence and Value Dilemma 2.1 Slowing growth in the consumer market In 2025, global shipments of IoT modules reached 1.68 billion units, a year-on-year increase of 31%. However, the growth rate of module shipments for consumer IoT products (smart home, wearable devices) has slowed to 12% . The consumer electronics sector contributed more than 50% of the shipments, but its growth rate has slowed to below 5%. In contrast, the Internet of Things (IoT) and Industrial Internet sectors are growing at a rate as high as 22% . The market is shifting from "ubiquitous connectivity" to "scenario differentiation"—not all sectors are growing, and manufacturers that have chosen the wrong direction will face the dual pressures of shrinking demand and price wars. 2.2 WiFi 7: The "Sweet and Painful" Process of Penetration Climbing WiFi 7 is seen as the next growth engine for the industry, but its penetration rate in 2026 is still far below expectations . Industry forecasts predict that WiFi 7 penetration will increase from 5% in 2025 to 8% in 2026 , contributing as much as 18% of revenue. The initial cost of a WiFi 7 module was $12, 40% higher than that of WiFi 6E, but it is expected to fall below $9 by Q4 of 2026. The good news is that WiFi 7 modules have entered the mass production and deployment stage. In June 2026, GCI Science & Technology disclosed that its Wi-Fi 7 modules had passed the certification of several leading customers and entered the small-batch delivery stage. However, the contradiction between high costs and low penetration rate remains a hurdle that module manufacturers must overcome . 2.3 AI Modules: The Gap Between Expectations and Reality Edge AI modules are seen as a new growth driver, with global shipments of related modules expected to reach 12 million units by 2025. Shipments of edge intelligence modules (integrated AI accelerators) are projected to reach 230 million units, representing a year-on-year increase of 189%. However, the market penetration rate of AI modules is still far below the industry's early optimistic expectations . The unit price of consumer IoT product modules has increased by 19% year-on-year due to the integration of AI edge computing capabilities, but this "price increase" is more driven by cost than by perceived value. In 2026, the shipment share of module solutions equipped with integrated AI acceleration engines is expected to be close to 15%, still a considerable distance from widespread adoption. 2.4 The Industry Dilemma of "Increased Revenue but No Increased Profit" In 2025, the global average export price of modules was US$23.7 per unit, a 21% decrease compared to the same period in 2023 , mainly due to fierce competition in the low-to-mid-range module market leading to price wars. Chinese manufacturers accounted for 55% of global shipments, but their average unit price was about 30% lower than that of similar products overseas. With shipments increasing, unit prices decreasing, and costs rising—under this triple squeeze, "increased revenue but not increased profits" has become a common predicament in the industry. III. The Pain Points of Technology and Application: The Gap Between "Usable" and "Effective" 3.1 Industrial Scenarios: Reliability Challenges in Electromagnetic Environments WiFi/Bluetooth modules perform reasonably well in consumer scenarios, but when they enter industrial settings, electromagnetic interference immediately becomes the most challenging problem . In industrial settings, the strong electromagnetic interference generated by equipment such as frequency converters and motors often leads to signal attenuation, packet loss, and even frequent disconnections in ordinary wireless modules. The requirements for wireless modules in the Industrial Internet of Things (IIoT) have evolved from simply "being able to connect" to "maintaining stable connections even under strong interference ." This demands that modules meet standards far exceeding those of consumer-grade products in terms of RF design, electromagnetic compatibility, and anti-interference capabilities. 3.2 Multi-protocol coexistence: "traffic congestion" in the 2.4GHz band The 2.4GHz band is already overburdened. Multiple protocols such as WiFi, Bluetooth, Zigbee, and Thread are crowding onto the same band, and mutual interference has become a common pain point for smart homes and the Industrial Internet of Things . In environments with numerous Wi-Fi hotspots and Bluetooth devices in the same space, Zigbee packet collisions and high packet loss rates become particularly prominent. The interference problem caused by multiple protocols coexisting cannot be solved independently by a single module manufacturer ; it requires collaborative optimization across the entire industry at the protocol, hardware, and system levels. 3.3 The technical limitations and cost pressures of PLC While PLCs have the unique advantage of being able to communicate as long as they have power, their technical limitations are also obvious . Low-cost PLC chips and modules face significant cost pressures compared to WiFi and BLE communication modules, which are already widely used in local communication in smart homes . The ability to embed small-sized PLC modules into small smart home products such as 86-switch panels, light bulbs, and sensors places higher demands on the chip's peripheral interfaces (such as multi-channel PWM, multi-channel ADC, and more than 10 GPIOs). The penetration of PLCs in the consumer market still faces the dual bottlenecks of cost and technology. IV.Geopolitical Pain: The "Compliance Storm" Escalates in 2026 4.1 FCC New Rules Take Effect: From "Whole Machine Ban" to "Component Blockade" By 2026, geopolitical factors had evolved from "potential risks" to "real costs . " In July 2026, the U.S. Federal Communications Commission (FCC) formally voted to completely ban the sale of equipment in the United States containing key hardware components from Chinese companies deemed to pose a "national security risk ." The FCC chairman explicitly stated that this move aims to "completely close the loopholes in components." The restrictions are no longer limited to specific brand-name end products, but extend to the bottom layer of the entire electronics supply chain . All electronics manufacturers selling products in the U.S. market must undergo in-depth supply chain traceability and compliance audits. 4.2 Certification barriers have been comprehensively upgraded. The FCC certifies approximately 40,000 electronic devices annually, with about 75% of the testing still relying on Chinese laboratories . On April 30, 2026, the FCC unanimously passed a new rule by a 5-0 vote, prohibiting laboratories in China from providing FCC testing and certification for electronic devices exported to the United States. The accreditation of already recognized laboratories in China will gradually expire within two years. Furthermore, the FCC is planning to expand restrictions on Chinese communication modules, potentially banning Chinese-made mobile communication modules from the U.S. market . Once a module is included on the FCC's "Control List," it will be considered a potential national security risk, unable to obtain FCC certification, and thus subject to a complete ban on its entry into the U.S. market. 4.3 Profound Impact on Chinese Module Manufacturers Chinese module manufacturers account for 55% of global shipments , making them highly dependent on exports. In 2025, China's wireless module exports reached $18.5 billion, primarily destined for Southeast Asia and Europe. If the restrictions imposed by the United States are fully implemented, they will directly impact billions of dollars in exports. Analysts believe that if mobile communication modules are ultimately included in the restricted list, global manufacturers will be forced to redesign product architectures, change suppliers, and rebuild certification processes . For connected vehicle, industrial automation, and smart city systems that heavily rely on Chinese modules, this could lead to increased costs and supply delays in the short term. V. As a module solution provider, what is our perspective? Having addressed these four major pain points, let's return to the initial question: As a module solution provider in the middle of the industry chain, what can we do? Frankly, we can't control supply chain price increases, we can't change geopolitics, and we can't control the evolution of technological standards. But our value lies precisely in making "connectivity" simpler and more reliable for our customers in the most complex environments . Component price increases are a fact, but we can help clients keep their BOM costs within a reasonable range through more precise solution selection and more flexible inventory strategies . Low WiFi 7 penetration is also a fact, but our work involves helping clients complete solution verification and mass production preparation while the technology maturity curve is still climbing—so that their products are ready when the market takes off. FCC compliance is becoming more difficult, but we can help clients plan their compliance path in advance , avoiding missing market opportunities due to certification delays. The industry environment in 2026 is indeed more complex than ever before. But the more complex the market, the more it needs professional intermediaries to reduce transaction costs and technical barriers. This is why Ofeixin has chosen to focus on module solutions . For module solution providers, the ability to maintain delivery capabilities under cost pressure, help customers reduce selection risks amidst technical challenges, and make compliance predictions amidst geopolitical changes will determine who survives this round of industry reshuffling. The key to navigating economic cycles lies not in the size of the business, but in the depth of understanding of the industry chain and the speed of response. (Data sources for this article: IIM Information Global IoT Module Market In-Depth Development Research Report (2026), Global Wireless Module Technology Development and Market Prospect Analysis Report (2026), Global IoT Module Industry Development and Outlook Report (2026), Shanghai Securities News, Securities Star, International Electronic Business Information, and other public information)