China WiFi BT Module manufacturer

Integrity、Innovation、Cooperation、Win-win

News

May 18, 2021

New Generation HiSilicon WiFi Module

In August 2019, at Huawei Developer Conference, Huawei officially released the Lingxiao Series WiFi-iot chips, which are mainly used for home automation products. This is Huawei's connectivity solution for HiLink's smart home ecological strategy. With the chips latest technology, HiLink's ecological connections will be more stable, convenient and secure, which is the cornerstone of HiLink's ecological prosperity.

As a leading manufacturer in China, we are specialized in providing customers with perfect Internet of Things connectivity solutions. The following will be a details of the WiFi Module which are based on HiSilicon WiFi chips.

 

1、Main Chip:Hi1131S

Module No: 3131A-S

latest company news about New Generation HiSilicon WiFi Module  0

Introduction:Mainly used in battery-powered low-power IPC and smart doorbell, work with HI3518EV200/300 and based on LiteOS , it has been recognized by the market for its low power consumption, fast wake-up and excellent performance. Also 3131A-S has been in mass production and successfully applied in this field.

 

Main Features

Support IEEE 802.11b/g/n

2.4GHz support 150 Mbps in 20/40 MHZ mode

Support WLAN SDIO interface

Enterprise level security which can apply WPA/WPA2 certification for WiFi

Operating Temperature:-30~70°C

Low power dissipation

 

 

2、Main Chip:Hi3861LV100

Module No: 3161A-SL/3161H-IL

latest company news about New Generation HiSilicon WiFi Module  1

Instruction:3161A-SL is an upgrade version of 3131A-S with a wider range of applications,mainly applied in the fields of battery-powered low-power IPC, smart doorbell and smart home.

 

In the field of low-power video door bell and IPC, Hi3861L is worked with Hi3518EV300 to operate in LiteOS dual mode (WIFI and CPU are both based on LiteOS ). Hi3861L has a rich interface for external sensors. With an embedded MCU and power management unit, it can reach Rapid Wake and lower power consumption. Meanwhile, it simplifies product design and is conducive to rapid product development.

3161H-IL can be directly used in battery-powered low-power door locks and other smart home products.latest company news about New Generation HiSilicon WiFi Module  2

Main Features

Support IEEE 802.11b/g/n

2.4GHz support 72.2 Mbps in 20MHZ mode

Support standard 20MHz nd 5M/10M narrow broadband, support STBC

Support SDIO,SPI,I2C,UART,I2S,PWM,ADC,GPIO interfaces

Module integrated 32K clock

WFA WPA, WFA WPA2 personal, and WPS2.0 for Wi-Fi

Built-in 352 KB SRAM and 288 KB ROM

Main chipset Built-in 32bit MCU and 2 MB flash memory

Operating Temperature:-40~85°C

Low power dissipation

 

 

3、Main Chip:Hi3861

Module No: 3161H-I

 

latest company news about New Generation HiSilicon WiFi Module  3

 

Introduction:Hi3861 is WIFI-IOT chip, which is mainly used in the normally power supply smart home, such as white goods, home appliances, and electrical products.latest company news about New Generation HiSilicon WiFi Module  4

Main Features

Support IEEE 802.11b/g/n

2.4GHz support 72.2 Mbps in 20MHZ mode

Support standard 20MHz nd 5M/10M narrow broadband, support STBC

Support SDIO,SPI,I2C,UART,I2S,PWM,ADC,GPIO interfaces

Module integrated 32K clock

Contact Details