Quality WiFi7 Module & WiFi HaLow Module manufacturer

For the past decade, most IoT devices have followed a "collect, upload, wait" model—data is transmitted from edge sensors to the cloud for processing. This model is feasible for simple monitoring, but it faces bottlenecks in terms of realtime performance, bandwidth consumption, and privacy protection. Today, WiFi 7 is redefining wireless connectivity with ultralow latency and ultrahigh throughput, while edge AI is bringing computing power down to the device level. The convergence of these two technologies is ushering in a new era of intelligent IoT.   I. The market votes with real money. The Wi Fi 7 market is expanding rapidly. According to Research and Markets data, the global WiFi 7 market size will grow from $2.76 billion in 2025 to $4.56 billion in 2026, with a CAGR of 65.4%, and is expected to reach $33.96 billion in 2030. ABI Research predicts that by 2029, 81% of consumergrade and 92% of enterprisegrade access points will be equipped with WiFi 7 or a newer standard. The edge AI market is even larger. Grand View Research shows that the global edge AI market will be worth approximately $24.9 billion in 2025, and is projected to reach $30 billion in 2026, growing at an annual rate of 20%, and is expected to exceed $118.7 billion by 2033. The convergence of these two multibillion dollar markets means that integration is no longer a vision, but a reality that is already underway. II. Wi Fi 7: A highway paved for edge AI Edge AI demands low latency, high throughput, and high reliability, which are precisely the core advantages of WiFi 7. The 320MHz channel and 4K QAM double the maximum bandwidth from 160MHz, increasing peak throughput by 2.4 times compared to WiFi 6; MultiLink Operation (MLO) allows devices to transmit simultaneously in the 2.4GHz, 5GHz, and 6GHz bands, achieving wirelevel reliability and seamless switching; and the open 6GHz spectrum provides a clean, highspeed channel. III. Edge AI: An Inevitable Shift from the Cloud to the Device AI must move to the edge for three reasons: cloudbased inference suffers from network latency, and in scenarios like industrial control and autonomous driving, tens of milliseconds can determine safety; massive amounts of raw data transmission consume bandwidth, while local processing only triggers communication for meaningful events, enabling architectural restructuring; and local processing of sensitive data naturally reduces the risk of privacy leaks. Currently, industrial visual quality inspection, intelligent security, edge gateways, and robotics and embodied intelligence are recognized as the four directions where edge AI is most likely to become mainstream solutions. Factory automation is the earliest area of implementation, while robotics is closest to the core of physical AI. 四、Core application scenario: The world that is being changed Smart manufacturing and industrial automation : the most urgent need is for integration with industrial scenarios. Industrialgrade WiFi 7 modules support temperatures from 40°C to 85°C, with actual throughput exceeding 4Gbps and latency of approximately 1ms. In SMT workshops, Wi Fi 7 solves signal blind spots, while edge AI performs visual inspection and predictive maintenance; the combination of the two is the only technological option.   Autonomous mobile robots and drones : Robots need to process visual data and make decisions locally in real time, while transmitting critical information back via lowlatency WiFi 7. The global cloudedgedevice collaboration market reached $48.7 billion in 2025 and is projected to exceed $180 billion by 2030, with a CAGR of 22.3%.   Smart Cities and Infrastructure : Under the conditions of wide outdoor temperature range and global compliance requirements, the WiFi 7 module covers a temperature range of 40°C to 85°C, and the edge AI completes image recognition locally. WiFi 7 provides highspeed backhaul, forming a complete closed loop.   Smart Home and Consumer IoT : Homes are shifting from "passive response" to "proactive service." Synaptics released the world's first Wi Fi 7 AInative MCU, integrating Wi Fi 7, Bluetooth LE 6.0, and Thread/Zigbee, enabling end devices to have local sensing and decisionmaking capabilities. The WiFi 7 gateway market is valued at $7.4 billion in 2025 and is projected to reach $20.9 billion in 2032, with home computing power considered the most likely area for explosive growth in 2026 and 2027. V. Ofeixin Wi Fi 7+ Edge AI Product Solution Based on the Qualcomm QCC2072 chip, O2072PM and O2072PB are two WiFi 7 + Bluetooth 6.0 combo modules, fully supporting 4K QAM, 320MHz channels, and MLO, with a peak rate of 5.8Gbps and eMLSR enhanced multilink switching. The O2072PM uses an M.2 Key E interface (22×30mm), suitable for highend robots and industrial equipment; the O2072PB is a compact surfacemount package (13×15×2.3mm), designed specifically for spaceconstrained devices such as AI cameras, smart cockpits, and industrial vision systems. Both support Bluetooth 6.0 channel detection for highprecision ranging. O2072PM also provides deep customization of the entire hardware platform (Qualcomm, Realtek, Woogi, HiSilicon, etc.), including size and interface trimming, native driver adaptation, and scenariobased RF optimization, becoming a key bridge connecting chips and terminal applications. VI. The Deep Logic of Technological Convergence: Integration of Connectivity, Computing, and Security In the past, wireless connectivity and edge computing were two separate paths, but this piecemeal architecture is becoming obsolete. ABI Research points out that edge AIoT platforms must be designed with connectivity, computing, and security as a unified strategy. Integrating Wi Fi 7 and AI acceleration into a single chip (such as the SYN765x) reduces space requirements, simplifies design, and saves costs. The significance of this integration lies in the fact that it is no longer a physical superposition of "WiFi chip + AI chip," but rather treats AI acceleration and wireless connectivity as a holistic system from the ground up, eliminating the need for devices to make painful tradeoffs between local inference and highspeed communication. VII. Industry Trends and Outlook Trend 1 : Wi Fi 7 penetration is accelerating, with a projected CAGR of approximately 65% from 2026 to 2030. AI workloads are driving companies to upgrade their networks ahead of schedule. Trend 2 : Edge AI is going from "optional" to "standard". 2026 is seen as the starting year for the explosion of Edge AI and Physical AI, and industrial computer manufacturers are transforming into AI Box solution providers. Trend 3 : The architecture is shifting from "cloudpipedevice" to "deviceedgecloud" collaboration, and the low latency of WiFi 7 is naturally suitable for distributed AI. Trend 4 : Multiprotocol convergence (Wi Fi 7 + Bluetooth LE + 802.15.4) is becoming a necessity. Singlechip solutions simplify development, reduce costs, and better support crossplatform standards such as Matter.  

Introduction: An Ongoing Shift in Industrial Focus The global wireless communication module industry is undergoing profound structural changes. The Industrial Internet of Things (IIoT) has surpassed consumer electronics to become the fastest-growing and largest core application market for wireless modules . This shift is not accidental—it is the result of the combined effects of four forces: market expansion, technological maturity, policy support, and industry demand. According to the "Global Wireless Module Industry In-Depth Analysis Report (2026)" released by IIM Information, the global wireless module industry market size is expected to reach approximately US$18.73 billion in 2026 , a 14.2% increase compared to 2025, with shipments exceeding 1.25 billion units . On the application demand side, Industrial Internet of Things (IIoT) and smart manufacturing already account for 21.3% of IoT module shipments , with demand for industrial sensors and edge gateway modules growing by 18% annually. Industrial Internet modules achieved a 37% year-on-year growth in 2025 , becoming the second largest segment after consumer electronics. I. Why has the Industrial Internet of Things become the main battleground for wireless modules? 1.1 Market Level: A Trillion-Yuan Demand Pool $277.35 billion in 2025 to $537.4 billion in 2030 , representing a CAGR of 14.3% . Each IIoT terminal requires at least one wireless module, and the size of the downstream market directly determines the total demand for upstream modules . 1.2 Technical Aspect: Wireless solutions are systematically replacing wired connections. Industrial scenarios have historically been dominated by wired protocols such as RS-485 and Modbus, but three major pain points are driving wireless alternatives: high cabling costs , with expensive cabling and construction fees for wired deployments, while wireless modules offer a low-cost "plug-and-play" solution; urgent need to upgrade existing equipment , with the "Implementation Opinions" issued by eight departments including the Ministry of Industry and Information Technology in July 2026 explicitly encouraging enterprises to deploy converged industrial equipment with embedded advanced communication modules; and the inherent need for wireless in industrial scenarios , such as electromagnetic interference environments, wide-coverage mining areas, mobile AGVs, and robots, where wired connections are unsuitable and naturally rely on wireless solutions. 1.3 Industry Level: The Maturity of New Technologies Transforms "Usable" into "Easy to Use" The cost of 5G modules has decreased by approximately 40% within two years, with industrial 5G module prices dropping to around 200 yuan, a 90% decrease compared to the initial commercial launch period . Shipments of 5G RedCap modules are projected to reach 8 million units in 2025 and exceed 30 million units in 2026. The high throughput and low latency of Wi-Fi 6/7 meet the needs of industrial video surveillance and other applications; Wi-Fi HaLow provides communication coverage of up to 1 kilometer in the Sub-1GHz band ; and the integration of Bluetooth 6.0 and edge AI enables modules to perform local data preprocessing. This increased technological maturity directly lowers the barriers and risks for industrial users adopting wireless solutions. 1.4 Demand Level: Edge AI Drives Module Upgrades Towards Intelligence Edge AI computing power is increasingly being deployed at the module level . Factory production lines operate with hundreds of sensors and robotic arms, requiring decisions to be made within milliseconds, leaving no room for cloud-based processing. Modules integrating AI acceleration capabilities can perform intelligent processing at the data source. According to IIM data, shipments of edge intelligent modules (integrated AI accelerators) reached 230 million units in 2025, a year-on-year increase of 189% . Industrial applications are driving the upgrade of modules from communication devices to key nodes integrating communication, computing, and intelligence . 1.5 Policy Level: Global Collaboration to Promote Industrial Internet of Things In July 2026, eight departments, including China's Ministry of Industry and Information Technology, issued the "Implementation Opinions on Promoting the High-Quality Development of the Industrial Internet," which explicitly proposed to comprehensively improve the connectivity rate of industrial equipment . The "Action Plan for Promoting the High-Quality Development of Industrial Internet Platforms (2026-2028)" proposed that the number of connected industrial devices should exceed 120 million units by 2028. The EU's RED Directive amendment (effective in 2026) imposed stricter limits on the energy efficiency of wireless modules; and the North American FCC promoted the 6GHz band dynamic spectrum sharing standard. The core logic of these policies is that the connectivity rate of industrial equipment is a key indicator of a country's manufacturing competitiveness . II . Special Requirements of Wireless Modules in Industrial Scenarios Industrial-grade modules must achieve breakthroughs in the following dimensions : Wide temperature range operation capability. Stable operation within a wide temperature range of -40°C to 85°C. High reliability and interference resistance. Excellent interference resistance design, stable connection maintenance, and millisecond-level low latency response. Long lifecycle and guaranteed supply. Industrial equipment has an upgrade cycle of years or even decades, requiring long-term stable supply and technical support. Small size and high integration. Industrial equipment has limited internal space, so it needs to integrate more functions within the smallest possible size. III . Industry Practice: Ofeixin Industrial Internet of Things Deployment Founded in 2014, Shenzhen Oufexin Technology Co., Ltd., headquartered in Guangming District, Shenzhen, has been recognized as a National High-tech Enterprise . Its product line covers Wi-Fi modules, Wi-Fi HaLow, Bluetooth modules, PLC modules, embedded IoT/AIoT modules, and more, with multiple product lines catering to the core needs of industrial scenarios. 3.1 Wi-Fi 7 Module: Designed for High-Bandwidth Industrial Scenarios O2Flytek has launched the O2072PM Wi-Fi 7 module based on the Qualcomm QCC2072 chip . Featuring an M.2 Key E interface, a 2T2R dual-antenna design, and support for Wi-Fi/BT coexistence, its 320MHz bandwidth, 4096-QAM modulation, and MLO multi-link aggregation technology give it significant advantages in industrial video surveillance, high-definition image transmission, VR/AR, and other scenarios. 3.2 Wi-Fi HaLow Module: A Powerful Industrial Tool for Long-Range, Low-Power Operation The 4108E-S module launched by Oufexin is based on the Morse Micro MM6108 chip, operates in the Sub-1GHz band, supports data rates up to 32Mbps , and is suitable for scenarios such as industrial automation, warehouse management, transportation and logistics, smart agriculture, and smart grids . 3.3 PLC Module: An Industrial Solution That Enables Communication with Power Power line communication (PLC) utilizes existing power lines to transmit data, eliminating the need for additional wiring . Oufexin PLC modules have been applied in new energy industrial scenarios such as charging piles, photovoltaic inverters, and energy storage systems , featuring low cost, stable communication, strong real-time performance, and strong anti-interference capabilities. 3.4 Industrial-grade Wi-Fi/Bluetooth module Ofeixin product line is clearly divided into three levels: consumer electronics grade, industrial grade, and automotive grade . The industrial grade module has excellent industrial temperature range performance and millisecond-level low latency , with an operating temperature range of -40 °C to 85°C, a transmit power of 19dBm, and a receive sensitivity of -82dBm. IV . Market Prospects and Industry Opportunities In terms of market size , the global wireless module market is projected to reach US$14.44 billion by 2030. The Chinese WLAN module market is expected to generate US$3.5-4.5 billion in annual revenue by 2026, with total shipments exceeding 600-700 million units. From a technological perspective , industrial module shipments are projected to reach 110 million units in 2026. The 5G industrial IoT market is expected to grow from $17.3 billion in 2025 to $22.56 billion in 2026. In terms of the competitive landscape , Chinese suppliers have already occupied 67% of the global module market share, but they also face the dual pressure of rising material prices and trade barriers. V .Conclusion: Four forces working together to drive the shift in industrial focus The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules, a result of the combined effects of market forces, technology, demand, and policy . Market level : The trillion-dollar and rapidly growing IIoT market provides a huge demand pool for modules; From a technical perspective : the maturity and cost reduction of technologies such as 5G, Wi-Fi 6/7, Wi-Fi HaLow, and Bluetooth 6.0 have transformed wireless solutions from "usable" to "easy to use". On the demand side : The extreme requirements for real-time performance and reliability in industrial scenarios are forcing modules to evolve towards edge intelligence; Policy level : Major global economies have elevated the connectivity of industrial equipment to a national strategy, creating institutionalized incremental demand. These four forces reinforce each other : technological progress lowers the barriers to entry, policy promotion accelerates transformation, market demand amplifies the scale effect, and the scale effect further reduces costs, forming a positive cycle. The Industrial Internet of Things (IIoT) has become the main battleground for wireless modules. This is not a prediction, but a fact that has already occurred and is accelerating. Whoever can deeply understand the special needs of industrial scenarios—wide temperature range, high reliability, long life cycle, and strong anti-interference—and continuously invest in areas such as multi-mode fusion and edge intelligence will gain the upper hand in the next stage.  

I. Trend Background: Why is "combination" becoming the new normal? IoT devices are becoming increasingly "all-rounders." A smart home control unit needs to connect to the cloud via Wi-Fi and also enable near-field network pairing with mobile phones via Bluetooth; an industrial gateway needs to connect to the local area network via Wi-Fi and also needs Bluetooth for on-site device debugging. This demand for "both...and..." is driving IoT communication modules from "single-protocol dedicated" to "multi-protocol convergence". A multi-protocol module (combo module) refers to a single wireless SoC that supports multiple protocol stacks, providing multiple wireless communication capabilities simultaneously on the same module. The most common combination is Wi-Fi + Bluetooth , with other combinations such as ZigBee + BLE and Wi-Fi + ZigBee . A single-protocol module , on the other hand , focuses on a single communication standard, concentrating all hardware and software resources to serve only one protocol. Both have their advantages and disadvantages, and the selection decision directly affects the device's cost, power consumption, size, and development cycle. 二、Five Advantages of Multi-Protocol Combination Modules 1. Size and PCB Layout: From "Two RF Systems" to "One System Coexisting" Using two independent single-protocol modules means requiring at least two sets of RF traces and two antennas. Multi-protocol modules consolidate the RF front-end, coexistence design, and interfaces onto a single SoC solution, significantly simplifying PCB layout. In the space-constrained environments of IoT devices, replacing two independent modules with a single module can reduce PCB area by more than 40% . 2. BOM Cost and Supply Chain Management: One less module, one less level of complexity The multi-protocol module simplifies procurement and version management into a single part number, significantly reducing the complexity of supply chain management. Compared to three separate modules, the three-in-one module can reduce BOM costs by more than 30% . 3. Power Management: Unified scheduling is better than decentralized management. The power state machine of the combined module makes it easier to implement a unified sleep/wake-up strategy at the driver layer, avoiding leakage current spikes caused by two independent chips operating independently. In contrast, the power management strategies of two independent modules are often difficult to coordinate precisely. 4. Certification and Compliance: Design Once, Test in a Coordinated Manner The combined module narrows down the transmit power level, spectrum template, and coexistence scenarios to a more predictable range, allowing for comprehensive planning of the certification path early in the project. Compared to certifying two modules separately, the combined module can save more than 30% of certification time and cost . 5. User Experience: A Natural Match for the "Distribution Network-Connectivity" Interaction Model In screenless IoT devices, the standard path has become "the mobile phone transmits the Wi-Fi SSID and password via Bluetooth → the device connects to the network via Wi-Fi". The combined module is naturally matched to this interaction model in terms of hardware , without the need for additional cross-chip communication overhead. III. Four major limitations of multi-protocol combination modules 1. Performance compromises: the cost of shared resources Wi-Fi, Bluetooth, ZigBee, and other mainstream wireless technologies coexist in the 2.4GHz ISM band. When they run simultaneously on a single chip, the multiple protocols need to share bandwidth, which may lead to potential increased latency and packet loss . Single-protocol modules concentrate all hardware resources to serve a single protocol, and generally perform better in terms of peak throughput and latency stability . 2. Limited flexibility: A change in one part affects the whole. Combination modules "bundle" multiple protocols onto the same hardware platform. If a product needs to be upgraded to one of the protocols in the future, the entire module often needs to be replaced . Single-protocol modules , on the other hand, can upgrade only one protocol , making product iteration more flexible. 3. Integration complexity: Not "plug and play" When different protocol stacks run on the same chip, a sophisticated time-division/frequency-division scheduling strategy is required to avoid self-interference. Developers need to handle complex issues such as priority management between protocols and coexistence strategy configuration. For inexperienced teams, this may actually prolong the development cycle. 4. The "hidden cost" of power consumption In scenarios where multiple protocols operate simultaneously or alternately, the overall power consumption of combined modules is typically higher than that of single-protocol BLE-only designs . For devices powered entirely by batteries with minimal data transmission , single-protocol BLE modules are more competitive in terms of power consumption. IV. Market Data and Industry Dynamics Market data confirms the upward trend in combo modules. The global wireless module market is expanding at a CAGR of 12.9% , projected to grow from $7.92 billion in 2025 to $8.94 billion in 2026. In the combo chip segment, the global Wi-Fi/Bluetooth Combo chip market reached $18.76 billion in 2025 , a year-on-year increase of 14.2% . Smart home, industrial IoT, and automotive electronics are the three core drivers, with the automotive OEM market expected to reach an annual demand of 980 million units in 2027 . 27.4% year-on-year in 2025. It is predicted that the number of connected IoT devices globally will exceed 30 billion by 2026 , with a significant increase in the proportion of devices using multi-protocol connections. Single-protocol modules will not disappear, but the market share of combined modules is expanding rapidly. V. Ofeixin Technology: In-depth layout of multi-protocol combination modules With multi-protocol combination modules rapidly becoming the industry mainstream, Ofeixin has built a complete product matrix covering multi-protocol combination modules such as Wi-Fi, Bluetooth, PLC, and IoT/AIoT , thanks to its years of experience in the field of wireless communication. In the field of Wi-Fi + Bluetooth combo modules , Ofeixin has achieved full-speed, full-scenario coverage from Wi-Fi 4 to Wi-Fi 7. Its Wi-Fi + Bluetooth combo module product line possesses the following core advantages: First, the speed coverage is comprehensive. From entry-level Wi-Fi 4/BLE combinations to flagship Wi-Fi 7/BLE 5.4 combinations, Ofeixin can provide precisely matched solutions for projects with different cost and performance requirements. The flagship combination module supports a 320MHz ultra-wide bandwidth , achieving high-speed wireless transmission at 5.8Gbps , while integrating the latest generation of Bluetooth Low Energy protocol; the mainstream Wi-Fi 6 series combination module supports 2x2 dual-band concurrent operation , with a stable speed of over 1200Mbps , balancing performance and cost-effectiveness. Secondly, it boasts outstanding interface compatibility. Ofeixin's Wi-Fi + Bluetooth combo module comprehensively covers various mainstream host interfaces such as PCIe, USB, and SDIO , enabling flexible adaptation to main control chips on different platforms and greatly reducing customers' hardware porting and adaptation costs. Third, it has mature multi-protocol concurrency capabilities. Through a sophisticated radio frequency coexistence scheduling algorithm, the combined modules of Ofeixin can achieve low-interference and low-latency collaborative work between Wi-Fi data transmission and Bluetooth scanning/connection , perfectly matching the classic interaction mode of "Bluetooth network configuration + Wi-Fi communication" for IoT devices, as well as multi-task scenarios such as concurrent Bluetooth audio, Bluetooth data transmission and Wi-Fi big data. In terms of multi-technology integration and vertical scenarios , Ofeixin has further integrated Wi-Fi, Bluetooth, and PLC-IoT power line carrier technology. Its PLC-IoT module, based on the IEEE 1901.1 standard, supports a single CCO to connect 200 STA nodes and features dynamic routing and multi-path automatic addressing capabilities, achieving dual "wired + wireless" connectivity in smart home, smart lighting, and other scenarios. In addition, the company also provides Wi-Fi HaLow (based on IEEE 802.11ah, targeting low power consumption and wide coverage), Nearlink , and other multi-protocol modules, widely covering application scenarios such as smart homes, smart cities, industrial IoT, and connected vehicles. From a technological perspective, Ofeixin's product portfolio precisely aligns with the industry's evolution from "single-protocol modules" to "multi-protocol combination modules." The company has obtained numerous core technology patents , and all its products have passed international certifications such as FCC, CE, and SRRC, as well as RoHS and REACH environmental directives. Today, with multi-protocol combination modules becoming the industry mainstream, Ofeixin is providing global IoT devices with a "one-stop" multi-protocol connectivity solution through its product system that covers all protocols, is compatible with multiple interfaces, and is adaptable to all scenarios . VI. Selection Recommendations and Conclusion The difference between multi-protocol combination modules and single-protocol modules is not a simple matter of superiority or inferiority, but rather a matter of different choices for different scenarios . Scenarios where a combination module is preferred include: devices needing to work collaboratively between Wi-Fi and Bluetooth (such as smart home control); limited PCB area; high requirements for BOM cost and supply chain efficiency; and screenless devices requiring Bluetooth to assist Wi-Fi network pairing. Scenarios where a single-protocol module is preferred include: extreme requirements for peak performance of a single protocol; requiring only one communication method; purely battery-powered devices with extremely sensitive power consumption; and scenarios requiring flexible upgrades to a specific protocol without replacing the entire module. The future is not about "combined modules replacing single-protocol modules," but rather "combined and single-protocol modules each finding their proper place." Combined modules, with their smaller size, lower BOM cost, and simplified supply chain, are becoming the mainstream choice for space- and cost-sensitive scenarios; single-protocol modules, on the other hand, remain irreplaceable in industrial control, professional communications, and other scenarios due to their superior peak performance and more flexible upgrade paths . For module manufacturers, having a complete matrix of both types of products is essential to meeting the diverse needs of different customers. The rise of multi-protocol combined modules is not a technological revolution, but an inevitable consequence of demand. 2